TWI297290B - Dry cleaning device for container colletcing substrate - Google Patents

Dry cleaning device for container colletcing substrate Download PDF

Info

Publication number
TWI297290B
TWI297290B TW095128138A TW95128138A TWI297290B TW I297290 B TWI297290 B TW I297290B TW 095128138 A TW095128138 A TW 095128138A TW 95128138 A TW95128138 A TW 95128138A TW I297290 B TWI297290 B TW I297290B
Authority
TW
Taiwan
Prior art keywords
cleaning
main body
storage container
dry
substrate storage
Prior art date
Application number
TW095128138A
Other languages
English (en)
Chinese (zh)
Other versions
TW200724254A (en
Inventor
Se Ho Kim
Jong Soo Park
Cheol Nam Yoon
Original Assignee
Samsung Corning Prec Glass Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Corning Prec Glass Co filed Critical Samsung Corning Prec Glass Co
Publication of TW200724254A publication Critical patent/TW200724254A/zh
Application granted granted Critical
Publication of TWI297290B publication Critical patent/TWI297290B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW095128138A 2005-12-29 2006-08-01 Dry cleaning device for container colletcing substrate TWI297290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050133741A KR100710685B1 (ko) 2005-12-29 2005-12-29 기판수납용기용 건식세정장치

Publications (2)

Publication Number Publication Date
TW200724254A TW200724254A (en) 2007-07-01
TWI297290B true TWI297290B (en) 2008-06-01

Family

ID=38182107

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128138A TWI297290B (en) 2005-12-29 2006-08-01 Dry cleaning device for container colletcing substrate

Country Status (4)

Country Link
JP (1) JP2007184524A (ko)
KR (1) KR100710685B1 (ko)
CN (1) CN1990127A (ko)
TW (1) TWI297290B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5923300B2 (ja) * 2011-12-28 2016-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN106824953B (zh) * 2016-12-20 2019-01-25 重庆皖渝纸制品有限公司 纸箱清洁装置
US11488848B2 (en) 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
CN110773536B (zh) * 2018-07-31 2021-10-22 台湾积体电路制造股份有限公司 晶粒容器工作站、晶粒容器处理的系统及方法
CN110449432B (zh) * 2019-07-25 2024-02-23 老肯医疗科技股份有限公司 一种清洗机自动进出车控制系统及使用方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003126794A (ja) * 2001-10-29 2003-05-07 Cts:Kk セラミックス部材の洗浄方法
KR20040049548A (ko) * 2002-12-06 2004-06-12 주식회사 하이닉스반도체 웨이퍼 세정방법
KR100596857B1 (ko) * 2004-01-12 2006-07-04 주식회사 하이닉스반도체 ＣＯ2 Ｓｎｏｗ Ｊｅｔ Ｃｌｅａｎｉｎｇ 공정을 이용한비트라인 형성 방법
KR20050101576A (ko) * 2004-04-19 2005-10-25 삼성전자주식회사 원자층 증착설비의 세정장치 및 그의 세정방법

Also Published As

Publication number Publication date
CN1990127A (zh) 2007-07-04
KR100710685B1 (ko) 2007-04-23
JP2007184524A (ja) 2007-07-19
TW200724254A (en) 2007-07-01

Similar Documents

Publication Publication Date Title
TWI297290B (en) Dry cleaning device for container colletcing substrate
US11559869B2 (en) Wafer edge polishing apparatus and method
TWI433801B (zh) Conveying device and bead processing device
JP5455987B2 (ja) 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
TWI606869B (zh) 周緣部塗布裝置、周緣部塗布方法及周緣部塗布用記錄媒體
TWI726886B (zh) 基板處理裝置及基板處理方法
TW201608663A (zh) 基板處理裝置
CN101414549A (zh) 基板清洗设备
TWI397118B (zh) 液體處理裝置、液體處理方法及記憶媒體
KR20120139573A (ko) 기판 처리 방법 및 기판 처리 유닛
CN108705383A (zh) 基板处理方法、基板处理装置及基板处理系统
JP2007036152A (ja) ウェーハ洗浄乾燥方法及びウェーハ洗浄乾燥装置
JP3420046B2 (ja) 洗浄装置
JP2007184495A (ja) ウエーハリングの再生処理装置
JP2017108113A (ja) 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム
JP5894490B2 (ja) 研削装置
JP5617065B2 (ja) 剥離方法、プログラム、コンピュータ記憶媒体及び剥離システム
JPWO2020105483A1 (ja) 基板処理装置及び基板処理方法
TWI479054B (zh) 電鍍處理裝置及電鍍處理方法以及記錄電鍍處理程式的記錄媒體
JP2801489B2 (ja) リングフレーム自動洗浄装置
CN210968392U (zh) 一种卸载装置及化学机械抛光辅助设备
JP3999540B2 (ja) スクラブ洗浄装置におけるブラシクリーニング方法及び処理システム
JP2002370071A (ja) 洗浄装置
JPH07211685A (ja) スピンナー洗浄装置
JP2014103409A (ja) 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体