CN1308140C - 粘合片材 - Google Patents

粘合片材 Download PDF

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Publication number
CN1308140C
CN1308140C CNB2004100700382A CN200410070038A CN1308140C CN 1308140 C CN1308140 C CN 1308140C CN B2004100700382 A CNB2004100700382 A CN B2004100700382A CN 200410070038 A CN200410070038 A CN 200410070038A CN 1308140 C CN1308140 C CN 1308140C
Authority
CN
China
Prior art keywords
adhesive sheet
layer
adhesive
weight
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100700382A
Other languages
English (en)
Chinese (zh)
Other versions
CN1590490A (zh
Inventor
相原伸
猿渡益巳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Mitsui Chemical Industry Co Ltd
Original Assignee
Mitsui Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemical Industry Co Ltd filed Critical Mitsui Chemical Industry Co Ltd
Publication of CN1590490A publication Critical patent/CN1590490A/zh
Application granted granted Critical
Publication of CN1308140C publication Critical patent/CN1308140C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B32B2323/043—HDPE, i.e. high density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B32B2323/046—LDPE, i.e. low density polyethylene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
CNB2004100700382A 2003-08-07 2004-08-05 粘合片材 Expired - Fee Related CN1308140C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003288498 2003-08-07
JP2003288498 2003-08-07

Publications (2)

Publication Number Publication Date
CN1590490A CN1590490A (zh) 2005-03-09
CN1308140C true CN1308140C (zh) 2007-04-04

Family

ID=33550043

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100700382A Expired - Fee Related CN1308140C (zh) 2003-08-07 2004-08-05 粘合片材

Country Status (5)

Country Link
US (2) US20050031822A1 (enExample)
EP (1) EP1505137B1 (enExample)
KR (1) KR100610211B1 (enExample)
CN (1) CN1308140C (enExample)
TW (1) TW200512270A (enExample)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006088074A1 (ja) * 2005-02-18 2006-08-24 Mitsui Chemicals, Inc. 半導体ウェハ表面保護シート及び該保護シートを用いる半導体ウェハの保護方法
EP1867692B1 (en) * 2005-03-29 2013-01-16 Mitsui Chemicals, Inc. Propylenic polymer composition for adhesives and laminates made by using the same
WO2006132183A1 (ja) * 2005-06-06 2006-12-14 Sekisui Chemical Co., Ltd. 表面保護フィルム
KR101276992B1 (ko) * 2005-11-08 2013-06-24 도레이 카부시키가이샤 폴리에스테르 적층 필름 및 전사박
KR100878752B1 (ko) * 2005-12-09 2009-01-14 에스케이유티스 (주) 충격흡수 및 실링용 시트
US7758964B2 (en) * 2006-02-10 2010-07-20 3M Innovative Properties Company Flame resistant covercoat for flexible circuit
JP2007268723A (ja) * 2006-03-30 2007-10-18 Lintec Corp 剥離シート
US7892891B2 (en) * 2006-10-11 2011-02-22 SemiLEDs Optoelectronics Co., Ltd. Die separation
JP5863157B2 (ja) * 2006-12-18 2016-02-16 日東電工株式会社 粘着シート
US8410880B2 (en) 2007-03-16 2013-04-02 Magnum Magnetics Corporation Material magnetizer systems
US9208934B1 (en) 2007-03-16 2015-12-08 Magnum Magnetics Corporation Material magnetizer systems
US8410881B2 (en) 2007-03-16 2013-04-02 Magnum Magnetics Corporation Material magnetizer systems
US7728706B2 (en) 2007-03-16 2010-06-01 Ogden Jr Orval D Material magnetizer systems
US9457547B2 (en) * 2007-11-07 2016-10-04 Magnum Magnetics Corporation Extrudable adherable material systems
KR100926259B1 (ko) * 2008-02-05 2009-11-12 주식회사 옵트론텍 광학용 글래스 표면보호 절단방법
DE102008021841A1 (de) * 2008-04-30 2009-11-05 Tesa Se Polyolefinfolie und Verwendung derselben
US8298917B2 (en) * 2009-04-14 2012-10-30 International Business Machines Corporation Process for wet singulation using a dicing singulation structure
JP5748952B2 (ja) * 2009-11-27 2015-07-15 日東電工株式会社 塗膜保護シート
JP4851613B2 (ja) * 2009-12-22 2012-01-11 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
JP2011178879A (ja) * 2010-03-01 2011-09-15 Nitto Denko Corp 保護シートおよびその利用
TW201134911A (en) * 2010-03-03 2011-10-16 Nitto Denko Corp Protective sheet and use thereof
PH12012501962A1 (en) * 2010-06-02 2014-10-01 Mitsui Chemicals Tohcello Inc Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
US8647966B2 (en) * 2011-06-09 2014-02-11 National Semiconductor Corporation Method and apparatus for dicing die attach film on a semiconductor wafer
JP5801615B2 (ja) * 2011-06-14 2015-10-28 日東電工株式会社 セパレータの選定方法および該選定方法により選定されたセパレータを用いた粘着シート
JP5883617B2 (ja) * 2011-11-09 2016-03-15 日東電工株式会社 セパレータ付き粘着シート
US8853304B2 (en) 2011-11-29 2014-10-07 Sabic Innovative Plastics Ip B.V. Polyester compositions and insert-molded articles made therefrom
FR2985601B1 (fr) * 2012-01-06 2016-06-03 Soitec Silicon On Insulator Procede de fabrication d'un substrat et structure semiconducteur
CN103254827A (zh) * 2012-02-15 2013-08-21 日东电工株式会社 表面保护片
WO2013154877A2 (en) * 2012-04-13 2013-10-17 Arkema France Multilayer polymeric structure
JP6001964B2 (ja) * 2012-09-04 2016-10-05 リンテック株式会社 半導体加工シート及び半導体装置の製造方法
EP2940717A4 (en) * 2012-12-28 2016-08-10 Lintec Corp CUTTING FOIL SUBSTRATE FILM AND CUTTING FOIL
US20140311097A1 (en) * 2013-02-21 2014-10-23 Nicolas J. Etienne Device for covering a door to provide for smoke and odor insulation and method for using and packaging same
KR102252057B1 (ko) 2013-02-21 2021-05-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리올레핀 중합체 재료의 다층을 포함하는 자가-접착성 테이프 및 방법
EP3159914B1 (en) * 2014-06-18 2019-07-24 LINTEC Corporation Dicing-sheet base film and dicing sheet
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
KR101796761B1 (ko) 2015-09-04 2017-11-13 태영화학공업 주식회사 Pvc 테이프 및 그 제조 방법
TWI595071B (zh) * 2015-10-22 2017-08-11 Furukawa Electric Co Ltd Semiconductor wafer surface polishing process surface protection adhesive tape and semiconductor wafer grinding method
CN105172318B (zh) * 2015-10-23 2017-06-20 苏州达翔新材料有限公司 一种胶粘制品的模切工艺
KR102609355B1 (ko) 2016-09-28 2023-12-05 삼성전자주식회사 보호 필름 및 이를 포함하는 전자제품
CN109890882B (zh) * 2016-11-02 2021-12-07 优泊公司 薄膜、卷绕体及粘合带
CN108102567B (zh) * 2018-01-08 2021-06-25 广东硕成科技有限公司 一种柔性线路板用高性能pvc防镀膜及其制备方法和应用
CN111655470A (zh) * 2018-01-24 2020-09-11 琳得科株式会社 长条层叠片及其卷料
CN112088196B (zh) * 2018-05-10 2023-02-28 日东新兴有限公司 热熔粘接片

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395602A (zh) * 2000-11-22 2003-02-05 三井化学株式会社 晶片机械加工粘结带及其制造和使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001518404A (ja) * 1997-10-01 2001-10-16 ミネソタ マイニング アンド マニュファクチャリング カンパニー エンボス加工された延伸ポリマーフィルム
JPH11193367A (ja) * 1997-11-05 1999-07-21 Sekisui Chem Co Ltd 表面保護フィルム
US6436531B1 (en) * 1998-07-20 2002-08-20 3M Innovative Properties Company Polymer blends and tapes therefrom
US6451425B1 (en) * 1999-06-16 2002-09-17 3M Innovative Properties Company Adhesive tape backing
JP4437867B2 (ja) * 2000-11-15 2010-03-24 日東電工株式会社 剥離シートおよびそれを有する感圧性接着シート
JP5192622B2 (ja) 2001-02-06 2013-05-08 アキレス株式会社 ダイシング用基体フィルム
CA2463076A1 (en) * 2001-10-17 2003-04-24 Avery Dennison Corporation Multilayered shrink films and articles encapsulated therewith

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395602A (zh) * 2000-11-22 2003-02-05 三井化学株式会社 晶片机械加工粘结带及其制造和使用方法

Also Published As

Publication number Publication date
EP1505137A1 (en) 2005-02-09
KR20050016180A (ko) 2005-02-21
TW200512270A (en) 2005-04-01
US20090294043A1 (en) 2009-12-03
US20050031822A1 (en) 2005-02-10
TWI324629B (enExample) 2010-05-11
CN1590490A (zh) 2005-03-09
EP1505137B1 (en) 2007-04-25
KR100610211B1 (ko) 2006-08-10

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Granted publication date: 20070404

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CF01 Termination of patent right due to non-payment of annual fee