TW200724254A - Dry cleaning device for container collecting substrate - Google Patents

Dry cleaning device for container collecting substrate

Info

Publication number
TW200724254A
TW200724254A TW095128138A TW95128138A TW200724254A TW 200724254 A TW200724254 A TW 200724254A TW 095128138 A TW095128138 A TW 095128138A TW 95128138 A TW95128138 A TW 95128138A TW 200724254 A TW200724254 A TW 200724254A
Authority
TW
Taiwan
Prior art keywords
collecting substrate
container collecting
cleaning device
dry
cleaning
Prior art date
Application number
TW095128138A
Other languages
Chinese (zh)
Other versions
TWI297290B (en
Inventor
Se-Ho Kim
Jong-Soo Park
Cheol-Nam Yoon
Original Assignee
K C Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K C Tech Co Ltd filed Critical K C Tech Co Ltd
Publication of TW200724254A publication Critical patent/TW200724254A/en
Application granted granted Critical
Publication of TWI297290B publication Critical patent/TWI297290B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

This invention provides a dry cleaning device for container collecting substrate. The dry cleaning device includes: a loading part for introducing and transferring the container collecting substrate; a cleaning part, using dry ice particles to clean the container collecting substrate; a unloading part, for moving out and transferring the container collecting substrate that has been cleaned at the cleaning part. According to this invention, since dry ice particles are used to clean the container collecting substrate, no disposals are released to ensure environment protection effect. In addition, since this invention uses dry icy particle, it allows cleaning of tiny locations and minimizes deformation or damages to the container collecting substrate thereby extending the lifespan. In addition, as compared to the conventional wet-type cleaning device, this invention is relatively simple and significantly reduces the size of the equipment, so as to provide economical benefits.
TW095128138A 2005-12-29 2006-08-01 Dry cleaning device for container colletcing substrate TWI297290B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050133741A KR100710685B1 (en) 2005-12-29 2005-12-29 Dry cleaning device for container collecting substrate

Publications (2)

Publication Number Publication Date
TW200724254A true TW200724254A (en) 2007-07-01
TWI297290B TWI297290B (en) 2008-06-01

Family

ID=38182107

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128138A TWI297290B (en) 2005-12-29 2006-08-01 Dry cleaning device for container colletcing substrate

Country Status (4)

Country Link
JP (1) JP2007184524A (en)
KR (1) KR100710685B1 (en)
CN (1) CN1990127A (en)
TW (1) TWI297290B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5923300B2 (en) * 2011-12-28 2016-05-24 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
CN106824953B (en) * 2016-12-20 2019-01-25 重庆皖渝纸制品有限公司 Carton cleaning device
CN110773536B (en) * 2018-07-31 2021-10-22 台湾积体电路制造股份有限公司 Die container workstation, system and method for processing die container
US11488848B2 (en) 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
CN110449432B (en) * 2019-07-25 2024-02-23 老肯医疗科技股份有限公司 Automatic vehicle entering and exiting control system of cleaning machine and use method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003126794A (en) * 2001-10-29 2003-05-07 Cts:Kk Method for cleaning ceramic member
KR20040049548A (en) * 2002-12-06 2004-06-12 주식회사 하이닉스반도체 A method for cleaning a wafer
KR100596857B1 (en) * 2004-01-12 2006-07-04 주식회사 하이닉스반도체 Method of manufacturing bit-line by using CO2 snow jet cleaning process
KR20050101576A (en) * 2004-04-19 2005-10-25 삼성전자주식회사 Apparatus for cleaning atom layer deposition equipment and method at the same

Also Published As

Publication number Publication date
TWI297290B (en) 2008-06-01
CN1990127A (en) 2007-07-04
KR100710685B1 (en) 2007-04-23
JP2007184524A (en) 2007-07-19

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