TWI299354B - - Google Patents
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- TWI299354B TWI299354B TW091118754A TW91118754A TWI299354B TW I299354 B TWI299354 B TW I299354B TW 091118754 A TW091118754 A TW 091118754A TW 91118754 A TW91118754 A TW 91118754A TW I299354 B TWI299354 B TW I299354B
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- TW
- Taiwan
- Prior art keywords
- weight
- epoxy resin
- adhesive
- adhesive layer
- parts
- Prior art date
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- 150000001875 compounds Chemical class 0.000 claims abstract description 59
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 48
- 239000003822 epoxy resin Substances 0.000 claims abstract description 47
- 239000012790 adhesive layer Substances 0.000 claims abstract description 37
- 230000005855 radiation Effects 0.000 claims abstract description 33
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 239000002390 adhesive tape Substances 0.000 claims abstract description 19
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000010521 absorption reaction Methods 0.000 claims abstract description 11
- 239000003999 initiator Substances 0.000 claims abstract description 11
- 239000010410 layer Substances 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 33
- 239000000853 adhesive Substances 0.000 abstract description 32
- 230000001464 adherent effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 31
- 238000001723 curing Methods 0.000 description 19
- 239000010408 film Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 16
- -1 (meth)acrylic acid acetal Chemical class 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 12
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 11
- 229910052707 ruthenium Inorganic materials 0.000 description 11
- 239000005056 polyisocyanate Substances 0.000 description 10
- 229920001228 polyisocyanate Polymers 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
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- 238000005520 cutting process Methods 0.000 description 6
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000002619 bicyclic group Chemical group 0.000 description 5
- 235000013339 cereals Nutrition 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
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- 239000005977 Ethylene Substances 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 239000004816 latex Substances 0.000 description 4
- 229920000126 latex Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 4
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- 239000000052 vinegar Substances 0.000 description 4
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
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- 239000003925 fat Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002023 wood Substances 0.000 description 3
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 244000166124 Eucalyptus globulus Species 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 125000002723 alicyclic group Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- CSNNWDJQKGMZPO-UHFFFAOYSA-N benzoic acid;2-hydroxy-1,2-diphenylethanone Chemical compound OC(=O)C1=CC=CC=C1.C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 CSNNWDJQKGMZPO-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- PMJHHCWVYXUKFD-UHFFFAOYSA-N pentadiene group Chemical group C=CC=CC PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- LNOLJFCCYQZFBQ-BUHFOSPRSA-N (ne)-n-[(4-nitrophenyl)-phenylmethylidene]hydroxylamine Chemical compound C=1C=C([N+]([O-])=O)C=CC=1C(=N/O)/C1=CC=CC=C1 LNOLJFCCYQZFBQ-BUHFOSPRSA-N 0.000 description 1
- ADYKPXIKPPZOQF-UHFFFAOYSA-N 1,1'-biphenyl;hydrazine Chemical compound NN.C1=CC=CC=C1C1=CC=CC=C1 ADYKPXIKPPZOQF-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- GFZJWZSGKFGOPI-UHFFFAOYSA-N 2,4-diethyl-3H-thiazepine Chemical compound C(C)N1SC=CC=C(C1)CC GFZJWZSGKFGOPI-UHFFFAOYSA-N 0.000 description 1
- XJDYMITYKGXGPC-UHFFFAOYSA-N 2-(2-aminoethoxycarbonyl)benzoic acid Chemical compound NCCOC(=O)C1=CC=CC=C1C(O)=O XJDYMITYKGXGPC-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- DAWJJMYZJQJLPZ-UHFFFAOYSA-N 2-sulfanylprop-2-enoic acid Chemical class OC(=O)C(S)=C DAWJJMYZJQJLPZ-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- LLNNEUFFUNTORG-UHFFFAOYSA-N 9-chloropurine Chemical compound N1=CN=C2N(Cl)C=NC2=C1 LLNNEUFFUNTORG-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- YXUZGQZVKQECOF-UHFFFAOYSA-N C(C1CO1)[Ru] Chemical compound C(C1CO1)[Ru] YXUZGQZVKQECOF-UHFFFAOYSA-N 0.000 description 1
- CNWDCXJSNRJZRC-UHFFFAOYSA-N CC(C)(C)C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C Chemical compound CC(C)(C)C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C CNWDCXJSNRJZRC-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 206010020649 Hyperkeratosis Diseases 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- IJZXKYZCSGWGKW-UHFFFAOYSA-N N1(NN1)C(C(=O)O)C.C(O)C(CO)(CO)CO Chemical compound N1(NN1)C(C(=O)O)C.C(O)C(CO)(CO)CO IJZXKYZCSGWGKW-UHFFFAOYSA-N 0.000 description 1
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229920012485 Plasticized Polyvinyl chloride Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 206010036790 Productive cough Diseases 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- ATMLPEJAVWINOF-UHFFFAOYSA-N acrylic acid acrylic acid Chemical class OC(=O)C=C.OC(=O)C=C ATMLPEJAVWINOF-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- FFBZKUHRIXKOSY-UHFFFAOYSA-N aziridine-1-carboxamide Chemical compound NC(=O)N1CC1 FFBZKUHRIXKOSY-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 229940125898 compound 5 Drugs 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- DNWBGZGLCKETOT-UHFFFAOYSA-N cyclohexane;1,3-dioxane Chemical compound C1CCCCC1.C1COCOC1 DNWBGZGLCKETOT-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- BMFYCFSWWDXEPB-UHFFFAOYSA-N cyclohexyl(phenyl)methanone Chemical compound C=1C=CC=CC=1C(=O)C1CCCCC1 BMFYCFSWWDXEPB-UHFFFAOYSA-N 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical group C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- YHHHHJCAVQSFMJ-UHFFFAOYSA-N decadiene group Chemical group C=CC=CCCCCCC YHHHHJCAVQSFMJ-UHFFFAOYSA-N 0.000 description 1
- GTBGXKPAKVYEKJ-UHFFFAOYSA-N decyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C(C)=C GTBGXKPAKVYEKJ-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- ZFTFAPZRGNKQPU-UHFFFAOYSA-N dicarbonic acid Chemical compound OC(=O)OC(O)=O ZFTFAPZRGNKQPU-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- QPMJENKZJUFOON-PLNGDYQASA-N ethyl (z)-3-chloro-2-cyano-4,4,4-trifluorobut-2-enoate Chemical compound CCOC(=O)C(\C#N)=C(/Cl)C(F)(F)F QPMJENKZJUFOON-PLNGDYQASA-N 0.000 description 1
- DUZXOCGAFNRAAG-UHFFFAOYSA-N ethyl carbamate;propane-1,2,3-triol Chemical compound CCOC(N)=O.OCC(O)CO DUZXOCGAFNRAAG-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 210000003746 feather Anatomy 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229930182470 glycoside Natural products 0.000 description 1
- 150000002338 glycosides Chemical class 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Landscapes
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Description
I299354 ^、發明說明 [發明所屬之技術領域] ^本發明係關於一種新穎感壓黏性膠帶。特別是本發明 員關表一種感壓黏性膠帶,該黏性膠帶特別適合用於矽晶 Q等之切晶粒以及進打將切晶粒所得晶片接合至之 過裎。 [先前技術] / 、例如矽或砷化鎵製成之半導·體晶圓係製造成大直徑 y式。此種晶圓係經切割分離(切晶粒)成為小元件晶片(ic :片)’且移送至隨後之固定步驟。此種過程中,特別是半 =體晶圓係以黏貼至感壓黏性膠帶之狀態而接受切晶粒、 凊潔、乾燥、擴展及拾取等步驟,並移送至隨後之接合步 •驟0 β、則述從半導體晶圓切晶/粒步驟至拾取步驟所使用之 I‘性& f需要具有某種膠黏^度,該膠黏㉟度需夠大以 切晶粒至乾燥步驟期間可牢固地固定晶圓晶片,但該膠 母占強度之程度又不會讓任何膠黏劑於拾取步驟黏合至曰 曰 u 曰曰圓 曰曰户j 〇
經::之晶片於晶粒接合步驟中,使用晶粒接合膠黏 二例如氧树脂膠I占齊j而接合至導線架。由此製造半導體 •^置仁田1C晶片極小時,適量膠黏劑的使用則有困難, ,會發生膠黏劑溢流Ic晶片的問題。相反地,以大的1C 曰片而ϋ則會出現例如因膠點劑用量不足而無法達成亘 有滿意強度的接人夕pq日 /、 〇之問通。此外,此種sa粒接合膠黏劑之 313934 6 1299354 施用係煩jg蓉 二、、、工。因此需要可簡化製造過程之改善辦法。 * ^為了角牛决珂述各項問題,曾經提出多種晶圓黏貼用之 ^ 5亥膠帶可發揮晶圓固定功能以及晶粒接合功能 ( >考曰本專利公開公告第2(1990)-321 81號)。 膠帶,2 =利公開公告第2(1990)_32181號揭示一種感壓 ^ 〃、匕括底材以及疊置其上之膠黏層,該膠黏層係由 成物所構成,該組成物係由(甲基)丙烯酸酯共聚 ,、、、通用的環氧樹脂、㉟用的可光聚物低分子量化合物、 …、化的’曰在裱氧樹脂固化劑以及光聚合引發劑所組成。 此種膠黏層於晶圓切晶粒時發揮晶圓固定功能。而於切晶 =完成後,當曝光於能量輻射時,該膠黏層固化,結果^ 黏層與底材間之膠黏強度降低。因此,拾取ic晶片時,感 壓膠黏層連同1C晶片一起由底材脫離。將帶有感壓膠黏層 之1C晶片固定於導線架上並加熱。隨後,膠黏層所含之環 氧樹脂產生接合強度因而最終將Ic晶片接合至導線架。 别述公開文獻所揭示用於晶圓黏貼之膠帶可進行所 謂的直接晶粒接合,因而免除施用晶粒接合膠黏劑之步 驟。亦即,於膠帶之膠黏層中,各種組成分皆於以能量輻 射固化及熱固化進行之晶粒接合過程固化,因此晶片與導 線架間,彼此係以極高強度接合。 隨後通常經由迴鋒步驟而進行接線接合。 近年來,發展出不含鉛之焊料並用於迴銲步驟俾因應 環保議題。不含錯之)千料的’丨容點比習知含絡之焊料的溶點 高,因而無矸避免地以車乂阿溫度進行迴銲。以高溫進行迴 313934 7 1299354 銲時,即使膠黏芦冬古丨θ 曰3有小$的水也將蒸發及膨脹,因而造 成封裝體龜裂的風險。 此外,於晶粒接合時,膠黏層需要適#地隨形黏附於 破黏合表面的輪廓。牯 ^ 別為了於熱壓接合時提升隨後的性 貝,膠黏層之彈性筏鉍女人丄、 羽 ’、;向溫熱壓接合時應降低。但前述 名知的膠黏劑,就此方面立 m ^ m ^而s仍未臻滿思。因而仍然需要 對感Μ膠黏劑加以改進。 [發明内容] (發明目的) 有鐘於前述先前技藝狀態而 的係提供一種黏 月本發明之目 固化物之吸水性,且了吹'、 ♦站層可減少膠黏層 (發明概述) 坪改係數。 本發明之純”包括底層以及疊置 層,此種膠勤岛4 /、上之I黏 Μ夏修黏層包括黏合成 的潛在環氧樹脂固化劑(c)、能量輻:;;= 及光聚合引發劑(E), σ匕。物(D)以 其中之環氧樹脂(B)與能量輻射人化 —者或二者於1分+ φ目士 ♦ °化合物(D)之任 士 . /、刀子中具有二環戊二烯骨架。 考X明中,較佳者係環氧樹脂 環戊二烯骨架·· 厂、有以下式表示之二 313934 8 1299354
能量輻射可聚合化合物(D)具有以下式表示之二環戍 一稀骨架應為較佳者: 〇 II ch2=crcoh2c
〇 CH2〇CCR=CH2 其中之R為氫原子或曱基。 本發明提供一種具有一膠黏層之黏性膠帶,該膠黏 T減少膠黏固化產物之吸水性,藉此避免迴銲時封裝體 裂;以及該膠黏層可降低其熱壓接合時的彈性係數,因 確保高度隨形黏附於被黏合表面之輪廓之能力。 (發明之詳細說明) 如前文所述,本發明之黏性膠帶包括底層以及疊置 上之膠黏層,此種膠黏層包括多 且 .4合成分(A)、環氧樹脂(B) …'活化的潛在環氧樹脂固化劑曰 剎(L)旎置輻射可聚合化合」 (D)以及光聚合引發劑(£),
其中之環氧樹脂(B)與能I _ , v 厂'月匕里1田射可聚合化合物(D)之右 或一者方;其分子中具有二環戊二烯骨芊。 首先說明组成膠黏層之各種成分之細節如後。 雖然丙烯酸系、聚酯 胺基甲酸乙酯、聚矽酮、天辩 3)3934 9 1299354 橡膠感壓膠㈣及其它多種通用的感壓膠黏劑均可用作為 黏合成分(A),但本發明特佳係採用丙烯酸系感壓膠黏劑。 就丙烯酸糸感壓膠黏劑而言,可提及者例如(甲基)丙 烯酸醋單體與(甲基)丙烯酸衍生物所衍生之結構單元所組 成之(甲基)丙烯酸醋共聚物。至於(甲基)丙烯酸醋單體,可 使用(甲基)丙烯酸環烷_、(甲基)丙烯酸苄酯及帶有含工 至18個碳原子之烷基之(甲基)丙烯酸烷基酯中之任一者。 其中4寸佳係使用帶有含丨至丨8個碳原子之烷基之(甲基) 丙烯酸烷基酯,例如丙烤酸曱酯、甲基丙烯酸甲酯、丙烯 酸乙酯、曱基丙烯酸乙酯、丙烯酸丙酯、甲基丙烯酸丙酯、 丙烯馱丁 g曰或甲基丙烯酸丁酯。至於(曱基)丙烯酸衍生 物,可提及者例如帶有縮水甘油基之(甲基)丙烯酸縮水甘 油酯或帶有羥基之丙烯酸羥乙酯。 (曱基)丙烯酸酯共聚物中,衍生自(甲基)丙烯酸縮水甘 油酯之結構單元之含量通常為〇至8〇莫耳%,較佳為5至 5 0莫耳/〇。將縮水甘油基導入(甲基)丙稀酸酯共聚物可提 高(曱基)丙烯酸酯共聚物與環氧樹脂(B)之相容性,升高固 化產物之Tg,且實現熱安定性的改良。將經化單體如丙烯 酸^乙S旨導入(曱基)丙烯酸酯共聚物中,有助於控制對被 黏合物之黏合力以及感壓膠黏性質。 丙稀酸糸感壓膠黏劑之分子量較佳為1 〇 〇,〇 〇 〇或以 上’又更佳為1 50,000至1,000,000之範圍。丙烯酸系感壓 %點劑之玻璃轉化溫度通常為2 0 °C或以下,且較佳為約· 7 〇 C至0 C之範圍。丙稀酸系感壓膠黏劑於室溫(2 3 °c )具有 313934 Ϊ299354 點性。 月匕,2 =為環氧樹脂(B)且具有二環戊二烯骨架知 子中H環戍二婦骨架以及反應性環氧 。%氧樹脂於室溫通常為固體,軟化溫声、i於其分 至90°C,更件。度較佳為約40 土為5至80 C及較理想為5〇至 此種具有二护# — a p 王/υ C之範圍。 衣戊一烯月架之環氧樹旦 至3000,爭社法 于里較佳為430 更佳為700至2500及較理想為1000 $ 範圍。具有二产一 至2〇〇〇之 一衣戊一焯月罙之環氧樹脂之環氧去曰 15〇至1000身/去旦 ..^ 衣虱田夏較佳為 見/田里,更佳為200至goo*/去旦 為210至400克/當量之範圍。 田里及較理想 具有二環戊二烯骨架之此等環 用下式之環氧樹脂: 中’特佳係採
其η值為〇至U)之範圍之不同數 物亦可用作為呈有_環戊-烯凡加 虱树月曰化& …“ 月架之環氧樹脂。舉例言 之,作為此種環氧樹脂混合物者 ΊΠΠη T ^ ^^挺及裱氧樹脂XD- 1 000-L 及 xD-1〇〇〇_2L(商品名, 製造)。 NlPP〇n Kayaku Co.? Ltd. 此等具有二環戊二烯骨架 (衣乳樹脂可各別使用或 313934 11 1299354 组合使用。 使用具有二環戍二烯骨架之戸β 士 ⑻,而未與後述其它通用的環氧::::作±為環氧樹脂 100重量份前述為合成分⑷,該二曰:且口時’相對於每 5至〗_重量份’更佳為5。至:::::脂之添加量較佳為 至600重量份。 里份及較理想為100 此外’亦可以具有二環戊 通用的環氧樹脂組合使用,你泛 木之裱氧樹脂與其它 環氧樹脂,較佳係使用分子^為環氧樹脂⑻。至於通用的 子量400至2〇〇〇之_般固熊严# /又液悲%氧樹脂以及分 的環氧樹脂之環氧當量㉟常::乳之摻合物 圍。至於此種通用的環氧招 見田里之乾 A、雙酉分F、間苯二齡、笨甲㈣^及者匕有酉分類(例如雙紛 樹脂)之縮水甘油醚類;醇(如丁 :醇'树曱酚酚醛清漆 醇),:水甘_,(如鄰二:乙 四風本一甲M之縮水甘油_類;經由以縮水甘 結至苯胺異氰尿酸酯等之所为 取代鍵 油基臟縮水甘油基性氫所獲得之縮水甘 衣虱树脂,以及所謂的脂環族環氧 化物,其例如係經由氡化分子内 、 併入其中所獲得,此種脂環族俨 ^又i•因而將^氧基 二環氧化物、3,4-環氧二 及環氧)環己基_55^(甲=,\二環己院叛酸酿以 ,氧)環己烷-間二喈 烷。 。 313934 12 ^99354 其中,較佳係使用雙酚縮水 的環氧樹脂。此等通用的^甘油基核乳樹脂作為通用 太於 寺通用的%氧樹脂可各別或組合使用。 本备明中,至少後述之 氧樹脂(B)中之任^ ^里田、可聚合化合物(D)與環 架。)之任-者必需於其分子中具有二環戍二稀骨 就環氧樹脂(B)而言,未 氧樹月旨,而採用其它不含二炸骨架之環 脂(即,使用且有二产六_ ^ 、 月架之通用的環氧樹 ⑴))時,相對—市骨架之能量輻射可聚合化合物 通用的浐气& 里知則述黏合成分(A),該等其 π的%乳樹脂之添加量較#袁 50至8〇〇舌旦 里季乂<土為5至1〇00重量份,更佳為 里份及較理想為]〇〇至6〇〇重量份。 樹二環戊二料架之環氧樹脂與其它通用的環氧 該環氧科… 于於母1〇0重讀丽述黏合成分㈧, 对^(B)之添加總量較佳為5至1 000重量份,更 為5 〇至8 0 〇重量份乃綮里相 土 此等纟人 伤及較理-為100至600重量份之範圍。 的/合中’具有二環戍二稀骨架之環氧樹脂對其它通用 '乳樹脂之比例較佳係於1 : 99至99: i,更佳為5 ·· 9S 至50 · 50以及較理想為】〇 : 90至40 : 60之範圍〔 固'皆化的户曰在環氧樹脂固化劑(C)係屬於下述類型之 H劑,即該固化劑於室溫不會與環氧樹脂(B)反應,但當 …、至某個溫度或更高時,該固化劑經活化而與環氧樹脂 (B)反應。 、 熱活化的潛在環氧樹脂固化劑(C)之活化可藉多種方 ^成’例如’其中活性物種(陰離子及陽離子)係經由加 ]3 313934 1299354 熱誘生化學反應而形成之方法,·其令熱 脂固化劑⑹於室溫附近係穩定地分散於環環氧樹 但於南溫時則溶解於環氧樹脂⑻而引發固 曰β)中, 法;其中固化劑包封於分子篩並於 ::方 化反應之方法;以及其中係使用微囊之方法慮而引發該固 产、、活化的,曰在核氧樹脂固化劑(c)可單獨使 使用。特別較佳係使用二氛二酿胺、味咬:二用或組合 物作為熱活化的潛在環氧樹脂固化劑(C)。 其混合 熱活化的潛在if Θ糾π η 份具有二環戍二焊骨相對於每〗。。重量 ,月木之%虱樹脂與其它通用的 二和’通常用量為0.U20重量份,較佳為〇:=月旨 重置份以及較理想為1至1〇重量份。 5 用作為能量輕射可聚合化合物(D)且具有二… 骨架之能量輕射可聚合化合物,於其分子中具/二;沐 烯骨架以及-或多個(較 _—裱戊二
團。能量輕射可聚合化人物_八早月匕,射可聚合基 „ 0 化°物(0)之分子量通常係於約H 至840且較佳為250至5〇〇之範圍。 、、 就具有二環戊二烯骨架之能量輻射可聚合 言,較佳係使用下式之可聚合化合物: 〇物而 Ο ch2=crcoh2c
CH2〇CCR=CH2
II 其中R為氮原子或甲基,及較佳為氫原子。 就具有一裱戊二烯骨架之能量輻射可聚合化合物⑺) 313934 14 1299354 而言,可提及者例如H-684(商品名,Nippon Kayaku c〇 , Ltd 製造)。 5 具有二環戊二烯骨架之能量輻射可聚合化合物⑴)可 單獨使用或組合使用。 使用具有二環戊二烯骨架之能量輻射可聚合化合物 而未使用其它後述通用的能量輻射可聚合化合物作為能量 輻射可聚合化合物⑴)時,相對於每1〇〇重量份前述黏合成 分(A),能量輻射可聚合化合物(D)之添加量較佳為至 5〇〇重量份,更佳為1〇至2〇〇重量份及較理想為2〇至 重量份。 此外,就能量輻射可聚合化合物(D)而言,亦可以具有 二環戊二烯骨架之能量輻射可聚合化合物可與其它通用的 能量輻射可聚合化合物組合使用。通用的能量輻射可聚合 化合物各別具有至少一個可聚合雙鍵於其分子中。其分^ 量通常為約100至3M00,較佳為3〇〇至1〇,〇⑼之範圍。 例如日本專利公開公告第96956及6〇(1 985卜 223 1 39號所揭示之低分子量化合物已廣泛地用作為前述 逋用的能量輻射可聚合化合物。其實例包含丙烯酸酯化合 物如二搜甲基丙烷三丙烯酸酯、四羥曱基曱烷四丙烯酸 酯、異戊四醇二丙烯酸酯、二異戊四醇單羥五丙烯酸略、 二異戊四醇六丙烯酸S旨、15肛丁二醇二丙烯酸醋、L卜己二 醇二丙烯酸酯及聚乙二醇二丙烯酸酷。 此外,可使用j有如經基或緩基之官能基的寡聚物丙 烯1 S曰化合物’例如养聚酯丙烯酸酯、胺基甲酸乙酯丙歸 313934 15 1299354 聚s旨内烯酸酯、 酸酯募聚物、環氧改質之丙烯酸酯 丙稀酸酯及衣康酸寡聚物。 當未使用具有二環戊二烯骨架之能量輻射可聚合化 合物,而只使用其它通用的(不具有二環戊二稀骨架)_息 輕射可聚合化合物(即,使用具有二環戊二烯骨架之琴:= 脂(B))作為能量輻射可聚合化合物(D)時,相對於每料 量份前述黏合成分(A),其它通用的能量輻射可聚合化八重 之添加量較佳為〇·1至500重量份,更佳為1〇至2〇〇 份及較理想為2 0至1 0 0重量份。 星 具有二環戊二烯骨架之能量輻射可聚合化合物與其 它通用的能量輻射可聚合化合物組合使用時,相對=每 100重里伤則述黏合成分(Α),能量輻射可聚合化合物(〇) 曰、力‘里較佳係於0·1至500重量份,更佳1〇至200重 里=及較理想為20至i 〇〇重量份之範圍。此種組合中,具 $:裱戊二烯骨架之能量輻射可聚合化合物對其它通用的 月匕里幸田射可聚合化合物之比例較佳係於1 : 99至% : ^, 為0 8 〇至7 0 · 3 0及較理想為4 〇 : 6 〇至5 〇 : 5 〇之 範圍。 人已括、則述具有二環戊二烯骨架之能量輻射可聚合化 合物及/或其它通用的能量輻射可聚合化合物之膠黏劑係 以光照射,化。至於光,可使用例如紫外光。 光♦。引發劑(E)混合入前述膠黏劑,不僅可縮短聚 合及固:匕時間,同時也可減少照射量。 光聚合弓丨發劑(E)可選自例如二苯甲_、苯乙酮、安息 16 313934 1299354 香、安息香甲基醚、安息香乙基醚、安息香異丙基醚、安 息香異丁基醚、安息香苯甲酸、安息香苯甲酸甲g旨、安息 香二曱基縮S同、2,4 -二乙基硫雜蒽顯]、經環己基苯基酮、 卞基二苯基硫化物、四甲基秋蘭姆一硫化物、偶氮雙異丁 腈、聯苯醯、聯苄、雙乙醯及/9 -氯蒽醌。 前述光聚合引發劑(E)通常之添加量,相對於每丨⑻重 量份具有二環戊二烯骨架之能量輻射可聚合化合物與其它 通用的能量輻射可聚合化合物之總和,為〇·5至丨5重量 知,#父佳為1.0至1 〇重量份及更佳為i. 5至6重量份。 本發明之黏性膠帶之膠黏層係由前述黏合成分(A)、環 氧樹脂(B)、熱活化的潛在環氧樹脂固化劑(c)、能量輻射 可聚合化合物(D)以及光聚合引發劑(E)作為主要成分所構 月’J迷成分所構成 可一 心修私層具有可藉能量稱珩周化也 時=熱固化之性f。因此,該黏性膠帶可用作為切晶粒 接八膠㈣卜也可用作為於固定時,將晶片熱塵 至;50。 之膠黏劑。雖然此種熱麼接合通常係方"0 有低彈性行,但本發明之膠㈣於此溫度範圍具 表面之卜 、,。果純勝帶可適當地隨形黏附於被黏合 =廓:因而可使晶片牢固地接合至導線架。 此外,固化吝“衝虜之固化產物可藉加熱固化而提供。 即使暴露於苛=具!絕佳切變強度與抗撕強度間的平衡, 可' d之〉;熱條件下仍 此外,膠黏層固下仍:維持滿思的接合性質。 化產物之吸水性低,因而可減少封裝體於 313934 17 1299354 迴銲步驟出現龜裂的情形。 為了於晶粒接合後提供導電性質,感壓膠黏層可填以 導電填料例如金、銀、銅、錄、紹、不銹鋼、碳、陶瓷、 或經由以銀塗覆之鎳、鋁等所獲得的材料。此外,為了提 供導熱性質,感壓膠黏層可填以導熱填料例如金、銀、銅、 錄、紹、不錄鋼、碎、鍺或其它金屬或其合金。此等添加 劑相對於每1 0 0重量份膠黏劑組成分(換言之,組成分 A + B + C + D + E)之添加量約為10至400重量份。 此種膠黏層可填以有機聚異氰酸酯化合物、有機聚亞 胺化合物等,俾於暴露於能量輻射前調節其初膠黏強度及 内聚強度。 有機聚異氰酸酯化合物例如可選自芳香族聚異氰酸 酯化合物、脂肪族聚異氰酸酯化合物、脂環族聚異氰酸酯 化合物、此等聚異氰酸酯化合物之三聚物、以及經由此等 聚異氰酸酯化合物與多元醇化合物反應獲得以異氰酸根為 末端基之胺基曱酸乙酯預聚物。有機聚異氰酸酯化合物之 具體實例包含2,4-伸甲苯基二異氰酸酯、2,6-伸曱苯基二 異氰酸酯、伸二甲苯基二異氰酸酯、1,4-伸二曱苯基二 異氰酸酯、二苯基甲烷-4,45-二異氰酸酯、二苯基曱烷-2,4、 二異氰酸酯、3-甲基二苯基曱烷二異氰酸酯、六亞甲基二 異氰酸酯、異佛爾明二異氰酸酯、二環己基甲烷-4,4、二異 氰酸酯、二環己基曱烷-2,4、二異氰酸酯以及離胺酸異氰酸 酉旨。 前述有機聚亞胺化合物之具體實例包含]二苯基 18 313934 Ϊ299354 —,4’-雙(1-氮丙啶羧醯胺)、三羥曱基丙烷-三-点-氮丙 二基丙酸醋、四羥甲基甲烷-三氮丙啶基丙酸s旨及 胺。、甲笨-2,4_雙(1-氮丙啶羧醯胺基)三-伸乙基三聚氰醯 物通常此等⑽聚異氰酸醋化合物或⑽聚亞胺化合 至之較佳添加量,相對於每1〇〇重量份黏合成分(A)為〇 舌10重量份’特別為0.1至5重量份及更特別為〇.5至2 重量份。 2 此外,可添加抗靜電劑至前述膠黏層。抗靜電劑的添 二抑制擴展或拾取步科靜電的產生,故可提升晶片的 11Γ。適合的抗靜電劑之實例包含一般已知的活化劑例 口陰,子性、陽離子性、非離子性及兩性活化劑。以勝點 層重量為基準,抗靜電劑之用量較佳為0至50重量%及二 別是自〇至30重量%之範圍。 寸 、例如,彳木用紫外光作為能量輻射時,以透光薄膜用作 為本發明純膠帶之底材。$當的透㈣膜的實例包含取 乙烯缚膜丄聚丙稀薄膜、聚丁烯薄膜、聚丁二稀薄膜、【 曱基戊烯薄朕、聚氯乙烯薄膜、'氣乙烯共聚物薄膜、聚乙 ,,對=二曱酸11薄膜、聚對萘二甲酸乙二酉旨薄膜、^丁 -醇對本二曱酸酯薄膜、聚胺基甲酸乙酯薄膜、乙烯,乙酸 乙烯醋薄膜、離子交聯聚合物樹脂薄膜、乙烯/(甲基)丙^ k、承物溥膜、乙稀/(甲基)丙烯酸酯共聚物薄膜、聚苯乙 烯薄膜二聚碳酸1旨薄膜。此外,Φ可使用由該等薄 之交聯薄㉟。更進一步,亦可使用由該等薄膜製成之積層 313934 19 1299354 、 另—方面,採用電子束作為处旦 需為读日日 ^ 十束作為n輻射時,底材盔 而為遗明。因此不僅可使 i …、 經著色m 刖述透光溽膜,同時也可使用 色所*之不透明薄膜、含氟樹㈣料。 底材之表面張力較佳為40達 。7、去m /广 思U /厘木或以下,更佳兔 J 、口/厘米或以下及較理想為35達 一 可使本發明之黏性膠帶之膠㈣ 未或'下。如此 石〆曰κ 、,丄 士占層谷易於晶粒接合時移轉至 料而獲得。亦可經由使底^底材可經由選用適當的材 功……表面接受離型處理,如施用-石夕酮樹脂寺而獲得。 用4、 底材厚度通常為約1〇至3〇 艸半乃承社劣 该木,較佳為20至2〇〇 锨未及更佳為5〇至15〇微米之範圍。 本發明之黏性膠帶可利用如輥刀涂淨 機、壓模塗覆機、或反向塗覆機等習凹^塗覆 膠黏層所獲得。視情況需要,膠黏組成物 :二成 溶解或分散於溶劑。 气後4木作則’ 通常如此形成之膠點層厚度較佳為3 別是10至6。微米之範圍。如此所得之點性勝帶:下: 方式使用。 f加以下迷 本發明黏性膠帶黏貼至矽晶圓之一主 經由黏性膠帶而固定至切晶粒單元册又面矽日日圓 T有黏性膠帶 晶圓使用切削裝置例如切晶粒録而切割成為jc曰〆夕 使最後所得黏貼至之純膠帶曝^能1 射。至於本發明所使用之能量輻射, 里田 」挺及者例如紫外 3)3934 20 1299354 (ΓΓ^Γ 3 65奈米)或電子f卜光用作為 和:圍“射強度係設定為20至500毫瓦/平方厘米 之机圍,而照射時間係設定於0·^150秒之範圍。此外, 例如:;電子束照射時,可參照前文使用紫外光照射之條件 加熱。 暴先於旎置輻射時,可執行輔助 此種曝光於能量輻射,將可使黏貼至Ic 表面的膠黏層由底材脫離。曝光於能量輕要 操作前施行。 L切日日粒 將所製得帶有膠黏層黏貼其上之1(:晶片固定於導線 架上並加熱,使膠點声 u❸之胗』層之%乳樹脂(B)固化。如此使IC晶 片與導線架彼此接合。加熱溫度通常為約 佳為…⑽及更佳為約8〇 :c, 間通常係於!至12〇八铲日^土 〇 C之犯圍。加熱時 U加執Μ 佳係於5至60分鐘之範圍。
^ : Μ果,可熱固化膠黏成分被固化,因而達成IC 晶片與V線架彼此間的強力接八 所組成之膠點層於㈣接人時^匕外’由前述各個成分 可妥♦地隨开4 具有低彈性係數’故膠黏層
Th 錢於被黏合物表面的輪廓1 與1C晶片可以以滿意的強度彼此接 … 膠黏層所含之能量輕 σ "方面而於 有之彈性俜了小。化&物(D)固化後,膠黏層具 有之5早性知數(於15(TC )較佳Λ 1 n mi 佳為 3.0XW 至 5。p °X1° 至 8·〇Χΐ〇、,更 主5·〇χ i(p pa以及軔w, X ]"a 之範圍。 ““ 1.0X 〗0'至 1.0 此外,環氧樹脂⑻固化後之最終固化產物具有極低的 3)3934 21 1299354 吸水係數,因此即使於迴銲時暴露 。々、回概,取終的图 物亦不會出現水的蒸發,因而可減 U化產 」减^封裝體龜裂的菸 如此最終固化後的勝黏層之吸水係數(暴露於的二° 度δ5%之氣氛168小時後測量)較佳為或以下,對= 為2.0%或以下及較理想為19%或以下。 更乙 除了前述用途外,本發明之黏性膠帶可用於 合物、玻璃、陶瓷、金屬等的接合。 版化 (發明效果) 依前文所揭示之本發明之優點,提供_種具有膠黏 性膠τ,其最終形成具有低吸水性之膠黏固化產物* 可防止迴銲時封裝體龜裂,並使熱屢接合時降低彈性係2 得以實現,因而具有絕佳隨形黏附於被黏合表面輪廓二 力。[實施方式] 此 (實施例) 後文將參照下列實施例舉例說明本發明,但該等實施 例、纟巴非囿限本發明之範圍。 、、 下列實施例及比較例中,「吸水係數」、「彈性係數」 及「抗撕強度」係以下述方式測定。 「吸水係數」 夕片黏性膠帶向上堆疊而形成厚度丨〇士〇·2毫米之積 層物,切割成50毫米χ 5〇毫米尺寸。積層物之主面以紫 卜光…、射並於1 60°C加熱1小時以執行熱固化。將所得 樣品置於85°C相對濕度85%之氣氛下靜置168小時。由樣 品所增加之任何重量求出吸水係數。 313934 22 1299354 彈性係數 有關各實施例及比較例之膠黏劑,準備未含任何熱活 化的潛在環氧樹脂固化劑(c)之膠黏劑。樣品之二主面皆以 200毫焦耳/平方厘米之紫外光照射。至於最後所得之樣 品,根據轉矩切變法,於15(rc使用Rhe〇metricScie此& F-E· Ltd.製造之RDAII以丨赫茲測定彈性係數。 「抗撕強度」 各黏性膠帶係黏貼至厚度35〇微米之矽晶圓經過2〇〇〇 號拋光之表面,以23〇毫焦耳/平方厘米之紫外光光量照 射’:晶粒成10毫米X 10毫米大小。隨後由膠黏層脫離 底材獲得帶有膠黏劑之各個矽晶片,係藉壓縮接合至10 米X 5 0毛米大小i 5 〇微米厚之銅板,壓縮係於1 5 進 盯1秒,並使其於1601之恆溫室内放置i小時以執行膠 黏層之熱固化。如此獲得抗撕強度測量用之樣品。 & 之石夕晶片側藉接合固定,銅板以9 〇度角撕離, 藉此執饤抗撕強度之測量(毫牛頓/1〇毫米)。撕離速度為5〇 毫米/分鐘。 下列貫施例及比較例中,係使用以下材料作為黏合成 刀(A)、被氧樹脂卜熱活化的潛在環氧樹脂固化劑(c)、 月匕里輻射可聚合化合物(D)以及光聚合引發劑(e)。 (A)點合成分 重量平均分子量900,000以及具有玻璃轉化溫度-28^ 之/、斗、物’其係以5 5重量份之丙烯酸丁酯、1 0重量份之 甲基丙稀酸曱酯、20重量份之曱基丙烯酸縮水甘油酯及1 5 23 313934 1299354 重量份之丙烯酸2-羥乙酯進料u ⑻環她旨 丁…所獲得。 ⑻):液態雙…氧樹腊(環氧當 軟化點:無,分子量:約42〇) 田里. 至200 ’ (B2):固態雙齡A環氧樹脂(環氧當 軟化點:93°C,分子量 17〇〇) 量·· 800 至 9〇〇, 環氣樹脂(商品名XD· (B3):帶有二環戍二稀骨架之 1000-L,Nippon Kayaku Co·,Ltd 制、止 Q·衣造,環氧當量: 25 0,軟化點:6 6〇C,η = 0·6 至 〇 7) (Β4):具有二環戍二稀骨架之環氧樹脂(商品名仰 1000-2L,Nippon Kayaku Co·,Ltd 製造環氧當量:擔 至 250,軟化點:57°C,ιι = 0·3 至 〇 4)。 (B5):固態鄰甲酚酚醛清漆環氧樹脂(環氧當量·· 2⑺ 至230,軟化點:92〇C,分子量:約165〇)。田里 (C) 熱活化的潛在環氧樹脂固化劑(環氧樹脂固化劑) (ci) · 一氰二醯胺(商品名:固化劑3636As,Asahi Denka Kogyo K.K.製造) (C2) : 2-苯基-4,5-二羥甲基咪唑(商品名:Curez〇1 2PHZ,Shikoku Chemicals Corporation 製造) (D) 能量輻射可聚合化合物 (D1):具有二環戊二烯骨架之能量輻射可聚合化合物 (商品名:Kayarad R684,Nippon Kayaku Co·,Ltd.製造, 分子量:304) (D2):二季戊四醇六丙烯酸酯(分子量:578)。 24 313934 1299354 (E) 光聚合引發劑 1-羥環己基苯基酮。 (F) 其它 交聯劑:芳香族聚異氰酸 ^ ^ , 夂§曰(伸甲苯基二異氰酸酯之三 ^曱基丙少元加合物)。 實施例1 膠黏劑組成物係經由以声 折獾ρ οη ^ , 衣1载明之比例混合各種成分 所獲付。90微米厚之積層 磁/田f工β 危材係由塑化PVC層以及乙 烯/甲基丙烯酸共聚物層所構 構成,於其乙烯/甲基丙烯酸共 ♦物層側(表面張力35達 、 U厘水)塗覆此種膠黏劑組成 物,而於底材上形成20微米之 ά 僅/逢 帶。 、胗黏層。由此彳隻得黏性膠 所得黏性膠帶之「吸水係數」、「彈性係數」及「抗撕 強度」係以前述方式測量。結果列於表i。 較例 1 重複貝靶例1之相同操作;惟,依表1所列改變成分之添 加比例。結果列於表丨。 ^ 313934 25 1299354 比較例1 實施例4 實施例3 實施例2 實施例1 μ μ 黏合劑組 成分(A) 膠黏層組成(重量份) g g S g g CD 環氧樹脂 s g to NJ dd UJ s μ tu V—· 一 O >~·- 環氧固化劑 一 * β 一 o »~^ o a 能量輻射 可聚合化 合物 5 s a to P L〇 〇 UJ o UJ o u> o 1 光聚合引 發劑(E) Ο 〇 U) o •U) o u> o 1>j 交聯劑 (F) 2.59 2.24 2.09 ! r—* oo ——_ L89 J 吸水係數 (%) 8·85χ 103 Ι.ΙΟχ ίο·1 6.03x 102 | 3.1.4x 102 j 5.21x 102 彈性係數 (150°C)(Pa) 8000 7500 7800 6500 7000 抗撕強度(毫 牛頓A0毫米) [圖式簡單說明] 本案無圖式。 26 313934
Claims (1)
1299354 r____ 一〜y ς:乎 卜^年今月 —一,一.〜 I —-—.«*·-一〜《J 拾、申請專利範圍 種站! 生膠暝’包括底層及層疊其上之膠黏層,該膠黏 層包含黏合成分(A)、環氧樹脂(B)、熱活化性潛在環氧 樹脂固化劑⑹、能量輻射可聚合化合物⑼及光聚合引 發劑(E),其中’環氧樹脂⑻與能量㈣可聚合化合物 (D)之任一者或兩者在其分子中具有二環戊二烯骨架, 環氧樹脂(B)相對於每100重量份之黏合成分(A)之量為 5至1000重量分, 熱活化性潛在環氧樹脂固化劑相對於每丨00重量 份之環氧樹脂(B)之量為ο·!至2〇重量份, 月ϊ輪射可聚合化合物(D)相對於每i 〇〇重量份之 黏合成分(A)之量為(M至500重量份, 光聚合引發劑(E)相對於每1〇〇重量份之能量輻射 可聚合化合物(D)之量為〇·5至15重量份。 2·如申請專利範圍第丨項之黏性膠帶,其中,該膠黏層 中所含之能量輻射可聚合化合物(D)固化後所呈現之 膠黏層彈性係數(150。〇)係在1 〇χ1〇ι至8 0xl03pa之範 圍。 3·如申請專利範圍第1項之黏性膠帶,其中,該膠黏層於 最終固化後之吸水係數(曝露於溫度8 5 〇c,相對濕度 85%環境下168小時)為2·3%或更低。 4·如申請專利範圍第1項之黏性膠帶,其中,該底層之厚 度為10至300 # m。 27 313934 1299354 5 ·如申請專利範圍第1項之黏性膠帶,其中,該膠黏層之 厚度為3至100 // m。 28 13934
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JP6332764B2 (ja) * | 2016-11-17 | 2018-05-30 | 大日本印刷株式会社 | 接着剤組成物およびそれを用いた接着シート |
JP6865614B2 (ja) * | 2017-03-28 | 2021-04-28 | 株式会社Adeka | 硬化性組成物 |
JPWO2022181564A1 (zh) * | 2021-02-24 | 2022-09-01 |
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DE2200021C3 (de) | 1972-01-03 | 1980-06-19 | Henkel Kgaa | Acrylsaeureester bzw. methacrylsaeureester von oh-gruppenhaltigen tricyclischen decanolen, verfahren zu deren herstellung sowie deren verwendung |
JPS55145726A (en) * | 1979-04-28 | 1980-11-13 | Hitachi Chem Co Ltd | Epoxy ester resin composition |
US4612209A (en) * | 1983-12-27 | 1986-09-16 | Ciba-Geigy Corporation | Process for the preparation of heat-curable adhesive films |
JPH0616524B2 (ja) | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
JPS60223139A (ja) | 1984-04-18 | 1985-11-07 | Nitto Electric Ind Co Ltd | 半導体ウエハ固定用接着薄板 |
JPH0715087B2 (ja) * | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
TW340967B (en) * | 1996-02-19 | 1998-09-21 | Toray Industries | An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device |
EP1165682B1 (en) * | 1999-02-15 | 2006-07-05 | DSM IP Assets B.V. | Resin composition and cured product |
-
2001
- 2001-08-21 JP JP2001250134A patent/JP4869517B2/ja not_active Expired - Fee Related
-
2002
- 2002-08-08 CN CNB028164075A patent/CN1322580C/zh not_active Expired - Fee Related
- 2002-08-08 DE DE60224543T patent/DE60224543T2/de not_active Expired - Fee Related
- 2002-08-08 KR KR1020047002477A patent/KR100755175B1/ko active IP Right Grant
- 2002-08-08 EP EP02755877A patent/EP1419527B1/en not_active Expired - Fee Related
- 2002-08-08 WO PCT/JP2002/008127 patent/WO2003017363A1/en active IP Right Grant
- 2002-08-08 US US10/487,531 patent/US7135224B2/en not_active Expired - Lifetime
- 2002-08-14 MY MYPI20023008A patent/MY134364A/en unknown
- 2002-08-20 TW TW091118754A patent/TWI299354B/zh active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9090800B2 (en) | 2009-03-03 | 2015-07-28 | Toray Advanced Materials Korea, Inc. | Adhesive tape for manufacturing electronic components |
TWI486419B (zh) * | 2012-12-27 | 2015-06-01 | Hon Hai Prec Ind Co Ltd | 膠帶 |
TWI788292B (zh) * | 2016-06-29 | 2023-01-01 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、樹脂片、多層印刷電路板及半導體裝置 |
Also Published As
Publication number | Publication date |
---|---|
MY134364A (en) | 2007-12-31 |
EP1419527A1 (en) | 2004-05-19 |
DE60224543D1 (de) | 2008-02-21 |
EP1419527B1 (en) | 2008-01-09 |
CN1545729A (zh) | 2004-11-10 |
US7135224B2 (en) | 2006-11-14 |
KR100755175B1 (ko) | 2007-09-03 |
CN1322580C (zh) | 2007-06-20 |
US20040232563A1 (en) | 2004-11-25 |
JP4869517B2 (ja) | 2012-02-08 |
JP2003055623A (ja) | 2003-02-26 |
WO2003017363A1 (en) | 2003-02-27 |
KR20040030979A (ko) | 2004-04-09 |
DE60224543T2 (de) | 2009-01-29 |
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