ATE397285T1 - Verfahren zum abtrennen eines dünnhalbleiterchips von einem wafer - Google Patents

Verfahren zum abtrennen eines dünnhalbleiterchips von einem wafer

Info

Publication number
ATE397285T1
ATE397285T1 AT03000708T AT03000708T ATE397285T1 AT E397285 T1 ATE397285 T1 AT E397285T1 AT 03000708 T AT03000708 T AT 03000708T AT 03000708 T AT03000708 T AT 03000708T AT E397285 T1 ATE397285 T1 AT E397285T1
Authority
AT
Austria
Prior art keywords
thin die
wafer
separating
tip
positioning
Prior art date
Application number
AT03000708T
Other languages
English (en)
Inventor
Shiuh-Hui Steven Chen
Chery Field
Didier R Lefebvre
Joe Pin Wang
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of ATE397285T1 publication Critical patent/ATE397285T1/de

Links

Classifications

    • H10P72/0442—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H10P72/78—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5142—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53274—Means to disassemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Pressure Sensors (AREA)
AT03000708T 2002-01-28 2003-01-13 Verfahren zum abtrennen eines dünnhalbleiterchips von einem wafer ATE397285T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/058,650 US6772509B2 (en) 2002-01-28 2002-01-28 Method of separating and handling a thin semiconductor die on a wafer

Publications (1)

Publication Number Publication Date
ATE397285T1 true ATE397285T1 (de) 2008-06-15

Family

ID=27609642

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03000708T ATE397285T1 (de) 2002-01-28 2003-01-13 Verfahren zum abtrennen eines dünnhalbleiterchips von einem wafer

Country Status (4)

Country Link
US (1) US6772509B2 (de)
EP (1) EP1336986B1 (de)
AT (1) ATE397285T1 (de)
DE (1) DE60321253D1 (de)

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US7407359B2 (en) * 2005-05-27 2008-08-05 Danville Automation Holdings Llc Funnel plate
US7845537B2 (en) 2006-01-31 2010-12-07 Ethicon Endo-Surgery, Inc. Surgical instrument having recording capabilities
WO2009067635A1 (en) * 2007-11-20 2009-05-28 Board Of Regents, The University Of Texas System Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices
US20090191029A1 (en) * 2008-01-30 2009-07-30 Taeg Ki Lim System for handling semiconductor dies
US20100126320A1 (en) * 2008-11-21 2010-05-27 Trumpf, Inc. Vacuum based part separation
DE102011108981B4 (de) * 2011-08-01 2016-02-18 Gottfried Wilhelm Leibniz Universität Hannover Struktureinrichtung mit einem Bauelement, Vorrichtung zur Applikation des Bauelements, Verfahren zur Herstellung der Struktureinrichtung und Verfahren zur Applikation des Bauelements
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
ITMI20131374A1 (it) * 2013-08-08 2015-02-08 St Microelectronics Srl Strumento di prelievo di die
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
KR101939013B1 (ko) * 2016-01-29 2019-01-15 예놉틱 옵틱컬 시스템즈 게엠베하 웨이퍼로부터 마이크로 칩을 분리하고 기판 상에 마이크로 칩을 배치하기 위한 방법 및 장치
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10471545B2 (en) * 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment

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US3973682A (en) * 1974-12-20 1976-08-10 International Business Machines Corporation Pick up assembly for fragile devices
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices
US4191057A (en) 1978-06-28 1980-03-04 Gould Inc. Inversion layer sprain gauge
DE2841312C2 (de) 1978-09-22 1985-06-05 Robert Bosch Gmbh, 7000 Stuttgart Monolithischer Halbleiter-Drucksensor und Verfahren zu dessen Herstellung
US4317126A (en) 1980-04-14 1982-02-23 Motorola, Inc. Silicon pressure sensor
US4395451A (en) 1980-07-14 1983-07-26 Althouse Victor E Semiconductor wafer and die handling method and means
NL8103573A (nl) * 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
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US4683755A (en) 1985-11-15 1987-08-04 Imo Delaval Inc. Biaxial strain gage systems
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US4990051A (en) * 1987-09-28 1991-02-05 Kulicke And Soffa Industries, Inc. Pre-peel die ejector apparatus
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US5356176A (en) 1993-05-25 1994-10-18 Trw Technar Inc. Vehicle occupant restraint apparatus
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US6608370B1 (en) 2002-01-28 2003-08-19 Motorola, Inc. Semiconductor wafer having a thin die and tethers and methods of making the same

Also Published As

Publication number Publication date
US6772509B2 (en) 2004-08-10
EP1336986A2 (de) 2003-08-20
US20030140486A1 (en) 2003-07-31
EP1336986B1 (de) 2008-05-28
EP1336986A3 (de) 2006-08-16
DE60321253D1 (de) 2008-07-10

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