TWI274866B - Inspection device for printed solder - Google Patents

Abstract

An inspection device for printed solder is provided, in which two beams are used to scan a printed circuit board, so as to increase the scanning efficiency. In addition, the device can avoid measured values from being affected by different optical characteristics of the two beams. Over an object scanning area of a printed circuit board where solders are printed thereon, a deflector 4 is used to receive two beams A and B with two different incident angles, and deflect the beams A and B to scan the object scanning area. A variable means 1c can be used to adjust the beams A and B to have the same polarization and power.

Description

I274865^8pifd0< IX, invention description: [Technical field of invention] There is a Γ Γ ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( And the shape of the solder or the like is checked from the measurement by using the amount of shift. In particular, it is possible to effectively check the two aspects while performing the inspection. [Prior Art] This uses displacement measurement. Based on the known principle of _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A perspective view of the structure of the displacement recording device. The displacement measuring device shown in Fig. 18 is substantially composed of an (optical scanning system) 51 and a light receiving system, and a system 55. The first channel of the cymbal projection optical system 51 is substantially composed of a light source. 52. The deflector 53 and the lens 54^' illuminate the object to be measured (9). The light source 52 is composed of, for example, a *electrode or the like, and emits a light beam to the deflector 53. The deflector ^ is in the example of Fig. 18. A polygon mirror (p〇lyg〇nmirr〇r) is used, and a plurality of mirror-shaped portions 53a are provided around the disk shape, and the light beam incident from the light source 52 is deflected by at least the inclusion thereof, at least for inclusion. In the case of a mirror, the ray is scanned by a beam of light on the surface of the object to be scanned. The lens 54 will be scanned by the deflection of the object. ; 53 to make a fan

The 12748 slave 8pifd < light receiving system 55 is composed of a condenser lens array 56, an imaging lens 57, and a light receiving component 58 (PSD (Position Sensitive Detector)). The condensing lens 56 is formed of synthetic resin or glass, and is formed in a plurality of (six shown in FIG. 18) concentrating lens portions 56a to 56f having an equal focal length fl (for example, 2 mm). the way. In each of the condensing lens portions 56a to 56f, a plane perpendicular to the optical axis thereof is formed in a spherical shape, and the measurement light can be uniformly reduced around the optical axis. An imaging lens 57 has a diameter larger than the scanning width of the irradiation spot S, converges the light beam from the collecting lens 56, and forms an image on the light receiving surface 58a of the light receiving unit. The displacement measuring device uses the light beam scanned in the x-axis direction (main scanning direction) of the deflector 53 to obtain the displacement amount of the object object 6〇 in the x-axis direction. At this time, by moving the measuring table 61 in the z-axis direction (sub-scanning direction), the Ζ sampling = displacement $ of each of the irradiation points s at the position of the χ γ second element can be obtained. As a result, a distance data of three dimensions is obtained, for example, the solder of the printed solder can be measured. The printed solder wire is judged from this ==put, regenerative' and compared with the pre-prepared reference for good or bad judgment. Beizhu, with the 'traditional light scanning device (in the middle of the picture, as shown in Figures 19A to 19C, do crying & eve & in, and when it is dead, the polygon mirror is in the scope of its rotation Η The beam of the entrance pupil is in the desired scanning document Patent Document No. 2000-97631 (paragraph _8]-[0〇33], Fig. 4) 12748 you 8pifdoc However, in the above displacement measuring device, one :: Range-sub-scanning scans, sub-main scans) is not possible, 53 due to ar two deflection angles (to, the mirror rotation can be pulled out of the 7-direction scanning beam beyond the scan of the object surface 6Ga, Therefore, even __. In addition, in each main scan, the sub-scan is measured for measuring the range of scanned objects, but this has the problem that the field must be delayed with the speed of the main scanning speed. One way to solve the problem is to consider the method of matching the polarizing side: the mirror of the polygon mirror is narrowed and the mirror surface is arranged. However, the precision in manufacturing is limited. Moreover, ^ ' j sweep', Width 'multiple mirrors of multiple mirrors (four) must be turned in two fixed When the surface is made to be multi-faceted, the size of the deflector becomes large, and as a result, the size of the broken portion becomes large. SUMMARY OF THE INVENTION The object of the present invention is to provide a kind of Yinqing Newcha device with a deflection angle of a deflector having two In order to improve the efficiency of the scanning, and then to change the inspection, and the 'as a means to achieve the effective use of the deflector to improve the scanning 的 达成 ' ' ' ' 录 录 录 录 录 录 录 录 录 录 录 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人 人- When the main light is scanned by the mirror light and the mirror surface is used, only the 5 〇% of the mirror surface can be used, and other light is incident on the deflector at a different angle from the above-mentioned light. I2748^8pif, doc: Use the other 50% of the mirrors to perform the main scan on the 浐★. In addition, the finalization of the main scan will make the inspection device more efficient overall. Efficient efficiency: square: time factor such as = two force = in-way "!: error caused by the opposite sex. For example, the value of the gate check ^ measured value and the other main light of the measurement of the error is not wrong, this It will be possible to print the shape of the solder this = Another object is to provide a technique for maintaining the measured = speed::number =:;, and then achieving the improvement 2 and preventing the characteristic differences of the plurality of lights from mentioning the subject's embodiment according to the present invention, In the present invention, the squeegee soldering inspection device includes a projection unit (7) and a light-receiving member 1 (the 射μ* emitted light across a predetermined scanning handle of the printed substrate printed on the solder is scanned and the light-receiving portion (8) Accepting a printed pattern from the printing substrate, the printed solder inspection device is used to inspect the solder. The print σρ(3) includes a light generating portion (1) for emitting μ (majority) 斟彔ί Ξ t(4) ' The plurality of light are received at different angles of incidence, and the direction of the scanned object is reversed toward the printed substrate. In order to solve the above problems, according to the present invention, the implementation of the "open" state, the β is a polygon mirror 'and has a Ν (majority) angular mirror surface scan along the periphery of the deflector, and every 360 degrees /[ΝΜ] 9 12748 micropifdoc Different incident angles (β), received from the light generating unit ^ 360 ^ [2ΝΜ] ^ ^ #, in order to solve the above problem, according to the hairline, the material description. The tin-inspection apparatus further includes a sub-scanning unit that moves in a direction perpendicular to the scanning direction, a == plate and a shape reproducing unit (105), and the light receiving unit is based on the main scanning using the polarizer and the sub-scanning unit. The amount of received light and the position received by the sub-scanning timing are reproduced based on the electrical signals output from the received light amount and the light receiving position, and the shape of the printed solder on the printed circuit board is reproduced. In order to solve the above problems, according to one of the embodiments of the present invention, the M-channel lights emitted by the light generating portion are the same polarized light and are provided on the scanned surface of the printed substrate. Roughly the same power. In order to solve the above problems, according to one embodiment of the present invention, the channel light is two lights, and the light generating portion further includes a light source (1a) for emitting light; and the polarization beam splitting portion (lb) The light from the light source is split into two splits composed of polarization directions perpendicular to each other; the first polarizer (Id) accepts one of the two splits and is set to the same polarization direction as the other splits; The second polarizing plate (lc) is disposed between the light source and the polarizing beam splitting portion, and splits one of the output of the first polarizing plate and another splitting light on the scanned surface of the printed substrate projected through the deflector The power is adjusted to be substantially the same. In order to solve the above problems, according to one embodiment of the present invention, the ramp light is two lights, and the light generating portion further includes a light source I2748fc (1a) for emitting light and a polarizing beam splitting portion (lb). Separating the light from the light source into two splits composed of polarization directions perpendicular to each other; the first polarizer (Id) receives one of the two splits and is set to the same polarization direction as the other splits; And a third polarizing plate (If), another splitting light that receives two splitting lights, one of the two splitting lights, and adjusting the power of the two splitting lights on the scanned surface of the printed substrate that is deflected and projected The formation is essentially the same.

In order to solve the above problems, according to one embodiment of the present invention, the printed solder inspection apparatus further includes a shape reproduction unit (105) for reproducing the printed solder from an electric signal output from the light receiving unit, and a correction portion (109) "When the M-channel light is sequentially projected by the deflector, in order to prevent the influence of the amount of light received by the light-receiving portion due to the difference in the characteristics of the ramp light, the correction for the purpose of the projection is used in advance: #料, In the electric letter from the light receiving unit to the shape reproducing unit, the above problem is solved by the correction of the projected material. According to the present invention, the tin includes the shape regenerating unit _: The electrical signals that are turned out are binarized, and from (10)), when the deflector is sequentially reproduced by f偏, and the difference in the characteristics of the β-channel light is corrected, in order to prevent the correspondence between the recall and the target object H, the pre-recorded correction data, corrects the threshold value, and uses the projected light according to the present invention, because the low-biased Μ different people are scaled by the aforementioned Μ 12748 from 8pif.doc [light ordering Sweep Therefore, the scanning speed can be N (major) corners in accordance with the present invention. The mirror's different human beings are subjected to the rotation of each of the above-mentioned ^^^^ faces to a rotation of approximately 36〇|/[2NM], and the two deflectors of the two polygons are rotated relative to the rotation period. D, J; l', for example because of the multiple, it can speed up the scanning speed. The field cycle is Μ According to the present invention, the main scanning effect can be improved.

The speed of movement, and the shape of the printed solder can be regenerated; and the force = to improve the overall inspection speed of the printed solder inspection device. According to the present invention, since the same polarizing direction ' emitted by the light generating portion' and on the surface on which the printed substrate is scanned, j is almost the same power, so on the printed solder surface of the inspection object 5 In order to prevent the power and bias in the characteristics of Jixian from measuring the measurement, the accuracy of the measurement is achieved. According to the present invention, when the light is two lights, the homogenization of the two lights can be achieved with a simple structure to prevent the influence of the difference between the two lights. One

According to the present invention, since the correction portion can be used to prevent the influence of the difference in the light on the reflected light, the correction data corresponding to the projection light is memorized in advance and the correction data pair is input to the aforementioned shape. When the electrical signal of the reproduction unit or the threshold value at the time of binarization is corrected, the optical system having the characteristics of multi-channel light does not exist, and the influence on the inspection due to the difference in the majority of light can be prevented. As described above, with the displacement measuring device of the present invention, it is possible to judge the two lights (light beams) of 12 I2748^8pifdoc: and can correct various light beams according to the correction of the material.易文: Other purposes, features and advantages can be more clearly illustrated as follows, and in conjunction with the closed type, the detailed description [implementation] is: a kind of technology, which uses a lot of light (hereinafter, called light or = ',,, the same thing' makes the scanning efficiency of the deflector better, so as to improve the surface roughness of the printed solder. First, in the embodiment i ^ = the structure of the invention. Next, the real _ 2 3, the technique of preventing the adverse effects on the measured value caused by the difference in the majority of the 特性 = 特性 : : : : 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数Electrical Correction. Embodiment 1 FIG. 1 is a structure of the present invention (including the structure of Embodiment 3). The thick line in the figure is the branch road (four) line. Actually, the light is light: but in FIG. In order to understand the light path, simply by single-line, it is not shown in Figure 1. The illuminating unit 3 is composed of a light generating unit and a illuminating unit, which is called a ray mirror 5, etc. Fig. J shows an example of two lights. In the light generating unit of this example, the light source la is wood. The light-emitting portion lb which comprises a laser semiconductor (four) and outputs the channel 13 12748^3⁄418^00 light receives the light into two light beams. The light splitting portion 1b includes a half mirror and a mirror. The half mirror makes a part of the light Passing and reflecting another portion of the light, the mirror further reflects another portion of the reflected light (beam A). When a plurality of μ channels of light are emitted, the beam splitting portion 1b also needs such a large number, or a plurality of light sources may be arranged. The portion 2 receives the two lights from the light generating portion i at the mirrors 2a, 2b, and the light beam A and the light beam B are incident on the deflector 4 at an angle substantially at an angle β to each other. In this example, the deflector 4 is in the Ν A polygon mirror is arranged on the side of the angle and is supported by a polygon mirror. The angle ρ is approximately 36 / / ν. Next, the incident angle of the beam Α and the beam 、, the polygon mirror and the relationship with the rotation angle are described. When the deflector 4 is located in the solid line of Figure 1 When the index is captured, the beam 反射 is reflected near the end of the mirror surface with a deflection of 4, and the reflected beam A(l) will be at the end position of the main scan (in the lower part of the convergence lens 5 of Fig.), and finally projected to As the side of the printed substrate 1G in the inspection object range H, the light beam B is reflected near the center of the mirror surface of the deflecting mirror 4, and the reflected light beam B(l) is at the starting position of the main scanning ( In the upper section of the convergent lens 5 of Fig. 1, the other side of the 17 brush substrate 10 of the range of the sharp object is finally projected. When the mirror rotates at an angle of 360 degrees/2N in the direction of rotation of Fig. 1, that is, the deflection The device 4 rotates to the figure n:; the position L beam A is reflected near the center of the mirror surface of the deflector 4, and the reflected virtual f is at the starting position of the main scanning (in the convergence lens s &amp; in Fig. 1), The light beam B(2) (dashed line) which is projected to the printed substrate 10 in the range of the scanning object and which is reflected back near the end of the mirror surface of the deflecting mirror 4 is at the end position of the main scanning (in FIG. 14) The lower portion of the convergence lens 5 of I2748f) is finally projected onto the printed substrate 1 of the scanning object range η The deflector 4 of G L is operated from the solid line position to the dotted line position, and the beam B(l) to the beam B(2) are scanned in the main scanning direction to scan the printed substrate in the range of the scanning object. Between this °, beam A(l) to beam A(2) are scanned out of the scanned object. When the rotation of the deflector 4 is rotated by p/2 from the position of the broken line of Fig. 1, the @lower beam A(7) to the beam A(1), scanning the scanning object range H, and the beam B(2) to the beam B(l), Outside the scan object range H. The upper B(1)~B(2)_ deflection angle and the beam A(2)~A(1)_biased limb are approximately β. As described above, the main scanning can be performed once for β/2, that is, the mirror surface of the deflecting mirror 4 with respect to the central axis, the half of the degree β. In other words, since the main scan is performed twice with one mirror, the efficiency is high. "In addition, in the above description, the explanation of the angle is "approx.", which is because the actual angle depends on the main scan and the second scan. Object range h tracing and other factors. The scanned object range η of Figure 1 is in the range of two: objects. Generally speaking, the range includes the entire printed circuit board being too large. When the printed solder is disposed on the printing base V portion, its printed solder will be included in the scanning object range, and a part of the brushing substrate is outside the range. =^ is illustrated by two beams, but it is also possible to use the ramp light 2 and perform a master scan at 360 degrees/ΝΜ. In this case, it is necessary to set the angle difference between the adjacent Μ道光东问&amp;人*+$ 音编夕果 to an angle of about 360*, and make the incident positions of these beams equal. 1274863⁄48^ is incident at intervals, such that a beam of light is incident on a mirror in each direction divided into individual regions. The field convergence lens 5 is composed of a ίθ lens, and converts the light beams A and Β scanned by the deflection mirror 4 into a parallel beam into a parallel light beam, and projects it onto a printed substrate such as the sub-scanning portion 104, and performs a main scanning for each of the deflectors 4 described above. In the case of a polygon mirror, each rotation is about β/2 angle, and the relationship between the projection and the printed substrate 10 of the inspection object is moved relative to the direction of the main scanning, and the main scanning is moved in the next-time. . The field is easily recognized by the right side. The sub-scanning unit 1〇4 of Fig. 1 is placed on the printed circuit board 1〇, and the sub-scanning at this time is fixed to the printed circuit board 1 to form the projection unit 3 and the light receiving unit 8 and the like. The sensor relationship is integrated and moves it = progress. Further, the sub-scanning unit 104 supports the printed circuit board 10, and can move in a direction perpendicular to the direction in which the main scanning is performed by the deflector 4 every time the deflector 4 performs scanning. The condensing lens 6 is configured to arrange a plurality of small lenses having equifocal distances from each other in a main scanning direction, and a surface of the small lens perpendicular to the optical axis is spherical, so that reflected light from the printed substrate 1 在 is on the optical axis. The circumference is evenly reduced, and is incident on the imaging lens 7. The imaging lens 7 images the image on the light receiving surface of the light receiving portion 8. The light receiving unit 8 detects an image forming position and a light amount (power, or power) of the reflected light from the printed substrate 1 as a position sensing detector (positioI1 sensitive detect ' pSD) '. The amount of light (received light amount) detected is used as an electrical signal output, and the electrical signal has a corresponding amount of received light at that position (the total received light amount or electrical signal is also referred to as a measured value). 16 I27486rpifdoc The shape reproduction unit 105 compares the data boundary μ value and converts the well neighbor 8 to a, and the straw is converted into a digital signal by the predetermined forest. Next, from the top: _ shape of the second = equal to: on the printed substrate 丨. The structural part of ^ is divided into, for example, _ points, thieves ^ 卩 = anti-parts ^ self-received = 8 in the ^ ^ = part of the binarization process is based on the purpose and cut 8 (power), in order to distinguish between the resistance and _ And the resistance with a large amount of material and the _/^= a critical value (memory as a parameter) for binarization. </ br> </ br> </ br> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> π ί 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识 辨识Next, the shape reproducing unit 1〇5 obtains the difference between the high amount and the height reference value, and finds the height of the tin and the area (area) where only the solder is present, and the text determination unit that calculates the solder indicates the solder. The amount of solder in the position of the soldering area is pre-memorized as a reference, and the area and volume of the same soldering place are judged to be a bad judgment of H5.

I27486B48pifd0C The measurement control unit 100 performs unified management control on the whole, whereby the main scanning control unit 101 controls the mirror driving unit 102 at a predetermined timing. The mirror drive unit 102 is constituted by a motor and rotates the deflector. The sub-scanning control unit 103 rotates β/2 every time the deflector 4, transmits a timing signal to the sub-scanning unit 104, moves the printed circuit board 10, and performs sub-scanning. The display unit 109 is for performing operations, input, visual confirmation of measured values, and the like. The identification mirror 9, the scanning light detecting portion 1A7, and the correction portion 1A8 are used to correct the influence of the optical characteristics of the wire and the wire on the measurement result. Since they will be described in detail in Embodiment 3, their explanations are omitted here. &quot;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&amp;&lt; The device, 86% of the mirror utilization efficiency can be achieved by the Russian efficiency - even the figure t said 3, using the half mirror 2a different from the mirror, in Figure 12, is semi-reflective to make the first beam A and the beam B. The A is in the beam with the scanned object; ^ = _. Further, the light beam B which is shifted by the mirror 2b, the scanner object range fi, and which is shifted to the scanning object (the polygon mirror) 4 is imaged on the light receiving portion 8. In this case, the reflected light of the beam Α is the smooth surface 8a. 18 I2748^8pifdoc

Next, as shown, by rotating the deflector 4 slowly, the beam A performs a main scan within the scanned object range H. 2 P2) Over deflector 4, the beam B is continuously imaged from the scanning object range H to the reflected light of the beam A in the light receiving portion 8 a P. Next, as shown in FIG. 14 'When the deflector 4 rotates: ::a. When the angle is ', the beam A will be in the range of the scanning object H ^ ^ 透过 透过 透过 , , , , , , 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 光束 此外 光束 光束 光束 光束 光束 光束 光束 光束The inspection on the road _ mirror 9, 2 ^ = and scan to the scan, 1 〇 7 irradiation. Scanning detection section The beam B bit is t1 in the county (four) H (four), and the main scanning position of the beam B is known. The inter-sub-point can then, as shown in Figure 15, the beam A is offset from the scanned object range H by the deflection. Then, the angle=object surface 10a is subjected to main scanning in a direction perpendicular to the main scanning direction. A new scanning object is then subjected to main scanning. Then, ^ = is imaged on the light receiving surface 8a of the light receiving portion 8. @Reflecting light &lt;_ joint ============================================================================================================== Irradiation to a position close to the object range H. "First 19 12748 from, this is in Fig. 15, outside the range of the scanned object η, the beam of light, the light is reflected by the detecting mirror 9, and the scanning detection part is irradiated Thus, it is detected that the beam A bit is outside the object range Η, and the elapsed time from the time point can be known from the main scanning position of the beam Α. Then, as the deflector 4 rotates, the above-described FIGS. 12 to 17 are repeated (the main scanning and the sub scanning are repeated). In the above-described projection unit 3, the half mirror 2a and the mirror 2b of the illuminating unit 2 emit two beams Λ and B of an incident angle difference of about β, and the beams A and B are divided by J to H 4 . The scanning is performed at the desired scanning object range H, and the scanned beam A and the beam B are converted into parallel beams by the converging lens 5. Thereby, in the partial motion of one scan caused by the deflector 4, when the light beam A (8) is deviated to the scanning object range h, the other light beam B (A) is scanned within the scanning object range H. Therefore, the deflection angle of the deflector 4 can be effectively utilized for scanning. Fig. 10 is a structural example shown in conjunction with the actual assembly of Fig. 1. The illuminating device (means) 2 is the same as that of Fig. 12. The two illumination lights emitted from the illumination device 2 are emitted by the deflector 4 at two different incident angles. Each of the illuminating lights is bent by the deflector 4, and scanned at a pre-frequency (stmek). The scanned illuminating light beam is incident on the plucking lens 5 to become a parallel moving beam, and an irradiation spot s is formed on the object surface l〇a. The illuminating light is reflected or scattered at each of the irradiation points S, and the reflected light and the scattered light (measuring light) are incident on the light receiving portion 8 side. The irradiation spot S is scanned and moved to a position opposed to the condensing lens portion 6a at one end of the condensing lens array 6. The 20 ray light from the irradiation spot s becomes a substantially parallel light beam by the condensing lens 6a and converges. The condensed measured light is incident on the imaging lens 7 in a state having an angle with respect to the optical axis of the imaging lens 7. The imaging lens 7 changes the direction of the measurement light incident on the condensing lens portion 6a so that the position of the illuminating light at one end of the scanning width direction of the illuminating surface 8a is measured light from the irradiation point, from the side (Fig. 1) In the X direction), the condenser lens 6a is also condensed and described, and the lens portion 7 is imaged on the light receiving surface 8a of the light receiving portion 8. Prison this

The pain-receiving surface is as described above, and the dot-like image K (imaging) accounts for the output of the electrode at a position that correctly corresponds to the height of the irradiation spot s. Next, the substrate 10 is printed by the second surface S: The irradiation point S is scanned, and the light receiving portion 8 is high; the position of the imaged image on the image is corresponding to the printed substrate (4). As described above, when the irradiation spot S is moving, the side end of the light receiving image width W is moved. To the other _. The handle of the handle 8a

Next, as the illuminating point S on the printed substrate 10 is moved along the height (Z) direction, the scanning of the light ', ^ is performed, and the photographic image K is deviated, and the first electric light corresponding to the position thereof is output. The electrical signal 'detects a reference from the point s. = Next, the difference between the heights of the points S before and after the movement. X, and judge and line processing. The 疋 shape regenerating unit 105 is as described above, and can be used in the x (four) scanning direction) to enter the 12748 micro 8 mail as

The line scanning beam obtains the Z of the printed substrate 10

The amount of displacement in the axial direction. This movement can be obtained by the three-dimensional distance data reproducing unit 105 of X-Y-Z.

i, the sensor 61 of the Jiu Shao 8 and so on along the Y-axis direction, the data of the shape of the 'Shidang projection 3 to measure the same printed substrate with two beams of light, because of the optical of the two beams The difference in characteristics is manifested in the test, and there will be problems affecting the judgment of the shape. 2(a) and 2= are modeled by his two beams, the influence of the printed circuit board 10 measured by the two beams, and the resistance portion, the solder portion and the frame portion on the printed substrate 1 ( What is the impact of the identification of mat). 2(a) and 2(b) show data measured by the light beams a and B, respectively, and the horizontal axis of either of the graphs indicates the amount of received light (power) received by the light receiving unit 8, and the vertical axis indicates the same received light. The number of degrees. This information can be used, for example, to identify data on solder sites, resistor locations, and pad locations. In Figs. 2(a) and 2(b), the positions of the soldering place, the resistance place, and the pads are shifted, and the main reason is that the power of the beam A and the beam b are different and the polarization is different. In particular, the former will result in a direct offset of the horizontal axis position. On the other hand, in Fig. 2, a difference occurs in the waveform shape indicated by the amount of received light (intensity)-degree, and as a result, a deviation is caused. Therefore, as shown in Fig. 2, the shape reproducing unit 105 is provided with a difference between the solder and the identification point XA of the resistor, and the light beam a can be recognized while the light beam A is recognizable. Figure 2 is a simplified illustration of only beam A or beam B 127486^01 B. However, in the case of the touch B, as described in #, the beam A and the beam person, | T drag, perform a main scan, and then the secret will become a more problem. For the difference between the optical characteristics of the two beams, for the inspection, "the technique described in '3" ==; the above two lights such as the beam A and the beam B ίί i _ the portion 3, in particular the light generating portion 1 The optical characteristics of the object are power and polarization. = The overall structure of the embodiment 2 is shown; the main component is different from that of the i-shaped portion, and the polarizing device I having the beam A and the beam 3 are polarized in the H portion 1 And ld' and the power of the beam a and the beam B are adjusted to be the same variable device (means) on the surface of the printed substrate ί (including the polarizing function). This structure is explained in detail by means of Figure 4. Figure 5, 6 In Fig. 4, the beam setting success rate of the LD light source la is a, and only has P polarized light or s polarized light in the vertical polarized light component. The light beam from the LD light source la is converted into parallel by the collimating lens ie The variable device "is a 1/2 wavelength plate (hereinafter referred to as a λ/2 wavelength plate lc), and converts a light beam having only a p component or an s component into a light beam having both a P component and an S component. The spectroscopic device (hand) lba is a polarized light splitter that passes the P component and reflects the s component. The passed P component is converted into an S component by a polarizing means Id (here also a λ/2 wavelength plate, hereinafter referred to as a λ/2 wavelength plate id). With this configuration, when the power ratio S/P of the s component to the Ρ component when passing through the /2 wavelength plate lc is Γ, the power of the light beams A and B after passing (reflecting) the spectroscopic device Iba is as follows: Table 23

I27486B48pif-d0C shows. Beam A (S component): rxa / (1+r) Beam B (converts the S component of the P component with λ/2 wavelength plate id): (1-q) xa/(l+r) where q is λ/2 Loss of the wavelength plate 1 d. In such an architecture, make the following adjustments. The λ/2 wavelength plate ld is rotated, and the P component after the output of the spectroscopic device 1ba is adjusted to have only the s component. This adjustment is to measure the power '' of the p component reflected from the λ/2 wavelength plate id to the value 〇. Thereafter, the χ/2 wavelength plate lc is rotated to change the ratio r, and the power meter is placed in place of the printed substrate 1 to adjust the power of the beam A and the beam B to be the same. In other words, adjust to r = 1_q. Further, the reason why the light beam A and the light beam B are adjusted to the same power at the position of the above-mentioned printed substrate 1 is that there is a loss due to the polarization characteristics of the mirror lbb, the deflector 4, the converging lens 5, and the like in the middle. And an adjustment method for taking this factor into account. Fig. 5 is a modification of Fig. 4, in which the λ/2 wavelength plate lc located before the spectroscopic device jba of Fig. 4 is removed, and the λ/2 wavelength plate If is placed on the side of the light beam A after the spectroscopic device jba. At this time, the spectroscopic device 1ba is not only polarized, but is simply split, and may be, for example, a half mirror. In the case of Fig. 5, the light beam A and the light beam B respectively received from the spectroscopic device 1ba are converted into S-polarized light by the λ/2 wavelength plate If and the λ/2 wavelength plate ld, respectively. At this time, any one of the lower powers, for example, the beam B, causes the λ/2 wavelength plate Id to convert the entire beam B into s polarized light. Thereafter, the λ/2 wavelength plate If is rotated, and the power of the light 24 12748 stagnation 8pifdoc beam A is measured at the position of the printed substrate 10, and is adjusted to the same power as the light beam B. Therefore, the λ/2 wavelength plate If adjusts the power by reflecting and losing a part of the light beam received from the spectroscopic device 1ba as P-polarized light. Fig. 6 is a diagram showing an example of having two LD light sources 10(10), lbb. The light from the LD sources iaa and lbb, respectively, is converted into parallel light by the collimator lens (3) and ieb, and the λ/2 wavelength plates ld and lg are converted into s-polarized light, and the output is used as the light beams A and B. As shown in FIG. 4, if the smaller power is the life of the beam B, the power is adjusted to rotate the λ/2 wavelength plate ld, and the entire beam B is set to s polarized light to rotate the λ/2 wavelength plate lg. The power of the light beam A is measured at the position of the printed substrate 1 turn and adjusted to the same power as the light beam B. According to the above method, the difference between the power of the two beams and the polarization can be reduced, whereby the difference in the measured values on the receiving aperture 8 can be reduced. Therefore, as described above, the discrimination of each portion of the printed circuit board 1 or the influence on the calculation error of the area and volume of the shape reproducing portion 1〇5 can be prevented. Embodiment 3 As described above, when scanning with two lights, there may be a difference in measurement due to the difference in their optical characteristics. The technique of injecting 4 3 in the third embodiment is to directly use the junction of Fig. 1 to explain the technique of correcting the influence of the difference in optical characteristics of the two lights on the measurement side. In the configuration of FIG. 1, the identification mirror 9 and the scanning light detecting unit 1〇108 are included in the waveform conversion unit including the data conversion unit brain. For example, the frame is configured to receive the light beam A and the light beam B. Differences in optical characteristics caused by 25 if.doc 12748 Shao 8p effects were corrected. In addition, the applicant's Japanese patent application in the application for the Japanese patent application 2宰3-19 is also corrected, but the correction of this situation is made up of the difference between the two beams = the light path. Correction caused by the characteristics of the present invention. There are eight = 1 to explain the summary of the correction, and then explain each part in detail. The identification mirror 9 of Fig. 1 is used for any of the zones, and is arranged to reflect light from two or more of the two sides of the main scanning to the scanning light detecting portion. Scan = "〇: receives the reflected light from the mirror 9 and generates, for example, a pulse signal that sets the scanning period of the light beam A to L. Then, the correction portion (10) is connected to the detecting portion 107. The signal 'corresponding to the light of the main scanning light===change a, the electrical signal received from the coffee or the processing result of the above-mentioned data converter in the shape reproduction unit (10), does not generate I and A The difference caused by B. The reflection Z 9 recognizes the example of the mirror 9. In Fig. 11, the identification is used. The inspection is performed by the detection of the mirror 9a and the knife edge % (4) The mirror 9a is disposed on the outer side of the scanning object range η on the end side of the most unidirectional sweeping::i. The beam from the sweep ===? is detected in the mirror-deciphered column, and the second wire The scanning light G and the light-emitting body in front of the blade member %. By providing the blade member 9b, the signal waveform (hereinafter referred to as a timing signal) when the transformer 26 1274865 §8pifd0c is replaced with an electrical signal can be made steep. Thus, it is detected that each beam bit is outside the range H of the scanned object, corresponding to the timing signal In addition, as shown in Fig. 11 (b), the detecting mirror 9a is not limited to the end point side, and may be provided on the starting point side. In this case, each light beam is scanned in the object. The range is detected before. That is, the beams that start scanning can be known from the timing signals. Figures 8Α, 8Β and Figures 9Α and 9Β are diagrams for more detailed description of the detection of the beams. Polarization by the deflector 4 The position of each of the light beams is slightly shifted from the scanning direction (offset) as shown in FIG. 8α, and the light is reflected by the detecting mirror 9a, and is detected by the light receiving means (means) 1〇7a in the scanning light detecting unit 107. It is enlarged by the amplifying means (means) 107b. Fig. 8B shows the state of each light beam of the mirror 9a at this time (the portion enclosed by a point of the lock line in Fig. 8A). In Fig. 8B, the display is shown. The difference between the irradiation position of the light beam a and the light beam b is reflected by the detecting mirror 9a, and as the light region received by the light receiving device 107a, there are only the region pi of the light beam a, the region F2 of the light beam a, B, and Only the area of the beam b. Here, the light-receiving device 10a has two light-receiving surfaces which are received by the light-receiving portion 107aa (not shown) that receives the light beam a from the region F1 having only the light beam A, and receive the regions from the light beams a and B. The light-receiving portion 107bb (not shown) of the light beams A and B of F2 is formed. The combination is not limited to the above, and may be the detection area F1, the sound of the sound, and the light of the two groups. 8pifd°c The scanning light detecting unit 1() 7 generates a timing signal, and the output of the measuring unit (10) and the light receiving detecting unit b is the main character f. FIG. 9A shows that the scanning light detecting unit 107 receives the text and judges The result of the respective light beams of the scanning is based on the result of the timing of the light receiving detection 胄1〇7 and the timing of the light beam b from the light receiving detecting unit 1G7bb. Fig. ^ shows the judgment result when beam A (region F1) and beam a, B (region ρ2) are judged. In any of the above-mentioned side scarfs, the timing signal of the reward results

The π Η level is displayed and is the wire B ′ and the L level is displayed and is the wire a. As a result of the judgment of Figs. 9A and 9B, each of the frequency signals from the light-receiving portion of the light-receiving portion of the light-receiving portion can be generated using a logic circuit composed of various logic elements. The correction unit 108 receives the output of the scanning light scanning unit 1〇7, and corrects the shape re-105 for the correction of the measured value of the light beam A and the correction of the light beam b. In this case, it is not necessary to indicate both, and in addition, the correction of the light beam to one of the beams may be indicated. Correction Combines the measured value of the square beam with the measured value of the other beam. Therefore, the correcting unit 108 has a memory device (means) 1 to 8a, and the correction data (Fig. 7) required for the correction is recorded in advance. The main content of the correction means 108 for the correction instruction is as follows. In the above description, it is described as "correction measurement value", but the value binarized by the threshold value is also included in the measurement value. The gain and the offset amount (〇 ffset) of the amount of received light received by the light receiving unit 8 are corrected. Figure 7 shows an example of a correction circuit. 28 Ι27480ΓρίΜ〇ε

For example, when the amount of light received by the beam 小于 is smaller than the beam Β: the device has just changed the portion 10 5 a at the time when the timing signal is at the L level, before the metric conversion, according to the amount of the material compared with the gain of the beam B. Poor, the electrical signal when the wire A = the amplification of the large 1 L is amplified. That is, in Fig. 7, the gain is increased based on the correction gain value ^ impedance R through the switch B (L side) according to the timing level. + In addition, the distribution of the amount of received light in the beam A is larger than the amount of received light compared to the beam. When the amount of received light is large, the time band at which the timing signal of the ® 9B is at the L level is large. Figure 7. Recording the L-bump of the daily casting signal. After the switch A (L side), the value of the correction offset A is amplified by the crying l = the sign is biased J. The gain required for the correction (Fig. 2° correction; shift value A, B), offset 篁 (the corrected gain value A of Fig. 7 is placed as the reference in Fig. 1 as the reference #|JA柘, 』乂逋ω, the correction is made to know in advance that the brush substrate ==== The value at the time of correction is the threshold value of the binarization when the above-mentioned gain correction and offset correction positive data conversion can be called by the above-mentioned timing signal The binarization of the above-described data conversion by the data changing unit 105a is compared with the electric value I and the L boundary value of the amount of received light from the light receiving unit 8. However, 'the optical light of the light beam A and the light beam B 29

I27486B48pif-d0C special f, &gt; especially the defensive rate and the bias *, the amount of light received by the light receiving portion 8 is different in the beam A "beam B", when the subject threshold value is binarized, there will be - The square is binarized, and the other - ^^ j is initialized. Therefore, 'there is an error judgment based on the judgment of the judgment unit 106 after the judgment unit 106. Therefore, it is necessary to make up the correction. The offsets shown in Fig. 7 are the same, and the description is omitted. In addition, the amplification of Fig. 7 in -2: is the same as the comparator described above. The impedance r is set to be infinite. The gain of the amplifier L is set to the last. Fig. 2 is an example in which the measurement of the solder and the resistance is shifted by fA_XB for the purpose of measurement by a single light. On the other hand, each time the main scan and the sub-scan are performed, the light beam A "beam B is interactively measured" is summarized to obtain a shape. However, the input time point of the shape reproduction portion 105 corresponds to that of FIG. 9b. If the timing signal 'is the same object, it will be corrected to make the amount of light received by A and B respectively (according to the difference in the size of the electrical signal, and because the identification point of solder and resistance can be χΑ = χΒ, 2 erroneous. That is to say, in the calculation of the area and shape of the soldering station, it is possible to prevent the resistance-related (four) material from being mixed with a bead material, and to make a wrong calculation. Although the present invention has been disclosed above in the preferred embodiment, Bran Beans stipulates the present invention, and any person skilled in the art can make some changes and refinements without departing from the essence of the invention.

The definition of the patent application scope attached to the stipulations shall prevail. ...I 30 I27486B48pif*doc [Simplified Schematic] FIG. 1 is a functional block diagram of Embodiment 1. Fig. 2 is an explanatory view for explaining the influence of the difference in optical characteristics of the two beams of the light projecting portion on the inspection apparatus. _ 3 is a functional block diagram of Embodiment 2. Fig. 4 is a view showing a modification of the light generating unit of the second embodiment. Fig. 5 is a view showing a modification of the light generating unit of the second embodiment.

Fig. 6 is a view showing a modification of the light generating unit of the second embodiment. Fig. 7 is an explanatory diagram for explaining correction of the third embodiment. Fig. 8A is an explanatory view for explaining a method of detecting a scanning beam in the third embodiment. Fig. 8B is an explanatory view for explaining a method of detecting a scanning beam in the third embodiment. Circle 9A is an explanatory diagram for explaining a method of generating a timing signal for identifying a light beam in the third embodiment. Fig. 9B is a view showing another example of an embodiment of an explanatory diagram of another method of generating a timing signal for identifying a light beam in the embodiment 3, and Fig. 10 is an explanatory/series operation of Fig. 1 of the present invention. Fig. 11 is an explanatory view for explaining the detection of Fig. 1A. Fig. 12 is a view for explaining the scanning of two beams of the two beams of Fig. 10 for explaining the light of the two beams. An illustration of the scan. 31 127486Teaching 8pifdoc Fig. 14 is a scanning diagram for explaining the two beams of Fig. 图. Fig. 15 is an explanatory diagram for explaining the two beams of Fig. 1 for the broadcast of the two brothers. Fig. 16 is for explaining the figure. Fig. 17 is an explanatory diagram for explaining the scanning of the two beams of Fig. 10. Fig. 18 is a view showing the structure of the conventional light projecting portion. Fig. D is a view showing the use of Fig. 18 Scanning body diagram of the Projector. [Main component symbol description]

1 : Light generating portion la : Light source laa, Ibb : LD Light source lb : Beam splitting portion lba · · Beam splitting device (means) lbb : Mirror lc : Variable device (means)

Id: polarizing device (means) le : collimating lens lea, leb: collimating lens

If : λ/2 wave plate 2 : Irradiation part 2a : Half mirror 2b : Mirror 3 : Projection part 4 : Deflector 5 : Convergent lens (Imitation lens) 32

I2748SB8pif*d0C 6: condensing lens array 6a: condensing lens unit 7: imaging lens 8: light receiving unit 9: identification mirror 9a: detection mirror 9b: blade 10: printed circuit board 100: measurement control unit 101: Main scanning control unit 102: mirror driving unit 103: sub-scanning control unit 104: sub-scanning unit 105: shape reproducing unit 105a: data conversion unit 106: determination unit 107: scanning light detecting unit 107a: light receiving device (means) 107aa 107bb: light receiving detection unit 108: correction unit 108a: memory device (means) 109: display unit 51: projection optical system 52: light source 33 I27486B48pifd, 53: deflector 53a: mirror portion 54: lens 55: light receiving system 56: Condenser lens arrays 56a-56f: condensing lens portion 57: imaging lens 58: light receiving element 58a: receiving surface 60: object 60a: object surface 34

Claims (1)

12748 dip 8pif.doc X. Patent application scope: 1.--Printing solder inspection device, having a projection portion (3) disk (8), the projection portion (3) for scanning a printed substrate across a printed substrate printed by solder The range ' emits light and scans, and the light receiving portion (8) receives the reflected light from the printing ship (4), and the printing is used to check the printing state of the solder, characterized in that: the projection portion (3) comprises: The light generating portion (1)' emits M (majority) light; and - receives the M lights at different incident angles = the object is biased toward the 'scanning target' substrate (10) scanning object van: two n The printed solder inspection apparatus according to item 1, wherein the number of surface angle λ angle mirrors has an n (majority) angular mirror surface around the deflector, is scanned by rotation, and is incident at a different angle of 36 _ Receiving from the light product, and further comprising: a printed solder inspection skirt according to the item, the sub-sweeping portion (1〇4), moving in a direction perpendicular to the direction of the deflector for the sake of picking; "Cutian* - shape reproduction unit (105), the light receiving unit according to the description By using the sub-scanning timing of the sub-scanning section, one of the following: Well: and 1 New Zealand's level are based on the electrical quantity of the light level, and the electrical signal is output from the light source. The printed soldering inspection device according to the above-mentioned item 2 or 3, wherein the M-channel lights emitted by the light-generating portion are in the same polarization direction, and The printed surface of the printed circuit board is provided with substantially the same power. The printed solder inspection apparatus of the fourth aspect of the invention, wherein the ramp light is two light, the light is generated. The portion further includes a light source (1a) for emitting light; a polarizing beam splitting portion (lb) for splitting light from the light source into two splits composed of mutually opposite polarization directions; a first polarized light a plate (Id) receiving one of the two beams of light and configured to have the same polarization direction as the other beam splitting; and a second polarizing plate (lc) disposed between the light source and the polarizing beam splitting portion Projected through the deflector On the scanned surface of the printed substrate, the power of the splitting and the other splitting of the output of the first polarizing plate is substantially the same. 6. The printing solder according to claim 4 of the patent application. Inspecting device, wherein the ramp light is two lights, the light generating portion further comprises: a light source (1a) for emitting light; and a polarizing beam splitting portion (lb) for splitting light from the light source to be perpendicular to each other The two polarizations formed by the polarization direction; the first polarizer (Id) accepts one of the two beams and is set to have the same polarization direction as the other beam; and 36 12748 Ao 8pifdoc a second polarizer (If), another splitting light that receives two splits, the light of the splitting light, and the power of the two splitting lights is adjusted to be on the scanned surface of the printed substrate Essentially the same. 7. The printing of the tin as described in the application of the patent specification in item i or 2 further includes: a regenerative unit (1G5) for reproducing the printed nickel from the electrical signal output from the light receiving unit; Correction ^(9)9)' When the M-channel light is sequentially projected by the deflection g, in order to prevent the influence of the light-receiving portion caused by the difference in characteristics of the light, a complementary Hxt corresponding to the light for projection is memorized in advance. The «mechanical material is used to correct the electric signal input from the light receiving unit 4 to the shape reproducing unit. The output of the printed solder inspection part of the first or second item is the same as the critical value of the raw part (1G5), and the soldering of the soldering brush is compared and binarized. From the binarization (four) material, the shape of the dry tin of the printing portion is regenerated; and the correction portion (109), when the deflector is used, in order to prevent the fresh sputum and the sinusoidal projection The light-receiving portion St caused by the difference: pre-memorizes the -complement correction/(four) projection corresponding to the light used for projection, and corrects the correction data for the critical value 37