TWI265214B - Anode for oxygen evolution - Google Patents

Anode for oxygen evolution Download PDF

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TWI265214B
TWI265214B TW094115470A TW94115470A TWI265214B TW I265214 B TWI265214 B TW I265214B TW 094115470 A TW094115470 A TW 094115470A TW 94115470 A TW94115470 A TW 94115470A TW I265214 B TWI265214 B TW I265214B
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outer layer
tin
titanium
metal
copper
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TW200540297A (en
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Paolo Rossi
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De Nora Elettrodi Spa
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Description

1265214 九、發明說明： 【發明所屬之技術領域】 本發明係關於水溶液内釋放古 例如用來破壞廢水内之_物。電壓氧氣用之陽極， 中很通常的反應，尤其是在廢水放氧氣是—般水處理 須降到極低水準時。在破壞沾有機物物質必 要視陽極釋放電位而定，必續禽旦f々初生悲氧效用，主 密度為佳。其他工業製程，‘=嫌=需使用過份電流 在本發明陽極高電位時釋放氧教Μ” 口成業裡，可取得 液内之氧化，無疑地展示其可是有機類在水溶 【先前技術】 ^廣佈和_相關用途。 陶質====;用上是在 修飾，主要為了賦予充分的導電性;又，二：：力各種 目的採用之傳統材料。然、而，此類物^表為此 !型=!於闊金屬之高度氧氣過電壓 =中〇括鈦紐合金基材’―種保紐陶質崎 於鈦和钽的氧化物，以及低催化活性之外層，\中 ^ ii表ΐΐί份’通常與銅、銥和銻等其他元素混合;此ϊ 於W0 03/100135號之實施例6。雖然W0 〇3/職3=的| 3能夠在指示應用中提供引人注目的初步效益，在硫^溶液 内丄以100 A/m電流，釋出電位略超出2V的氧氣，但其使 用哥命令人不滿意。事實上，即使上述陽極具有低催化^性 之外層，在通常工業操作條件下’釋放氧氣電位連同有機類 除去效率，在數百小時内有驟降的傾向。此外，從w〇 03/100135號的說明，應可注意到相關電極之製法在大量生產 中相當複雜’由於事實上必須應用大量二種不同母質的交替 層（在實施例中，有各二塗料之十層交替）。 、 曰 1265214 【發明内容】 ，咐怠=下於ϊ 法，碎:ί，ii在=„壓釋放氧氣的陽極之製 鈦合屬is?包含在陶質基材，或最好在鈦、 =屬氧^第一保護性内層，基於=以已= 内層，以及含有錫、銅和録的氧化物之外層。H姐 在-較佳具_中，按照本發騎化0之鈦或鈦 具備適當粗巧度形態，例如經喷砂，隨後以硫_二， 人f另了較佳具體例中，第一内層包括鈦和钮的氧化物之 ϊί/i2^於貴金屬的第二内層含銘，更狀其量在10和 A iiif」銅和朗減物，可㈣要財他元素組 σ。錫的3里宜在5和25 g/m2之間，銻在0.4和2 _2之 f二ii0,2和1咖2之間；在更佳具體例中，錫存在量 佔總金屬含量的至少9〇%重量。 f另一要旨下，本發明包含高度過電壓釋放氧氣用之陽 亟的‘法，包括隨後應用基於閥金屬氧化物的第一保護性内 層，基於貴金屬的第二内層，以及在陶質或閥金屬基材上含 有錫、銅_氧化物之外層。在—較佳具翻巾，基材為鈦 ，鈦合f，經預先處理以賦予適度粗糙度形態，例如利用噴 砂/接著以硫酸蝕刻，如w〇 〇3/〇76693號所载。然而，可 進行其他類處理，例如熱處理或電漿喷液處理，或以其他腐 蝕劑加以蝕刻。在一較佳具體例中，第一内層是應用母質， 例如欽和麵的氯化物，接著例如在450和600°C間加以熱分 1265214 解而得；母質應用可如技術上已知，利用不同的單一或組合 技術，諸如喷塗、刷塗或輥塗進行。在一較佳具體例中^ 二内層是利用六氯鉑酸在溫度400 —60(rc熱分&而得，但亦 I實施其他型式的貴金屬應用，例如經由電鍍程序。於形成 第一内層之際，可含有其他貴金屬之母質，但實際上有鉑存 在為佳。 在-特佳具體射’使用含有錫、銅和錄的氧化物 貝，例如相關氯化物之單-溶液，施以外層。溶液按昭 技術施予，在450和600°C間分解為佳。 本發明陽極能在高度過電壓釋出氧氣，即在數 2 電流密度，顯示2V (NHEUxJl之餘，其= 03/100135號的陽極，或先前技術之其他陽極。本發^願拘 ίΐίΐί論’可以假設以wo __5號而言，陽S ，層有龜裂:戈裂縫的傾向’會暴露若干面積’雖然延伸 限二但銥含量冑，或摊何叙·F，氧 積，上面，氧氣過電壓仍然相當高。 自暴路田銘面 此種說明係可利用附圖所列資料加以實質化。 【實施方式】 、、 言’第1圖曲線參照在硫酸納内，於PH 5和25 物之外層。實降tΜ以及基於鈒和组的氧化 擬w==5陽極，外^)模 X 口用以下貫施例進一步澄清，但無意限制其範 1265214 圍，範圍純由所附申請專利範圍加以界定。 實施例 取按照ASTM B 265為1級，尺寸45 cm mm的鈦片，以金剛砂進行噴砂，以含ι〇的：厚2 硫^，在溫度87〇C進行钱刻。對鈦片施以含鈦和曰^ 25% 之溶液，濃度為〇.U M Ti和〇 〇3 M Ta，利^哈^化物 續塗佈之間，於5(rc乾燥1()分 | = 解15分鐘。 1文牡C進仃熱分 、因此，得第一内層，上面施以第二内層 成。以分散於丁香紛内之六氯翻酸 ^ j 後，f 50(TC熱分解1〇分鐘。 運订一人塗刷，母次塗 最後施以外層，依次為錫（IV) 仏t(II)(佔總金屬含量之挪）二全7含之旦i4 4%)的減物溶液。彻刷塗 ^金屬3里之 乾燥和在52(TC分解之循環，A母―人塗後進仃在机 如此所得本發明電極，在Η $如λα 士 △ 氧氣情形下，經極化測試，的;▲納内釋放 A筮1同如士 飞、、、口果為弟1圖内曲線（1)所示。 在第1 ®内，亦列出在同樣條件 等數，別如“ L =物所得極化數據。此 g/1 Γ二力S=5r、時後，在電流密度5。二2，測量ΐ ν (νηε)Γ^Ϊ 2,15 試，在同樣條件的釋放气〃 f 就製備的陽極，經同樣測 此菜寻豕顯而可知’本發明可就上述實施例之其他 1265214 變化或修飾加以實施。 不在於限制本發明，而是可按照不同具體例使用， =延其_ ’且其程度伽確以_中請專職圍加以界 佩ί案說明書全文和申請專利範圍巾，「包括」字樣意指不 排除其他元件或附加組件的存在。
【圖式簡單說明】 弟1圖表示本發明陽極釋放氧氣之極化曲線。 【主要元件符號說明】 ⑴為相對於本發明陽極之極化曲線 (2)ίίί於本發明陽極只具有二内層（分別基於欽和知的 氧化物，以及鈦）之極化曲線 々s一妁 ⑶為相對於陽極只具有第—_ (基於鈦和纽 和外層（基於銥和鈕的氧化物）之極化曲線妁飞匕物）

Claims (1)

1265214 十、申請專利範園： 1· 一種高度過電壓釋放氧教用 基材’施加於該基材而基於括閥金屬或陶質 該第-内層而基於貴金屬之第丄㈣=内層，施加於 氧化物之外層者。 9 及含有錫、銅和銻的 鈦或目帛1狀陽極，射_麵基材係由 3·如申請專利範圍第2項之陽搞，甘丄a 材’具有粗糙度形態，係利用處理加‘合=基 刻，並視情形先進行喷砂者。 卫制匕括以石;IL酸名虫 和以姆11 貞娜f内層包括欽 至24=^者專利範圍第1項之陽極，其中該第二内層包括1〇 6.如申請專利範圍第】項 咖2錫、0.4至2 g/m2録，和〇 2至^亥外層包括5至25 其量極，射錫存在於該外層， 8·—種高度過電壓釋放氧韻用 或陶質基材施以基_金屬之第 :j二包括對閥金屬 於貴金屬m並施 ；⑽施以基 者。 物銅和銻的氧化物之外層 9·如申請專利範圍第8項之方法， 金基材，具有控制下的粗链 材為鈦或鈦合 蝕刻而得者。 〜、係利用賀砂和隨後之硫酸 10·如申請專利範圍第8或9項 5，係利用選自噴塗、刷塗和輕塗之至少2第一内 氣化物溶液開始，隨後在450至_。 方法大和f之 η.如申請專利範圍第8項之方法^^第==用 1265214 含六氯鉑酸的溶液，在400至60(TC之溫度加以熱分解而實施 者。 、 12.如申請專利範圍第8項之方法’其中該外層係次 塗佈實施’從含錫、錄和銅的氯化物之溶液開 至60(TC的溫度加以熱分解者。 喊在450 .-種電化學製法，包括在 上，於2V (_)以上之電位，在陽1項之電極 14.如申請專利範園第】 者。 者。 貝之衣去，包括工業上之水處理 廢水如申請專利範圍第14項之勢、丰，甘一 中之有機分子者。 、“中該處理包括消除
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Families Citing this family (15)

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Publication number Priority date Publication date Assignee Title
ITMI20061947A1 (it) * 2006-10-11 2008-04-12 Industrie De Nora Spa Catodo per processi elettrolitici
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ITMI20111132A1 (it) * 2011-06-22 2012-12-23 Industrie De Nora Spa Anodo per evoluzione di ossigeno
ITMI20122035A1 (it) * 2012-11-29 2014-05-30 Industrie De Nora Spa Elettrodo per evoluzione di ossigeno in processi elettrochimici industriali
RU2577402C1 (ru) * 2014-09-30 2016-03-20 Акционерное общество "Ордена Трудового Красного Знамени научно-исследовательский физико-химический институт им. Л.Я. Карпова" Анод для выделения кислорода и способ его изготовления
CN105154913B (zh) * 2015-07-02 2017-05-31 北京师范大学 一种水处理用电催化电极中层的制备方法
CN108299868A (zh) * 2016-08-25 2018-07-20 先丰通讯股份有限公司 触媒涂料及使用其的阳极
US11668017B2 (en) * 2018-07-30 2023-06-06 Water Star, Inc. Current reversal tolerant multilayer material, method of making the same, use as an electrode, and use in electrochemical processes
CN109868464A (zh) * 2019-03-11 2019-06-11 江阴安诺电极有限公司 具有贵金属涂层的阳极板
JP2020153000A (ja) * 2019-03-22 2020-09-24 株式会社豊田中央研究所 電気化学反応デバイス
CN114272920B (zh) * 2021-11-22 2023-10-03 广东省科学院资源利用与稀土开发研究所 一种有机污染物降解用复合氧化物涂层电极及其制备方法
CN114351179A (zh) * 2021-12-02 2022-04-15 江苏友诺环保科技有限公司 一种具有中间层的铱钽锰涂层钛阳极板及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2596776B1 (fr) * 1986-04-03 1988-06-03 Atochem Cathode pour electrolyse et un procede de fabrication de ladite cathode
JPS62284095A (ja) * 1986-06-02 1987-12-09 Permelec Electrode Ltd 耐久性を有する電解用電極及びその製造方法
JP2574699B2 (ja) * 1989-04-21 1997-01-22 ダイソー 株式会社 酸素発生陽極及びその製法
AT397436B (de) * 1990-07-26 1994-04-25 Avl Verbrennungskraft Messtech Anode einer elektrochemischen sensoranordnung und verfahren zu deren herstellung
CA2061390A1 (en) * 1991-03-01 1992-09-02 Oronzio De Nora Metal anodes for electrolytic acid solutions containing fluorides or fluoroanionic complexes
JP3212327B2 (ja) * 1991-08-30 2001-09-25 ペルメレック電極株式会社 電解用電極
NL9101753A (nl) * 1991-10-21 1993-05-17 Magneto Chemie Bv Anodes met verlengde levensduur en werkwijzen voor hun vervaardiging.
JP3236653B2 (ja) * 1992-02-25 2001-12-10 ペルメレック電極株式会社 電解用電極
LU88516A1 (de) 1993-07-21 1996-02-01 Furukawa Electric Co Ltd Sauerstoff erzeugende Elektrode und Verfahren dieselbe herzustellen
JP2925938B2 (ja) * 1994-04-04 1999-07-28 古河電気工業株式会社 酸素発生用電極とその製造方法
JPH11221570A (ja) * 1998-02-05 1999-08-17 Matsushita Electric Ind Co Ltd 有機汚水の分解電極及びそれを用いた有機汚水の分解方法、及びそれを用いた有機汚水の分解装置
JP2931812B1 (ja) * 1998-04-24 1999-08-09 ティーディーケイ株式会社 電解用電極およびその製造方法
US7247229B2 (en) 1999-06-28 2007-07-24 Eltech Systems Corporation Coatings for the inhibition of undesirable oxidation in an electrochemical cell
ITMI20020535A1 (it) * 2002-03-14 2003-09-15 De Nora Elettrodi Spa Anodo per sviluppo di ossigeno e relativo substrato
ITMI20021128A1 (it) * 2002-05-24 2003-11-24 De Nora Elettrodi Spa Elettrodo per sviluppo di gas e metodo per il suo ottenimento

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