KR100681565B1 - 다이부착형 페이스트 및 반도체소자 - Google Patents
다이부착형 페이스트 및 반도체소자 Download PDFInfo
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- KR100681565B1 KR100681565B1 KR1020037005007A KR20037005007A KR100681565B1 KR 100681565 B1 KR100681565 B1 KR 100681565B1 KR 1020037005007 A KR1020037005007 A KR 1020037005007A KR 20037005007 A KR20037005007 A KR 20037005007A KR 100681565 B1 KR100681565 B1 KR 100681565B1
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- Prior art keywords
- weight
- less
- paste
- epoxy resin
- viscosity
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- ATGQXTGTNDXTJC-UHFFFAOYSA-N C(C1OC1)N(CC1OC1)Cc1cc(OCC2OC2)ccc1 Chemical compound C(C1OC1)N(CC1OC1)Cc1cc(OCC2OC2)ccc1 ATGQXTGTNDXTJC-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
실시예 | |||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | |
컴파운딩 (중량부) | |||||||||
에폭시 수지 a1-1 | 18.2 | 18.2 | 25 | 21 | 30 | 30 | 41 | 35 | |
에폭시 수지 a1-2 | 18.2 | ||||||||
BPF | 4.8 | 4 | 8 | 5 | |||||
t-부틸페닐 글리시딜에테르 | 9.8 | 5 | 4 | 4 | 16 | 8 | 5 | 6 | 8.8 |
비스페놀 F | 1 | 1 | 1 | 1 | 2 | 2 | 2 | 2 | 2 |
DDA | 0.3 | 0.4 | 0.3 | 0.4 | 0.5 | 0.5 | 0.5 | 0.5 | 0.3 |
2P4MHZ | 0.7 | 0.8 | 0.7 | 0.7 | 1.5 | 1.5 | 1.5 | 1.5 | 0.7 |
은분말 | 70 | 70 | 70 | 70 | 70 | ||||
실리카 충전제 | 50 | 50 | 50 | 50 | |||||
특성 | |||||||||
점도(Paㆍs) | 15 | 20 | 21 | 23 | 18 | 24 | 26 | 25 | 17 |
접착강도(gf/칩) | |||||||||
25℃ | >4000 | >4000 | >4000 | >4000 | >4000 | >4000 | >4000 | >4000 | >4000 |
250℃ | 1500 | 1380 | 2070 | 1700 | 1400 | 1360 | 1650 | 1690 | 1400 |
휨 량 (㎛) | 70 | 75 | 80 | 70 | 80 | 65 | 80 | 76 | 68 |
탄성률(MPa) | 5096 | 4508 | 5390 | 5292 | 4700 | 4310 | 5100 | 4950 | 5000 |
내습성 시험에서의 불량율(%) | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
포트 수명 (일수) | 6 | 6 | 5 | 7 | 7 | 6 | 5 | 6 | 5 |
총 평가 | o | o | o | o | o | o | o | o | o |
비교예 | ||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | |
컴파운딩 (중량부) | ||||||||||
에폭시 수지 a1-1 | 7 | 26 | 18.2 | 18.2 | 16.7 | 21 | ||||
BPA | 21 | |||||||||
BPF | 21 | 2 | ||||||||
ELM-100 | 18.2 | |||||||||
E-630 | 30 | |||||||||
t-부틸페닐 글리시딜 에테르 | 7 | 7 | 21 | 2 | 10.8 | 7 | 16 | 10.8 | 7 | 7 |
비스페놀 F | 1 | 1 | 1 | 1 | 3.8 | 2 | 1 | 1 | 1 | |
DDA | 0.3 | 0.4 | 0.3 | 0.4 | 0.3 | 0.3 | 0.5 | 0.3 | 0.3 | 0.7 |
2P4MHZ | 0.7 | 0.8 | 0.7 | 0.7 | 0.7 | 0.7 | 1.5 | 0.7 | 5 | |
DBU | 0.3 | |||||||||
은분말 | 70 | 70 | 70 | 70 | 70 | 70 | 70 | 70 | 70 | |
실리카 충전제 | 50 | |||||||||
특성 | ||||||||||
점도(Paㆍs) | 30 | 25 | 12 | 59 | 16 | 34 | 75 | 24 | 16 | 28 |
접착강도(gf/칩) | ||||||||||
25℃ | >4000 | >4000 | 2050 | 1030 | 3800 | >4000 | 2600 | >4000 | 3500 | 2300 |
250℃ | 1100 | 1250 | 470 | 600 | 860 | 1200 | 800 | 1750 | 900 | 950 |
휨 량 (㎛) | * | * | 60 | * | 80 | * | 75 | 75 | 80 | 80 |
탄성률(MPa) | 7056 | 6960 | 3920 | 8036 | 4900 | 7350 | 5096 | 5488 | 5488 | 5700 |
내습성 시험에서의 불량율(%) | 10 | 0 | 30 | 40 | 10 | 0 | 10 | 100 | 60 | 20 |
포트 수명 (일수) | 7 | 7 | 7 | 5 | 6 | 6 | 4 | 6 | 1 | 5 |
총 평가 | × | × | × | × | × | × | × | × | × | × |
Claims (2)
- 필수성분으로서:(A) 500ppm 이하의 염소를 함유하고 25℃에서 5,000mPaㆍs 이하의 점도를 갖는 다음 일반식(1)로 표시되는 에폭시 수지 (a1)과,(여기서, R은 1 내지 3 탄소원자를 갖는 알킬기나 -H 이다)300ppm 이하의 염소를 함유하고 25℃에서 1,000mPaㆍs 이하의 점도를 갖는 에폭시기 함유 반응성 희석제 (a2)를 (a1):(a2)의 중량비 40:60 내지 90:10 범위로서 포함하는 액상 에폭시 수지;(B) 분자내에 적어도 2개의 히드록실기를 가진 페놀 화합물;(C) 잠재성 경화제;(D) 이미다졸 화합물; 및(E) 무기 충전제를 포함하고,상기 성분(B), (C) 및 (D)의 양이 성분(A)의 100중량부당 각각 1 내지 10중량부, 0.5 내지 5중량부 및 0.5 내지 10중량부이고, 성분(E)의 양이 상기 (A), (B), (C) 및 (D) 성분들 전체 100중량부당 25 내지 900중량부인 것을 특징으로 하는 다이부착형 페이스트.
- 제1항에 따른 다이부착형 페이스트를 사용하여 제조한 반도체 소자.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000310083 | 2000-10-11 | ||
JPJP-P-2000-00310083 | 2000-10-11 | ||
PCT/JP2001/000314 WO2002031018A1 (en) | 2000-10-11 | 2001-01-19 | Die-attaching paste and semiconductor device |
Publications (2)
Publication Number | Publication Date |
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KR20030059805A KR20030059805A (ko) | 2003-07-10 |
KR100681565B1 true KR100681565B1 (ko) | 2007-02-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020037005007A KR100681565B1 (ko) | 2000-10-11 | 2001-01-19 | 다이부착형 페이스트 및 반도체소자 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040014842A1 (ko) |
EP (1) | EP1325053B1 (ko) |
KR (1) | KR100681565B1 (ko) |
CN (1) | CN1187389C (ko) |
DE (1) | DE60116126T2 (ko) |
MY (1) | MY128135A (ko) |
TW (1) | TWI281478B (ko) |
WO (1) | WO2002031018A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100422235C (zh) * | 2003-10-17 | 2008-10-01 | 深圳丹邦科技有限公司 | 用于芯片搭载及封装的电绝缘树脂浆 |
US20050194456A1 (en) | 2004-03-02 | 2005-09-08 | Tessier Patrick C. | Wireless controller with gateway |
WO2006103962A1 (ja) * | 2005-03-25 | 2006-10-05 | Sumitomo Bakelite Co., Ltd. | 半導体装置、並びにバッファーコート用樹脂組成物、ダイボンド用樹脂組成物、及び封止用樹脂組成物 |
WO2010123765A2 (en) * | 2009-04-20 | 2010-10-28 | Henkel Corporation | Thin bond line semiconductor packages |
SG188261A1 (en) * | 2010-09-02 | 2013-04-30 | Sumitomo Bakelite Co | Fixing resin composition for use in rotor |
TWI586749B (zh) * | 2010-11-19 | 2017-06-11 | 漢高日本股份有限公司 | 單組分環氧樹脂組成物 |
US10852025B2 (en) | 2013-04-30 | 2020-12-01 | Ademco Inc. | HVAC controller with fixed segment display having fixed segment icons and animation |
CN109563238B (zh) * | 2016-08-10 | 2021-08-27 | 三键有限公司 | 环氧树脂组合物以及含有其的导电性胶粘剂 |
JP6967726B2 (ja) * | 2018-01-31 | 2021-11-17 | パナソニックIpマネジメント株式会社 | はんだペーストおよび実装構造体 |
KR20240030043A (ko) | 2022-08-29 | 2024-03-07 | 이주원 | 에너지 절약을 위한 자동 점멸 전등 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10237157A (ja) * | 1997-02-27 | 1998-09-08 | Sumitomo Bakelite Co Ltd | 液状樹脂組成物および該液状樹脂組成物を使用して作製した半導体装置 |
MY122050A (en) * | 1998-05-29 | 2006-03-31 | Sumitomo Chemical Co | Highly purified epoxy resin |
JP3719855B2 (ja) * | 1998-09-03 | 2005-11-24 | 住友ベークライト株式会社 | 半導体用樹脂ペースト |
JP3719856B2 (ja) * | 1998-09-03 | 2005-11-24 | 住友ベークライト株式会社 | 半導体用樹脂ペースト |
-
2001
- 2001-01-16 TW TW090100958A patent/TWI281478B/zh not_active IP Right Cessation
- 2001-01-19 CN CNB01816403XA patent/CN1187389C/zh not_active Expired - Fee Related
- 2001-01-19 US US10/398,012 patent/US20040014842A1/en not_active Abandoned
- 2001-01-19 DE DE60116126T patent/DE60116126T2/de not_active Expired - Lifetime
- 2001-01-19 WO PCT/JP2001/000314 patent/WO2002031018A1/en active IP Right Grant
- 2001-01-19 KR KR1020037005007A patent/KR100681565B1/ko active IP Right Grant
- 2001-01-19 EP EP01901435A patent/EP1325053B1/en not_active Expired - Lifetime
- 2001-01-27 MY MYPI20010364A patent/MY128135A/en unknown
Also Published As
Publication number | Publication date |
---|---|
MY128135A (en) | 2007-01-31 |
US20040014842A1 (en) | 2004-01-22 |
WO2002031018A1 (en) | 2002-04-18 |
EP1325053A1 (en) | 2003-07-09 |
TWI281478B (en) | 2007-05-21 |
DE60116126T2 (de) | 2006-08-03 |
DE60116126D1 (de) | 2006-01-26 |
CN1469890A (zh) | 2004-01-21 |
EP1325053B1 (en) | 2005-12-21 |
CN1187389C (zh) | 2005-02-02 |
KR20030059805A (ko) | 2003-07-10 |
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