TWI271264B - Determination method for life/quality of polishing pad or the like, conditioning method of polishing pad, polishing device, semiconductor device and its manufacturing method - Google Patents
Determination method for life/quality of polishing pad or the like, conditioning method of polishing pad, polishing device, semiconductor device and its manufacturing method Download PDFInfo
- Publication number
- TWI271264B TWI271264B TW092117510A TW92117510A TWI271264B TW I271264 B TWI271264 B TW I271264B TW 092117510 A TW092117510 A TW 092117510A TW 92117510 A TW92117510 A TW 92117510A TW I271264 B TWI271264 B TW I271264B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- polishing pad
- adjustment
- grinding
- adjuster
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 361
- 238000000034 method Methods 0.000 title claims description 73
- 239000004065 semiconductor Substances 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 230000003750 conditioning effect Effects 0.000 title abstract 7
- 238000007517 polishing process Methods 0.000 title description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 43
- 238000005259 measurement Methods 0.000 claims abstract description 13
- 238000000227 grinding Methods 0.000 claims description 152
- 230000001186 cumulative effect Effects 0.000 claims description 20
- 230000007246 mechanism Effects 0.000 claims description 16
- 230000002950 deficient Effects 0.000 claims description 4
- 230000032683 aging Effects 0.000 claims description 2
- 239000000543 intermediate Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 124
- 230000008569 process Effects 0.000 description 42
- 238000004140 cleaning Methods 0.000 description 25
- 238000012545 processing Methods 0.000 description 20
- 230000009471 action Effects 0.000 description 13
- 238000012546 transfer Methods 0.000 description 10
- 238000012806 monitoring device Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 238000005406 washing Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 239000006061 abrasive grain Substances 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000002689 soil Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 241001422033 Thestylus Species 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
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- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
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- 230000000717 retained effect Effects 0.000 description 2
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- SHXWCVYOXRDMCX-UHFFFAOYSA-N 3,4-methylenedioxymethamphetamine Chemical compound CNC(C)CC1=CC=C2OCOC2=C1 SHXWCVYOXRDMCX-UHFFFAOYSA-N 0.000 description 1
- 206010011469 Crying Diseases 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- 108091035710 E-box Proteins 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
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- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- 239000002245 particle Substances 0.000 description 1
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- 238000011084 recovery Methods 0.000 description 1
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- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
- B24B49/186—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools taking regard of the wear of the dressing tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002189264A JP4259048B2 (ja) | 2002-06-28 | 2002-06-28 | コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200403128A TW200403128A (en) | 2004-03-01 |
| TWI271264B true TWI271264B (en) | 2007-01-21 |
Family
ID=29996841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092117510A TWI271264B (en) | 2002-06-28 | 2003-06-27 | Determination method for life/quality of polishing pad or the like, conditioning method of polishing pad, polishing device, semiconductor device and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4259048B2 (https=) |
| TW (1) | TWI271264B (https=) |
| WO (1) | WO2004002681A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101297931B1 (ko) | 2005-04-01 | 2013-08-19 | 가부시키가이샤 니콘 | 연마 장치, 이 연마 장치를 이용한 반도체 디바이스 제조방법, 및 이 반도체 디바이스 제조 방법에 의해 제조된반도체 디바이스 |
| JP4658182B2 (ja) * | 2007-11-28 | 2011-03-23 | 株式会社荏原製作所 | 研磨パッドのプロファイル測定方法 |
| DE102008002396A1 (de) | 2008-06-12 | 2009-12-17 | Biotronik Vi Patent Ag | Implantierbares Wirkstoffreservoir und Vorrichtung mit einem implantierbaren Wirkstoffreservoir |
| US20100099342A1 (en) * | 2008-10-21 | 2010-04-22 | Applied Materials, Inc. | Pad conditioner auto disk change |
| KR101100276B1 (ko) * | 2009-08-04 | 2011-12-30 | 세메스 주식회사 | 기판 연마 장치 및 그의 연마 패드 교체 방법 |
| KR101066596B1 (ko) * | 2009-08-04 | 2011-09-22 | 세메스 주식회사 | 기판 연마 장치 |
| TWI381904B (zh) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
| JP5511600B2 (ja) | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
| JP5896625B2 (ja) | 2011-06-02 | 2016-03-30 | 株式会社荏原製作所 | 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置 |
| JP6193623B2 (ja) | 2012-06-13 | 2017-09-06 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
| KR101395553B1 (ko) * | 2013-04-18 | 2014-05-15 | 주식회사 케이씨텍 | 웨이퍼 디척 공정의 오류를 최소화하는 화학 기계적 연마장치 및 그 제어 방법 |
| CN104858784A (zh) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备（上海）有限公司 | 研磨垫修整方法 |
| CN104858783A (zh) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备（上海）有限公司 | 研磨垫修整方法 |
| KR102406256B1 (ko) * | 2015-09-10 | 2022-06-08 | 주식회사 케이씨텍 | 화학 기계적 연마 장치 및 컨디셔닝 디스크의 교체시기 감지방법 |
| JP7463142B2 (ja) * | 2020-03-13 | 2024-04-08 | 株式会社東京精密 | 研磨パッドの厚み測定装置 |
| JP7735084B2 (ja) * | 2021-05-24 | 2025-09-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| KR102809945B1 (ko) | 2021-05-27 | 2025-05-22 | 삼성전자주식회사 | 컨디셔닝 디스크 교체 장치 및 이를 이용한 컨디셔닝 디스크 교체 방법 |
| JP7351558B1 (ja) | 2022-05-31 | 2023-09-27 | 株式会社吉田光学工業所 | 研磨装置及び研磨方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5609718A (en) * | 1995-09-29 | 1997-03-11 | Micron Technology, Inc. | Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers |
| JPH1086056A (ja) * | 1996-09-11 | 1998-04-07 | Speedfam Co Ltd | 研磨パッドの管理方法及び装置 |
| JP3019079B1 (ja) * | 1998-10-15 | 2000-03-13 | 日本電気株式会社 | 化学機械研磨装置 |
| US6194231B1 (en) * | 1999-03-01 | 2001-02-27 | National Tsing Hua University | Method for monitoring polishing pad used in chemical-mechanical planarization process |
| JP2001150337A (ja) * | 1999-11-29 | 2001-06-05 | Hitachi Ltd | 研磨方法および研磨装置並びにこれを用いた半導体装置の製造方法 |
| JP2001260001A (ja) * | 2000-03-13 | 2001-09-25 | Hitachi Ltd | 半導体装置の平坦化方法及びその装置 |
| JP2001263418A (ja) * | 2000-03-22 | 2001-09-26 | Tokai Rubber Ind Ltd | マスダンパ付きサポート装置 |
| JP2001334461A (ja) * | 2000-05-26 | 2001-12-04 | Ebara Corp | 研磨装置 |
| EP1270148A1 (en) * | 2001-06-22 | 2003-01-02 | Infineon Technologies SC300 GmbH & Co. KG | Arrangement and method for conditioning a polishing pad |
| JP2003019657A (ja) * | 2001-07-06 | 2003-01-21 | Toshiba Corp | ドレッシング方法及び研磨装置 |
| JP2003117816A (ja) * | 2001-10-03 | 2003-04-23 | Hitachi Ltd | 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法 |
-
2002
- 2002-06-28 JP JP2002189264A patent/JP4259048B2/ja not_active Expired - Lifetime
-
2003
- 2003-06-27 TW TW092117510A patent/TWI271264B/zh not_active IP Right Cessation
- 2003-06-27 WO PCT/JP2003/008216 patent/WO2004002681A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004025413A (ja) | 2004-01-29 |
| JP4259048B2 (ja) | 2009-04-30 |
| TW200403128A (en) | 2004-03-01 |
| WO2004002681A1 (ja) | 2004-01-08 |
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| MK4A | Expiration of patent term of an invention patent |