TWI290626B - Electroconductive contact probe holder - Google Patents

Electroconductive contact probe holder Download PDF

Info

Publication number
TWI290626B
TWI290626B TW092108967A TW92108967A TWI290626B TW I290626 B TWI290626 B TW I290626B TW 092108967 A TW092108967 A TW 092108967A TW 92108967 A TW92108967 A TW 92108967A TW I290626 B TWI290626 B TW I290626B
Authority
TW
Taiwan
Prior art keywords
holder
contact probe
hole forming
holes
reinforcing member
Prior art date
Application number
TW092108967A
Other languages
English (en)
Other versions
TW200305723A (en
Inventor
Toshio Kazama
Mitsuhiro Nagaya
Hiroyasu Sotoma
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW200305723A publication Critical patent/TW200305723A/zh
Application granted granted Critical
Publication of TWI290626B publication Critical patent/TWI290626B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
TW092108967A 2002-04-16 2003-04-16 Electroconductive contact probe holder TWI290626B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002113485 2002-04-16
JP2002126875 2002-04-26

Publications (2)

Publication Number Publication Date
TW200305723A TW200305723A (en) 2003-11-01
TWI290626B true TWI290626B (en) 2007-12-01

Family

ID=29253562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092108967A TWI290626B (en) 2002-04-16 2003-04-16 Electroconductive contact probe holder

Country Status (8)

Country Link
US (1) US7239158B2 (zh)
EP (1) EP1496366A4 (zh)
JP (2) JP4578807B2 (zh)
KR (1) KR100791136B1 (zh)
CN (1) CN100387993C (zh)
AU (1) AU2003235187A1 (zh)
TW (1) TWI290626B (zh)
WO (1) WO2003087852A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618310B (zh) * 2013-09-27 2018-03-11 恩普樂股份有限公司 安裝構件及電氣零件用插座
TWI646335B (zh) * 2018-05-10 2019-01-01 中華精測科技股份有限公司 導位板及其製造方法和具有該導位板之探針頭

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003087852A1 (en) * 2002-04-16 2003-10-23 Nhk Spring Co., Ltd. Holder for conductive contact
JP4639101B2 (ja) * 2004-03-31 2011-02-23 日本特殊陶業株式会社 部品支持基板及びその製造方法、光デバイス
JP4395429B2 (ja) * 2004-10-20 2010-01-06 日本発條株式会社 コンタクトユニットおよびコンタクトユニットを用いた検査システム
JP4757531B2 (ja) * 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
JP5244288B2 (ja) * 2005-06-08 2013-07-24 日本発條株式会社 検査装置
JP4905876B2 (ja) * 2005-10-31 2012-03-28 日本発條株式会社 導電性接触子ホルダの製造方法および導電性接触子ホルダ
JP4884749B2 (ja) * 2005-10-31 2012-02-29 日本発條株式会社 導電性接触子ホルダの製造方法および導電性接触子ユニットの製造方法
JP4841298B2 (ja) * 2006-04-14 2011-12-21 株式会社日本マイクロニクス プローブシートの製造方法
TW200809209A (en) * 2006-04-18 2008-02-16 Tokyo Electron Ltd Probe card and glass substrate drilling method
WO2008072699A1 (ja) 2006-12-15 2008-06-19 Nhk Spring Co., Ltd. 導電性接触子ホルダ、導電性接触子ユニット、および導電性接触子ホルダの製造方法
US7447041B2 (en) * 2007-03-01 2008-11-04 Delphi Technologies, Inc. Compression connection for vertical IC packages
CN101315392A (zh) * 2007-05-31 2008-12-03 佛山普立华科技有限公司 探针定位装置
EP2159580B1 (en) * 2008-08-26 2015-10-07 Lake Shore Cryotronics, Inc. Probe tip
WO2010061888A1 (ja) 2008-11-26 2010-06-03 日本発條株式会社 プローブユニット用ベース部材およびプローブユニット
JP5372706B2 (ja) * 2009-11-04 2013-12-18 株式会社日本マイクロニクス プローブ針ガイド部材及びこれを備えたプローブカード並びにそれを用いる半導体装置の試験方法
CN103076555A (zh) * 2013-02-07 2013-05-01 安拓锐高新测试技术（苏州）有限公司 一种芯片测试针架
WO2014123235A1 (ja) * 2013-02-08 2014-08-14 日本発條株式会社 プローブユニット用ベース部材、プローブホルダ、プローブユニット、プローブユニット用ベース部材の製造方法およびプローブユニット用積層構造体
CN104198772B (zh) * 2014-08-28 2017-11-21 安拓锐高新测试技术（苏州）有限公司 嵌入式芯片测试插座及其加工方法
KR102134235B1 (ko) * 2020-02-27 2020-07-15 주식회사 비티솔루션 테스트 소켓 모듈
KR102184057B1 (ko) * 2020-09-07 2020-11-27 주식회사 에스에이치엘 4개 와이어 접속방식이 가능한 전극 접속 유니트
TWI825798B (zh) * 2022-06-22 2023-12-11 吳俊杰 彈性探針及電路測試裝置

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JPS60154868A (ja) 1984-01-23 1985-08-14 Toshiba Corp 銅管とアルミニウム管との接続方法
JPS60168062A (ja) 1984-02-10 1985-08-31 Yokowo Mfg Co Ltd 集積回路のパタ−ン検査用ピンブロツク
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US6246247B1 (en) * 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
JPH07161426A (ja) * 1993-12-03 1995-06-23 Furukawa Electric Co Ltd:The ベアチップバーンインテスト用ソケット及びその製造方法
JP3442137B2 (ja) 1993-12-17 2003-09-02 日本発条株式会社 導電性接触子ユニット
JP3394620B2 (ja) * 1995-01-20 2003-04-07 株式会社日立製作所 探針組立体および検査装置
JP2790074B2 (ja) * 1995-03-31 1998-08-27 日本電気株式会社 プローブ装置
US5804984A (en) * 1996-08-02 1998-09-08 International Business Machines Corporation Electronic component test apparatus with rotational probe
DE69831491T2 (de) * 1997-07-14 2006-06-29 NHK Spring Co., Ltd., Yokohama Leitender kontakt
JPH11108954A (ja) 1997-10-03 1999-04-23 Eejingu Tesuta Kaihatsu Kyodo Kumiai コンタクトプローブ
JP3135884B2 (ja) 1998-03-26 2001-02-19 株式会社ヨコオ 回路基板検査装置のテストヘッド
JP4880120B2 (ja) 1998-07-10 2012-02-22 日本発條株式会社 導電性接触子
JP4124520B2 (ja) 1998-07-30 2008-07-23 日本発条株式会社 導電性接触子のホルダ及びその製造方法
JP4060984B2 (ja) * 1999-04-07 2008-03-12 株式会社日本マイクロニクス プローブカード
US6255832B1 (en) * 1999-12-03 2001-07-03 International Business Machines Corporation Flexible wafer level probe
JP3500105B2 (ja) 2000-02-10 2004-02-23 日本発条株式会社 導電性接触子用支持体及びコンタクトプローブユニット
JP2002098727A (ja) * 2000-09-25 2002-04-05 Oht Inc 検査ユニット、及び、基板の製造方法
JP5075309B2 (ja) * 2001-03-16 2012-11-21 日本発條株式会社 導電性接触子用支持体
WO2003087852A1 (en) * 2002-04-16 2003-10-23 Nhk Spring Co., Ltd. Holder for conductive contact
AU2003235189A1 (en) * 2002-04-16 2003-10-27 Nhk Spring Co., Ltd Holder for conductive contact

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI618310B (zh) * 2013-09-27 2018-03-11 恩普樂股份有限公司 安裝構件及電氣零件用插座
TWI646335B (zh) * 2018-05-10 2019-01-01 中華精測科技股份有限公司 導位板及其製造方法和具有該導位板之探針頭

Also Published As

Publication number Publication date
JP4578807B2 (ja) 2010-11-10
JPWO2003087852A1 (ja) 2005-08-18
JP2010237220A (ja) 2010-10-21
KR20040105877A (ko) 2004-12-16
KR100791136B1 (ko) 2008-01-02
EP1496366A4 (en) 2005-09-14
WO2003087852A1 (en) 2003-10-23
CN100387993C (zh) 2008-05-14
JP4920769B2 (ja) 2012-04-18
EP1496366A1 (en) 2005-01-12
CN1646924A (zh) 2005-07-27
TW200305723A (en) 2003-11-01
AU2003235187A1 (en) 2003-10-27
US7239158B2 (en) 2007-07-03
US20050225313A1 (en) 2005-10-13

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MM4A Annulment or lapse of patent due to non-payment of fees