JPH04221705A - Visual inspection device - Google Patents
Visual inspection deviceInfo
- Publication number
- JPH04221705A JPH04221705A JP2405843A JP40584390A JPH04221705A JP H04221705 A JPH04221705 A JP H04221705A JP 2405843 A JP2405843 A JP 2405843A JP 40584390 A JP40584390 A JP 40584390A JP H04221705 A JPH04221705 A JP H04221705A
- Authority
- JP
- Japan
- Prior art keywords
- height
- substrate
- point
- light
- irradiation point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000011179 visual inspection Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 6
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 238000005755 formation reaction Methods 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000003287 optical Effects 0.000 abstract 1
Abstract
PURPOSE: To enable correct visual inspection by correctly measuring the height of a substrate.
CONSTITUTION: A light scanning means 1 is adapted to apply optical beams substantially vertically or obliquely to a sample 2 in which parts are mounted on a substrate having diffuse transmission, and a light irradiation point is scanned on the sample 2. A height/brightness measuring means 3 is adapted to make scattered light from the light irradiation point into image for the substantially vertically irradiation and make regular reflection light from the irradiation point into an image for the oblique irradiation and measure the height and brightness of the light irradiation point from the position and brightness of an image formation point concerning each image formation point. A substrate judging means 4 judges whether the light irradiation point is on a substrate 2a or not from the measured brightness. A height select means 5 is adapted to select a height measured by oblique irradiation in a portion where the light irradiation point is judged to be on a substrate 2b by the means 4 and select a height measured by the substantially vertical irradiation in a portion where the light irradiation point is judged to be not on the substrate 2a by the means 4. A correct visual inspection can be made by using the selected height.
COPYRIGHT: (C)1992,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2405843A JPH04221705A (en) | 1990-12-25 | 1990-12-25 | Visual inspection device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2405843A JPH04221705A (en) | 1990-12-25 | 1990-12-25 | Visual inspection device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04221705A true JPH04221705A (en) | 1992-08-12 |
Family
ID=18515452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2405843A Withdrawn JPH04221705A (en) | 1990-12-25 | 1990-12-25 | Visual inspection device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04221705A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0749219A (en) * | 1993-08-05 | 1995-02-21 | Nec Corp | Measuring device for ic lead height |
JP2002257516A (en) * | 2001-03-02 | 2002-09-11 | Nagoya Electric Works Co Ltd | Method and device for measuring height of solder |
JP2009103512A (en) * | 2007-10-22 | 2009-05-14 | Hitachi Ltd | Wiring pattern treatment apparatus |
JP2010139445A (en) * | 2008-12-12 | 2010-06-24 | Anritsu Corp | Solder printing inspection device |
WO2012029975A1 (en) * | 2010-09-03 | 2012-03-08 | 株式会社ブリヂストン | Method and device for detecting shape of band-shaped member, and two-dimensional displacement sensor |
WO2019187422A1 (en) * | 2018-03-30 | 2019-10-03 | 浜松ホトニクス株式会社 | Distance measurement unit and light irradiation device |
-
1990
- 1990-12-25 JP JP2405843A patent/JPH04221705A/en not_active Withdrawn
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0749219A (en) * | 1993-08-05 | 1995-02-21 | Nec Corp | Measuring device for ic lead height |
JP2002257516A (en) * | 2001-03-02 | 2002-09-11 | Nagoya Electric Works Co Ltd | Method and device for measuring height of solder |
JP2009103512A (en) * | 2007-10-22 | 2009-05-14 | Hitachi Ltd | Wiring pattern treatment apparatus |
JP2010139445A (en) * | 2008-12-12 | 2010-06-24 | Anritsu Corp | Solder printing inspection device |
WO2012029975A1 (en) * | 2010-09-03 | 2012-03-08 | 株式会社ブリヂストン | Method and device for detecting shape of band-shaped member, and two-dimensional displacement sensor |
CN103189713A (en) * | 2010-09-03 | 2013-07-03 | 株式会社普利司通 | Method and device for detecting shape of band-shaped member, and two-dimensional displacement sensor |
US9121693B2 (en) | 2010-09-03 | 2015-09-01 | Kabushiki Kaisha Bridgestone | Method and apparatus for detecting shape of strip-shaped member and two-dimensional displacement sensor |
JP5782036B2 (en) * | 2010-09-03 | 2015-09-24 | 株式会社ブリヂストン | Band-shaped member shape detection device and two-dimensional displacement sensor |
EP2613122A4 (en) * | 2010-09-03 | 2016-12-14 | Kk Bridgestone | Method and device for detecting shape of band-shaped member, and two-dimensional displacement sensor |
WO2019187422A1 (en) * | 2018-03-30 | 2019-10-03 | 浜松ホトニクス株式会社 | Distance measurement unit and light irradiation device |
JP2019178923A (en) * | 2018-03-30 | 2019-10-17 | 浜松ホトニクス株式会社 | Distance measuring unit and light irradiation device |
US11428520B2 (en) | 2018-03-30 | 2022-08-30 | Hamamatsu Photonics K.K. | Distance measurement unit and light irradiation device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980312 |