TWI324629B - - Google Patents

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Publication number
TWI324629B
TWI324629B TW093123421A TW93123421A TWI324629B TW I324629 B TWI324629 B TW I324629B TW 093123421 A TW093123421 A TW 093123421A TW 93123421 A TW93123421 A TW 93123421A TW I324629 B TWI324629 B TW I324629B
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
layer
adhesive
wafer
cutting
Prior art date
Application number
TW093123421A
Other languages
English (en)
Chinese (zh)
Other versions
TW200512270A (en
Inventor
Aihara Shin
Saruwatari Masumi
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of TW200512270A publication Critical patent/TW200512270A/zh
Application granted granted Critical
Publication of TWI324629B publication Critical patent/TWI324629B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B32B2323/043—HDPE, i.e. high density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B32B2323/046—LDPE, i.e. low density polyethylene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW093123421A 2003-08-07 2004-08-05 Pressure-sensitive adhesive sheet TW200512270A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003288498 2003-08-07

Publications (2)

Publication Number Publication Date
TW200512270A TW200512270A (en) 2005-04-01
TWI324629B true TWI324629B (enExample) 2010-05-11

Family

ID=33550043

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123421A TW200512270A (en) 2003-08-07 2004-08-05 Pressure-sensitive adhesive sheet

Country Status (5)

Country Link
US (2) US20050031822A1 (enExample)
EP (1) EP1505137B1 (enExample)
KR (1) KR100610211B1 (enExample)
CN (1) CN1308140C (enExample)
TW (1) TW200512270A (enExample)

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KR20070087104A (ko) * 2005-02-18 2007-08-27 미쓰이 가가쿠 가부시키가이샤 반도체 웨이퍼 표면 보호시트 및 그 보호시트를 이용한반도체 웨이퍼의 보호 방법
US8106122B2 (en) * 2005-03-29 2012-01-31 Mitsui Chemicals, Inc. Propylene-based polymer composition for adhesive use and laminate thereof
US20090117379A1 (en) * 2005-06-06 2009-05-07 Katsunori Toyoshima Surface protection film
CN101304878B (zh) 2005-11-08 2012-06-13 东丽株式会社 聚酯层合膜及转印箔
KR100878752B1 (ko) * 2005-12-09 2009-01-14 에스케이유티스 (주) 충격흡수 및 실링용 시트
US7758964B2 (en) * 2006-02-10 2010-07-20 3M Innovative Properties Company Flame resistant covercoat for flexible circuit
JP2007268723A (ja) * 2006-03-30 2007-10-18 Lintec Corp 剥離シート
US7892891B2 (en) * 2006-10-11 2011-02-22 SemiLEDs Optoelectronics Co., Ltd. Die separation
JP5863157B2 (ja) * 2006-12-18 2016-02-16 日東電工株式会社 粘着シート
US8410881B2 (en) 2007-03-16 2013-04-02 Magnum Magnetics Corporation Material magnetizer systems
US9208934B1 (en) 2007-03-16 2015-12-08 Magnum Magnetics Corporation Material magnetizer systems
US8410880B2 (en) 2007-03-16 2013-04-02 Magnum Magnetics Corporation Material magnetizer systems
US7728706B2 (en) 2007-03-16 2010-06-01 Ogden Jr Orval D Material magnetizer systems
US9457547B2 (en) * 2007-11-07 2016-10-04 Magnum Magnetics Corporation Extrudable adherable material systems
KR100926259B1 (ko) * 2008-02-05 2009-11-12 주식회사 옵트론텍 광학용 글래스 표면보호 절단방법
DE102008021841A1 (de) * 2008-04-30 2009-11-05 Tesa Se Polyolefinfolie und Verwendung derselben
US8298917B2 (en) * 2009-04-14 2012-10-30 International Business Machines Corporation Process for wet singulation using a dicing singulation structure
JP5748952B2 (ja) * 2009-11-27 2015-07-15 日東電工株式会社 塗膜保護シート
JP4851613B2 (ja) * 2009-12-22 2012-01-11 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP2011178879A (ja) * 2010-03-01 2011-09-15 Nitto Denko Corp 保護シートおよびその利用
TW201134911A (en) * 2010-03-03 2011-10-16 Nitto Denko Corp Protective sheet and use thereof
MY165350A (en) * 2010-06-02 2018-03-21 Mitsui Chemicals Tohcello Inc Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
US8647966B2 (en) * 2011-06-09 2014-02-11 National Semiconductor Corporation Method and apparatus for dicing die attach film on a semiconductor wafer
JP5801615B2 (ja) * 2011-06-14 2015-10-28 日東電工株式会社 セパレータの選定方法および該選定方法により選定されたセパレータを用いた粘着シート
JP5883617B2 (ja) * 2011-11-09 2016-03-15 日東電工株式会社 セパレータ付き粘着シート
US8853304B2 (en) 2011-11-29 2014-10-07 Sabic Innovative Plastics Ip B.V. Polyester compositions and insert-molded articles made therefrom
FR2985601B1 (fr) * 2012-01-06 2016-06-03 Soitec Silicon On Insulator Procede de fabrication d'un substrat et structure semiconducteur
CN103254827A (zh) * 2012-02-15 2013-08-21 日东电工株式会社 表面保护片
WO2013154877A2 (en) * 2012-04-13 2013-10-17 Arkema France Multilayer polymeric structure
JP6001964B2 (ja) * 2012-09-04 2016-10-05 リンテック株式会社 半導体加工シート及び半導体装置の製造方法
CN104756237A (zh) * 2012-12-28 2015-07-01 琳得科株式会社 切割片用基材膜及切割片
US20140311097A1 (en) * 2013-02-21 2014-10-23 Nicolas J. Etienne Device for covering a door to provide for smoke and odor insulation and method for using and packaging same
CN105143379B (zh) 2013-02-21 2018-05-29 3M创新有限公司 包含多层聚烯烃聚合物材料的自粘条带和方法
EP3159914B1 (en) * 2014-06-18 2019-07-24 LINTEC Corporation Dicing-sheet base film and dicing sheet
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
KR101796761B1 (ko) 2015-09-04 2017-11-13 태영화학공업 주식회사 Pvc 테이프 및 그 제조 방법
TWI595071B (zh) * 2015-10-22 2017-08-11 Furukawa Electric Co Ltd Semiconductor wafer surface polishing process surface protection adhesive tape and semiconductor wafer grinding method
CN105172318B (zh) * 2015-10-23 2017-06-20 苏州达翔新材料有限公司 一种胶粘制品的模切工艺
KR102609355B1 (ko) 2016-09-28 2023-12-05 삼성전자주식회사 보호 필름 및 이를 포함하는 전자제품
WO2018084158A1 (ja) * 2016-11-02 2018-05-11 株式会社ユポ・コーポレーション フィルム、巻回体および粘着テープ
CN108102567B (zh) * 2018-01-08 2021-06-25 广东硕成科技有限公司 一种柔性线路板用高性能pvc防镀膜及其制备方法和应用
WO2019146605A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートおよびその巻収体
CN112088196B (zh) * 2018-05-10 2023-02-28 日东新兴有限公司 热熔粘接片

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WO1999016608A1 (en) * 1997-10-01 1999-04-08 Minnesota Mining And Manufacturing Company Embossed oriented polymer films
JPH11193367A (ja) * 1997-11-05 1999-07-21 Sekisui Chem Co Ltd 表面保護フィルム
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JP4437867B2 (ja) * 2000-11-15 2010-03-24 日東電工株式会社 剥離シートおよびそれを有する感圧性接着シート
JP4780828B2 (ja) * 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP5192622B2 (ja) 2001-02-06 2013-05-08 アキレス株式会社 ダイシング用基体フィルム
MXPA04003265A (es) * 2001-10-17 2004-07-23 Avery Dennison Corp Peliculas contractiles multicapa y etiquetas hechas a partir de las mismas.

Also Published As

Publication number Publication date
KR100610211B1 (ko) 2006-08-10
TW200512270A (en) 2005-04-01
KR20050016180A (ko) 2005-02-21
CN1590490A (zh) 2005-03-09
EP1505137B1 (en) 2007-04-25
CN1308140C (zh) 2007-04-04
EP1505137A1 (en) 2005-02-09
US20050031822A1 (en) 2005-02-10
US20090294043A1 (en) 2009-12-03

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees