TW200529721A - Inspection device for printed solder - Google Patents

Abstract

An inspection device for printed solder is provided, in which two beams are used to scan a printed circuit board, so as to increase the scanning efficiency. In addition, the device can avoid measured values from being affected by different optical characteristics of the two beams. Over an object scanning area of a printed circuit board where solders are printed thereon, a deflector 4 is used to receive two beams A and B with two different incident angles, and deflect the beams A and B to scan the object scanning area. A variable means 1c can be used to adjust the beams A and B to have the same polarization and power.

Description

200529WC IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a printing solder inspection device, which performs a deflection scan on a printed circuit board on which a solder printed with an inspection object is printed, and the displacement is measured from Measure the shape of solder etc. The system is a technology that can effectively deviate the majority of light, and can also perform inspection. [Prior art] Generally, a displacement measuring device is used when measuring a shape. Such a known displacement measuring device is based on a triangulation measurement, and measures the displacement of a measurement object, object surface (e.g., Patent Document 1). Fig. 18 shows the structure of the displacement measuring device after the patent document 1 is changed. The displacement measuring device shown in FIG. 18 is roughly composed of a projection optical system (optical scanning system) 51 and a light receiving system 55. The projection optical system 51 is generally composed of a light source 52, a deflector 53 and a lens 54 to irradiate the measurement object 60. The light source 52 is composed of, for example, a laser polar body, and emits a light beam to the deflector 53. In the example of the deflector 53, a polygon mirror is used. The polygon mirror has a plurality of mirror surface portions 53a around the disc shape. By its rotation, the light beam incident from the light source 52 is deflected, at least for the range of objects to be scanned including the measurement object (shown in FIG. 19). H) Scan. In such a deflector 53 constituted by such an angle lens, a single unidirectional scan is performed on the scanning object = range with one beam on one mirror surface. The lens 54 converges the light beam fan-shaped by the deflector 53 into a parallel state. 6 20052? 2T light receiving system 55 is composed of a condenser lens array 56, an imaging lens 57, and a light receiving component 58 (PSD (Position Sensitive Detector)). The condenser lenses 56 are formed of synthetic resin or glass, and a plurality of condenser lenses 56a to 56f (e.g., six are shown in Fig. 18) having equal focal lengths fl (e.g., 20 mm) are arranged in a line. In each of the condenser lens portions 56a-56f, the surface perpendicular to the optical axis is made spherical, and the measurement light can be uniformly reduced along the periphery of the optical axis. The imaging lens 57 has a straightness larger than the scanning width of the irradiation spot S.

Diameter, converges the light beam from the condenser lens 56, and forms an image on the light receiving surface 58a of the light receiving element%. This type of displacement measuring device uses the light beam scanned in the X-axis direction (main scanning direction) of the deflector 53 to obtain the displacement amount of the measurement object 60 in the 2-axis direction. At this time, by moving the measuring table 61 in the γ-axis direction (sub-scanning direction), it can be said that the ζ-axis and displacement of each irradiation point s at the χ_γ secondary ^ position are obtained. As a result, three-dimensional distance data is obtained For example, can be the shape of the solder being printed. The printed solder inspection device 'regenerates the shape from this lean material and compares it with the county's preparation to make a good or bad judgment.) Heart-shaped shellfish! 妾 ί' in In addition to the traditional light scanning device (projection optical system 51), when it is turned, the lens that makes people shoot towards I53 scans with its mirror in the range of its rotating parts. %. The light beam of ... is in the desired scanned object Patent Document 1 JP-A-2000-97631 (paragraphs [0028]-[0033], FIG. 4) 2005297¾ The object range is in progress, and a mirror surface 53a is scanned with a mirror surface ^ == 7 Unavailable at -Angle_. Therefore: the beam that is deflected to scan will exceed the object outside the narrative face 53a, and will be deflected by the next-mirror face 53a: the interval within the range of the object described by Η will be 2 = 2, and the next: Discontinuities. In addition, in each main scan, a sub-scan is performed for the next scanned object range. == one thing solves the above problem =: ==: Health. There are limitations to narrowing the mirror surface and placing multiple mirror surfaces. In addition, in order to obtain the width, if the number of mirror faces must be maintained at a certain level, the size of the device becomes large. The size will be large, as a result [Summary of the Invention] To provide a printed solder inspection device, There is a deflection angle of Chaqiu Geng ~ to improve the scanning efficiency, and then improve the detection rate of 2 *. Also, as an effective use of the deflector, the scanning it section is further improved, so that most channels of light are incident at different incident angles. ° Example t, as described above, when the main scan of a predetermined range of π field objects is performed with one light and one mirror surface, when the mirror surface is used, other light may be incident at a different angle from the above-channel light. Device, 200529721 ', the main scanning can be performed by using other mirrors that are closed in light. In addition, if the main scanning is performed during a main scanning, the inspection device as a whole is more efficient. On the one hand, as mentioned above, if you try to use the majority of the light to evaluate the efficiency, 'At this time, due to the difference between multiple lights, you can know the peak-tracing value of the trace-light and the other trace. The company scans the error 'This will likely bring the shape inspection of the printed solder. Another object of the present invention is to provide a technology for maintaining the accuracy of the measurement and improve the scanning efficiency with most light scanning to achieve the purpose of cover In other words, the present invention is to provide a technology that: xi 改 改 #scan effect and prevent these effects on the measured value. To solve the above problems, according to this According to an embodiment of the present invention, the present invention provides a kind of inspection device for inspecting a tin solder, comprising a projection unit ⑺ and a light receiving unit (3) for scanning a predetermined range of scanning objects across a printed substrate printed by solder, and scanning the light, The light receiving unit ⑻ receives the reflected light from the printed substrate. The printed solder inspection device is used to check the printed state of the solder. 1. The above-mentioned σρ (3) includes a light generating unit ⑴ for emitting M (most) lights .: The omnidirectional device (4) receives the M lights at different angles of incidence, deflects toward the target range, and sequentially scans the printed object range of the printed substrate. In order to solve the above-mentioned problems, according to one of the present invention, In the embodiment, as described above, the director is a polygon mirror, and has N (most) angular 4 sibling faces along the periphery of the deflector, and is scanned by rotation, and is received at the 20052TOTc angle ⑻ of each pass / [Li] from The light generated by the light generating section is scanned with a scanning object of approximately 36 ^ / [2N__ 'according to each phase. In order to solve the above-mentioned problem, a shape bear is implemented according to one of the present invention. The sub-scanning section (104) moves the projection section and the printed substrate with respect to a direction perpendicular to the scanning direction by using a deflector = turn knob fineness / ceramic] (that is, p / 2) to perform sub-scanning ;

And a t-regenerating section (105), the light receiving section outputs the received light and the light receiving position according to the timing of the main scan using the polarizer and the sub-scanning of the use and drawing section, and is based on the light output and the light receiving position. The electrical signal reproduces the shape of the printed solder on the printed circuit board. In order to solve the above-mentioned problem, according to one embodiment of the present invention, the lights emitted by the light generating unit have the same polarization direction, and are provided with substantially the same power on the scanned surface of the printed substrate. 2. In order to solve the above problem, according to one embodiment of the present invention, the M channels of light are two lights, and the light generating unit further includes a light source (la)] for emitting light; the polarizing beam splitting unit (lb), The light from the light source is split into two beams of light consisting of polarizing directions perpendicular to each other; the first polarizing plate (Id) receives one of the two beams of light and is set in the same polarization direction as the other beam of light; and The second polarizing plate (lc) is disposed between the light source and the polarizing beam splitting unit, and splits one of the light beams output by the first polarizing plate and the other beam of light on the scanned surface of the printed substrate projected by the polarizer. The power is adjusted to be substantially the same. In order to solve the above-mentioned problem, according to one of the implementation modes of the present invention, the M channel light is described as two lights, and the light generating unit further includes a light source.

20052TOT (la) for emitting light; polarizing beam splitter (lb) splits the light from the light source into two beams of light consisting of polarizing directions perpendicular to each other; the first to polarizing plate (Id) accepts two beams of light And a third polarizing plate (If) that accepts the other beam splitting of two beams, one of the two beam splitting, and passes through the polarizer and On the scanned surface of the projected printed substrate, the powers of the two beam splitters are adjusted to be substantially the same. ’

In order to solve the above-mentioned problem, according to one of the implementation forms of the present invention, the aforementioned printed solder inspection device further includes a shape reproduction unit (105) that regenerates the printed solder from the electrical signal output by the light receiver; and correction = (109) 'When the aforementioned μ-channel light is sequentially projected with a deflector, in order to prevent the influence of the amount of light received by the light-receiving unit caused by the difference in the characteristics of the M-channel light, the correction data corresponding to the light used for projection is memorized, and In order to solve the above-mentioned problems, according to the present invention, the electrical data input from the light-receiving unit to the shape reproduction unit is calculated by using projection data. According to the present invention, the == is installed to include the shape regeneration key), and the value of the = is used to predict; The money signal output by the Ministry is binarized, and the shape of the printed solder is re-reconstructed from the -valued tribute (109). When the deflector sequentially projects the correction caused by the difference in the characteristics of #M 道光 =, ", 2" 'In order to prevent the compensation corresponding to the light used for projection :::: 量: 影:' Correction data in advance is used to correct the critical value. According to the present invention, since the deflector receives the aforementioned M 20052 milk Yfc and light at different incident angles and sequentially scans, the scanning speed can be increased. According to the present invention, it has N (majority) angles. shape. . The mirror ’accepts the rotation from the front angle, the angle from the front angle, and the angle from the front, and then enters the deflector in the order of two days. Compared with the rotation period = L, the scanning speed can be increased. The shift ΪΪΓΓ of the station can improve the efficiency of the main scan and then speed up the subscan

Since the shape of the printed solder can be reproduced, the overall inspection speed of the printed solder inspection apparatus can be improved. According to the present invention, since the same deflection from the light generating portion is set, and the same power is set on the scanned surface of the printed substrate, the printed solder surface of the inspection object can be prevented from being prevented. The influence of the power and deflection in the characteristics of the M channel light on the measurement, so as to achieve the precision of the measurement. According to the present invention, when the M light is two lights, the homogeneity of the two lights can be achieved with a simple structure to prevent the influence of the difference between the two lights on the inspection. "According to the present invention, since the correction portion can be used to prevent the aforementioned reflected light from affecting the reflected light, the correction data corresponding to the projected light is memorized in advance, and the correction data is input to the aforementioned correction data pair. The electrical signal of the shape reproduction unit or the threshold value when binarizing is corrected. Therefore, when an optical system that homogenizes the characteristics of multi-channel light does not exist, it can prevent the influence on inspection caused by the difference of many lights. As described above, using the displacement measuring device of the present invention, two light beams (beams) that are irradiated on the measurement object can be judged on the 1220052Ψ2T, and based on the judgment results, each beam can be corrected with the best correction data. Various corrections. ▲ In order to make the above and other objects, features, and advantages of the present invention more obvious, the following detailed description of preferred embodiments and the accompanying drawings are as follows. Σ [Embodiment] Description The structure of this invention. Next, the embodiments 2 and 3 prevent the majority, and the present invention is a technology that uses the majority Light (hereinafter, referred to as light or light beam is the same thing), to make the scanning efficiency of the deflector better, in order to improve the speed of inspection of printed solder. First, in Example 1, the optical of light Techniques that have adverse effects on measured values due to differences in characteristics. The technique described in Example 1 is a type of optics that seeks a majority before measurement. Miscellaneous. The technique described in Example 2 is measuring. Example 1. The optical characteristics of several lights are different, and the electrical interpolation after the measurement is performed. The structure of 3) is a functional line. In fact, the light is simply a picture of light with a single line. 1 is a drawing of the structure of the present invention (including Example 3 {not intended. The thick line in the figure is a line representing the light path. A solid beam, but in Figure 1, for _ 光 职

The medium 'light source 1 a is composed of a frame structure including an illumination unit 2, a deflecting lens, and a lens 5. Example of optical output f in Fig. 1. In this example, a laser semiconductor (LD) is generated in the light generating part and outputs a single 13

200529W light, the beam splitter lb that receives this light splits this light into two lights. The beam splitter lb includes a half mirror and a mirror. The half mirror allows a part of the light to pass and reflects another part of the light, and the mirror further reflects another part of the reflected light (beam A). When emitting a plurality of M channels of light, the beam splitter 1b also needs such a large number, or M light sources may be arranged. The user, transmitter, and receiver 2 receive two lights from the light generating unit 1 at the reflecting mirrors 2a and 2b. The light beam A and the light beam B are respectively at an angle β to the deflector 4. In this example, the deflector 4 is arranged on the side of the N-corner

Polygonal mirror with N mirrors and supported by rotation. The angle p is approximately 36 ° ... Next, the incident angles of the light beam A and the light beam B, and the relationship between the polygon mirror and its rotation angle will be described. When the deflector 4 is in the rotation position of the solid line in FIG. 1, the light beam A is reflected near the end of the mirror surface of the deflector 4, and the reflected light beam A (1) ^ is at the end position of the main scan (in the figure! Convergence) The bottom 4 of the lens 5 is projected onto the side of the printed circuit board 10 which is an inspection target within the range of the scanning object. At this time, the light beam B is reflected near the center of the deflection mirror ^ mirror, and the reflected light beam B⑴ will be at the starting position of the main scan (on the upper part of the second lens 5), and finally projected onto the p substrate of the scanned object. On the other side. The mirror will shoot the upper part of the 5 'reflection with the beam A (2) (dotted line) of 36 ° / 2 in the starting position of the main scan. At this time, the light beam 3's reflection on the substrate 10 of the deflection mirror 1 will be on track; 14

20052972T (lower part of the converging lens 5), and finally was purchased_scanning parts range 3 side of the base plate 1G. Between the deflector 4 shown in FIG. 1 and the f-line position, from the beam line to the beam line B, the main beam is scanned, and the substrate is scanned at the scanning position within the scanning object range. Scanning from beam A (l) to wire A 丝 is outside the scope of the riding object. When the rotation of the B-direction device 4 is further rotated by β / 2 from the dotted line position in FIG. 1, the two beams A (2) to the beam A⑴ scan the range H of the scanned object, and the beam B (2) to the beam B (l). The material is scanned in the range of the scanned object. The deflection angle on is larger than the deflection angle between the beams a (2) to a (1) by β. As described above, a main scan can be performed at β / 2, i.e., -half of the angle β occupied by the mirror surface of the deflection mirror 4 with respect to the central axis. In other words, since the main scan is performed twice with one mirror, the efficiency is very high. In addition, in the above description, the description of the angle is expressed by "approximately" and "approximately", because the actual angle depends on the main scan. "There must be a sub-scan between the next main scan, Factors such as the need for sufficient scanning. The scanned object range in Figure 1 rarely includes the range of the inspection object. Generally speaking, the entire printed substrate 10 is included in the range. The printed substrate is too large. Part of the substrate 'its printed solder will be included in the scanned object range, while a portion of the printed substrate will be outside the range. The above is described with two beams, but it is also beamed' and is performed once per degree_ The main scan. In the second step, the angle difference between the beam angles of the M beams adjacent to each other is set to an angle of about 360 and NM, and the incident positions of these beams are set at 15 20052 ^ ff intervals. 'Personal shot' causes a beam of light to hit a mirror surface that is divided into M regions in the scanning direction. Convergence and transparency 5 is composed of f0 lens, and will rotate the counties A and B scanned by the deflection mirror 4. Become a parallel light beam on the printed substrate. A pair of scanning units 104, each time the aforementioned deflector 4 performs a main scan, if the right side is a polygon mirror, each time it is rotated by about p / 2, the projection unit 3 Close to the inspection board of the printed board 1G _ relative reading main scanning direction

Move in the direction of the main scan in the next-next time. For easy identification, the sub-scanning section 104 of FIG. 1 is provided at the position of the printed circuit board 10. At this time, after the sub-scanning is fixed on the printed circuit board 10, the relationship between the sensors such as the projection section 3 and the light-receiving section 8 is integrated. The sub-scanning unit 104 supports the printed substrate 10, and each time the scan in the deflected state 4 is performed, it can be aligned with the direction in which the main scan is performed by the deflector 4. Move vertically. The condenser lens 6 is configured by arranging a plurality of small lenses having the same focal length in the main scanning direction. The surface of the small lens perpendicular to the optical axis is made spherical so that the reflected light from the printed substrate 10 is on the optical axis. The periphery is narrowed uniformly and enters the imaging lens 7. The imaging lens 7 forms an image on a light receiving surface of the light receiving unit 8. The light receiving section 8 is a position sensitive detector (PSD), which detects the imaging position of the reflected light from the printed substrate 10 and its light quantity (power, or intensity). The detected light quantity (received light quantity) is output as an electrical signal, and this electrical equipment signal has the corresponding amount of light received at that position (there is also the light quantity or electrical signal collectively referred to as the measured value). 16

20052975T The shape reproduction unit 105 uses the data conversion unit 105a to compare the analogue electrical signals obtained by the light receiving unit 8 by binarization (0, 1 "or" L, H "), and converts them into digital ones. signal. Next, the solder area is extracted from these values, and the area and volume of the shape of the printed solder on the printed circuit board are obtained. In addition, the structural portion on the printed substrate 10 is divided into, for example, a solder portion, an impedance portion, a pad portion, and the like. . Knife

/ In addition, the binarization processing in the aforementioned data conversion section is based on the amount of light (power) received from the light receiving section 8. In order to distinguish between a soldering place with a small amount of light received, a resistance gap, and a resistor and a wiring pattern with a large amount of light received, A certain threshold (memory as a parameter) for binarization. ...... From the soldering place and resistance gap of 3 =, according to the displacement 1 of =, the reference displacement amount is used as the identification point, and the resistance gap with a small displacement amount below the identification point is shifted only to capture Take the area above the solder. = The shape reproduction unit 105 obtains the value using the above-mentioned binarization. = The average value of the amount of displacement in the above-mentioned resistance and the sigma_zone_, the reference value of the degree of return. Next, the miscellaneous regeneration part bamboo = the difference from the reference value of the height, the area (area) of the tin tin is obtained, and the material tin_product determination unit 106 stores the j material indicating the position where the solder is located. For reference, and compared with the area and volume of the Er Ersheng Department = bad ^ tin place, perform a good 17 20052972 ΐ ε Master = Control Department 进行 carry out unified management and control of the whole, dream this system. The mirror 101 driving unit 102 rotates the deflector at a predetermined timing.-The secondary scanning unit 104 turns to β / 2 to Λ, and transmits the timing signal to the unit ⑽ to advance = H1 (). _ '. Display m 2 φ, input, visual confirmation of measured values, etc. All except for the difference in optical characteristics between the first beam A and the beam B: manufacturing = influence of the measurement result. Because = description, their description is omitted here. The angle of the armour, the field, and the field f in the part 3 'because the rotation speed of the deflector 4 will be doubled every time! _ Scanning the actual product, the deflector 4 = Lu can achieve the inspection of the South speed. For example, a光 # 和 & & 1 An angular device with a b-side mirror, the efficiency of the use of the 86 mirror can be approximated-two-way use: 2 to FIG. 17 to explain the benefits of the projection section 3 == The reflection is different, its ηη; L lens 2b, to make a beam A disk beam b. In the beam of "in the mirror" 4. In addition, the range of the scanned object reflected by f / Now® is shifted to the range of the scanned object and the light beam B deflected toward the M polygon mirror M is imaged on the light receiving surface% of the light receiving section 8. Reflected light from this moon ’s beam A

200529TOOC Next, as shown in FIG. 13, by rotating the deflector 4, the beam A enters the scanning object range 1 {inside (angle β / 2) through the deflector 4 'beam β from the scanning object range Η: off-pass beam The reflected light of Α is continuously imaged in the light receiving part ^^ 也 ^ Then 'as shown in Figure 14, when the deflector 4 rotates = r scans the object range H to perform = ΐ = dagger biased benefit 4, the first beam B will be illuminated To the position close to the target range η In addition, in FIG. 12, the detection mirror 9 is arranged on the optical path irradiated by the light beam B outside the scanning object range Η, and reflects the light beam and irradiates f to the scanning detection unit 1Q7. 2 'outside, and from: = degree, beam A turns from the scanned object = 4: ^ The object is scanned in the direction perpendicular to the main scanning direction, and the main scanning is performed. Then, the light beam is imaged on the light receiving surface 8a of the light receiving section 8. < β) ^^ As shown in the figure, the main object is scanned by the beam B to scan the range Η of the object 的 by rotating the deflector 4 by an angle (β / 2 + such as β). This captured light JA is deviated from the scanned object range and diffused. Stop, light t, 1? ^ No, at the rotation angle of the deflector 4 is connected to the main scan. The light beam A is irradiated to a position close to the object range Η. 20052 ΨΤΪΤ port, here is the first “bit is in the object range ===, and the elapsed time from time to time knows the main scanning operation of beam a (repeated main scanning and sub scanning t). The above-mentioned projection unit 3 uses the half of the irradiation unit 2 =: 1 it and the beam B is respectively deflected to 'enter the object within the desired scanning object track &' and the scanned beam A and light are converted into parallel shirts by Wei Wei 5. Therefore, in the partial motion of one scan caused by the deflector 4, when the money A⑼ of the towel is deviated to the scanning object range 物件, the other beam B (A) is scanned within the scanning object range η. Therefore, the deflection angle of the deflector 4 can be effectively used for scanning. Fig. 10 is a structural example shown in conjunction with the actual assembly of Fig. 1. The irradiation device (means) 2 are the same as those of Fig. 12. From the irradiation device 2 The two emitted light beams are emitted by the deflector 4 at two different angles of incidence. Each of the emitted light beams is bent by the deflector 4 and scanned at a predetermined frequency (stroc). The scanned irradiation light beam is incident on convergence The lens 5 is formed as a light beam that moves in parallel on the object surface 10a. Shooting point S. The irradiation light is reflected or scattered on each irradiation point S, and the reflected light and scattered light (measurement light) are incident on the light receiving part 8. The irradiation point S is scanned and moved to the condenser lens with the bit Relative position of the condenser lens portion 6a at one end of the array 6. The measurement 20 from the irradiation point s

In 20052, the amount of light is still substantially parallel by the condenser lens 6a and converges. The converged measurement light enters the imaging lens 7 in a state of having an angle with respect to the optical axis of the imaging lens 7. The imaging lens 7 changes the direction of the measurement light incident on the condenser lens portion 'so that the measurement light is formed at a position on one end in the scanning width direction of the light receiving surface 8a. From the side (x direction in FIG. 10), the measurement light from the irradiation point is also focused on the light receiving surface 8a of the light receiving unit 8 by the light collecting unit 6a_large solution line '. 'On the light-receiving surface 8a of the light-receiving portion 8, a point-like image K (imaging') is formed at a high signal (current output is extremely polarized) corresponding to the irradiation spot s. Next, use the following: The position of the image κ imaged on the light-receiving surface 8a of the irradiation spot on the substrate 10 changes in height again. "As described above for the printed circuit board 10, when the irradiation spot S moves with Judoro, The position of the image κ shifted on the X front surface 8a within the relative range of the apricot lens 6a is shifted from the -side end of the width W to the other-side end. ~ The main scan of M 8a is then followed by "on the printed substrate 10" The projected point s moves along the direction of the height ，, and the scanning of C, when the photograph K is deviated, and an electrical signal corresponding to its position ^ smooth surface 8a is output, and the base | breast money of the projected point S is detected. 'From the height of 9 planes between the height of the irradiation point S and the height of the front side, and judge and process it. The S ruler enters the shape reproduction unit 105 as described above, and can be used in the χ eight-axis direction (main scanning direction). ) Enter 21

20052972ff The scanning beam is used to obtain the outside of the z-axis of the printed circuit board 10, and the projection unit 3 and the light receiving unit s ′] are cut by the sub-scanning unit 104, partly relative to the printed circuit board 1G_measurement stage regeneration unit 105 produce. I. Beco uses the influence of the shape to measure the ω beam. # 同 — When the scale brush substrate is in a shape of 'Because the difference in the optical kinematics of the chirped beam is reflected in the measured value, it will affect the shape judgment. The problem. Fig. 2 (a) and = show the effect of the printed circuit board 10 measured by the two beams on his two wires, which will affect the resistance part, solder part and frame part (mat) of the printed board 10 ) And so on. The solid 2 (a) and 2 (b) represent the data measured by the light beams a and B, respectively. The horizontal axis of any graph represents the amount of light (power) received by the light receiving unit 8, respectively. The amount of light received. This data is, for example, data that can be used to identify soldering sites, resistance sites, and pad sites. In Figures 2 (a) and 2 (b), the positions of various parts of the soldering place, resistance place, and pad are shifted. The main reason is that the power of beam A and beam B are different, and the polarization is different. Especially the former, will cause a direct shift of the horizontal axis position. In the latter case, there is a difference in the wave shape > shown by the amount of received light (intensity) _degrees in Fig. 2 and the result is a deviation. Therefore, as shown in FIG. 2, in the above-mentioned shape reproduction unit 105, even if the identification point XA of the solder and the resistance is set to distinguish and attempt to extract the soldering place, the light beam A cannot be identified, but the light beam B cannot be identified. Figure 2 is a simplified illustration of beam A or beam 22 200529TZffc beam B only. In fact, as described above, each time the light beam a and the light beam B are subjected to the interactive sub-scanning, a primary scan is performed, and then they are combined and used in the inspection, so it will become a more complicated problem. In order to prevent the influence of the difference in optical characteristics of the two light beams on the inspection, the techniques described in Embodiments 2 and 3 are described below. Embodiment 2 The structure of Embodiment 2 is such that the difference between the optical characteristics of the two light beams such as the light beam A and the light beam b is attempted to be cancelled in the projection unit 3, particularly the light generation unit i. In particular, the optical characteristics of the object are power and polarized light. FIG. 3 shows the overall structure of Embodiment 2. The main components different from FIG. 丨 are the polarizing device (means) ld provided in the light generating section 1 with the same polarized light beams A and b, and the power of the light beams A and B. It is adjusted to be the same variable device (means) lc (including a polarizing function) on the surface of the printed substrate 10. This architecture is explained in detail using FIG. 4. Figures 5 and 6 are variations. In FIG. 4, the beam setting success rate of the LD light source la is a, and it has only P-polarized light or S-polarized light among the vertical polarization components. The light beam from the LD light source la is converted into parallel light by a collimating lens ie. The variable device lc is a 1/2 wavelength plate (hereinafter referred to as a λ / 2 wavelength plate lc), and converts a light beam having only a p component or an s component into a light beam having both a P component and an S component. The spectroscopic device (hand) lba is a polarized light splitter that passes the p component and reflects 8 components. The passed P component is converted into an S component by a polarizing device Id (here also a λ / 2 wavelength plate, hereinafter referred to as a λ / 2 wavelength plate Id). With this structure, when the power ratio S / Pg r of the S component and the P component when passing through the λ / 2 wavelength plate lc, the power of the light beams A and B after passing through the (reflection) spectroscopic device lba is expressed by the following formula: 23 20052 ^ 72Γ shown. Beam A (S component): rxa / (l + r) Beam B (convert S component of P component by λ / 2 wavelength plate Id): (1-q) X a / (1 + r) where q is λ / 2 wavelength plate 1 d loss. In such an architecture, the following adjustments are made. The λ / 2 wavelength plate id is rotated to adjust the P component after the output of the spectroscopic device lba to only the s component. This adjustment is to measure the power of the P component reflected from the λ / 2 wavelength plate Id, and rotate to a value of 0. After that, the λ / 2 wavelength plate lc is rotated to change the ratio r. A power meter is placed instead of the printed circuit board 10, and the powers of the light beam a and the light beam B are adjusted to be the same. That is, adjust it to r = 1-q. In addition, the reason why the beam A and the beam B are adjusted to the same power at the position of the printed substrate 10 described above is that there is a loss due to the polarization characteristics of the mirror lbb, the deflector 4, and the convergence lens 5 in the middle. It is an adjustment method that takes this factor into account. FIG. 5 is a modification of FIG. 4, that is, the λ / 2 wavelength plate lc in front of the spectroscopic device iba in FIG. 4 is removed, and the λ / 2 wavelength plate lf is set on the light beam A side after the spectroscopic device lba. At this time, the spectroscopic device lba has nothing to do with polarized light, and only performs simple spectroscopic splitting. For example, it may be a half mirror. In the case of FIG. 5, the light beam a and the light beam B received from the spectroscopic device lba are converted into S-polarized light by the human / 2 wavelength plate lf and the human / 2 wavelength plate ld, respectively. At this time, if any one of the lower powers is, for example, the beam B, the λ / 2 wavelength plate id is used to convert the entire beam b into S-polarized light. After that, the λ / 2 wavelength plate If is rotated, and the light is measured at the position of the printed substrate 10 24

20052972TOC The power of beam A and adjust it to the same power as beam B. Therefore, the λ / 2 wavelength plate If adjusts the power by using a part of the light beam received from the spectroscopic device lba as P polarization reflection and loss. FIG. 6 is a diagram showing an example having two LD light sources laa, lbb. The light from the LD light sources laa and lbb, respectively, are converted into flat light by the collimating lenses lea and leb, respectively, and then converted into s-polarized light by using the \ / 2 wavelength plates ld and lg, and the output is used as the light beams A and B. As shown in FIG. 4, if the smaller power is the beam B, the power adjustment is to rotate the λ / 2 wavelength plate ld, turn the entire φ beam B 11 into S polarized light, and rotate the λ / 2 wavelength plate lg. The #power of the light beam A 'is measured at the position of the printed circuit board 10 and is set to the same power as the light beam B. According to the above method, the difference between the power of the two beams and the polarized light can be reduced, so that the difference in the measured values on the light receiving section 8 can be reduced. Therefore, as explained in FIG. 2 described above, the influence of the recognition of each part of the printed circuit board 10 or the calculation error on the area and volume of the shape reproduction section 105 can be prevented. Example 3 • As described above, when scanning with two light beams, the influence caused by the difference in their optical characteristics may also differ in measurement. In the third embodiment, the 'projection unit 3' uses a structure shown in FIG. 1 to explain the technique of correcting the influence of the difference in optical characteristics of two lights on the measurement side. In the structure shown in FIG. 1, the recognition mirror 9, the scanning light detection section ω7, and the positive section 108 use the waveform reproduction section 105 (including the data conversion section 105a). For example, the frame structure is used to Correct the measurement result of the effect of 25 200529? 2ffc caused by the difference in the optical characteristics of A and beam B. In addition, the Japanese Patent Application No. 2003-195GG6 filed by the applicant also makes corrections', but the correction in this case is made by the difference in the light path of the two beams. The present situation is a correction caused by the characteristics of ㈣ 道光. The outline of the correction will be described with reference to FIG. 1, and each section will be described in detail later. Figure ... The identification mirror 9 is used to distinguish the two lights of the main scanning light = Ho-a ', and is arranged at a position where the main scanning deviates from the range of the scanned object. The remaining light is reflected to the scanning light detection unit Zhe. The scan = measurement unit 107 receives the reflected light from the identification mirror 9 and generates a pulse signal in which the scanning period of the light beam A is set to Η and the light beam B is set to L. Next, the correction unit ι〇8 receives the signal from two Γ corresponding to the light beam a or light of the main scanning light, and the two beams 05a corrects the processing result of the electrical signal unit 1G8 received from the light receiving unit 8 and does not generate photometry. The difference between A and B. Example of reflection = 9. It is used in Figure 11 'for identification. The upward-measuring reflecting mirror 9a for each light beam, which is structured as shown in the mirror 9a and the blade member, is arranged on the most unidirectional scanning object. From scanning back, =; to being = 2 :: = beams are folded at the detection mirror%, and the detection section U) 7 (has a scanning photopole body in front of the optical element 9b). By setting the blade 9b, the signal waveform (hereinafter referred to as a timing signal) when the change is changed to an electrical signal can be made steep. By this, it is detected that each beam bit is outside the range 扫描 of the object to be scanned, and at the time position corresponding to the timing signal, each beam whose scanning has been completed can be known. In addition, as shown in Fig. 11 (b), the detection mirror 9a is not limited to the end point side, and may be provided on the start point side. In this case, each beam is detected before scanning the object range. In other words, from the timing signal, each light beam that has been traced can be known. 8A and 8B and FIGS. 9A and 9B are diagrams for explaining the detection of each beam in more detail. The position of each beam when polarized by the polarizer 4 is as shown in FIG. 8A, and the scanning direction (offset) is slightly shifted. This light is reflected by the detection mirror 9a, and the light receiving device (means) in the scanning light detection unit 107 is scanned. I07a is detected, and is amplified by a magnifying device (means) 107b. Fig. 8B shows the state of each light beam entering and exiting the detection-side mirror 9a at this time (the part enclosed by a one-point lock line in Fig. 8A). In FIG. 8B, it is shown that the difference caused by the irradiation positions of the light beam A and the light beam B is reflected by the detection mirror 9a as a light region received by the light receiving device 107a. There is only a region pi and a beam a of the light beam a. , • Area F2 of B and area with only beam B. Here, the light receiving device 107a has two light receiving surfaces. The two light-receiving surfaces are a light-receiving detection unit 107aa (not shown) that receives the light beam A from the area F1 where only the light beam A is present, and a light-receiving detection unit 107bb (not shown) that receives the light beams A and B from the area F2 of the light beams A and B. Draw). This combination is not limited to the above-mentioned situation, but may also be any of detection area F1, hit and ^ 27 20052972Toc scanning light detection unit 107 further generates a timing signal, which can be identified by the rotation of the detection unit unaa and the light detection unit b. The second 107 accepts and judges the result based on the timing signal of the light beam a from the light receiving section & and the result based on the timing signal from the f light detecting section 107bb @beam B. Figure ^ shows the judgment results when beam A (area F1) and beams A and B (area η) are not used for judgment. In any one of the above examples, the timing signals of the riding results show HiMiL and system B, and [level and beam a. Figures 9A and 9B can be used to generate the frequency signals from the S-light detection section 1G7aa and the light-receiving detection section 1 () lion using logic circuits composed of various logic elements. The correction unit 108 receives the output of the scanning light scanning unit 107, and corrects the measurement value of the beam person and the measurement of the beam b by the shape re-unit 105, and instructs correction of the value. At this time, ‘does not have to indicate both, but on the limit, you can also make corrections to the square. Correction, 疋 matches the measurement value of the beam on the other side with the measurement of the other beam. ° = Here, the correction unit 108 has a memory device (means), and stores the correction data required for correction in advance (Figure 7). The main contents of the correction hand & 108 correction instruction are as follows. In the above description, 疋 δ has been set as the "correction measurement value", but the value of the threshold value = value is also included in the value. 1 value ^ Increase S and offset of the received light amount received by the main body light unit 8. FIG. 7 shows an example of a correction circuit. 28 200529Τ2Ϊ τ: & 1 When the amount of dual light of Rutian Beamer is less than the amount of light received by Beam B, the secret Γ⑽ changes the data when the time sequence signal is at the L level, making the data change. The T with the electrical signal on the b side of the light beam: the difference between the light beam and the light beam 'amplifies the electrical signal amplifier and gain of the light beam A. That is, in Fig. 7, according to the L > bit'M of the timing signal, the switch B (L side) is passed, and the impedance R is increased based on the correction increase A to increase the gain. In addition, when the distribution of the amount of received light of the beam A and the distribution of $ amount of light compared to the amount of received light of the beam B are shifted toward the-side where the amount of received light is larger, the timing signal in FIG. 9B is L level. In the time zone, at the input terminal of the amplifier B, the electrical signal on the beam A side is shifted by the above-mentioned offset.

#Size is offset downward. That is, in FIG. 7, according to the L level of the timing signal, the switch A (L side) is passed, and the value A of the correction offset is given to the amplifier L, 2 to electrically offset. Because the required gains (the offset values A and B in Fig. 2) and offsets (the correction gain values A and B in Fig. 7) can be set by using the printed circuit board as a reference in Fig. 1, Instead of the printed circuit board 10, the weights are known in advance, so it can be achieved by means of memorizing in the memory device f8a, so that the timing signal s is output based on the value at the time of correction. It is also possible to perform both of the above-mentioned gain correction and offset correction. Corrects the threshold for binarization at the time of data conversion. The binarization of the above-mentioned data conversion in the data changing section 105a generally uses a comparator to compare an electrical signal corresponding to the amount of received light from the light receiving section 8 with a threshold value. However, due to the optical 29 20052 idoc characteristics of the light beam A and the light beam b, especially the power and polarization thereof, the amount of light received by the light receiving unit 8 is different in the case of the light beam A and the light beam B. When binarizing with the same critical value, one side may be binarized, and the other side may not be binarized. Therefore, there is a possibility that the judgment may be wrongly made based on the judgment result of the judgment section later. So complement is exactly what f wants. The method of this correction is the same as the offset in Fig. 7; therefore, Lang is omitted. The amplified If L at the value of If gj 7 is operated as the aforementioned comparator. Set the impedance r to infinite, and the gain of the amplifier L to the maximum 0 ^ Then, return to FIG. 2 to explain. Figure 2 is used to illustrate that when a single beam A or beam chirp is used to measure the switch, the electrical and optical points are shifted by XA-XB. In general, each time the main scan and the sub scan are performed, the beam A and the beam B are measured alternately ', and they are summarized to obtain the shape. However, the input time point of the shape reproduction unit 105 as shown above corresponds to FIG. 9B. If the timing signal is a phase object, it is corrected so that the light receiving amounts of the light beam A and the light beam B (based on the size of the electrical signal) are not. The difference is that since the identification points of solder and resistance can be XA = XB, it can prevent misjudgment. That is to say, in the calculation of the area and product (shape) of the soldering place in the future, it is possible to prevent the electric data from being mixed with the shell material of the soldering place, and make an incorrect calculation. ^ Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to: The present invention is not intended for anyone who is familiar with the art, within the scope of the spirit of the present invention, it can be modified and retouched. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent application.

200529W [Brief description of the drawings] FIG. 1 is a functional block diagram of the first embodiment. Fig. 2 is an explanatory diagram for explaining the influence on the inspection device caused by the difference in optical characteristics of the two light beams of the light projecting portion. FIG. 3 is a functional block diagram of the second embodiment. FIG. 4 is a schematic diagram of a modification example of the light generating portion of the second embodiment. FIG. 5 is a schematic diagram of a modification example of the light generating portion of the second embodiment.

FIG. 6 is a schematic diagram of a modification example of the light generating section in the second embodiment. FIG. 7 is an explanatory diagram illustrating correction in the third embodiment. Fig. 8A is an explanatory diagram illustrating a scanning beam detection method in the third embodiment. Fig. 8B is an explanatory diagram illustrating a scanning beam detection method in the third embodiment. An explanatory diagram is generated to explain the method of generating the timing signal of the beam in the third embodiment. In another example 3, an explanatory diagram of a timing signal for identifying a light beam is a local motion of a sequence Γ. FIG. 1 is a schematic diagram of another example of the embodiment of FIG. 1. FIG. 1 is an explanatory diagram for explaining detection of sweeping of two light beams in FIG. 10. In addition, the two beams of light == an explanatory diagram illustrating the scanning of the two beams of FIG. 10. FIG. 1G is an explanatory diagram for explaining scanning of two light beams in FIG. 1G. 31

200529WC FIG. 14 is a diagram for explaining the sweeping of the two beams in FIG. FIG. 15 is a diagram for explaining the two-beam insertion of FIG. 10. FIG. 16 is a diagram for explaining the scanning of the two beams in FIG. 10 = FIG. 17 is a diagram for explaining the scanning of the beams in FIG. 10 _ FIG. 18 is a perspective view showing the structure of the light projection unit of the conventional technology . FIG. 19 is an explanatory diagram for explaining sweep and sweep using the light projection unit in FIG. 18. [Description of main component symbols]

1: light generating section la: light source laa, lbb: LD light source lb: beam splitter lba · spectral device (means) lbb: reflector lc: variable device (means)

Id: Polarizing device (means) le: Collimation lens lea, leb: Collimation lens If: λ / 2 wavelength plate 2: Irradiation section 2a: Half mirror 2b: Mirror 3: Projection section 4: Polarizer 5: Convergence Lens (f〇 lens) 32

200529T2T 6: Condensing lens array 6a: Condensing lens section 7: Imaging lens 8: Light receiving section 9: Identification mirror 9a: Detection mirror 9b: Blade 10: Printed circuit board_100: Measurement control section 101: Main Scanning control unit 102: Mirror driving unit 103: Sub-scanning control unit '104: Sub-scanning unit-105: Shape reproduction unit 105a: Data conversion unit 106: Judgment unit 107: Scanning light detection unit 107a: Light receiving device (means) 107aa, 107bb: light detection unit 108: correction unit 108a: memory device (means) 109: display unit 51: projection optical system 52: light source 33 200529 ^ 24 53: deflector 53a: mirror surface 54: lens 55: light receiving system 56: Condensing lens array 56a-56f: Condensing lens section 57: Imaging lens 58 · Light receiving element 58a: Receiving surface 60: Object 60a · Object surface

34

Claims (1)

2005297ΪΤ 10. Scope of patent application ··· A tin inspection device, which includes a projection unit (3), a virtual light receiving unit (8), and a projection of the printing unit (3) across the printed substrate to be printed. The scanning target range emits light and scans. The light receiving unit receives reflected light from the printed substrate. The printed solder inspection device is used to inspect the printing state of the solder, and is characterized in that: a projection unit (3 ) Includes: a light generating unit (1) 'emits M (majority) light; and 丨 -biases 11 (4), the same person's shooting angle accepts these M ^ the object range deviation, and sequentially scans the print The scanned object of the substrate ^ ㈤. Make use of the inspection device for Yin Qing tin as described in the first full-time application:: Middle side deflection ☆ is-a polygon mirror, which is provided along the periphery of the deflector, and the angular mirror surface is scanned by rotation, and is scanned at each 36. 2M] ^. Shoots, receives the light from the light generating section, and sequentially scans the scanning target range with a rotation of 贯, 3 = degree / [2々 cafe]. Including the printed solder inspection device described in item 2 of the μ patent, the sub-scanning section (rigid) 'uses the deflector / pottery] (that is, P / 2) to make the projection section and the ^ direction Move in the vertical direction for scanning; ^ ... Putian-Secret Regeneration Department⑽) 'The light receiving unit describes the timing of the sub-scanning using the sub-scanning unit and the timing of the sub-scanning using the sub-scanning unit and a receiver, The electrical signal from the transfer receiving wire 35 200529W regenerates the shape of the printing pad on the printed substrate. The FDA 4. Please request that the M channels of light emitted by the light generating unit in the printed solder inspection described in item 2 or 3 of the patent scope are the same polarized light α and are on the scanned surface of the printed circuit board. , Set to have substantially the same power. 5. The printed solder inspection device as described in item 4 of the scope of the patent application, wherein the M channels of light are two lines of light, and the light generating unit is a light source (la) for emitting light;-Polarizing beam splitting unit (lb ), The two beam splittings composed of the light splitting domains from the light source by mutually polarizing directions perpendicular to each other; μ, a first polarizing plate (Id), receiving one of the two beam splittings, and setting The other polarization direction is the same polarization direction; and a first polarizing plate (lc) is disposed between the light source and the polarizing beam splitting section ▲ 'on the scanned surface of the printed substrate projected through the polarization H, The power of one of the-and the other-output by the -th polarizing plate is adjusted to be substantially the same. 6. The printed solder inspection device as described in item 4 of the patent claim, wherein the M channels of light are two lines of light, and the light generating unit further includes: a light source (la) for emitting light; a polarizing beam splitting unit ( lb), splitting the light from the light source into two beams of light consisting of polarizing directions perpendicular to each other; a first polarizing plate (Id), receiving one of the two beams of light, and setting it to be the same as the other Light splits in the same direction of polarization; and electrical signals for printed solder inspections described in item 36 20052975ffc-The second polarizing plate (If) 'receives two spectroscopic beams = one of the light-and, for the scanned surface of the printed plate J projected by the _ polarizer, the two spectroscopic beams The power is adjusted to be substantially phase 7. If the first or second position of the patent application scope is included, it further includes: a shape reproduction unit (105), which regenerates the printed solder output from the light receiving unit; and a correction unit (109), When the M channels of light are sequentially projected by the deflector: In order to prevent the influence of the light receiving part and the distance caused by the characteristics of the M channels of light, a supplement corresponding to the light used for projection is memorized in advance, Using the lean material and the correction data of the projected light, the electrical signal input from the light receiving section to the shape reproduction section is corrected. 8. The printed solder inspection device described in item 1 or 2 of the patent scope of Shenjing 'further includes: Α Shape regeneration section (丨 05), compares the electrical signals output by the light receiving unit with a predetermined threshold value, and performs Binarization, regenerating the shape of the printed solder from the binarized data; and the correction section (109), when the deflectors are used to sequentially project the M channels of light ^ waiting for the M channels Influenced by the difference in the characteristics of the road light, the light receiving part and the parent are affected, and a correction figure corresponding to the light used for projection is memorized in advance, and the threshold value is corrected with the correction data of the projected light. . 37