SG11201807973RA - Chip packaging apparatus and method thereof - Google Patents

Chip packaging apparatus and method thereof

Info

Publication number
SG11201807973RA
SG11201807973RA SG11201807973RA SG11201807973RA SG11201807973RA SG 11201807973R A SG11201807973R A SG 11201807973RA SG 11201807973R A SG11201807973R A SG 11201807973RA SG 11201807973R A SG11201807973R A SG 11201807973RA SG 11201807973R A SG11201807973R A SG 11201807973RA
Authority
SG
Singapore
Prior art keywords
chip
packaging apparatus
pick
chip packaging
processing device
Prior art date
Application number
SG11201807973RA
Inventor
Feng Yu
Hong Gang Wang
Yang Li
Yong Xin Wang
Original Assignee
Capcon Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Capcon Ltd filed Critical Capcon Ltd
Publication of SG11201807973RA publication Critical patent/SG11201807973RA/en

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Classifications

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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
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Abstract

PCTInternational Patent Application No.: PCT/CN/076233 PATENT 1 Chip packaging apparatus and method thereof of Disclosure Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device configured to process a chip supplied by a corresponding chip supplying device; and at least one chip transferring device, wherein each chip transferring device has a plurality of bonding heads, and each of the bonding heads is used to transfer one chip processed by a corresponding chip processing device. Each chip processing device comprises at least two pick-up platforms, each of the pick-up platforms is configured such that multiple chips can be simultaneously provided thereon, and the plurality of bonding heads on a corresponding chip transferring device is configured to simultaneously pick up multiple chips from each pick-up platform in one operation. A method for packaging chips is also disclosed.
SG11201807973RA 2016-03-14 2016-03-14 Chip packaging apparatus and method thereof SG11201807973RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/076233 WO2017156671A1 (en) 2016-03-14 2016-03-14 Chip packaging apparatus and method thereof

Publications (1)

Publication Number Publication Date
SG11201807973RA true SG11201807973RA (en) 2018-10-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807973RA SG11201807973RA (en) 2016-03-14 2016-03-14 Chip packaging apparatus and method thereof

Country Status (7)

Country Link
US (1) US11189507B2 (en)
KR (1) KR102281279B1 (en)
CN (1) CN108886002B (en)
MY (1) MY198186A (en)
PH (1) PH12018501980A1 (en)
SG (1) SG11201807973RA (en)
WO (1) WO2017156671A1 (en)

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MY198186A (en) 2023-08-09
PH12018501980A1 (en) 2019-07-01
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CN108886002A (en) 2018-11-23
US20190080942A1 (en) 2019-03-14

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