TW200717636A - Bonding apparatus and bonding method - Google Patents
Bonding apparatus and bonding methodInfo
- Publication number
- TW200717636A TW200717636A TW095129297A TW95129297A TW200717636A TW 200717636 A TW200717636 A TW 200717636A TW 095129297 A TW095129297 A TW 095129297A TW 95129297 A TW95129297 A TW 95129297A TW 200717636 A TW200717636 A TW 200717636A
- Authority
- TW
- Taiwan
- Prior art keywords
- collet
- chip
- upward
- wafer ring
- gas
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7501—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005307303A JP4530966B2 (ja) | 2005-10-21 | 2005-10-21 | ボンディング装置及びボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200717636A true TW200717636A (en) | 2007-05-01 |
TWI335051B TWI335051B (zh) | 2010-12-21 |
Family
ID=38097883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095129297A TW200717636A (en) | 2005-10-21 | 2006-08-10 | Bonding apparatus and bonding method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4530966B2 (zh) |
KR (1) | KR100779613B1 (zh) |
TW (1) | TW200717636A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI501324B (zh) * | 2013-07-25 | 2015-09-21 | Hanmi Semiconductor Co Ltd | 倒裝晶片結合裝置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5953022B2 (ja) * | 2011-09-19 | 2016-07-13 | ファスフォードテクノロジ株式会社 | ボンディング方法 |
JP6064831B2 (ja) | 2013-08-08 | 2017-01-25 | 三菱電機株式会社 | 試験装置、試験方法 |
CN104319251B (zh) * | 2014-10-29 | 2018-02-06 | 三星半导体(中国)研究开发有限公司 | 芯片拾取装置 |
JP6715353B2 (ja) * | 2017-01-30 | 2020-07-01 | 株式会社新川 | ピックアップ装置およびピックアップ方法 |
CN106847674B (zh) * | 2017-03-21 | 2023-05-26 | 优然沃克(北京)科技有限公司 | 一种蓝宝石晶片加工用快速脱片装置 |
KR102012720B1 (ko) | 2017-06-30 | 2019-11-04 | 프리시스 주식회사 | 진공밸브 엑츄에이터 |
JP7134804B2 (ja) * | 2018-09-20 | 2022-09-12 | 株式会社東芝 | コレットチャック、半導体製造装置、および半導体装置の製造方法 |
KR102199450B1 (ko) * | 2019-04-09 | 2021-01-06 | 레이저쎌 주식회사 | 레이저 리플로우 장치의 레이저 가압 헤드 모듈 |
JP7471862B2 (ja) * | 2020-02-27 | 2024-04-22 | キオクシア株式会社 | 貼合装置および貼合方法 |
US11552031B2 (en) * | 2020-03-13 | 2023-01-10 | Asmpt Singapore Pte. Ltd. | High precision bonding apparatus comprising heater |
CN117080127B (zh) * | 2023-10-11 | 2024-01-05 | 江苏快克芯装备科技有限公司 | 芯片吸取异常检测装置及检测方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2530013B2 (ja) * | 1988-11-18 | 1996-09-04 | 富士通株式会社 | 半導体装置の製造方法 |
JPH1168300A (ja) * | 1997-08-25 | 1999-03-09 | Ueno Seiki Kk | ボール吸着治具の制御方法およびボール吸着治具システム |
JP2000225679A (ja) * | 1999-02-05 | 2000-08-15 | Canon Inc | オフセット印刷方法、装置及びそれにより製造する高精細パターン基板 |
JP2002186923A (ja) * | 2000-12-19 | 2002-07-02 | Shibaura Mechatronics Corp | 基板のクリーニング装置、及びクリーニング方法 |
JP4190161B2 (ja) * | 2001-05-08 | 2008-12-03 | 株式会社新川 | ウェーハリングの供給返送装置 |
-
2005
- 2005-10-21 JP JP2005307303A patent/JP4530966B2/ja active Active
-
2006
- 2006-08-10 TW TW095129297A patent/TW200717636A/zh unknown
- 2006-09-05 KR KR1020060085024A patent/KR100779613B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI501324B (zh) * | 2013-07-25 | 2015-09-21 | Hanmi Semiconductor Co Ltd | 倒裝晶片結合裝置 |
Also Published As
Publication number | Publication date |
---|---|
JP4530966B2 (ja) | 2010-08-25 |
JP2007115979A (ja) | 2007-05-10 |
KR20070043597A (ko) | 2007-04-25 |
KR100779613B1 (ko) | 2007-11-26 |
TWI335051B (zh) | 2010-12-21 |
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