TWI315244B - - Google Patents

Info

Publication number
TWI315244B
TWI315244B TW98104232A TW98104232A TWI315244B TW I315244 B TWI315244 B TW I315244B TW 98104232 A TW98104232 A TW 98104232A TW 98104232 A TW98104232 A TW 98104232A TW I315244 B TWI315244 B TW I315244B
Authority
TW
Taiwan
Application number
TW98104232A
Other languages
Chinese (zh)
Other versions
TW200930524A (en
Inventor
Satoshi Sueyoshi
Kentaro Tanaka
Tomohiro Matsuo
Original Assignee
Yaskawa Denki Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Denki Seisakusho Kk filed Critical Yaskawa Denki Seisakusho Kk
Publication of TW200930524A publication Critical patent/TW200930524A/en
Application granted granted Critical
Publication of TWI315244B publication Critical patent/TWI315244B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW98104232A 2006-07-11 2007-07-10 Multijoint robot TW200930524A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006190822 2006-07-11

Publications (2)

Publication Number Publication Date
TW200930524A TW200930524A (en) 2009-07-16
TWI315244B true TWI315244B (en) 2009-10-01

Family

ID=38923081

Family Applications (3)

Application Number Title Priority Date Filing Date
TW96125092A TW200817151A (en) 2006-07-11 2007-07-10 Multijoint robot
TW98104232A TW200930524A (en) 2006-07-11 2007-07-10 Multijoint robot
TW98104233A TW200932456A (en) 2006-07-11 2007-07-10 Multijoint robot

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW96125092A TW200817151A (en) 2006-07-11 2007-07-10 Multijoint robot

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW98104233A TW200932456A (en) 2006-07-11 2007-07-10 Multijoint robot

Country Status (5)

Country Link
JP (3) JP4168410B2 (en)
KR (3) KR100914387B1 (en)
CN (3) CN101863015B (en)
TW (3) TW200817151A (en)
WO (1) WO2008007516A1 (en)

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* Cited by examiner, † Cited by third party
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JP4655228B2 (en) * 2006-07-11 2011-03-23 株式会社安川電機 Articulated robot and transfer method of articulated robot
JP2010064219A (en) * 2008-09-12 2010-03-25 Yaskawa Electric Corp Multi-joint robot
JP4591624B1 (en) * 2010-03-12 2010-12-01 株式会社安川電機 Industrial robot
KR200466172Y1 (en) * 2010-04-28 2013-04-09 히라따기꼬오 가부시키가이샤 Substrate transferring robot
CN103079774B (en) * 2010-09-13 2015-03-04 丰田自动车株式会社 Support arm
KR101211911B1 (en) * 2010-11-02 2012-12-13 주식회사 로보스타 Robot for reversing panels of display apparatus
KR101682465B1 (en) * 2010-11-17 2016-12-05 삼성전자 주식회사 Robot for transporting substrate
JP5847393B2 (en) * 2010-11-30 2016-01-20 川崎重工業株式会社 Transfer robot
CN102145488B (en) * 2011-02-14 2012-12-26 山东爱通工业机器人科技有限公司 Flexible four-DOF (Degree of Freedom) mechanical arm
JP5565345B2 (en) * 2011-03-07 2014-08-06 株式会社安川電機 Transfer robot
CN102161199B (en) * 2011-03-16 2012-09-19 哈尔滨工业大学 W-axis coaxial transmission mechanism for silicon wafer transmission robot
CN102126209B (en) * 2011-03-16 2012-08-15 哈尔滨工业大学 W-shaft differential shaft transmission mechanism used for wafer-handling robot
CN102126208B (en) * 2011-03-16 2012-09-19 哈尔滨工业大学 Parallel connection type R-shaft expansion mechanical arm
CN102152297B (en) * 2011-03-16 2013-04-10 哈尔滨工业大学 Series type R-shaft expanding mechanical arm
JP5387622B2 (en) * 2011-06-17 2014-01-15 株式会社安川電機 Transfer robot
JP5429256B2 (en) * 2011-10-03 2014-02-26 株式会社安川電機 Robot system
JP5768827B2 (en) * 2013-03-14 2015-08-26 株式会社安川電機 Robot system and workpiece transfer method
KR101458697B1 (en) * 2013-04-19 2014-11-05 현대중공업 주식회사 Apparatus and Method for Transferring Substrate
JP6295037B2 (en) * 2013-08-08 2018-03-14 日本電産サンキョー株式会社 Industrial robot
KR101506188B1 (en) * 2013-08-30 2015-03-26 주식회사 로보스타 Transfer robot having multiple arm
JP6352016B2 (en) * 2014-03-27 2018-07-04 日本電産サンキョー株式会社 Industrial robot
CN105922233B (en) * 2016-06-28 2018-08-07 江苏捷帝机器人股份有限公司 A kind of high accurate intelligent mechanical arm and its working method
CN105922242B (en) * 2016-06-28 2018-06-29 江苏捷帝机器人股份有限公司 A kind of efficient Intelligentized mechanical arm and its method of work
CN106041876B (en) * 2016-06-28 2019-01-29 江苏捷帝机器人股份有限公司 A kind of the Intelligentized mechanical arm and its working method of all-around mobile
CN106078724B (en) * 2016-06-29 2020-01-24 微创（上海）医疗机器人有限公司 Mechanical arm and surgical robot thereof
CN106175934B (en) * 2016-06-29 2019-04-30 微创（上海）医疗机器人有限公司 Operating robot and its mechanical arm
JP6873881B2 (en) * 2017-10-13 2021-05-19 日本電産サンキョー株式会社 Industrial robot
KR102059445B1 (en) 2017-11-28 2019-12-27 주식회사 엠티에스이 Mobile work table
CN108608460A (en) * 2018-04-23 2018-10-02 深圳市华星光电半导体显示技术有限公司 Mechanical arm configuration and robot
CN110549354A (en) * 2018-05-31 2019-12-10 北新集团建材股份有限公司 Lower-copying type mechanical grabbing clamp
CN110454554A (en) * 2019-08-26 2019-11-15 苏州领裕电子科技有限公司 A kind of uniaxial folding linear arm mould group
JP2022104004A (en) * 2020-12-28 2022-07-08 日本電産サンキョー株式会社 Industrial robot

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58109284A (en) * 1981-12-22 1983-06-29 株式会社小松製作所 Robot device
GB2287045B (en) * 1994-03-04 1997-05-14 Joseph Michael Programmable materials
JP2599571B2 (en) * 1994-05-11 1997-04-09 ダイトロンテクノロジー株式会社 Substrate transfer robot
JPH11347982A (en) * 1998-06-02 1999-12-21 Mecs Corp Sliding part structure of carrying robot
CN2341778Y (en) * 1998-12-02 1999-10-06 和椿事业股份有限公司 Mechanical arm
JP3973006B2 (en) 2000-03-23 2007-09-05 日本電産サンキョー株式会社 Double arm robot
JP2003158170A (en) * 2001-11-20 2003-05-30 Aitec:Kk Slot detector of cassette for substrate
CN2637135Y (en) * 2003-07-02 2004-09-01 陕西科技大学 Can type lifting and position rotating mechanical hand
CN100342519C (en) * 2003-07-16 2007-10-10 东京毅力科创株式会社 Transport device and drive mechanism
JP4063781B2 (en) * 2004-03-04 2008-03-19 株式会社ラインワークス Transport device
KR101108767B1 (en) * 2006-07-11 2012-03-13 가부시키가이샤 야스카와덴키 Multi-joint robot and wiring method

Also Published As

Publication number Publication date
TWI315243B (en) 2009-10-01
KR101120824B1 (en) 2012-03-23
JP5077406B2 (en) 2012-11-21
CN101360589B (en) 2011-02-09
TW200932456A (en) 2009-08-01
KR20080081196A (en) 2008-09-08
KR20080082606A (en) 2008-09-11
CN101863015B (en) 2012-02-15
CN101844359B (en) 2013-06-05
KR100914386B1 (en) 2009-08-28
JP2010274413A (en) 2010-12-09
JP2008155361A (en) 2008-07-10
TW200817151A (en) 2008-04-16
TWI357375B (en) 2012-02-01
TW200930524A (en) 2009-07-16
CN101360589A (en) 2009-02-04
KR20080081197A (en) 2008-09-08
KR100914387B1 (en) 2009-08-28
CN101863015A (en) 2010-10-20
JP4596375B2 (en) 2010-12-08
CN101844359A (en) 2010-09-29
JP4168410B2 (en) 2008-10-22
WO2008007516A1 (en) 2008-01-17
JPWO2008007516A1 (en) 2009-12-10

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