JP2004025413A5 - - Google Patents
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- Publication number
- JP2004025413A5 JP2004025413A5 JP2002189264A JP2002189264A JP2004025413A5 JP 2004025413 A5 JP2004025413 A5 JP 2004025413A5 JP 2002189264 A JP2002189264 A JP 2002189264A JP 2002189264 A JP2002189264 A JP 2002189264A JP 2004025413 A5 JP2004025413 A5 JP 2004025413A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- conditioning
- conditioner
- polishing
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 77
- 230000003750 conditioning effect Effects 0.000 claims 48
- 230000001186 cumulative effect Effects 0.000 claims 11
- 238000000034 method Methods 0.000 claims 9
- 238000005259 measurement Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 230000002950 deficient Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 230000001143 conditioned effect Effects 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002189264A JP4259048B2 (ja) | 2002-06-28 | 2002-06-28 | コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法 |
| TW092117510A TWI271264B (en) | 2002-06-28 | 2003-06-27 | Determination method for life/quality of polishing pad or the like, conditioning method of polishing pad, polishing device, semiconductor device and its manufacturing method |
| PCT/JP2003/008216 WO2004002681A1 (ja) | 2002-06-28 | 2003-06-27 | 研磨パッド等の寿命・良否判定方法、研磨パッドのコンディショニング方法、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002189264A JP4259048B2 (ja) | 2002-06-28 | 2002-06-28 | コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004025413A JP2004025413A (ja) | 2004-01-29 |
| JP2004025413A5 true JP2004025413A5 (https=) | 2005-10-27 |
| JP4259048B2 JP4259048B2 (ja) | 2009-04-30 |
Family
ID=29996841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002189264A Expired - Lifetime JP4259048B2 (ja) | 2002-06-28 | 2002-06-28 | コンディショナの寿命判定方法及びこれを用いたコンディショナの判定方法、研磨装置、並びに半導体デバイス製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4259048B2 (https=) |
| TW (1) | TWI271264B (https=) |
| WO (1) | WO2004002681A1 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101297931B1 (ko) | 2005-04-01 | 2013-08-19 | 가부시키가이샤 니콘 | 연마 장치, 이 연마 장치를 이용한 반도체 디바이스 제조방법, 및 이 반도체 디바이스 제조 방법에 의해 제조된반도체 디바이스 |
| JP4658182B2 (ja) * | 2007-11-28 | 2011-03-23 | 株式会社荏原製作所 | 研磨パッドのプロファイル測定方法 |
| DE102008002396A1 (de) | 2008-06-12 | 2009-12-17 | Biotronik Vi Patent Ag | Implantierbares Wirkstoffreservoir und Vorrichtung mit einem implantierbaren Wirkstoffreservoir |
| US20100099342A1 (en) * | 2008-10-21 | 2010-04-22 | Applied Materials, Inc. | Pad conditioner auto disk change |
| KR101100276B1 (ko) * | 2009-08-04 | 2011-12-30 | 세메스 주식회사 | 기판 연마 장치 및 그의 연마 패드 교체 방법 |
| KR101066596B1 (ko) * | 2009-08-04 | 2011-09-22 | 세메스 주식회사 | 기판 연마 장치 |
| TWI381904B (zh) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
| JP5511600B2 (ja) | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
| JP5896625B2 (ja) | 2011-06-02 | 2016-03-30 | 株式会社荏原製作所 | 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置 |
| JP6193623B2 (ja) | 2012-06-13 | 2017-09-06 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
| KR101395553B1 (ko) * | 2013-04-18 | 2014-05-15 | 주식회사 케이씨텍 | 웨이퍼 디척 공정의 오류를 최소화하는 화학 기계적 연마장치 및 그 제어 방법 |
| CN104858784A (zh) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备(上海)有限公司 | 研磨垫修整方法 |
| CN104858783A (zh) * | 2014-02-26 | 2015-08-26 | 盛美半导体设备(上海)有限公司 | 研磨垫修整方法 |
| KR102406256B1 (ko) * | 2015-09-10 | 2022-06-08 | 주식회사 케이씨텍 | 화학 기계적 연마 장치 및 컨디셔닝 디스크의 교체시기 감지방법 |
| JP7463142B2 (ja) * | 2020-03-13 | 2024-04-08 | 株式会社東京精密 | 研磨パッドの厚み測定装置 |
| JP7735084B2 (ja) * | 2021-05-24 | 2025-09-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
| KR102809945B1 (ko) | 2021-05-27 | 2025-05-22 | 삼성전자주식회사 | 컨디셔닝 디스크 교체 장치 및 이를 이용한 컨디셔닝 디스크 교체 방법 |
| JP7351558B1 (ja) | 2022-05-31 | 2023-09-27 | 株式会社吉田光学工業所 | 研磨装置及び研磨方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5609718A (en) * | 1995-09-29 | 1997-03-11 | Micron Technology, Inc. | Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers |
| JPH1086056A (ja) * | 1996-09-11 | 1998-04-07 | Speedfam Co Ltd | 研磨パッドの管理方法及び装置 |
| JP3019079B1 (ja) * | 1998-10-15 | 2000-03-13 | 日本電気株式会社 | 化学機械研磨装置 |
| US6194231B1 (en) * | 1999-03-01 | 2001-02-27 | National Tsing Hua University | Method for monitoring polishing pad used in chemical-mechanical planarization process |
| JP2001150337A (ja) * | 1999-11-29 | 2001-06-05 | Hitachi Ltd | 研磨方法および研磨装置並びにこれを用いた半導体装置の製造方法 |
| JP2001260001A (ja) * | 2000-03-13 | 2001-09-25 | Hitachi Ltd | 半導体装置の平坦化方法及びその装置 |
| JP2001263418A (ja) * | 2000-03-22 | 2001-09-26 | Tokai Rubber Ind Ltd | マスダンパ付きサポート装置 |
| JP2001334461A (ja) * | 2000-05-26 | 2001-12-04 | Ebara Corp | 研磨装置 |
| EP1270148A1 (en) * | 2001-06-22 | 2003-01-02 | Infineon Technologies SC300 GmbH & Co. KG | Arrangement and method for conditioning a polishing pad |
| JP2003019657A (ja) * | 2001-07-06 | 2003-01-21 | Toshiba Corp | ドレッシング方法及び研磨装置 |
| JP2003117816A (ja) * | 2001-10-03 | 2003-04-23 | Hitachi Ltd | 研磨パッドの修復方法および研磨パッドの修復装置およびそれを用いた被加工物の研磨方法 |
-
2002
- 2002-06-28 JP JP2002189264A patent/JP4259048B2/ja not_active Expired - Lifetime
-
2003
- 2003-06-27 TW TW092117510A patent/TWI271264B/zh not_active IP Right Cessation
- 2003-06-27 WO PCT/JP2003/008216 patent/WO2004002681A1/ja not_active Ceased
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