TWI256094B - Film carrier tape for mounting electronic devices thereon and method of manufacturing the same - Google Patents

Film carrier tape for mounting electronic devices thereon and method of manufacturing the same

Info

Publication number
TWI256094B
TWI256094B TW092106193A TW92106193A TWI256094B TW I256094 B TWI256094 B TW I256094B TW 092106193 A TW092106193 A TW 092106193A TW 92106193 A TW92106193 A TW 92106193A TW I256094 B TWI256094 B TW I256094B
Authority
TW
Taiwan
Prior art keywords
carrier tape
film carrier
electronic devices
mounting electronic
wiring pattern
Prior art date
Application number
TW092106193A
Other languages
English (en)
Other versions
TW200306633A (en
Inventor
Akira Koyanagi
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200306633A publication Critical patent/TW200306633A/zh
Application granted granted Critical
Publication of TWI256094B publication Critical patent/TWI256094B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
TW092106193A 2002-03-25 2003-03-20 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same TWI256094B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002083655A JP3750113B2 (ja) 2002-03-25 2002-03-25 電子部品実装用フィルムキャリアテープ及びその製造方法

Publications (2)

Publication Number Publication Date
TW200306633A TW200306633A (en) 2003-11-16
TWI256094B true TWI256094B (en) 2006-06-01

Family

ID=28035799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092106193A TWI256094B (en) 2002-03-25 2003-03-20 Film carrier tape for mounting electronic devices thereon and method of manufacturing the same

Country Status (5)

Country Link
US (1) US6744123B2 (zh)
JP (1) JP3750113B2 (zh)
KR (1) KR100631331B1 (zh)
CN (1) CN100367490C (zh)
TW (1) TWI256094B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3886513B2 (ja) * 2004-02-02 2007-02-28 松下電器産業株式会社 フィルム基板およびその製造方法
JP4657689B2 (ja) * 2004-12-01 2011-03-23 新藤電子工業株式会社 Ｃｏｆテープの製造方法
JP2007059627A (ja) * 2005-08-24 2007-03-08 Nitto Denko Corp Ｔａｂ用テープキャリアの製造方法
JP2007067073A (ja) * 2005-08-30 2007-03-15 Nitto Denko Corp Ｔａｂ用テープキャリアの製造方法
JP2008205172A (ja) * 2007-02-20 2008-09-04 Shindo Denshi Kogyo Kk Ｃｏｆキャリアテープ、ｃｏｆキャリアテープの製造方法、およびｃｏｆ型半導体装置の製造方法
KR101457939B1 (ko) 2009-11-02 2014-11-10 엘지이노텍 주식회사 탭 테이프 및 그 제조방법
KR101148099B1 (ko) 2010-10-01 2012-05-23 엘지이노텍 주식회사 탭 테이프 및 그 제조방법
KR101258952B1 (ko) 2011-07-01 2013-04-29 한윤석 기능성 에스엠디 캐리어 밴드용 십자 조인트 테이프
KR101331397B1 (ko) * 2012-08-13 2013-11-19 엘지이노텍 주식회사 탭 테이프 및 그 제조방법
KR20180073349A (ko) * 2016-12-22 2018-07-02 엘지디스플레이 주식회사 유기 발광 표시 장치
CN110471258A (zh) * 2019-08-23 2019-11-19 江苏上达电子有限公司 一种cof基板的高精度制造方法
TWI713166B (zh) * 2020-02-17 2020-12-11 頎邦科技股份有限公司 晶片封裝構造及其電路板
CN111674065B (zh) * 2020-04-25 2022-03-22 东莞市朝京电子科技有限公司 载带成型免调试的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54147780A (en) * 1978-05-11 1979-11-19 Seiko Instr & Electronics Ltd Carrier tape
TW263596B (zh) * 1992-12-28 1995-11-21 Mitsui Mining & Smelting Co
JPH09186202A (ja) * 1995-10-30 1997-07-15 Mitsui Mining & Smelting Co Ltd Ｔａｂテープの製造方法およびｔａｂテープ用積層体
JP3487173B2 (ja) * 1997-05-26 2004-01-13 セイコーエプソン株式会社 Ｔａｂ用テープキャリア、集積回路装置及び電子機器
US6320135B1 (en) * 1999-02-03 2001-11-20 Casio Computer Co., Ltd. Flexible wiring substrate and its manufacturing method
JP4729823B2 (ja) * 2000-10-11 2011-07-20 パナソニック株式会社 キャリアテープの連結部材とそれを用いたキャリアテープの連結方法
JP2003059979A (ja) * 2001-08-20 2003-02-28 Mitsui Mining & Smelting Co Ltd 電子部品実装用積層フィルム及び電子部品実装用フィルムキャリアテープ

Also Published As

Publication number Publication date
KR100631331B1 (ko) 2006-10-04
CN1447423A (zh) 2003-10-08
CN100367490C (zh) 2008-02-06
JP2003282646A (ja) 2003-10-03
US20030178724A1 (en) 2003-09-25
KR20030077408A (ko) 2003-10-01
US6744123B2 (en) 2004-06-01
JP3750113B2 (ja) 2006-03-01
TW200306633A (en) 2003-11-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees