JP4259048B2 - コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法 - Google Patents

コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法 Download PDF

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Publication number
JP4259048B2
JP4259048B2 JP2002189264A JP2002189264A JP4259048B2 JP 4259048 B2 JP4259048 B2 JP 4259048B2 JP 2002189264 A JP2002189264 A JP 2002189264A JP 2002189264 A JP2002189264 A JP 2002189264A JP 4259048 B2 JP4259048 B2 JP 4259048B2
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Japan
Prior art keywords
polishing
conditioner
conditioning
polishing pad
pad
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Expired - Lifetime
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JP2002189264A
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English (en)
Japanese (ja)
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JP2004025413A5 (https=
JP2004025413A (ja
Inventor
進 星野
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Nikon Corp
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Nikon Corp
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Publication date
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Priority to JP2002189264A priority Critical patent/JP4259048B2/ja
Priority to TW092117510A priority patent/TWI271264B/zh
Priority to PCT/JP2003/008216 priority patent/WO2004002681A1/ja
Publication of JP2004025413A publication Critical patent/JP2004025413A/ja
Publication of JP2004025413A5 publication Critical patent/JP2004025413A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B24B49/186—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools taking regard of the wear of the dressing tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2002189264A 2002-06-28 2002-06-28 コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法 Expired - Lifetime JP4259048B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002189264A JP4259048B2 (ja) 2002-06-28 2002-06-28 コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法
TW092117510A TWI271264B (en) 2002-06-28 2003-06-27 Determination method for life/quality of polishing pad or the like, conditioning method of polishing pad, polishing device, semiconductor device and its manufacturing method
PCT/JP2003/008216 WO2004002681A1 (ja) 2002-06-28 2003-06-27 研磨パッド等の寿命・良否判定方法、研磨パッドのコンディショニング方法、研磨装置、半導体デバイス及び半導体デバイス製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002189264A JP4259048B2 (ja) 2002-06-28 2002-06-28 コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法

Publications (3)

Publication Number Publication Date
JP2004025413A JP2004025413A (ja) 2004-01-29
JP2004025413A5 JP2004025413A5 (https=) 2005-10-27
JP4259048B2 true JP4259048B2 (ja) 2009-04-30

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Family Applications (1)

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JP2002189264A Expired - Lifetime JP4259048B2 (ja) 2002-06-28 2002-06-28 コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法

Country Status (3)

Country Link
JP (1) JP4259048B2 (https=)
TW (1) TWI271264B (https=)
WO (1) WO2004002681A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156122B2 (en) 2011-06-02 2015-10-13 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
US12145233B2 (en) 2021-05-27 2024-11-19 Samsung Electronics Co., Ltd. Conditioning disk replacement apparatus and method

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101297931B1 (ko) 2005-04-01 2013-08-19 가부시키가이샤 니콘 연마 장치, 이 연마 장치를 이용한 반도체 디바이스 제조방법, 및 이 반도체 디바이스 제조 방법에 의해 제조된반도체 디바이스
JP4658182B2 (ja) * 2007-11-28 2011-03-23 株式会社荏原製作所 研磨パッドのプロファイル測定方法
DE102008002396A1 (de) 2008-06-12 2009-12-17 Biotronik Vi Patent Ag Implantierbares Wirkstoffreservoir und Vorrichtung mit einem implantierbaren Wirkstoffreservoir
US20100099342A1 (en) * 2008-10-21 2010-04-22 Applied Materials, Inc. Pad conditioner auto disk change
KR101100276B1 (ko) * 2009-08-04 2011-12-30 세메스 주식회사 기판 연마 장치 및 그의 연마 패드 교체 방법
KR101066596B1 (ko) * 2009-08-04 2011-09-22 세메스 주식회사 기판 연마 장치
TWI381904B (zh) * 2009-12-03 2013-01-11 Nat Univ Chung Cheng The method of detecting the grinding characteristics and service life of the polishing pad
JP5511600B2 (ja) 2010-09-09 2014-06-04 株式会社荏原製作所 研磨装置
JP6193623B2 (ja) 2012-06-13 2017-09-06 株式会社荏原製作所 研磨方法及び研磨装置
KR101395553B1 (ko) * 2013-04-18 2014-05-15 주식회사 케이씨텍 웨이퍼 디척 공정의 오류를 최소화하는 화학 기계적 연마장치 및 그 제어 방법
CN104858784A (zh) * 2014-02-26 2015-08-26 盛美半导体设备（上海）有限公司 研磨垫修整方法
CN104858783A (zh) * 2014-02-26 2015-08-26 盛美半导体设备（上海）有限公司 研磨垫修整方法
KR102406256B1 (ko) * 2015-09-10 2022-06-08 주식회사 케이씨텍 화학 기계적 연마 장치 및 컨디셔닝 디스크의 교체시기 감지방법
JP7463142B2 (ja) * 2020-03-13 2024-04-08 株式会社東京精密 研磨パッドの厚み測定装置
JP7735084B2 (ja) * 2021-05-24 2025-09-08 株式会社荏原製作所 基板処理装置および基板処理方法
JP7351558B1 (ja) 2022-05-31 2023-09-27 株式会社吉田光学工業所 研磨装置及び研磨方法

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Publication number Priority date Publication date Assignee Title
US5609718A (en) * 1995-09-29 1997-03-11 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
JPH1086056A (ja) * 1996-09-11 1998-04-07 Speedfam Co Ltd 研磨パッドの管理方法及び装置
JP3019079B1 (ja) * 1998-10-15 2000-03-13 日本電気株式会社 化学機械研磨装置
US6194231B1 (en) * 1999-03-01 2001-02-27 National Tsing Hua University Method for monitoring polishing pad used in chemical-mechanical planarization process
JP2001150337A (ja) * 1999-11-29 2001-06-05 Hitachi Ltd 研磨方法および研磨装置並びにこれを用いた半導体装置の製造方法
JP2001260001A (ja) * 2000-03-13 2001-09-25 Hitachi Ltd 半導体装置の平坦化方法及びその装置
JP2001263418A (ja) * 2000-03-22 2001-09-26 Tokai Rubber Ind Ltd マスダンパ付きサポート装置
JP2001334461A (ja) * 2000-05-26 2001-12-04 Ebara Corp 研磨装置
EP1270148A1 (en) * 2001-06-22 2003-01-02 Infineon Technologies SC300 GmbH & Co. KG Arrangement and method for conditioning a polishing pad
JP2003019657A (ja) * 2001-07-06 2003-01-21 Toshiba Corp ドレッシング方法及び研磨装置
JP2003117816A (ja) * 2001-10-03 2003-04-23 Hitachi Ltd 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156122B2 (en) 2011-06-02 2015-10-13 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
US9302366B2 (en) 2011-06-02 2016-04-05 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
JP2016128209A (ja) * 2011-06-02 2016-07-14 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法、および研磨装置
US9943943B2 (en) 2011-06-02 2018-04-17 Ebara Corporation Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus
US12145233B2 (en) 2021-05-27 2024-11-19 Samsung Electronics Co., Ltd. Conditioning disk replacement apparatus and method

Also Published As

Publication number Publication date
TWI271264B (en) 2007-01-21
JP2004025413A (ja) 2004-01-29
TW200403128A (en) 2004-03-01
WO2004002681A1 (ja) 2004-01-08

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