201007314 九、發明說明： 【發明所屬之技術領域】 本發明係關於修復基板上之賴案缺陷之修復方法。 【先前技術】 點賴為t觀各鮮健和⑽3)時，以預定圖 案塗佈膠於基板以黏著或密封基板之裝置。 這的點膠機包含平卜頭單元、頭支撐件、以及X 軸驅，單元。基板安裝於平台上。用以排出膠之喷嘴安裝 於頭f元。頭單元由頭支料所讀。X軸驅動單元安插 在頭單元及頭支撐件H雜頭單元於頭支樓件之外 推線方向(X軸方向）。點職配有複數個頭單元其同時 形成複數個膠圖案於大面積基板上，以增加產量。 虽調整喷嘴及基板間之間隙時，點膠機形成膠圖案於 基板上。為達此目的，頭單元提供有量測喷嘴及基板間之 間隙資料之雷射位移感測器，以及移動喷嘴及雷射位移感 測器於Z軸方向（垂直方向）之Z軸驅動單元。 雷射位移感測器包含發射雷射光之發射部，以及與發 ，部相隔預定距離並接收雷射光之接收部。雷射位移感測 二輪出電讯號給控制單元，因而量測基板及噴嘴間之間隙 資料，電訊號對應自發射部所發射並由基板所反射之大部 201007314 份雷射光之影像形成位置而產生。 ^改變基板及噴嘴間之相對位置時，這翻點職形 成預定的膠随於基板上。亦即，於頭單元安裝於頭支撐 件之狀態下，鮮元水平移_^軸方向及…方向並 排出膠到基板4塗佈膠於基板時，雷射位移感測器量測 M ^ 4c RS p m κ± 再者，基於雷射位移感測器所量測之間隙資料，安裝 於頭單认喷嘴_於2軸方向，並控财嘴及基板間之 間隙’使_:轉a定。於此狀訂，自噴嘴排出膠到基 板’因而形成膠圖案於基板上。 / ^ 當形成膠圖案完成時，塗佈有膠之基板經過測試程 2。於此程序中，測試基板以決定膠圖案的厚度是否在預 疋範圍内，以及膠圖案是否不連續。為了決定基板上膠圖 案的缺陷區段，由雷射掃瞄器掃瞄整個基板表面，以量測 所塗膠的截面積，或由相機拍攝膠圖案，以決定膠圖案是 否不連續。 ' ,如此一來，習知為了決定膠圖案是否有缺陷，必須輸 送具有膠圖案之基板到測試程序。再者，必須利用額外測 试設備來決定膠圖案是否不連續，或膠圖案厚度是否在預 疋範圍内，使得測試膠圖案的程序非常複雜且無法快速執 6 201007314 行0 有測試料中決定_案有缺陷時，具 有缺__之基板必須再次輸送到 二佈程序，以於基板上執行修復程序。亦即，當無法:夬 地修復塗佈有缺陷膠圓案之基板。 田··、、、 參 程岸!技術Γ題在於，測試或修復缺陷膠圖案的 fi 相當長的時間，使得大量的產品生 產變得困難並增加製造成本。 再者’習知修復程序的問題在於，在形成糊案後即 使财-㈣段有缺陷（膠㈣不_或厚度不適當 等）’將重新塗佈膠圖案的所有區段，而可能無法精確地 修復缺缺’並由於重複塗佈膠而可能發生其他問題。 φ 【發明内容】 因此，本發明有鑒於習知技術發生的問題，本發明之 一目的在於提供一種基板修復方法，其僅修復具有膠圖案 缺陷之區段’並最小化其他缺陷部分的發生。 為了達成上述目的，本發明提供一種修復基板之方 法’包含：第一步驟’對於基板上之膠圖案標明修復區段； 以及第二步驟，塗佈膠於第一步驟所標明之修復區段。 7 201007314 第二步驟包含：（a)量測基板及噴嘴間之間隙資料之 步驟，以及(b)根據於(a)步驟量測之基板及喷嘴間之間隙 資料，於基板及噴嘴間之間隙維持固定時塗佈膠於修^區 段之步驟。 / 再者，第二步驟包含：（a)量測與第一步驟所標明之 修復區段相鄰之區段中基板及喷嘴間之間隙資料之步 驟；以及(b)根據於(a)步驟量測之基板及喷嘴間之間隙資 料，於基板及喷嘴間之間隙維持固定時塗佈膠於修復區段 之步驟。（a)步驟量測與第一步驟標明之修復區段平行之 一線中基板及喷嘴間之間隙資料。 同時，當第一步驟量測之修復區段包含複數個修復區 段’且複數個修復區段間之間隔為預定間隔或更小時，第 二步驟連續地塗佈膠於複數個修復區段。 第一步驟決定當塗佈膠於基板時量測之基板及噴嘴 間之間隙資料是否脫離參考範圍，以及標明量測的間隙脫 離參考範圍之區段為修復區段。 【實施方式】 於後’將參考伴隨圖式，說明根據本發明較佳實施例 之基板修復方法。 8 201007314 - m 4根據本發日聰示點膠機之透視®，且圖2為顯 不圖1之點膠機之頭單元之透視圖。 圖^為顯 1 如圖根據本發明之點膠機包含底框架1〇、平 ❿ ❹ =;:定於底====。 LM=件4〇錄於平台3Q _之γ財向。安裝頭支 牙件50使其由該對LM料件 爾修二貞 $ 60於X轴方向，各χ軸驅動單元7()用以安裝 驅件50。控制單元控制頭單元60及χ轴 動平未料）謂做底轉iG上，以移 ;氏框架10的Y軸方向，而第二驅動裝置59 =供於_ 5。上，以沿LM導引件 = 件50。於基板20具有大面積 ^ 支軸，以增加形成膠圖案程二率鳩數個碩 與注3 3示番各頭單元6〇包含填充有膠之注射器61， 量測噴ΐ 62 IS:::之噴嘴6!，置於鄰近喷嘴62並 土 4之間隙資料之雷射位移感測器 201007314 63，移動噴嘴62及雷射位移感測器63於γ軸方向之γ軸 驅動單元64，以及移動噴嘴62及雷射位移感測器63於ζ 軸方向之Ζ軸驅動單元65。 、 雷射位移感測器63包含發射雷射光之發射部631，以 及與發射部631相距預定距離並接收自基板2〇°反射之雷 射光之接收部632。雷射位移感· 63輸出電訊號到控制 器’因而量測基板及喷嘴間之間隙資料，電 射部咖所發射且由基板20反射之大部份光 位置而產生。 再者，截面積感測器66可安裝於各頭單元⑼，以量 ^塗佈於基板20上之膠圖案ρ之截面積。截面積感測器 66連續地發射雷射光到基板2〇，以掃描膠圖案ρ，藉此量 測膠圖案Ρ之截面積。由截面積感測器66所量測之膠圖 案Ρ之截面積資料，用以決定膠_Ρ是否有缺陷。 於後’根據本發明架構成如上所述之點賴，當塗佈 於基板之膠圖案有缺陷時’將參考圖3至圖7說明修復基 圖3為根據本發明實施例之點膠機之雷射位移感測器 量^之間m顯示喷嘴及基板間之_資料之波形之 示意圖；圖4為顯示於膠圖案形成於其上之基板標明修復 201007314 區段之示意圖，·圖5為顯示於膠圖案形成於其上之基板標 明修復區段之方法之流程圖；圖6為顯示於基板及喷嘴間 所量測之間隙資料之位置以修復基板之示意圖。 根據本發明之基板修復方法包含標明基板20上之膠 圖案之修復區段，以及重新塗佈膠於標明的修復區段。 於此’如於具有缺陷膠圖案之基板標明修復區段之方 法之實施例提出利用塗佈膠程序時於基板2〇及喷嘴62 間所量測之間隙資料之方法。 如圖3所示，當各頭單元60移動於χ軸方向及γ軸 方向，以使膠塗佈於基板2〇，雷射位移感測器63所量測 之間隙資料於塗佈膠進行方向描纟會出波形。於步驟S12， 將所量測的間隙資料與預設參考範圍比較，並決定基板2〇 及喷嘴62間之間隙資料是否在參考範圍内。 於此，當並未精確塗佈膠於基板2〇時，而使膠圖案p 為不連續的或膠圖案的厚度未達到參考值時，可由雷射位 移感測器63量測基板20及喷嘴63間之間隙資料而實驗 取得參考範圍R。亦即，當基板2〇及喷嘴62間之間隙資 料變化時，分析膠圖案形狀的改變。當膠圖案有缺陷時， 量測基板20及喷嘴62間之間隙，而決定參考範圍R。 201007314 再者，如圖4所示，於步驟S13，將基板2〇及喷嘴 62間之間隙資料不在參考範圍R内之區段，標明為基板 20需要修復的區段，稱為修復區段§。假設將雷射位移感 測器63量測之間隙資料開始脫離參考範圍R之點標明 為區段的初始點Pi，而將量測脫離參考範圍R之間隙資料 重返參考範HR之點’翻為終止點pf，峨初始點pi ❹ ❹ 到終士點Pf之區段可設定為修復區段S。修復區段S可透 過计算初始點之座標（Xi Yi)及終止點^之 (Xf，Yf)之程序來設定。 ’、 同時’ 4明了修復區段s，執行重新塗佈膠到相關 Ο復區段S之程序。亦gp，當各頭單元6〇水平移動於X t向及Y軸方向時，使得喷嘴62到達修復區段的初始 * 1，喷嘴62排出並塗佈膠到修復區段s。之後，當塗 =之喷嘴62到達修復區段s之終止諸時，完成膠的 老p出。 =喷嘴62—到達修復區段$之初始點pi就排出膠戈 膠1、二為各頭單元60之移動速度及透過噴嘴62排注 初ίίΐ 異、，可能無法立即排出膠到修復區段k 將‘嘴過初始點Pi後可塗佈膠。因此，較佳地’ 初妗點，而1初°點Pl相距預定距離之位置，標明為排出 中，、导喷嘴到達排出初始點時則排出勝。於此案例 初始點可位於噴嘴62移動方向在修復區段s之 12 201007314 =始點Pl之前。然而’若有需要，排出初始點可位於初 始點Pi之後。 ❹ 參 士祕Γ時’於嘴嘴62 一到達修復區段s之終止點Pf就完 哈趣β膠之案例中，因為各頭單元60之移動速度及透過 2排f±{膠之速賴的差異，可能無法立即於修復區 二之終止點Pf完祕轉&，❿可於通祕止點付後 的排出。因此’較佳地’將喷嘴62與終止點Pf相 疋距離之位置，標明為排出終止點，而當喷嘴62到 =出終止點時則完成排出穋。排出終止點可位於喷嘴62 ^動=向在修復區段S之終止點pf之前。然而，若有需 要排出終止點可位於終止點pf之後。 同時’可於谬圖案提供複數個修復區段。當修復區段 曰的距離很小時’有強烈的可能性認為在修復區段s間 =不連續的或轉度是有缺關。再者，當紐區段$ ㈣，離D很小刚個修復區段S的排出終止點及接續的 j區段S之排出初始點間之間隔時間為很短。因此，當 ^、膠排ϋ{麟著重新開糾，可能發生錯誤。由於 修復程序，亦即重新塗佈膠的程序，可能無法順 因此，當複數個修復區段s間的間隔時短時，亦 J 口L復區& s的排出終止點及接續的修復區段$之排 13 201007314 間在預設範圍内時’較佳將前個修復 、、的t復區段s標明為一個修復區段s。 而脫=考則的間隙資料可能因外界環境造成的雜訊 參 案例，間隙資料描繪出在相當窄的 的變動動的波形。當將雜訊造成之間隙資料 陷的膠圖牵^為修復區段時’可能塗佈膠到甚至沒有缺 膠·而由於重複塗佈膠，因而導致不必要的 成其他的缺陷部份。因此，當在預設間隔内（例 數m财:資料麟參考細r之變械形為預定次 時(例如約3或4次）’將變動視為雜訊所造成， 其標並未脫離參伽。因此，不將 同時’為了標明基板20將要修復的修復區段s，本發 明利用基板20及喷嘴62間之間隙資料。然而，本發明並 =限於這個方法，本發明可利用截面積感測器、雷射感測 =、相機、以及其他手段，來決定膠圖案不連續的缺陷部 份’因而標明修復區段S。 如上所述，當標明基板20之修復區段S，執行重新塗 佈膠到相關修復區段s之修復程序。於此，當修復區段s 間的間隔D為預設間隔或更小時，連續塗佈膠到複數個"修 復區段S，因而修復了修復區段s。 / 14 201007314 當塗佈膠到基板20之修復區段S，可不量測基板2〇 及喷嘴62間之間隙資料而塗佈膠。然而，為了避免在修 復程序後缺陷再次發生於膠圖案，較佳地，利用雷射位移 感測器63量測基板20及喷嘴62間之間隙資料，並根據 上述所量測之基板20及喷嘴62間之間隙資料，使基板2〇 及喷嘴62間之間隙維持固定時塗佈膠。 於此，於修復區段S之膠圖案為不連續的案例中，沒 有膠塗佈於基板20或少量的膠塗佈到基板2〇。因此，形 成膠圖案於基板20之程序在修復前，量測修復區段$中 基板20及喷嘴62間之間隙資料，以及利用量測的間隙資 料使基板20及喷嘴62間之間隙維持固定時，重新塗佈谬 到修復區段s。以此方式，執行修復程序。 / 於修復區段S之膠圖案厚度為不適當的賴中，已經 有塗佈膠於基板2G ’所以雷射位移細^ 63無法順利地 K測基板20及喷嘴62間之間隙資料’且量測的準雜低。 因此’如圖6及7所示，當於步驟S21標明基板2〇 上膠圖案之祕部分之修段s時，在修復步驟前，於 步驟S22 ’量測與修復區段s相鄰之基板2〇及噴嘴62間 區段之間隙資料，亦即’膠是塗佈於基板2〇之修復區段s。 當基於所量側之間_料使基板2G及噴嘴62間之間隙維 15 201007314 持固定時，於步驟S23將膠塗佈於基板20上之修復區段 s。較佳地，與修復區段s相鄰之區段位於與修復區段s 平行之線上，以增加基板20及喷嘴62間之間隙資料量測 的準確性。 根據本發明點膠機標明修復區段之方法，利用塗佈膠 於基板20時於基板20及喷嘴62間所量測的間隙資料， 因而快速地標明修復區段S。 再者，根據本發明點膠機之基板修復方法，僅在基板 20上之膠圖案P具有缺陷部分執行修復操作，因而精確地 修復缺陷部分’以及最小化了因重複塗佈膠而發生的其他 缺陷部分。 再者，根據本發明點膠機之基板修復方法，量測修復 區段S中基板20及喷嘴62間之間隙資料，以及利用所量 參 測之間隙資料使基板20及喷嘴62間之間隙維持固定，而 重新塗佈膠於修復區段S，而可精確地修復基板2〇。 再者，根據本發明點膠機之基板修復方法，量測與修 復區段S相鄰之區段之基板2〇及喷嘴62間之間隙資料， 以及基於所量測之間隙資料使基板2〇及喷嘴62間之間隙 維持固定，而塗佈膠於基板2〇之修復區段s，而可更精確 地修復基板20。 16 201007314 根據本發·賴之基板做綠，其優勢在於僅修 復基板上有缺之區段，而可精確地修復缺陷部 分，以及最小化因重複塗佈膠造成其他缺陷部分的發生。 本發明描述於此之實施例可獨立實施或彼此結合實 施。雖然:已揭露本發明較佳實施例作為說明範例，^匕技 賴域者應赚在轉離本發财請專纖目界定之精 w 神與範疇下可有各種修改、添加、及替換。 【圖式簡單說明】 、本發明上述及其他目的、特徵及優點，參考詳細說明 並配合伴隨圖式，將更加清楚了解，其中： 圖1為根據本發明顯示點膠機之透視圖； 圖2為顯示圖1之點膠機之頭單元之透視圖； 圖3為顯示圖1之點膠機之雷射位移感測器量測之間 〇 隙資料’顯示噴嘴及基板間之間隙資料之波形之示意圖； 圖4為顯示基板上標明修復區段之示意圖； 圖5為顯示標明基板之修復區段之方法之流程圖； 圖6為顯示於基板及喷嘴間所量測之間隙資料之位置 以修復基板之示意圖；以及 圖7為依序顯示根據本發明之基板修復方法之流程 201007314201007314 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method of repairing a defect on a substrate. [Prior Art] A device in which a paste is applied to a substrate to adhere or seal a substrate in a predetermined pattern, depending on the respective freshness and (10) 3). This dispenser includes a flat head unit, a head support, and an X-axis drive unit. The substrate is mounted on the platform. The nozzle for discharging the glue is mounted on the head f element. The head unit is read by the head stock. The X-axis drive unit is inserted in the head unit and the head support H head unit in the push line direction (X-axis direction) outside the head support. The job is equipped with a plurality of head units which simultaneously form a plurality of glue patterns on a large-area substrate to increase the yield. When the gap between the nozzle and the substrate is adjusted, the dispenser forms a glue pattern on the substrate. To this end, the head unit is provided with a laser displacement sensor for measuring the gap between the nozzle and the substrate, and a Z-axis driving unit for moving the nozzle and the laser displacement sensor in the Z-axis direction (vertical direction). The laser displacement sensor includes a transmitting portion that emits laser light, and a receiving portion that is spaced apart from the emitting portion by a predetermined distance and receives the laser light. The laser displacement senses the second round of the power output signal to the control unit, thereby measuring the gap data between the substrate and the nozzle, and the electrical signal corresponds to the image forming position of the 201007314 portion of the laser light emitted by the transmitting portion and reflected by the substrate. produce. ^ When changing the relative position between the substrate and the nozzle, this turns to form a predetermined glue on the substrate. That is, when the head unit is mounted on the head support member, the fresh element is horizontally moved in the direction of the axis and the direction is ... and the glue is discharged to the substrate 4 when the glue is applied to the substrate, and the laser displacement sensor measures M ^ 4c RS pm κ± Furthermore, based on the gap data measured by the laser displacement sensor, it is mounted on the head single-finger nozzle _ in the 2-axis direction, and the gap between the control nozzle and the substrate is 'set _: turn a fixed. In this case, the glue is discharged from the nozzle to the substrate, thus forming a glue pattern on the substrate. / ^ When the glue pattern is completed, the substrate coated with the glue passes through the test procedure 2. In this procedure, the substrate is tested to determine if the thickness of the glue pattern is within a predetermined range and if the glue pattern is discontinuous. In order to determine the defective section of the glue pattern on the substrate, the entire surface of the substrate is scanned by a laser scanner to measure the cross-sectional area of the applied glue, or the glue pattern is photographed by the camera to determine whether the glue pattern is discontinuous. In this way, in order to determine whether the glue pattern is defective, it is necessary to send the substrate with the glue pattern to the test procedure. Furthermore, additional test equipment must be used to determine whether the glue pattern is discontinuous, or whether the thickness of the glue pattern is within the pre-existing range, so that the procedure for testing the rubber pattern is very complicated and cannot be quickly executed. 6 201007314 Line 0 Determination of the test material _ When the case is defective, the substrate with the missing __ must be transported again to the second cloth program to perform the repair procedure on the substrate. That is, when it is impossible to: repair the substrate coated with the defective plastic round. Tian····· 参 岸! The technical problem is that testing or repairing the defective rubber pattern fi for a long time makes the production of a large number of products difficult and increases the manufacturing cost. Furthermore, the problem with the 'native fix' is that even if the financial-(four) segment is defective after the paste case is formed (glue (four) is not _ or the thickness is not appropriate, etc.), all segments of the rubber pattern will be recoated, and may not be accurate. Repair the defect 'and other problems may occur due to repeated application of the glue. φ [ SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the problems of the prior art, and it is an object of the present invention to provide a substrate repairing method which only repairs a section having a rubber pattern defect and minimizes the occurrence of other defective portions. In order to achieve the above object, the present invention provides a method of repairing a substrate </RTI> comprising: a first step 'specifying a repair section for a glue pattern on the substrate; and a second step of applying a glue to the repair section indicated in the first step. 7 201007314 The second step includes: (a) the steps of measuring the gap between the substrate and the nozzle, and (b) the gap between the substrate and the nozzle according to the gap between the substrate and the nozzle measured in the step (a). The step of applying the glue to the repair section while maintaining the fixing is maintained. / Further, the second step comprises: (a) measuring the gap data between the substrate and the nozzle in the section adjacent to the repair section indicated in the first step; and (b) measuring according to the step (a) The gap between the substrate and the nozzle is a step of applying the glue to the repairing section when the gap between the substrate and the nozzle is maintained. (a) The step measures the gap between the substrate and the nozzle in a line parallel to the repair section indicated in the first step. Meanwhile, when the repair section of the first step includes a plurality of repair sections ' and the interval between the plurality of repair sections is a predetermined interval or less, the second step continuously applies the glue to the plurality of repair sections. The first step determines whether the gap between the substrate and the nozzle measured when the glue is applied to the substrate is out of the reference range, and the section indicating the gap of the measured gap is the repair section. [Embodiment] A substrate repairing method according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings. 8 201007314 - m 4 According to this issue, the perspective of the dispenser of the dispenser is shown, and Figure 2 is a perspective view of the head unit of the dispenser of Figure 1. Figure 1 is a schematic view. The dispenser according to the present invention comprises a bottom frame 1 平, 平 ❹ =;: set at the bottom ====. LM=Part 4 is recorded on the platform 3Q _ γ 财. The head piece 50 is mounted such that it is repaired by the pair of LM members by 60 in the X-axis direction, and each of the shaft drive units 7 () is used to mount the drive member 50. The control unit control head unit 60 and the boring shaft are not expected to be rotated to the bottom of the iG to shift the Y-axis direction of the frame 10, and the second drive unit 59 = for _5. Up, along the LM guide = piece 50. The substrate 20 has a large area ^ fulcrum to increase the degree of formation of the glue pattern. The number of the dies is 3 and the number of the head units 6 〇 includes the syringe 61 filled with glue, and the measurement sneeze 62 IS::: The nozzle 6!, the laser displacement sensor 201007314 63 placed in the gap between the nozzle 62 and the soil 4, the moving nozzle 62 and the laser displacement sensor 63 in the γ-axis direction of the γ-axis driving unit 64, and the movement The nozzle 62 and the laser displacement sensor 63 are in the x-axis direction of the x-axis drive unit 65. The laser displacement sensor 63 includes a transmitting portion 631 that emits laser light, and a receiving portion 632 that is spaced apart from the transmitting portion 631 by a predetermined distance and receives the laser light reflected from the substrate 2?. The laser displacement sensation 63 outputs an electrical signal to the controller, which measures the gap between the substrate and the nozzle, and the position of the light emitted by the illuminating unit and reflected by the substrate 20 is generated. Further, the cross-sectional area sensor 66 can be mounted on each of the head units (9) to measure the cross-sectional area of the glue pattern ρ coated on the substrate 20. The cross-sectional area sensor 66 continuously emits laser light to the substrate 2 to scan the glue pattern ρ, thereby measuring the cross-sectional area of the glue pattern Ρ. The cross-sectional area data of the glue pattern measured by the cross-sectional area sensor 66 is used to determine whether the glue Ρ is defective. Hereinafter, the frame according to the present invention is constructed as described above, and when the glue pattern applied to the substrate is defective, the repair base will be described with reference to FIGS. 3 to 7. FIG. 3 is a dispensing machine according to an embodiment of the present invention. The laser displacement sensor quantity ^ shows a schematic diagram of the waveform of the data between the nozzle and the substrate; FIG. 4 is a schematic diagram showing the section on the substrate on which the glue pattern is formed to mark the repair 201007314, and FIG. 5 is shown in FIG. A flowchart of a method in which a substrate on which a glue pattern is formed indicates a repairing section; and FIG. 6 is a schematic view showing the position of the gap data measured between the substrate and the nozzle to repair the substrate. The substrate repair method according to the present invention includes a repair section that marks the glue pattern on the substrate 20, and recoats the glue to the identified repair section. The embodiment of the method of designing a repair section on a substrate having a defective glue pattern proposes a method of measuring the gap data between the substrate 2 and the nozzle 62 during the application of the glue application. As shown in FIG. 3, when each head unit 60 moves in the x-axis direction and the γ-axis direction so that the glue is applied to the substrate 2, the gap information measured by the laser displacement sensor 63 is applied to the coating glue. The trace will show the waveform. In step S12, the measured gap data is compared with a preset reference range, and it is determined whether the gap data between the substrate 2 and the nozzle 62 is within the reference range. Here, when the glue pattern p is not precisely applied, and the glue pattern p is discontinuous or the thickness of the glue pattern does not reach the reference value, the substrate 20 and the nozzle can be measured by the laser displacement sensor 63. The gap between the 63 data and the experiment obtained the reference range R. That is, when the gap information between the substrate 2 and the nozzle 62 is changed, the change in the shape of the glue pattern is analyzed. When the glue pattern is defective, the gap between the substrate 20 and the nozzle 62 is measured to determine the reference range R. 201007314 Furthermore, as shown in FIG. 4, in step S13, a section in which the gap between the substrate 2 and the nozzle 62 is not in the reference range R is indicated as a section in which the substrate 20 needs to be repaired, which is called a repair section. . It is assumed that the point where the gap data measured by the laser displacement sensor 63 starts to deviate from the reference range R is indicated as the initial point Pi of the section, and the gap data of the measurement out of the reference range R is returned to the point of the reference range HR. For the termination point pf, the section from the initial point pi ❹ 到 to the final point Pf can be set as the repair section S. The repair section S can be set by calculating the coordinates of the initial point (Xi Yi) and the termination point (Xf, Yf). At the same time, the repair section s is clarified, and the procedure of recoating the glue to the relevant section S is performed. Also, when each head unit 6 is horizontally moved in the X t direction and the Y axis direction, the nozzle 62 is caused to reach the initial state of the repair section * 1, the nozzle 62 is discharged and the glue is applied to the repair section s. Thereafter, when the nozzle 62 reaches the end of the repair section s, the old p-out of the glue is completed. = Nozzle 62 - When the initial point pi of the repair section is reached, the glue gel 1 and the head 2 are moved at the speed of each head unit 60 and the nozzles 62 are discharged, and the glue may not be immediately discharged to the repair section k. The glue can be applied after the mouth has passed the initial point Pi. Therefore, it is preferable to 'the initial point, and the position where the first point P1 is apart from the predetermined distance is marked as being discharged, and when the pilot nozzle reaches the discharge initial point, the discharge is won. In this case, the initial point can be located in the moving direction of the nozzle 62 before the repair section s 12 201007314 = the starting point P1. However, the discharge initial point can be located after the initial point Pi if necessary. ❹ 参 Γ Γ ' 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于The difference may not be immediately at the end point of the repair zone 2 Pf complete secret & ❿, can be discharged after the end of the secret point. Therefore, the position where the nozzle 62 is at a distance from the end point Pf is marked as the discharge end point, and when the nozzle 62 reaches the end point, the discharge port is completed. The discharge end point may be located at the nozzle 62 ^ before the end point pf of the repair section S. However, if it is necessary to discharge the termination point, it may be located after the termination point pf. At the same time, a plurality of repair sections can be provided in the 谬 pattern. When the distance between the repaired sections is small, there is a strong possibility that there is a gap between the repaired sections s = discontinuous or the degree of rotation. Furthermore, the interval between the exit section of the critical section S and the initial point of the discharge of the succeeding section S is very short. Therefore, when ^, the rubber raft ϋ { 麟 re-opening the correction, an error may occur. Due to the repair procedure, that is, the procedure of recoating the glue, it may not be possible to do so. When the interval between the plurality of repair sections s is short, the discharge end point of the J-portion complex & s and the subsequent repair section When the row between 2010 and 201007314 is within the preset range, it is better to mark the previous repair, the t complex segment s as a repair segment s. The gap data of the test result may be due to the noise caused by the external environment, and the gap data depicts a relatively narrow waveform. When the glue image trapped by the noise is involved in the repair section, it is possible to apply the glue to or even lack of glue. Due to the repeated application of the glue, unnecessary defects are caused. Therefore, when the change is regarded as a noise in the preset interval (the number of m: the data is referenced to the predetermined number of times (for example, about 3 or 4 times), the target is not separated. Therefore, the present invention utilizes the gap information between the substrate 20 and the nozzle 62 in order to indicate the repair section s to be repaired by the substrate 20. However, the present invention is limited to this method, and the present invention can utilize the cross-sectional area. Sensor, laser sensing =, camera, and other means to determine the defective portion of the discontinuous pattern of the glue pattern - thus indicating the repair section S. As described above, when the repair section S of the substrate 20 is marked, execution is performed again. The repair process of applying the glue to the relevant repair section s. Here, when the interval D between the repair sections s is a preset interval or less, the glue is continuously applied to a plurality of "repair section S, thus repairing Repair section s. / 14 201007314 When the glue is applied to the repair section S of the substrate 20, the glue may be applied without measuring the gap between the substrate 2 and the nozzle 62. However, in order to avoid recurrence of defects after the repair process In the glue pattern, preferably, using a laser The shift sensor 63 measures the gap data between the substrate 20 and the nozzle 62, and applies the glue when the gap between the substrate 2 and the nozzle 62 is kept fixed according to the gap data between the substrate 20 and the nozzle 62 measured as described above. Here, in the case where the glue pattern of the repair section S is discontinuous, no glue is applied to the substrate 20 or a small amount of glue is applied to the substrate 2. Therefore, the procedure for forming the glue pattern on the substrate 20 is before repair. The gap data between the substrate 20 and the nozzle 62 in the repair section $ is measured, and when the gap between the substrate 20 and the nozzle 62 is maintained by the measured gap data, the crucible is recoated to the repair section s. In the manner of performing the repair process. / In the case where the thickness of the glue pattern in the repairing section S is inappropriate, there is already coating glue on the substrate 2G' so the laser displacement is fine ^ 63 and the substrate 20 and the nozzle 62 cannot be smoothly measured. The gap data 'and the quasi-homogeneity of the measurement is low. Therefore, as shown in FIGS. 6 and 7, when the repair portion s of the secret portion of the substrate 2 〇 glue pattern is indicated in step S21, before the repair step, in step S22 'Measurement and repair section s adjacent to substrate 2 〇 and nozzle 62 The gap information of the inter-section, that is, the glue is applied to the repairing section s of the substrate 2 。. When the gap between the substrate 2G and the nozzle 62 is fixed according to the amount between the measured sides, the dimension is maintained at 15 201007314, Step S23 applies the glue to the repair section s on the substrate 20. Preferably, the section adjacent to the repair section s is located on a line parallel to the repair section s to increase the gap between the substrate 20 and the nozzle 62. Accuracy of data measurement. According to the method of the present invention for marking the repair section, the gap data measured between the substrate 20 and the nozzle 62 when the glue is applied to the substrate 20 is used, thereby quickly indicating the repair section S Further, according to the substrate repairing method of the dispenser of the present invention, only the adhesive pattern P on the substrate 20 has a defective portion to perform a repairing operation, thereby accurately repairing the defective portion' and minimizing occurrence of repeated application of the adhesive. Other defects. Furthermore, according to the substrate repairing method of the dispenser of the present invention, the gap data between the substrate 20 and the nozzle 62 in the repairing section S is measured, and the gap between the substrate 20 and the nozzle 62 is maintained by using the gap data of the measured amount. Fixing, and re-applying the glue to the repairing section S, the substrate 2 can be accurately repaired. Furthermore, according to the substrate repairing method of the dispenser of the present invention, the gap between the substrate 2〇 and the nozzle 62 of the section adjacent to the repair section S is measured, and the substrate 2 is made based on the measured gap data. The gap between the nozzles 62 is maintained constant, and the glue is applied to the repair section s of the substrate 2 to repair the substrate 20 more accurately. 16 201007314 According to the green of the board of this hair, the advantage is that only the missing sections on the substrate can be repaired, and the defective parts can be accurately repaired, and other defects caused by repeated coating of the glue can be minimized. The embodiments described herein may be implemented independently or in combination with one another. Although the preferred embodiment of the present invention has been disclosed as an illustrative example, those skilled in the art should be able to make various modifications, additions, and substitutions in the context of the departure of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will become more apparent from 1 is a perspective view showing the head unit of the dispenser of FIG. 1; FIG. 3 is a waveform showing the gap between the nozzle and the substrate between the laser displacement sensor of the dispenser of FIG. Figure 4 is a schematic view showing the repair section on the substrate; Figure 5 is a flow chart showing the method of indicating the repair section of the substrate; Figure 6 is a view showing the position of the gap data measured between the substrate and the nozzle Schematic diagram of repairing a substrate; and FIG. 7 is a flow chart showing a substrate repairing method according to the present invention in sequence 201007314
【主要元件符號說明】 10 底框架 20 基板 30 平台 40 線性馬達導引件 50 頭支撐件 59 第二驅動裝置 60 頭單元 61 注射器 62 喷嘴 63 雷射位移感測 631 發射部 632 接收部 64 γ軸驅動單元 65 Z轴驅動單元 66 截面積感測器 70 X軸驅動單元[Main component symbol description] 10 Bottom frame 20 Substrate 30 Platform 40 Linear motor guide 50 Head support 59 Second drive unit 60 Head unit 61 Syringe 62 Nozzle 63 Laser displacement sensing 631 Transmitting portion 632 Receiving portion 64 γ-axis Drive unit 65 Z-axis drive unit 66 cross-sectional area sensor 70 X-axis drive unit