TWI281478B - Die-attaching paste and semiconductor device - Google Patents

Die-attaching paste and semiconductor device Download PDF

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Publication number
TWI281478B
TWI281478B TW090100958A TW90100958A TWI281478B TW I281478 B TWI281478 B TW I281478B TW 090100958 A TW090100958 A TW 090100958A TW 90100958 A TW90100958 A TW 90100958A TW I281478 B TWI281478 B TW I281478B
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Taiwan
Prior art keywords
paste
weight
amount
epoxy resin
parts
Prior art date
Application number
TW090100958A
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English (en)
Inventor
Toshiro Takeda
Kazuto Onami
Tomohiro Kagimoto
Original Assignee
Sumitomo Bakelite Co
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Publication of TWI281478B publication Critical patent/TWI281478B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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Description

1281478 A7 B7 五、發明說明（1 ) 技藝領域 本發明係關於一種樹脂糊料用於將半導體晶片如I C 、L S I或其類似者黏附於金屬框架或其類似者之上。 技藝背景 近年來由於電子工業顯著的生長，已依序發展出電晶 體、I C、LS及ITLS I ;在此類晶片中電路整合之程 度已見到急劇的增加；晶片的大量生產已變得可能的；結 果’半導體產物使用晶片已變得使用廣汎的。據此，在半 導體產物的大量生產中如何增加可施工性及降低成本已變 爲重要的議題。傳統上，半導體產物其製作一般係由將晶 片黏合至導體（例如金屬框架），此係採用Au — S i共 熔鑄’且然後經由密封膠將生成的材料作密封。樹脂封膠 已被發展出，而代替密封膠，其原因在大量生產中的可施 工性及成本，且彼目前正被廣汎的使用。據此，經由焊料 或樹脂糊料（即用於黏附晶片的糊料）的黏合已使用於鑲 嵌，作爲改進用以A U — S i共熔鑄的方式。 然而，由焊料黏合據言有問題在低可靠度，容易污染 晶片電極等。且彼使用係限制於功率電晶體及功率I C之 晶片，彼係須要高熱傳導度。相反地，由用於黏附晶片的 糊料的黏合係優於由焊料黏合，在可施工性，可靠度等方 面。且用於黏附晶片的糊料之需求正快速增加。 由於I C或其類似者之整合程度移向較高的密度，近 年來晶片已漸增地變得較大。另一方面，銅框架係用於降 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) .1 ϋ «ϋ ϋ 一-0, _ n ϋ S ϋ ϋ ·ϋ ϋ ·
經濟部智慧財產局員工消費合作社印製 -4 1281478 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（2) 低成本，代替高成本的4 2合金框架與慣常的鉛框架。當 I C或其類似者之晶片而彼尺寸約4至5mmx 4至5 mm或較大者，然而，在經由Au - S i共熔鑄而加熱黏 合至銅框架上，晶片引起裂開或翹曲且招致I C性質劣化 ，此係由於介於晶片與銅框架之間不同的熱膨脹係數，且 此將引起問題。 此係因爲作爲晶片材料#矽或其類似者，具有熱膨脹 係數在3 X 10_6/°C且4 2合金框架之熱膨脹係數在8 X 1 0_6/°C但針對銅框架高達2 Ο X 1 0_6/°C。爲了 減輕此問題，考量使用經由用於黏附晶片的糊料之黏合而 代替經由A u - S i共熔鑄的黏合。當以慣常的環氧基（ 熱固性樹脂）爲主的糊料用作爲用於黏附晶片的糊料，然 而，其係三度空間硬化且因此彼經固化產物具有高彈性模 數；結果，發生介於晶片與銅框架之間的張力不能被吸收 〇 當可使用環氧樹脂能得到經固化產物的低交聯密度， 例如環氧樹脂其中內含大量的環氧基單體，則可得到具有 低彈性模數的經固化產物，但彼具有低黏著強度。此外， 通常的環氧樹脂具有高黏度，且當混合以無機塡充劑，將 賦予太高的黏度，造成當分散中連成一串且隨後有低的可 施工性。於其中加入大量的溶劑以改進可施工性將導致空 孔產生。爲了解決該麻煩，有發明（J P — A— 2 000 一 80149、JP — A- 2000 — 80150 及 JP —A— 2000 — 80151)，彼係針對其中包含三官 (請先閱讀背面之注意事項再填寫本頁)
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本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -5- 1281478 A7 -------B7____ 五、發明說明（3 ) 能甘油基胺類型環氧樹脂及反應性稀釋劑的樹脂糊料。然 而’使用此類糊料，當在糊料中的甘油基胺類型環氧樹脂 具有高氯含量，得到的半導體構裝將具有低的耐水性。 本發明之揭示 本發明之目的在提供一種用於黏附晶片的糊料而彼帶 有充分的熱黏著強度1賦予經固化產物以低彈性模數，且 從而導致無晶片裂開或翹曲且在結果上不發生I C或其類 似者的性質劣化，甚至當用於將大的晶片（例如I C )黏 合至銅框架或其類似者，且彼係可快速硬化的，且不產生 空孔。 本發明係關於用於黏附晶片的糊料而其中包含下列作 爲基本的成分： (A) —種液體環氧樹脂而其中包含（a 1 )由以下 通式（1 )代表的環氧樹脂，其中內含氯含量在5 0 0 ppm或更低且彼具有黏度在5，OOOmPa · s或更 低（在2 5 t：下）： I I---------裝！1__ 丨訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製
量 ( 含 及氯 ’ 含 Η 內 I 中 或其 團而 基劑 基釋 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -6- 1281478 A7 B7 五、發明說明（4) 在3〇〇PPm或更低且彼具有黏度在1，OOOmPa • s或更低，（a 1 ) : ( a 2 )的重量比例在4 0 : 6 〇 至 9 0 : 1 〇， (B ) —種酚化合物其在分子中具有至少二種羥基基 團， (C ) 一種潛在的硬化劑、 (D ) —種咪唑化合物、及 (E ) —種無機塡充劑， 其中成分（B) 、（C)及（D)之用量分別爲1至 10重量份、0 · 5至5重量份及0 · 5至10重量份， 以每1 0 0重量份的成分（A)計，且成分（E )之用量 爲2 5至9 0 0重量份，以每1 0 0重量份的成分（A) 、（：B ) 、（ C )及（D )之總量計。 本發明亦關於半導體裝置，而彼係由使用上述用於黏 附晶片的糊料而製作。 發明之詳細說明 本發明中使用的液體環氧樹脂（A)包含由通式（1 )代表的環氧樹脂（a 1 )及內含環氧基基團的反應性稀 釋劑（a2)，且（al) ： (a2)的重量比例在40 :60至90: 10。由通式（1)代表的環氧樹脂（ a 1)具有氯含量在500ppm或更低。氯含量在大於 5 0 0 P Pm係不佳的，因爲使用該環氧樹脂製作的樹脂 糊料顯示低耐水性當使用在半導體封裝之中。由通式（1 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) | 裝·！ ！ I 訂-！ Λ 經濟部智慧財產局員工消費合作社印製 1281478 A7 B7 五、發明說明（5) )代表的環氧樹脂（a 1 )可帶有各種分子量；然而’ _ 佳爲具有小分子量的環氧基樹脂而彼在室溫下爲液體°胃 氧樹脂（a 1)須要具有黏度在5，OOOmPa · s或 更低（在2 5 °C下），基於本發明用於黏附晶片的糊料·之 配料可施工性及糊料配料之可施工性之觀點。 將與由通式（1 )代表的環氧樹脂（a 1 )混合的’ 此項內含環氧基基團的反應性稀釋劑（a 2 )，須要具胃 氯含量在300ppm或更低且黏度在1，OOOmPa •s或更低（在25°C下）。氯含量在大於30〇PPm 將不提出，因爲使用該反應性稀釋劑製作的樹脂糊料將_ 示低耐水性當使用於半導體構裝。黏度在大於1 ’ 〇 〇 〇 mP a · s係不佳的，基於配料的糊料可施工性之觀點。 反應性稀釋劑（a 2 )之實施例爲正丁基甘油基醚、維沙 (versaUc )酸之甘油基酯類、苯乙烯氧化物、乙基己基甘 油基醚、苯基甘油基醚、甲苯酚基甘油基醚及丁基苯基甘 油基醚。此類化合物可單獨使用或合倂二或更多種使用。 由通式（1 )代表的環氧樹脂（a 1 )及內含環氧基 基團的反應性稀釋劑（a 2 )之重量比例在6 0 : 4 0至 9 0 : 1 0。當反應性稀釋劑（a 2 )之比例大於4 0 % 重量比，所得到的樹脂糊料帶有低黏著強度；當此比例少 於1 0 %重量比，所得到的樹脂糊料具有高黏度及低可施 工性；因此，該比例係不佳的。 本發明中，其它環氧樹脂可與液體環氧樹脂（A)合 倂使用，而用量宜在不超過總環氧樹脂的3 0 %重量比。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) — II 訂 — 經濟部智慧財產局員工消費合作社印製 -8 - 經濟部智慧財產局員工消費合作社印製 1281478 A7 ____B7_ 五、發明說明（6) 可混合以液體環氧樹脂（A )的其它環氧基樹脂包括例如 脂肪族的環氧樹脂如聚甘油基醚（得自介於（a )雙酚A 、雙酚F、酚系酚醛淸漆、甲酚酚醛淸漆或其類似者與（ b)表氯醇之間的反應）、丁烷一二醇二甘油基醚、新戊 二醇二甘油基醚及其類似者；雜環基的環氧樹脂如二甘油 基乙內醯脲及其類似者；及脂環族環氧樹脂如乙烯基環己 烯二氧化物、二環戊~二烯二氧化物、脂環族二環氧基己二 酸酯及其類似者。在此類化合物中，可使用一種或二或更 多種之組合。 用於本發明中的酚化合物（B )係用作爲環氧樹脂之 硬化劑。用於本發明中的酚化合物（B )在分子中帶有二 個或更多活化的羥基基團而能與環氧基基團反應造成交聯 。該酚化合物之實施例爲雙酚A;雙酚F;雙酚S;四甲 基雙酚A;四甲基雙酚F;四甲基雙酚S;二羥基聯苯基 醚；二羥基苯甲酮；鄰一羥基酚；間一羥基一酚；對一羥 基酚；雙酚；四甲基雙酚；亞乙基雙酚；甲基亞乙基雙（ 甲基酚）；環亞己基雙酚；酚系酚醛淸漆樹脂而彼係得自 將單氫酚（例如酚、甲酚或二甲苯酚）與甲醛在稀釋的水 溶液之中反應且係在強酸下；預縮合物而彼係在介於單氫 酚與多官能基醛（例如丙烯醛或乙二醛）之間於酸之下的 反應而得到；及預縮合物而彼係在多氫酚（例如間苯二酚 、兒茶酚或氫醌）及甲醛於酸之下的反應而得到。此類化 合物可單獨使用或混合使用。 酚化合物（B )之用量在1至1 0重量份，以每 (請先閱讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -9 - 1281478 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（7) 1 0 0重量份的液體環氧樹脂（A )計。當酚化合物（B )用量少於1重量份，將不能得到充分的黏著或低應力； 當用量大於1 0重量份，將不能得到充分的耐熱性或充分 的黏著；因此，該用量係不佳的。 使用於本發明中的潛在的硬化劑（C )係用作爲環氧 樹脂之硬化劑。彼係在高溫下發揮功能但在室溫下不發揮 功能。潛在的硬化劑（C )之實施例爲羧酸二醯肼如己二 酸二醯肼、十二酸二醯肼、間苯二酸二醯肼、對一氧基苯 甲酸二醯肼及其類似者；及二氰二醯胺。當使用潛在的硬 化劑（C )，相較於當僅使用酚化合物（B )作硬化，將 得到明顯地較高的熱黏著強度。此外，因爲潛在的硬化劑 (C )比酚化合物（B )具有較小的當量，合倂使用藥劑 (C) 與化合物（B)可提供一樹脂糊料而不具如此高的 黏度。此外，因爲藥劑（C )具有潛在的可硬化性，可得 到具有卓越貯存穩定性的樹脂糊料。潛在的硬化劑（C ) 其使用量在0 . 5至5重量份，以每1 0 0重量份的液體 環氧樹脂（A )計。當潛在硬化劑（C )的用量少於 0 · 5重量份，將得到低的熱黏著強度；當用量大於5重 量份，將不能得到充分的低應力；因此，該用量係不佳的 〇 使用於本發明中的咪唑化合物（D )爲用以允許本發 明樹脂糊料具有快速可硬化性的基本的成分。咪唑化合物 (D) 之實施例爲通常的咪唑如2 -甲基咪唑、2 —乙基 咪唑、2 -苯基咪唑、2 —苯基一 4 一甲基咪唑、2 —苯 (請先閱讀背面之注意事項再填寫本頁) 裝
I ϋ Μι ϋ · ΜΗ MM* ΜΜ I I 雪 J 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 10- 1281478 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（8) 基—4 —甲基一5 —羥甲基—咪唑、2 —苯基一4，5 — 二羥甲基咪唑、2 — —咪唑及其類似者；及化合 物而彼係得自在其中加入三嗪或異三聚氰酸以得到較高的 貯存穩定性者，例如2，4 —二氨基—6 - { 2 -甲基咪 唑—（1) }—乙基一 s -三嗪或其異三聚氰酸加合物。 此類化合物可單獨使用或混合二或更多種而使用。咪唑化 合物（D )之用量在0 .5至10重量份，以每100重 量份的液體環氧樹脂（A )計。當咪唑化合物（D )之用 量少於0 . 5重量份，所生成的樹脂糊料之快速可硬化性 將不充分的；當用量大於1 0重量份，生成的樹脂糊料不 再顯示快速可硬化性之改進，且可能顯示降低的貯存穩定 性；因此，該用量係不佳的。 使用於本發明中的無機塡充劑（E )包括銀粉末、二 氧化矽塡充劑等。銀粉末係用於較高的導電度，及含有離 子性雜質（例如鹵素離子及鹼金屬離子）含量宜在1 0 P pm或更低。此銀粉末的之顆粒形狀可爲薄片狀、樹脂 狀、球形或其類似者。所使用的銀粉末之粒徑其變化取決 於製作的樹脂糊料所須要之黏度；然而，慣常地，平均粒 徑宜在2至1 0 //m且最大粒徑較佳者在約5 0 //m。彼 有可能使用相對地粗糙的銀粉末及細微銀粉末之混合物。 彼亦可能使用合適的不同顆粒形狀之銀粉末的混合物。 使用於本發明中的二氧化矽塡充劑帶有平均粒徑在1 至2 0 //m且最大粒徑在5 0 或更低。當平均粒徑少 於1 /zm，生成的樹脂糊料具有高黏度；當平均粒徑大於 (請先閱讀背面之注意事項再填寫本頁) · ^1 ϋ ϋ ϋ mMmm a·— · mmmt i— »1 n 1 I I · 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 11 - 1281478 A7 B7 五、發明說明（9) 2〇//m，生成的樹脂糊料導致彼於塗覆或硬化期間發生 樹脂流動且生成的溢流；因此，該平均粒徑係不佳的。當 最大粒徑大於5 0 //m，當使用分散器塗覆生成的樹脂糊 料頂針的出口將堵塞，使不可能長期連續使用頂針。彼有 可能使用相對地粗糙二氧化矽塡充劑與細微二氧化矽塡充 劑兩者之混合物。彼亦可能使用合適的不同顆粒形狀之二 氧化矽塡充劑的混合物。可使用除了銀粉及二氧化矽塡充 劑以外的無機塡充劑，以給予所須要的性質。 使用的無機塡充劑（E)之用量在2 5至9 0 0重量 份，以每100重量份的成分（A) 、( B ) 、（C)及 (D )之總量計。當用量少於2 5重量份，生成的樹脂糊 料之經固化產物將具有不充強化的機械性質且具有低黏著 剪強度。當用量大於9 0 0重量份，生成的樹脂糊料具有 高黏度及低可施工性。 如須要，本發明樹脂糊料可含有添加劑如矽烷耦合劑 、鈦酸鹽耦合劑、顏料、染料、消泡劑、界面活性劑、溶 劑及其類似者，只要無損害於在所欲求之用途中樹脂糊料 所須要之性質。 本發明樹脂糊料之製作，例如經由預調混合個別成分 ，使用三-滾筒磨機或其類似者捏合此預調混合物以形成 糊料’且在真空下將糊料除氣。本發明之半導體裝置可經 使用本發明的用於黏附晶片的糊料且進一步經使用慣常的 一般方法而製作 本紙張尺度適用中國國家標準(CNS)A4規格（21〇 X 297公釐） 請 先 閲 讀 背 面 之 注 意 事 項 I裝 頁i I 訂 經濟部智慧財產局員工消費合作社印製 -12- 1281478 A7 B7 五、發明說明（1Q) 執行本發明的最佳模式 接著，本發明尤其是記述於實施例。在實施例中，成 分之比例係由重量份展示。 實施例1至9及比較例1至1 0 使用三-滾筒磨機將展示於表1及2的成分配料且捏 合，以得到各種樹脂糊料。在2 mmH g的真空腔室之中 將各樹脂糊料脫氣3 0分鐘，且然後依據下列方法測量各 項性質。 使用的成分 •通式（1)之環氧樹脂（環氧樹脂a 1 — 1)： 黏度=2 ’ OOOmPa · s ’總氯含量=400 p pm，環氧當量=2 2 0 •通式（1)之環氧樹脂（環氧樹脂a 1—2)： 黏度=4，OOOmPa · s ，總氯含量=350 p pm，環氧當量=2 3 5 •通式（1 )之環氧樹脂（ELM - 1 〇〇其係由 Sumitomo Chemical 公司製作，R = C Η 3 : 黏度=4，0 0 0 m P a · s，總氯含量= 3，0Q0ppm，環氧當量=250 •通式（1 )之環氧樹脂（E - 6 3 0其製作係由Shell Jap an 公司，R = — Η): 黏度二8，OOOmPa · s，總氯含量=800 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) • ϋ 1 ·1«
經濟部智慧財產局員工消費合作社印製 -13 - 1281478 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（11) ppm，環氧當量=280 •雙酚A類型環氧樹脂（BPA): 黏度=9，OOOmPa · s ’環氧當量=185 •雙酚F類型環氧樹脂（B P F ): 黏度=5，OOOmPa · ’環氧當量=170 •反應性稀釋劑（a 2 ):第三一丁基苯基甘油基 醚黏度= 400'mPa · s，總氯含量=1 10 ppm
•酚化合物（B ):雙酚F •潛在的硬化劑（C ):二氰二醯胺（D D A ) •咪π坐化合物（D) : 2 -苯基一 4 一甲基_5 —經基— 甲基咪唑（2P4MHZ) •無機塡充劑（E )： 銀粉：薄片狀銀粉末彼具有粒徑在〇 · 1至5 0 β m 且平均粒徑在3 //m 二氧化矽塡充劑：二氧化矽塡充劑彼具有平均粒徑在 5 //m且最大粒徑在2 0 μπι 用於之評估各項性質之方法 •黏度 各樹脂糊料黏度之測量係使用Ε類型黏度計（3 °錐 體）於 25Ϊ：，在 2.5rpm。 •彈性模數 (請先閲讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -14- 經濟部智慧財產局員工消費合作社印製 1281478 A7 __B7_ 五、發明說明（12 ) 將樹脂糊料塗覆在鐵弗龍片上採用1 0 m m寬度，約 1 5 Omm長度及1 〇 〇 pm厚度。將塗層片置於1 7 0 °C的烤箱中3 0分鐘以硬化此糊料。然後，將自鐵弗龍片 剝離而生成的的膜作抗張測試，測試長度在1 0 0 m m且 拉伸速率在lmm/m i η，以得到應力一應變曲線。由 此曲線的起始梯度計算彈性模數。 •黏著強度 使用樹脂糊料將2 X 2 mm砂晶片裝設在銅框架上。 將所生成的材料置於1 7 0 °C的烤箱3 0分鐘以硬化糊料 。然後，使用黏著強度測試機於2 5 °C及2 5 0 °C測量黏 附剪力強度。 •翹曲量 使用樹脂糊料，將6 X 1 5 X 0 · 3 m m矽晶片裝設 於厚度在2 0 0 //m的銅框架上。所生成的材料允許在 1 7 0 °C放置3 0分鐘以硬化糊料。然後，使用表面粗糙 度測δ式機測量晶片之鍾曲（測試長度：1 3 m m )。 •耐水性 將得自將鋁接線在矽晶片上而形成的模擬晶片，使用 樹脂糊料裝設在1 6 -孔D I P (雙同軸封裝）的銅框架 上。將所生成的材料置於1 7 0 °C的烤箱3 0分鐘以硬化 糊料。然後，執行金線黏合。於此之後，使用環氧基模製 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐） (請先閲讀背面之注意事項再填寫本頁)
· ϋ n ϋ I tmmm ϋ ϋ I c^i n I ϋ I
-15- 1281478 A7 B7 _ 五、發明說明（13 ) <請先閱讀背面之注意事項再填寫本頁) 化合物Ε Μ E - 6 3 Ο Ο Η執行轉移模製，而彼係由 Sumitomo Bakelite公司製作，此模製係於1 7 0 °C及2分 鐘的條件之下，接著於1 7 5 °C及4小時的條件之下作後 硬化。將所生成的封裝在一壓力鍋之中於於1 2 5°C、 2 · 5 a t m、及5 0 0小時的條件之下處理，以檢視其 電路之缺陷（％ )。 •使用時限 將樹脂糊料允許置於一 2 5 °C的恆溫器之中，且測量 之其中糊料之黏度變得至少1 · 2倍於起始黏度的天數。 •總氯含量 經濟部智慧財產局員工消費合作社印製 將約1 g的環氧樹脂準確地稱重在具有平坦底部的 2 0 0 -毫升燒瓶之中。然後，依此順序加入沸石及2 5 毫升的正丁基二甘醇一乙醚。將所生成的混合物加熱以溶 解環氧樹脂。於自然冷卻之後，加入2 5毫升的1 N水溶 性氫氧化鉀溶液。於加熱下將所生成的混合物回流1 0分 鐘。混合物允許泠卻約1小時。將燒瓶內容物移入燒杯中 ，且採用約5 0毫升的冰醋酸淸洗燒瓶內部且將淸洗液移 入燒杯中。然後，使用0 · 0 1 N水溶性硝酸銀溶液執行 電位滴定法。亦採用相同方法執行空白試驗。在環氧樹脂 中總氯含量係由以下公式測定。 總氯（w t · % ) =〔 { 0 · 0 1 X f X ( V — V ’ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） • 16 - 1281478 A7 B7 五、發明說明（14) )XAW}/(Wxl〇〇〇)〕X100 ί :強度在0 · 〇 1 N的水溶性硝酸銀溶液 V :用以滴定又環氧樹脂的〇 · 〇 1 Ν水溶性硝酸銀 溶液之體積（毫升） .V， ··用以滴定又空白試驗的〇 · 〇 ί ν水溶性硝酸 銀溶液之體積（毫升） w :環氧樹脂之'重量 A W : 3 5 · 4 6 性質評估結果之展示於表1及表2 ° (請先閱讀背面之注意事項再填寫本頁) i I I I I I I 訂· I I 1 I I I ! 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 1281478 A7 B7 ^_ 經濟部智慧財產局員工消費合作社印製 HE ____ 實施例 $ j r 〇\ V 〇〇 〇 °° 00^00^ 1—H 17 >4000 1400 68 5000 0 5 〇 〇〇 - 2二 - 25 >4000 1690 76 4950 0 6 〇 r- 一 ^ ^ 〇 寸 …ο — ^ go ο 1 - - \〇 ^ 〇〇 ΟΟ Ο. ^ ^ ^ 〇 — w 24 >4000 1360 65 4310 0 6 〇 υη Ο 。CN 10 心 〇 18 >4000 1400 80 4700 0 7 〇 寸 7：寸寸一 '卜^ ^ ο ο卜 23 >4000 1700 70 5292 0 7 〇 m ' 寸—π卜Q Ν ο ο ^ 21 >4000 2070 80 5 390 0 5 〇 03 18.2 4.8 5 1 0.4 0.8 70 20 >4000 1380 75 4508 0 6 〇 1 ^ 〇〇 〇 00 〇； — 〇〇> τ i 15 >4000 1500 70 5096 0 6 〇 <1ml| 卿1 龚 ru mn m m s ϊ ® 二二擀 s A]m Din nx? ΠΧ： ^ 癍奪 V ^ K 翠 tif lif 111 ^ Ϊ 醛醉S搬》〇3鴉11 性質 m Μ •N ε s s H< 巳缌鹚爷盤. MW ^ 租 fflSEElS 5 願驟袒製· SS讲 Μ 〇 (請先閱讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -18- 1281478 A7 B7 五、發明黎科4 16 〇 〇
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X L ocnose 09 OA寸 iz Z I _ M, 3ltpK-mS 舔 sdrHIg胡餾衾«·· ---l·---I----_ 裝--------訂· — (請先閱讀背面之注意事項再填寫本頁) QL 000 寸.0 I L Irsl X L 0 0969 * 05 000寸< Lrl QL io Γ0 X L 01 iz, * 0011 000 寸 < ocn 經濟部智慧財產局員工消費合作社印製 (φ ¥ _)龚 31 『歡识》象与祕 0 ® ηρρα ZHS 寸 dcslναα j 螽a 韜««扭_擗sx-H濉 0C9-H 001-23 dsvdPQ 0 00 0 mg —^ Gi) Ηa £ 2 辱 1K =侧 0Z&mmm 巳锻。◦ 〇«赃《&她 蹈_二二租担基昍® 線;s 騮酲相_翻 s«ii:x卜-褰遯1+(°.寸“)醛粼Λ Η-°°.Γ·η3α 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -19- 1281478 A7 B7 五、發明說明（17 ) (請先閱讀背面之注意事項再填寫本頁) 由表1及2可淸楚看出，實施例1至9供給樹脂糊料 彼具有高的熱黏著強度，低應力（即小彈性模數及小翹曲 量）’長的使用時限及優越的的耐水性。然而，在比較例 1的樹脂糊料，因爲使用雙酚A類型環氧樹脂，低應力性 質係較差的，翹曲量大，且發生晶片裂開。在比較例2的 樹脂糊料，因爲使用雙酚F類型環氧樹脂，低應力性質較 差的，翹曲量大，且·發生晶片裂開。在比較例3的樹脂糊 料，因爲使用大量的反應性稀釋劑，黏著強度顯著的降低 。在比較例4的樹脂糊料，因爲使用小量的反應性稀釋劑 ，黏度高，其將降低可施工性。在比較例5的樹脂糊料， 因爲未使用酣化合物，黏著強度顯著地低。在比較例6的 樹脂糊料，因爲使用大量的酚化合物，熱黏著低。在比較 例7及8的各樹脂糊料，因爲使用高總氯含量之環氧樹脂 ，耐水性顯著地低。在比較例9的樹脂糊料，因爲使用大 量咪唑，使用時限顯著地短。在比較例1 〇的樹脂糊料， 彼使用第三-胺代替咪唑，其耐水性低。 經濟部智慧財產局員工消費合作社印製 如此，依據本發明的半導體用樹脂糊料具有高熱黏著 強度，且有優越的應力舒張，且因此，適於使用在將大的 晶片（例如I C )黏合至銅框架，且可預防I C或其類似 者的性質劣化，導致在I C組合中顯露晶片裂開或晶片變 形。 工業可施用性 本發明樹脂糊料係用於黏合晶片與金屬框架或其類似 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -20 - 1281478 A7 __B7_ 五、發明說明（18 ) 者，而此兩者係構成電子工業的半導體裝置。 (請先閱讀背面之注意事項再填寫本頁) | · I II ^1 ϋ 1 ϋ 1 一着 0, · - I mm— I mmmmmm ϋ I · 經濟部智慧財產局員工消費合作社印製 -21 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）

Claims (1)

1281478 A8 B8 C8 D8 六、申請專利範圍 1 · 一種用於黏附晶片的糊料，而其中包含下列作爲 基本的成分： (A) —種液體環氧樹脂，其中包含（a 1 )由以下 通式（1 )代表的環氧樹脂而其中氯含量在5 〇 〇 p pm 或更低且彼具有黏度在5，0〇〇mpa · s或更低（在 2 5 t：下）：
(1) 其中R爲帶有1至3個碳原子的烷基基團或一 Η，及（ a 2 )內含環氧基基團的反應性稀釋劑而其中氯含量在 3〇0ppm或更低且彼具有黏度在1 ，OOOmPa · s或更低（在25°C下），（al) : (a2)的重量比 例在40:60至90:10， (B ) —種酚化合物其在分子中具有至少二種羥基基 團， (請先閱讀背面之注意事項再填寫本頁) 訂---------
經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 (C ) 一種潛在的硬化劑， (D ) —種咪唑化合物、及 (E) —種無機塡充劑，其中成分（B) (C )及 (D)之用量分別在1至10重量份、〇 · 5至5重量份 及〇 · 5至10重量份，以每1〇〇重量份的成分（A) 計，且成分（E )用量在2 5至9 0 0重量份而彼係以每
1281478 ab OO C8 D8 六、申請專利範圍 100重量份的成分（A) 、( B ) 、（C)及（D)之 總量計。 2 . —種半導體裝置，彼係使用敘述於申請專利範圍 第1項的用於黏附晶片的糊料所製作。 (請先閱讀背面之注意事項再填寫本頁) · I— I— d n n n 1^1 一 ^ n n ϋ tame ϋ I I
經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -23-
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