TWI255860B - High-mechanical strength copper alloy - Google Patents

High-mechanical strength copper alloy

Info

Publication number
TWI255860B
TWI255860B TW090123710A TW90123710A TWI255860B TW I255860 B TWI255860 B TW I255860B TW 090123710 A TW090123710 A TW 090123710A TW 90123710 A TW90123710 A TW 90123710A TW I255860 B TWI255860 B TW I255860B
Authority
TW
Taiwan
Prior art keywords
mass
mechanical strength
copper alloy
strength copper
crystal grain
Prior art date
Application number
TW090123710A
Other languages
English (en)
Inventor
Takayuki Usami
Takao Hirai
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of TWI255860B publication Critical patent/TWI255860B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
TW090123710A 2000-12-15 2001-09-26 High-mechanical strength copper alloy TWI255860B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000381863A JP3520046B2 (ja) 2000-12-15 2000-12-15 高強度銅合金

Publications (1)

Publication Number Publication Date
TWI255860B true TWI255860B (en) 2006-06-01

Family

ID=18849785

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090123710A TWI255860B (en) 2000-12-15 2001-09-26 High-mechanical strength copper alloy

Country Status (6)

Country Link
US (1) US6893514B2 (zh)
JP (1) JP3520046B2 (zh)
KR (1) KR100472650B1 (zh)
CN (1) CN1262679C (zh)
DE (1) DE10147968B4 (zh)
TW (1) TWI255860B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3520034B2 (ja) 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
US7090732B2 (en) 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
JP3520046B2 (ja) 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
JP4664584B2 (ja) * 2003-09-18 2011-04-06 株式会社神戸製鋼所 高強度銅合金板および高強度銅合金板の製造方法
DE112005000312B4 (de) * 2004-02-27 2009-05-20 The Furukawa Electric Co., Ltd. Kupferlegierung
JP3837140B2 (ja) * 2004-04-30 2006-10-25 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
JP3946709B2 (ja) * 2004-05-13 2007-07-18 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
JP4809602B2 (ja) * 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
CN101166840B (zh) * 2005-02-28 2012-07-18 古河电气工业株式会社 铜合金
WO2006109801A1 (ja) * 2005-04-12 2006-10-19 Sumitomo Metal Industries, Ltd. 銅合金およびその製造方法
KR100792653B1 (ko) * 2005-07-15 2008-01-09 닛코킨조쿠 가부시키가이샤 전기 전자기기용 동합금 및 그의 제조 방법
JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
JP2007169764A (ja) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The 銅合金
EP2426225B1 (en) 2006-05-26 2015-12-02 Kabushiki Kaisha Kobe Seiko Sho Copper alloy with high strength, high electrical conductivity, and excellent bendability
EP1967596B1 (en) * 2007-02-13 2010-06-16 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
US20080190523A1 (en) * 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
US8287669B2 (en) * 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
JP4851596B2 (ja) * 2007-11-01 2012-01-11 古河電気工業株式会社 銅合金材の製造方法
CN101939453A (zh) * 2008-02-08 2011-01-05 古河电气工业株式会社 电气电子零件用铜合金材料
JP4653240B2 (ja) * 2008-03-31 2011-03-16 古河電気工業株式会社 電気電子機器用銅合金材料および電気電子部品
EP2267173A4 (en) * 2008-03-31 2013-09-25 Furukawa Electric Co Ltd COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC DEVICES AND ELECTRICAL AND ELECTRONIC COMPONENTS
US9005521B2 (en) * 2010-04-02 2015-04-14 Jx Nippon Mining & Metals Corporation Cu—Ni—Si alloy for electronic material
WO2013018228A1 (ja) 2011-08-04 2013-02-07 株式会社神戸製鋼所 銅合金

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JP4308931B2 (ja) 1997-11-04 2009-08-05 三菱伸銅株式会社 ＳｎまたはＳｎ合金メッキ銅合金薄板およびその薄板で製造したコネクタ
JP3510469B2 (ja) 1998-01-30 2004-03-29 古河電気工業株式会社 導電性ばね用銅合金及びその製造方法
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JP3739214B2 (ja) 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
TW448235B (en) 1998-12-29 2001-08-01 Ind Tech Res Inst High-strength and high-conductivity Cu-(Ni, Co)-Si copper alloy for use in leadframes and method of making the same
JP3520034B2 (ja) 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
JP3520046B2 (ja) 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
US7090732B2 (en) 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy
JP3824884B2 (ja) 2001-05-17 2006-09-20 古河電気工業株式会社 端子ないしはコネクタ用銅合金材
JP2003094045A (ja) 2001-09-27 2003-04-02 Lapur:Kk 浄水器

Also Published As

Publication number Publication date
US6893514B2 (en) 2005-05-17
KR100472650B1 (ko) 2005-03-07
DE10147968B4 (de) 2005-08-18
DE10147968A1 (de) 2002-08-29
JP2002180161A (ja) 2002-06-26
US20020119071A1 (en) 2002-08-29
CN1358875A (zh) 2002-07-17
CN1262679C (zh) 2006-07-05
KR20020053702A (ko) 2002-07-05
JP3520046B2 (ja) 2004-04-19

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MM4A Annulment or lapse of patent due to non-payment of fees