TWI297188B - - Google Patents

Download PDF

Info

Publication number
TWI297188B
TWI297188B TW092109690A TW92109690A TWI297188B TW I297188 B TWI297188 B TW I297188B TW 092109690 A TW092109690 A TW 092109690A TW 92109690 A TW92109690 A TW 92109690A TW I297188 B TWI297188 B TW I297188B
Authority
TW
Taiwan
Prior art keywords
joined
processing chamber
objects
movable wall
partial
Prior art date
Application number
TW092109690A
Other languages
English (en)
Chinese (zh)
Other versions
TW200308046A (en
Inventor
Akira Yamauchi
Katsumi Terada
Satoru Naraba
Takashi Hare
Original Assignee
Toray Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Eng Co Ltd filed Critical Toray Eng Co Ltd
Publication of TW200308046A publication Critical patent/TW200308046A/zh
Application granted granted Critical
Publication of TWI297188B publication Critical patent/TWI297188B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW092109690A 2002-04-26 2003-04-25 Mounting method and mounting apparatus TW200308046A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002125815A JP4233802B2 (ja) 2002-04-26 2002-04-26 実装方法および実装装置

Publications (2)

Publication Number Publication Date
TW200308046A TW200308046A (en) 2003-12-16
TWI297188B true TWI297188B (enExample) 2008-05-21

Family

ID=29267578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092109690A TW200308046A (en) 2002-04-26 2003-04-25 Mounting method and mounting apparatus

Country Status (7)

Country Link
US (1) US7279358B2 (enExample)
JP (1) JP4233802B2 (enExample)
KR (1) KR101010155B1 (enExample)
CN (1) CN1650399A (enExample)
AU (1) AU2003235378A1 (enExample)
TW (1) TW200308046A (enExample)
WO (1) WO2003092053A1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7245022B2 (en) * 2003-11-25 2007-07-17 International Business Machines Corporation Semiconductor module with improved interposer structure and method for forming the same
JP2005191556A (ja) * 2003-12-02 2005-07-14 Bondotekku:Kk ガス封入金接合方法及び装置
JP3790995B2 (ja) 2004-01-22 2006-06-28 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに接合装置
DE102004034421A1 (de) * 2004-07-15 2006-02-09 Pac Tech - Packaging Technologies Gmbh Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern
US7304395B2 (en) * 2005-07-05 2007-12-04 Oki Electric Industry Co., Ltd. Semiconductor chip package
US7316554B2 (en) * 2005-09-21 2008-01-08 Molecular Imprints, Inc. System to control an atmosphere between a body and a substrate
WO2008156170A1 (ja) * 2007-06-20 2008-12-24 Japan E. M. Co., Ltd. 半田接合装置
FR2932945B1 (fr) * 2008-06-18 2010-09-03 Set Dispositif pour l'assemblage de composants a plots de soudure metalliques
JP2011108990A (ja) * 2009-11-20 2011-06-02 Shibuya Kogyo Co Ltd ボンディング装置
KR20120017259A (ko) * 2010-08-18 2012-02-28 삼성모바일디스플레이주식회사 주울열 봉지 장치 및 그것을 이용한 봉지 방법
US8844793B2 (en) * 2010-11-05 2014-09-30 Raytheon Company Reducing formation of oxide on solder
TWI564106B (zh) * 2011-03-28 2017-01-01 山田尖端科技股份有限公司 接合裝置以及接合方法
JP5892685B2 (ja) * 2011-06-28 2016-03-23 アピックヤマダ株式会社 圧着装置および圧着方法
US9105492B2 (en) * 2012-05-08 2015-08-11 LuxVue Technology Corporation Compliant micro device transfer head
KR101332082B1 (ko) * 2012-06-18 2013-11-22 삼성전기주식회사 카메라 모듈의 제조장치
KR101931358B1 (ko) * 2012-06-25 2018-12-31 삼성전자주식회사 지그 및 그 제작방법과 지그를 이용한 초음파 프로브용 칩의 플립 칩 본딩방법
KR20140131420A (ko) * 2013-05-02 2014-11-13 삼성디스플레이 주식회사 라미네이팅 장치 및 이를 이용한 라미네이팅 방법
KR20140133675A (ko) * 2013-05-09 2014-11-20 삼성디스플레이 주식회사 유기발광 표시장치 제조용 라미네이터
KR101632848B1 (ko) 2015-12-22 2016-06-22 주식회사 신아텍 커버 글라스 성형 방법 및 커버 글라스용 성형 금형체 어셈블리
KR101632847B1 (ko) 2015-12-22 2016-06-22 주식회사 신아텍 모바일 디스플레이용 커버 글라스 성형 장치
JP6582975B2 (ja) * 2015-12-28 2019-10-02 富士通株式会社 半導体実装装置、半導体実装装置のヘッド及び積層チップの製造方法
JP6705727B2 (ja) * 2016-09-26 2020-06-03 ファスフォードテクノロジ株式会社 フリップチップボンダおよび半導体装置の製造方法
US11515286B2 (en) 2019-01-09 2022-11-29 Kulicke And Soffa Industries, Inc. Methods of bonding of semiconductor elements to substrates, and related bonding systems
US11205633B2 (en) * 2019-01-09 2021-12-21 Kulicke And Soffa Industries, Inc. Methods of bonding of semiconductor elements to substrates, and related bonding systems
CN116168999A (zh) * 2022-12-28 2023-05-26 苏州众芯联电子材料有限公司 一种下部电极的给电部及其制作和组装工艺
US20240339430A1 (en) * 2023-04-10 2024-10-10 Asmpt Singapore Pte. Ltd. System and method for fluxless thermocompression bonding
WO2025018162A1 (ja) * 2023-07-20 2025-01-23 富士フイルム株式会社 接合体の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5188280A (en) 1989-04-28 1993-02-23 Hitachi Ltd. Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
JPH0744135B2 (ja) * 1989-08-28 1995-05-15 株式会社東芝 半導体基板の接着方法及び接着装置
DE69124356T2 (de) * 1990-07-18 1997-06-05 Nissha Printing Vorrichtung und verfahren zum transferdrucken
US5916513A (en) * 1997-08-04 1999-06-29 Motorola Method and apparatus for affixing components to a substrate when a manufacturing line ceases operation
JP3400338B2 (ja) * 1998-02-12 2003-04-28 株式会社新川 バンプボンディング装置
JP2001244279A (ja) * 2000-02-25 2001-09-07 Nec Niigata Ltd 基板の供給方法、基板供給装置、チップ供給装置およびチップ実装装置
JP3922870B2 (ja) * 2000-08-04 2007-05-30 東レエンジニアリング株式会社 実装方法
JP4822577B2 (ja) 2000-08-18 2011-11-24 東レエンジニアリング株式会社 実装方法および装置
JP2002064268A (ja) 2000-08-18 2002-02-28 Toray Eng Co Ltd 実装方法および装置
JP3822043B2 (ja) * 2000-09-25 2006-09-13 太陽誘電株式会社 チップ部品組立体の製造方法
JPWO2002056352A1 (ja) * 2001-01-15 2004-05-20 リンテック株式会社 貼合装置及び貼合方法
US20020187239A1 (en) * 2001-02-06 2002-12-12 Dusan Miljkovic Nutraceuticals and methods of obtaining nutraceuticals from tropical crops

Also Published As

Publication number Publication date
TW200308046A (en) 2003-12-16
US20060016555A1 (en) 2006-01-26
US7279358B2 (en) 2007-10-09
CN1650399A (zh) 2005-08-03
KR101010155B1 (ko) 2011-01-24
JP4233802B2 (ja) 2009-03-04
WO2003092053A1 (fr) 2003-11-06
KR20040102170A (ko) 2004-12-03
JP2003318229A (ja) 2003-11-07
AU2003235378A1 (en) 2003-11-10

Similar Documents

Publication Publication Date Title
TWI297188B (enExample)
JP7542885B2 (ja) 接合方法および接合装置
JP4050732B2 (ja) 半導体装置およびその製造方法
US7645681B2 (en) Bonding method, device produced by this method, and bonding device
TWI242836B (en) Bonding apparatus and method
KR100691759B1 (ko) 접합방법 및 접합장치
JP5281739B2 (ja) 陽極接合装置
JP2009220151A (ja) 接合方法およびこの方法により作成されるデバイス、接合装置並びにこの方法により接合される基板
JP2014113633A (ja) 接合方法及び接合装置
WO2003001858A1 (fr) Procede et dispositif pour procedure d'installation
JP2005294824A (ja) 真空中での超音波接合方法及び装置
TW511443B (en) Method for laminating and mounting semiconductor chip
JP2005191556A (ja) ガス封入金接合方法及び装置
JP2016134419A (ja) 接合方法および接合システム
JP2006134899A (ja) 接合方法および装置
JP2009105254A (ja) 接合方法およびこの方法により作成されるデバイス並びに接合装置
US6996889B2 (en) Electronic part mounting apparatus and method
JP2004119696A (ja) ボンディング方法、ボンディングステージ、及び電子部品実装装置
JP2006080100A (ja) 接合方法および装置
WO2002015258A1 (fr) Procede de fixation
JP2002050861A (ja) 常温接合装置及び方法
JPWO2003001586A1 (ja) 実装方法および装置
JP2007088241A (ja) 押圧装置および押圧方法
JP3915624B2 (ja) 電子部品装着装置および電子部品装着方法
TW200406875A (en) Connection method and connection device and connected object

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees