TWI270671B - Inspection apparatus for print circuit board for mounting electronic parts and a method for identifying poor pattern - Google Patents

Inspection apparatus for print circuit board for mounting electronic parts and a method for identifying poor pattern Download PDF

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Publication number
TWI270671B
TWI270671B TW093116918A TW93116918A TWI270671B TW I270671 B TWI270671 B TW I270671B TW 093116918 A TW093116918 A TW 093116918A TW 93116918 A TW93116918 A TW 93116918A TW I270671 B TWI270671 B TW I270671B
Authority
TW
Taiwan
Prior art keywords
defective
workpiece
image
circuit board
defective portion
Prior art date
Application number
TW093116918A
Other languages
English (en)
Chinese (zh)
Other versions
TW200506351A (en
Inventor
Hiroshi Hasegawa
Sachio Noto
Keisuke Sekido
Masahiro Arima
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200506351A publication Critical patent/TW200506351A/zh
Application granted granted Critical
Publication of TWI270671B publication Critical patent/TWI270671B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
  • Image Analysis (AREA)
TW093116918A 2003-06-13 2004-06-11 Inspection apparatus for print circuit board for mounting electronic parts and a method for identifying poor pattern TWI270671B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003170053A JP3866688B2 (ja) 2003-06-13 2003-06-13 電子部品実装用フィルムキャリアテープの検査装置およびパターン不良の確認方法

Publications (2)

Publication Number Publication Date
TW200506351A TW200506351A (en) 2005-02-16
TWI270671B true TWI270671B (en) 2007-01-11

Family

ID=34094996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116918A TWI270671B (en) 2003-06-13 2004-06-11 Inspection apparatus for print circuit board for mounting electronic parts and a method for identifying poor pattern

Country Status (4)

Country Link
JP (1) JP3866688B2 (ko)
KR (1) KR100697902B1 (ko)
CN (1) CN1300572C (ko)
TW (1) TWI270671B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408362B (zh) * 2009-10-19 2013-09-11 Innolux Corp 陣列基板與液晶面板的自動檢測方法，製程機台及其陣列基板自動檢測裝置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006308351A (ja) * 2005-04-27 2006-11-09 Jst Mfg Co Ltd 電子部品検査方法及び，これを用いる電子部品検査システム
JP4809032B2 (ja) * 2005-10-04 2011-11-02 ヤマハ発動機株式会社 実装基板の検査装置および印刷装置
JP2007188128A (ja) * 2006-01-11 2007-07-26 Omron Corp カラー画像を用いた測定方法および測定装置
JP4966139B2 (ja) * 2007-09-13 2012-07-04 株式会社東芝 接合材貼付検査装置、実装装置、電気部品の製造方法
CN100566540C (zh) * 2007-10-17 2009-12-02 太阳油墨（苏州）有限公司 印刷电路板的外观检查方法
CN102856214A (zh) * 2011-06-27 2013-01-02 鸿骐新技股份有限公司 电路板置件方法
KR101251852B1 (ko) * 2011-12-27 2013-04-10 삼성전기주식회사 다층인쇄회로기판 불량 검사 방법
CN102937595B (zh) * 2012-11-13 2015-05-20 浙江省电力公司电力科学研究院 一种pcb板检测方法、装置及系统
CN105635662A (zh) * 2014-11-08 2016-06-01 智比特信息技术（镇江）有限公司 一种检测用载带重封机的监视系统及其计算机监视方法
CN104494313A (zh) * 2014-12-18 2015-04-08 深圳市五株科技股份有限公司 制作ic载板标识的方法及其打标装置
KR101933079B1 (ko) * 2017-01-26 2019-03-15 주식회사 제니스테크 정밀도가 향상된 필름 검사 장치, 이를 포함하는 패턴 형성 장치 및 필름 검사 방법
WO2019003267A1 (ja) * 2017-06-26 2019-01-03 ヤマハ発動機株式会社 部品実装装置および部品データ作成方法
TWI639367B (zh) 2017-07-07 2018-10-21 迅得機械股份有限公司 軟板標記系統及方法
CN109283243A (zh) * 2017-07-19 2019-01-29 迅得机械股份有限公司 软板标记系统及方法
CN115258237B (zh) * 2022-08-11 2024-04-16 深圳市中金科五金制造有限公司 一种全自动电子感应系统及其ccd垂直检测方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821147A (ja) * 1981-07-30 1983-02-07 Matsushita Electric Ind Co Ltd 印刷配線基板の検査装置
DE69435333D1 (de) * 1993-04-21 2011-03-24 Omron Tateisi Electronics Co Vorrichtung zur visuellen kontrolle von platinen und deren verwendung zur kontrolle und korrektur von lötungen
JP3363103B2 (ja) * 1998-11-16 2003-01-08 日本ビクター株式会社 外観検査装置
WO2001041068A1 (fr) * 1999-11-29 2001-06-07 Olympus Optical Co., Ltd. Systeme de detection de defaut
GB2388428A (en) * 2000-09-10 2003-11-12 Orbotech Ltd Reduction of false alarms in PCB inspection
JP2008034659A (ja) * 2006-07-28 2008-02-14 Rohm Co Ltd 窒化物半導体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408362B (zh) * 2009-10-19 2013-09-11 Innolux Corp 陣列基板與液晶面板的自動檢測方法，製程機台及其陣列基板自動檢測裝置

Also Published As

Publication number Publication date
KR100697902B1 (ko) 2007-03-20
KR20040107439A (ko) 2004-12-20
CN1573320A (zh) 2005-02-02
JP2005005619A (ja) 2005-01-06
CN1300572C (zh) 2007-02-14
TW200506351A (en) 2005-02-16
JP3866688B2 (ja) 2007-01-10

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MM4A Annulment or lapse of patent due to non-payment of fees