TWI274866B - Inspection device for printed solder - Google Patents

Inspection device for printed solder Download PDF

Info

Publication number
TWI274866B
TWI274866B TW094100962A TW94100962A TWI274866B TW I274866 B TWI274866 B TW I274866B TW 094100962 A TW094100962 A TW 094100962A TW 94100962 A TW94100962 A TW 94100962A TW I274866 B TWI274866 B TW I274866B
Authority
TW
Taiwan
Prior art keywords
light
scanning
printed
splitting
unit
Prior art date
Application number
TW094100962A
Other languages
English (en)
Chinese (zh)
Other versions
TW200529721A (en
Inventor
Norihiko Masuda
Takahisa Tashita
Masaya Sugai
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Publication of TW200529721A publication Critical patent/TW200529721A/zh
Application granted granted Critical
Publication of TWI274866B publication Critical patent/TWI274866B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/136—Segmentation; Edge detection involving thresholding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
TW094100962A 2004-02-25 2005-01-13 Inspection device for printed solder TWI274866B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004049336A JP4014571B2 (ja) 2004-02-25 2004-02-25 印刷はんだ検査装置

Publications (2)

Publication Number Publication Date
TW200529721A TW200529721A (en) 2005-09-01
TWI274866B true TWI274866B (en) 2007-03-01

Family

ID=35010799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094100962A TWI274866B (en) 2004-02-25 2005-01-13 Inspection device for printed solder

Country Status (4)

Country Link
JP (1) JP4014571B2 (ja)
KR (1) KR100632650B1 (ja)
CN (1) CN100462715C (ja)
TW (1) TWI274866B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699179B2 (ja) * 2005-11-10 2011-06-08 日本オートマチックマシン株式会社 電線端末部の芯線検査装置
NO336441B1 (no) * 2012-01-24 2015-08-17 Tomra Sorting As Anordning, system og fremgangsmåte for optisk detektering av materie
US9551569B2 (en) * 2014-10-13 2017-01-24 Hermes-Epitek Corporation Apparatus and method for curvature and thin film stress measurement
CN105093256B (zh) * 2015-06-29 2017-12-01 京东方科技集团股份有限公司 一种射线检测基板及其制造方法和射线探测器
CN105864144B (zh) * 2016-05-23 2019-01-22 重庆德盟液压机械有限公司 囊膜式液压缸或气缸
CN106018434B (zh) * 2016-07-06 2018-12-28 康代影像科技(苏州)有限公司 一种光学检测设备
JP6306230B1 (ja) * 2017-02-09 2018-04-04 Ckd株式会社 半田印刷検査装置、半田印刷検査方法、及び、基板の製造方法
JP2019100753A (ja) * 2017-11-29 2019-06-24 アンリツ株式会社 プリント基板検査装置及びプリント基板検査方法
JP2020046341A (ja) * 2018-09-20 2020-03-26 パイオニア株式会社 投光装置、投受光装置及び測距装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113355A (en) * 1980-12-30 1982-07-14 Fujitsu Ltd Pattern detection
JPS62232545A (ja) * 1986-04-01 1987-10-13 Kobe Steel Ltd 表面欠陥検出方法
JP3109840B2 (ja) * 1990-12-28 2000-11-20 キヤノン株式会社 面状態検査装置
JPH04279846A (ja) * 1991-03-08 1992-10-05 Fujitsu Ltd 光学式検査装置
JPH0921759A (ja) * 1995-07-10 1997-01-21 Hitachi Electron Eng Co Ltd 基板の異物検査装置
JP3441580B2 (ja) * 1995-12-14 2003-09-02 富士通株式会社 読取装置
JP4343449B2 (ja) * 2001-01-31 2009-10-14 アンリツ株式会社 印刷半田検査装置及び方法
JP2003097924A (ja) * 2001-09-21 2003-04-03 Matsushita Electric Ind Co Ltd 形状測定装置および測定方法

Also Published As

Publication number Publication date
CN1661362A (zh) 2005-08-31
JP2005241336A (ja) 2005-09-08
KR20060043034A (ko) 2006-05-15
JP4014571B2 (ja) 2007-11-28
KR100632650B1 (ko) 2006-10-12
CN100462715C (zh) 2009-02-18
TW200529721A (en) 2005-09-01

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MM4A Annulment or lapse of patent due to non-payment of fees