KR100796425B1 - 도포장치 - Google Patents
도포장치 Download PDFInfo
- Publication number
- KR100796425B1 KR100796425B1 KR1020060079210A KR20060079210A KR100796425B1 KR 100796425 B1 KR100796425 B1 KR 100796425B1 KR 1020060079210 A KR1020060079210 A KR 1020060079210A KR 20060079210 A KR20060079210 A KR 20060079210A KR 100796425 B1 KR100796425 B1 KR 100796425B1
- Authority
- KR
- South Korea
- Prior art keywords
- coating
- pump
- tube
- slit nozzle
- coating liquid
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (4)
- 한쌍의 평행한 레일(2) 사이에 기판 재치 스테이지(4)가 배치되고, 상기 기판 재치 스테이지(4)를 걸치도록 슬릿노즐(10)을 구비한 문형 이동기구(3)가 상기 레일(2) 사이에 주행 가능하게 걸쳐진 도포장치에 있어서,상기 문형 이동기구(3)는, 상기 한쌍의 평행한 레일(2)의 각각에 상호 맞물리는 주행체(5)와, 이들 주행체(5) 사이를 연결하는 연결 빔(7)과, 상기 슬릿노즐(10)을 장착하기 위해, 상기 주행체(5) 사이에 승강 가능하게 가설되는 노즐 베이스 플레이트(9)를 구비하고, 상기 연결 빔(7)은 주행시에 기판에 간섭하지 않는 범위에서 주행체(5) 사이의 가장 낮은 위치에 장착되어 있으며, 상기 연결 빔(7)에 도포액 송액 펌프가 장착되어 있고, 이 도포액 송액 펌프는 튜브 프램 펌프(12)이며 또한 도포액의 출구측이 위쪽이 되도록 비스듬히 장착되어 있고, 도포액의 출구측과 슬릿노즐(10)은 플랙시블 튜브(14)로 연결되어 있는 것을 특징으로 하는 도포장치.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060079210A KR100796425B1 (ko) | 2005-08-23 | 2006-08-22 | 도포장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2005-00240590 | 2005-08-23 | ||
KR1020060079210A KR100796425B1 (ko) | 2005-08-23 | 2006-08-22 | 도포장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070075305A Division KR20070079346A (ko) | 2005-08-23 | 2007-07-26 | 도포장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070023542A KR20070023542A (ko) | 2007-02-28 |
KR100796425B1 true KR100796425B1 (ko) | 2008-01-21 |
Family
ID=41344263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060079210A KR100796425B1 (ko) | 2005-08-23 | 2006-08-22 | 도포장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100796425B1 (ko) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62282181A (ja) | 1985-02-14 | 1987-12-08 | シ−メンス、アクチエンゲゼルシヤフト | 配量ポンプ |
JP2001310152A (ja) | 2000-05-02 | 2001-11-06 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
KR20050022483A (ko) * | 2003-09-01 | 2005-03-08 | 삼성에스디아이 주식회사 | 동기 이동형 펌프 유닛을 갖는 도포장치 |
JP2005193174A (ja) * | 2004-01-08 | 2005-07-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
KR20050078410A (ko) * | 2004-01-29 | 2005-08-05 | 삼성에스디아이 주식회사 | 다이코팅 시스템 |
KR20070012245A (ko) * | 2005-07-22 | 2007-01-25 | 도쿄 엘렉트론 가부시키가이샤 | 기판 처리 장치 |
JP2007054698A (ja) | 2005-08-23 | 2007-03-08 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
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2006
- 2006-08-22 KR KR1020060079210A patent/KR100796425B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62282181A (ja) | 1985-02-14 | 1987-12-08 | シ−メンス、アクチエンゲゼルシヤフト | 配量ポンプ |
JP2001310152A (ja) | 2000-05-02 | 2001-11-06 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
KR20050022483A (ko) * | 2003-09-01 | 2005-03-08 | 삼성에스디아이 주식회사 | 동기 이동형 펌프 유닛을 갖는 도포장치 |
JP2005193174A (ja) * | 2004-01-08 | 2005-07-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
KR20050078410A (ko) * | 2004-01-29 | 2005-08-05 | 삼성에스디아이 주식회사 | 다이코팅 시스템 |
KR20070012245A (ko) * | 2005-07-22 | 2007-01-25 | 도쿄 엘렉트론 가부시키가이샤 | 기판 처리 장치 |
JP2007054698A (ja) | 2005-08-23 | 2007-03-08 | Tokyo Ohka Kogyo Co Ltd | 塗布装置 |
Also Published As
Publication number | Publication date |
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KR20070023542A (ko) | 2007-02-28 |
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