TWI293262B - Paste dispenser and method for controlling the paste dispenser - Google Patents

Paste dispenser and method for controlling the paste dispenser Download PDF

Info

Publication number
TWI293262B
TWI293262B TW095113381A TW95113381A TWI293262B TW I293262 B TWI293262 B TW I293262B TW 095113381 A TW095113381 A TW 095113381A TW 95113381 A TW95113381 A TW 95113381A TW I293262 B TWI293262 B TW I293262B
Authority
TW
Taiwan
Prior art keywords
nozzle
substrate
unit
dispenser
drive
Prior art date
Application number
TW095113381A
Other languages
English (en)
Chinese (zh)
Other versions
TW200706258A (en
Inventor
Young-Il Lim
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200706258A publication Critical patent/TW200706258A/zh
Application granted granted Critical
Publication of TWI293262B publication Critical patent/TWI293262B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target

Landscapes

  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW095113381A 2005-04-15 2006-04-14 Paste dispenser and method for controlling the paste dispenser TWI293262B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050031546A KR100696932B1 (ko) 2005-04-15 2005-04-15 페이스트 도포기 및 그 제어방법

Publications (2)

Publication Number Publication Date
TW200706258A TW200706258A (en) 2007-02-16
TWI293262B true TWI293262B (en) 2008-02-11

Family

ID=37076846

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113381A TWI293262B (en) 2005-04-15 2006-04-14 Paste dispenser and method for controlling the paste dispenser

Country Status (4)

Country Link
JP (1) JP4385033B2 (ko)
KR (1) KR100696932B1 (ko)
CN (2) CN101570082B (ko)
TW (1) TWI293262B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100807824B1 (ko) * 2006-12-13 2008-02-27 주식회사 탑 엔지니어링 페이스트 디스펜서
JP5459833B2 (ja) * 2009-07-17 2014-04-02 芝浦メカトロニクス株式会社 ペースト塗布装置
KR101089747B1 (ko) * 2009-07-29 2011-12-07 에이피시스템 주식회사 도포 장치의 제어 방법
KR101089749B1 (ko) * 2009-11-27 2011-12-07 에이피시스템 주식회사 도포장치 및 이의 제어 방법
CN107139590B (zh) * 2017-05-05 2018-10-30 京东方科技集团股份有限公司 一种喷墨打印设备以及喷墨打印方法
JP2020164274A (ja) * 2019-03-28 2020-10-08 ブラザー工業株式会社 接着装置
JP7488658B2 (ja) 2020-01-27 2024-05-22 株式会社ジャノメ 液体材料塗布装置
WO2021216069A1 (en) * 2020-04-23 2021-10-28 Hewlett-Packard Development Company, L.P. Adjusting distance between print media and printhead

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3372799B2 (ja) * 1996-12-17 2003-02-04 株式会社 日立インダストリイズ ペースト塗布機
JP3490355B2 (ja) 1999-09-27 2004-01-26 株式会社 日立インダストリイズ ペースト塗布機
JP2002153792A (ja) 2000-11-16 2002-05-28 Hitachi Industries Co Ltd ペースト塗布機
KR100700176B1 (ko) * 2002-12-18 2007-03-27 엘지.필립스 엘시디 주식회사 액정 표시패널의 디스펜서 및 이를 이용한 노즐과 기판의갭 제어방법
JP2004351571A (ja) * 2003-05-29 2004-12-16 Fanuc Ltd ノズル隙間調整方法
KR100540633B1 (ko) * 2003-06-20 2006-01-11 주식회사 탑 엔지니어링 페이스트 도포기 및 그 제어 방법
KR100552092B1 (ko) * 2003-06-28 2006-02-13 주식회사 탑 엔지니어링 평판표시장치 제조용 페이스트 도포장치

Also Published As

Publication number Publication date
JP4385033B2 (ja) 2009-12-16
KR100696932B1 (ko) 2007-03-20
KR20060109205A (ko) 2006-10-19
CN100496988C (zh) 2009-06-10
JP2006297385A (ja) 2006-11-02
TW200706258A (en) 2007-02-16
CN1847014A (zh) 2006-10-18
CN101570082B (zh) 2013-08-21
CN101570082A (zh) 2009-11-04

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