TWI296944B - - Google Patents

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Publication number
TWI296944B
TWI296944B TW095126258A TW95126258A TWI296944B TW I296944 B TWI296944 B TW I296944B TW 095126258 A TW095126258 A TW 095126258A TW 95126258 A TW95126258 A TW 95126258A TW I296944 B TWI296944 B TW I296944B
Authority
TW
Taiwan
Prior art keywords
coating
substrate
pump
slit nozzle
liquid
Prior art date
Application number
TW095126258A
Other languages
English (en)
Chinese (zh)
Other versions
TW200716263A (en
Inventor
Yoshiaki Masu
Hirotsugu Kumazawa
Kazunobu Yamaguchi
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200716263A publication Critical patent/TW200716263A/zh
Application granted granted Critical
Publication of TWI296944B publication Critical patent/TWI296944B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
TW095126258A 2005-08-23 2006-07-18 A coating device for glass substrate or semiconductor wafer TW200716263A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005240590A JP3938388B2 (ja) 2005-08-23 2005-08-23 塗布装置

Publications (2)

Publication Number Publication Date
TW200716263A TW200716263A (en) 2007-05-01
TWI296944B true TWI296944B (ja) 2008-05-21

Family

ID=37777394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126258A TW200716263A (en) 2005-08-23 2006-07-18 A coating device for glass substrate or semiconductor wafer

Country Status (4)

Country Link
JP (1) JP3938388B2 (ja)
KR (1) KR20070079346A (ja)
CN (1) CN1919476A (ja)
TW (1) TW200716263A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796425B1 (ko) 2005-08-23 2008-01-21 도쿄 오카 고교 가부시키가이샤 도포장치
WO2011155299A1 (ja) * 2010-06-09 2011-12-15 シャープ株式会社 レベリング処理装置およびこれを備えた塗布膜製造装置ならびに塗布膜製造方法
CN103809390B (zh) * 2012-11-14 2016-08-31 沈阳芯源微电子设备有限公司 一种显影喷头
JPWO2016152956A1 (ja) * 2015-03-25 2018-01-25 リンテック株式会社 ガスバリア層付き成形物の製造装置
JP7004546B2 (ja) 2017-11-10 2022-01-21 東京応化工業株式会社 ポンプ、塗布装置および塗布方法
US11660632B2 (en) * 2018-03-28 2023-05-30 Ecosys S.R.L. Device for coating, in particular painting, the main surfaces of rigid panels with liquid products
CN111871710A (zh) * 2020-08-26 2020-11-03 深圳市宏锦电子有限公司 点胶装置
CN114405744B (zh) * 2022-02-08 2022-10-21 浙江荣泰电工器材股份有限公司 一种低溶剂高粘度复合胶的施胶工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715795A (en) * 1985-02-14 1987-12-29 Siemens Aktiengesellschaft Metering pump
JPH09164357A (ja) * 1995-12-18 1997-06-24 Dainippon Screen Mfg Co Ltd 液体塗布装置
JP4301694B2 (ja) * 2000-05-02 2009-07-22 東京応化工業株式会社 塗布装置
JP4447331B2 (ja) * 2004-01-08 2010-04-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TW200716263A (en) 2007-05-01
JP2007054698A (ja) 2007-03-08
JP3938388B2 (ja) 2007-06-27
KR20070079346A (ko) 2007-08-06
CN1919476A (zh) 2007-02-28

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