TWI248585B - Contactless smart card with an antenna and a chip support made of fibrous material - Google Patents
Contactless smart card with an antenna and a chip support made of fibrous material Download PDFInfo
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- TWI248585B TWI248585B TW091112337A TW91112337A TWI248585B TW I248585 B TWI248585 B TW I248585B TW 091112337 A TW091112337 A TW 091112337A TW 91112337 A TW91112337 A TW 91112337A TW I248585 B TWI248585 B TW I248585B
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- antenna
- wafer
- contact
- support
- conductive ink
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Links
- 239000002657 fibrous material Substances 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 claims description 15
- 239000004033 plastic Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 60
- 239000000976 ink Substances 0.000 description 32
- 230000035882 stress Effects 0.000 description 12
- 238000003475 lamination Methods 0.000 description 3
- -1 PVE Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000008710 crystal-8 Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000004177 elastic tissue Anatomy 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009823 thermal lamination Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
Description
1248585 A7 ______B7_ --__ .五、發明說明(I ) '發明領域 本發明是關於一種智慧卡,特別是關於一種具有紙製 轉接器(adapter )的非接觸式智慧卡(contactless sma= card) 〇 發明背景 智慧卡的應用正逐漸的擴大。這些以銀行卡與電話卡 的形式而變得相當普遍的裝置,隨著新科技的發展以及非 接觸技術的出現,產生了很大的二次發展。目前已經確實 創造出新的應用,例如,在交通運輸方面,非接觸式智慧 卡已經發展成爲主要公共交通運輸系統及高速公路系統的 付款工具,而另一種以非接觸式智慧卡作爲付款工具的應 用爲電子錢包。許多公司也已經爲他們個人使用的非接觸 智慧卡發展出認證的機制。 非接觸式智慧卡與相關的讀卡機之間的資訊交換,係 藉由非接觸式智慧卡裡的天線以及讀卡機裡的第二天線之 間的電磁耦合。爲了硏發儲存以及處理資訊,故智慧卡設 置有非接觸式晶片或者非接觸式模組與天線相連接。天線 與晶片或者非接觸式模組一般係位於塑膠材料(例如PVE ,PET,PC)製作的非導電性支座上。天線的製作則是藉 由在支座上進行化學銅或鋁蝕刻,或者捲繞導體金屬線( 例如銅)。 智慧卡通常是單塊的,天線支座係插在兩層塑膠材料 層(例如PVE,PET,PC,ABS )之間,這兩層塑膠材料 4 f靖先閱讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) A7 1248585 五、發明說明(> ) (請先閲讀背面之注意事項再填寫本頁) 層係作爲卡片的上部與下部本體,然後施壓以熱疊層技術 使其黏接在一起。該非接觸式晶片與模組係藉由導電膠或 者能夠建立歐姆接觸的等效物連接至天線。 然而,這種智慧卡具有一些主要的缺點,最顯著的缺 點係在疊層過程中實施的塑膠熱黏接動作,造成整塊卡片 在吸收應力方面的機械特性不佳,當該智慧卡承受太大的 彎曲應力與/或扭曲應力時,所有的這些應力會傳送到非 接觸式晶片或者電子模組,而且主要會傳送到構成連接的 黏接點。黏接點承受極大的張力可能導致晶片與天線之間 的連接或者非接觸式模組與天線之間的連接斷裂,而且天 線也可能因爲這些機械應力而切斷。 傳統非接觸式智慧卡的另一項缺點爲成本價格。使用 經由化學蝕刻或者捲繞金屬線所獲得的天線需要花費高成 本價格,這並不利於這種工具的普及化。再者,使用非接 觸式電子模組也會增加成本價格。 爲了避免這些缺點,在法國專利第9915019號專利中 提出另一種製程,其包括在一纖維支座(例如紙)上使用導 電油墨印製天線,然後對於此天線支座進行熱處理使油墨 硬化。接下來的步驟包括連接晶片與天線,以及藉由熱壓 模塑技術使卡片本體連接天線支座的兩面,這個最後的步 驟是疊層步驟。 事實上’這種方法的缺點在於,在進行疊層步驟時, 晶片與天線接點膠合的硬度會導致組成天線的導電油墨斷 裂。因此,以脆弱的材料製作天線,天線與晶片之間的連 __ 5 本紙張尺度適用中國國家標準(CNS)A4規格(21〇 X 297公爱) 一""'— A7 1248585 五、發明說明()) 接有時候會被切斷,並且可能在任何時刻斷裂,特別是受 到外部應力作用時。 發明槪要 本發明的主要目的即在提供一種非接觸式智慧卡,能 夠改善習知技術的缺點,抵抗智慧卡在使用上相關的機械 應力,由於本發明使用的材料便宜,因此成本價格低。 本發明的另一目的係在提供一種非接觸式智慧卡,在 卡片進行疊層步驟時,天線與晶片之間的連接不會損壞。 本發明是關於一種非接觸式智慧卡,其中一天線係位 於一個以纖維材料製作的天線支座上,該天線包括至少一 圏的導電油墨以及兩個接點印製在該天線基座上,該智慧 卡的各個卡片本體係由至少一層塑膠材料製作,以及一具 有接點的晶片與該天線相連接;該智慧卡更包括一個以纖 維材料製作的晶片支座,該晶片支座上印製有兩條可聚合 的導電油墨帶’該兩條導電油墨帶係與該晶片的接點相連 接’該晶片支座係放置在該天線支座上,使得該導電油墨 帶與該天線接點接觸而與該天線接點相連接,該晶片係位 於該天線支座的空穴中,使得該晶片的堅硬部份沒有與該 天線接點或者該天線本身接觸。 本發明的再一目的係提出一種智慧卡的製造方法,包 括下列步驟: 在纖維材料製作的天線支座上,使用可聚合的導電油 墨印製天線及製作兩個天線接點,並且對於該天線支座進 _____ 6 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁)
A7 1248585 五、發明說明(~ ) 行熱處理以烘乾導電油墨; 於該天線支座形成一空穴; (請先閱讀背面之注意事項再填寫本頁) 製作一晶片支座,該晶片支座係以纖維材料製成,並 且在該晶片支座上印製兩條導電油墨帶; 使一晶片之接點接觸該晶片支座,使得該晶片接點接 觸該導電油墨帶; 將該晶片支座放置在該天線支座上,使得該導電油墨 帶與該天線接點相接觸,並且使得該晶片被置於該空穴中 :以及 使卡片本體疊合在該天線支座的兩側,包括藉由熱壓 模組技術在該天線支座的兩側熔接一層塑膠材料,完美地 使該晶片與該天線相連接。 圖式簡單說明 伴隨著圖式及以下的詳細說明,本發明的特點,目的 及功效將變得更爲明顯,其中: 第1圖顯示根據本發明之智慧卡天線支座的前視圖; 第2 a及第2 b圖顯示根據本發明之智慧卡晶片支座 的前視圖; 第3圖係第2圖所示之晶片支座沿A-A軸的剖視圖; 第4圖顯示天線支座承載晶片支座之縱向剖視圖;以 及 第5圖顯示根據本發明之智慧卡的縱向剖視圖。 元件符號說明 ____ 7 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) A7 1248585 _____ B7 五、發明說明($ ) 10 天線支座 12 天線 14 接點 16 接點 18 空穴 2 0 晶片支座 2 2 導電油墨帶 2 4 導電油墨帶 2 6 晶片 2 8 接點 3 0 接點 3 2 卡片本體 3 4 卡片本體 I --- (請先閱讀背面之注意事項再填寫本頁) -線 較佳實施例詳細說明 如第1圖所示,根據本發明之智慧卡包括一天線支座 1 0,天線支座1 0係由一種纖維材料製作,較佳者爲紙 。此支座上印製有天線1 2,天線1 2包括四個同心的圈 。天線1 2的端點形成天線接點i 4或1 6。夭線的這四 圏和天線接觸係使用一種可聚合的導電油墨製作。根據一 較佳貫施例,此油墨是一種環氧樹脂油墨摻雜導電材料, 例如銀’銅或者碳。天線支座上的空穴1 8係從天線支座 剪下來形成的,用來容納晶片。 第2 a圖及第2 b圖顯示晶片支座2 〇的前視圖。晶 _______8 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) A7 1248585 -------— B7___ 五、發明說明(b ) •裝--- (請先閱讀背面之注意事項再填寫本頁) 片支座2 0係由纖維材料製作,根據一較佳實施例,這種 纖維材料爲紙。在晶片支座2 〇上印製有兩條可聚合的導 電油墨2 2及2 4,根據一較佳實施例,此油墨是一種環 氧樹脂油墨ί爹雜導電材料,例如銀,銅或者碳。導電油墨 帶2 2與2 4可以是其他的形狀,但並不脫離本發明的範 圍。例如第2 b圖所示,導電油墨帶2 2與2 4可以是二 個梯形’其長邊與晶片支座2 〇的外緣並齊。這個梯形的 大表面區域會降低晶片支座放置於天線支座所需要的準確 度’因而能夠增加這個動作的生產速度,提高產出,降低 機器成本。一具有接點的晶片26位於支座2〇上。 第3圖顯示第2圖所示之晶片支座2 0沿著A-A軸的 縱向剖視圖。從圖中可以看出晶片2 6係連接至支座2 0 ’使得接點2 8與3 0與導電油墨帶2 2與2 4接觸。有 幾種方法可以被用來使晶片2 6連接至晶片支座2 0。
根據本發明的第一實施例,一旦放置晶片使得晶片的 接點2 8與3 0面向導電油墨帶2 2與2 4,便對晶片施 壓’使得晶片的接點造成晶片支座2 0與導電油墨帶2 2 與2 4變形。在壓力釋放之後,晶片支座2 〇與導電油墨 帶2 2與2 4維持變形後的形狀,使得晶片接點與導電油 墨帶之間獲得大接觸表面。 根據本發明的第二實施例,係以導電膠塗佈導電油墨 帶2 2與2 4,然後’將晶片2 6放置在晶片支座2 0, 使得晶片的接點2 8與3 0埋在導電膠裡,且面向導電油 墨帶2 2與2 4。 9 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) A7 1248585 五、發明說明(Ί ) 如第4圖所示,將經由上述方式獲得的晶片支座2〇 放置到天線支座1 〇,使得晶片2 6被包含在空穴1 8中 。導電油墨帶2 2與2 4接觸到天線接點1 4與16,晶 片2 6便與天線1 2相連接。當智慧卡製作完成時,晶片 2 6與天線1 2之間的連接並未藉由導電膠,這是最可靠 的。導電油墨帶2 2與2 4的長度使得晶片支座2 0在天 線支座10上面的縱向移動並不影響晶片與天線之間的連 接。一旦智慧卡製作完成,橫向的移動是不可能的。不過 ’爲了使技術更加的完美,並且改善其接觸,以及避免晶 片支座2 0移動,可以在導電油墨帶2 2與2 4以及天線 接觸14與16塗佈導電膠。 智慧卡製作完成後,其剖視圖係如第5圖所示。一層 塑膠材料疊合於天線支座1 〇的兩側,且天線晶座i 〇上 承載有晶片支座2 0因而形成卡片本體3 2與3 4。卡片 本體3 2與3 4以及天線支座1 〇之間的疊合較佳者係藉 由熱壓模塑技術。卡片本體所使用的材料可以是PVC, PET,PETG,PC,或者ABS。根據一較佳實施例,這些卡 片本體係以PVC製作。根據此實施例,各卡片本體只有一 層。然而,卡面本體亦可以是由幾層相同或者不同的塑膠 材料組成。 經由上述製程獲得的智慧卡具有良好的機械阻力,這 是因爲天線支座與晶片支座都是以相同非常有彈性的纖維 材料製作。相較於具有金屬模組的非接觸式智慧卡,根據 本發明之智慧卡其天線支座並不會受到機械應力影響而導 ___ 10 本紙張尺度^用中國國家標準(CNS)A4規格(210 X 297公釐) "^^ : ' (請先閱讀背面之注意事項再填寫本頁)
A7 1248585 五、發明說明(?) (請先閱讀背面之注意事項再填寫本頁) 致天線斷裂。在這個智慧卡中,唯一存在的應力點是晶片 本身的堅硬結構。然而,由於晶片的表面區域非常小,這 些應力也會很小。再者,當晶片放置在特定的晶片支座上 並且嵌入天線支座的空穴時,晶片並沒有直接與天線支座 接觸’因此並未接觸天線圏或者其接點,減少了在疊合動 作中天線接點或者天線本身產生的剪應力與機械應力。根 據本發明之智慧卡提供了絕佳的可靠性,其使用便宜的材 料能夠以很低的成本價格製作智慧卡。 _____ 11
本紙張尺度適用中國國家標準(CNS)A4 &格(210 X 297公iT
Claims (1)
- 六、申請專利範圍 1、 一種非接觸式智慧卡,其特點於一係位於一以纖 維材料製作的天線支座(1 〇)上之天線(1 2 ),且該 天線包括至少一圈的導電油墨以及兩個接點(1 4,丄6 )印製在該天線基座上,該智慧卡的各個卡片本體係由至 少一層塑膠材料製作,以及一具有接點(2 8,3 〇 )的 晶片(2 6 )與該天線相連接; 該智慧卡的特徵在於其包括一以纖維材料製作的晶片 支座(2 0 ),該晶片支座上印製有兩條可聚合的導電油 墨帶(2 2,2 4 ),該兩條導電油墨帶係與該晶片(2 6 )的接點(2 8,3 0 )相連接,該晶片支座(2 0 ) 係放置在該天線支座(1 〇 )上,使得該導電油墨帶(2 2 ’ 2 4 )與該天線接點(1 4,1 6 )接觸而與該天線 接點相連接,該晶片(2 6 )係位於該天線支座(1 〇 ) 的空穴(1 8 )中,使得該晶片的堅硬部份沒有與該天線 接點(1 4,1 6 )或者該天線(1 2)接觸。 2、 如申請專利範圍第1項所述之智慧卡,其中該晶 片與該導電油墨帶之間的連接係藉由將該晶片接點埋在該 導電油墨帶與在該晶片支座中。 3、 如申請專利範圍第1項所述之智慧卡,其中該晶 片與該導電油墨帶之間的連接係藉由一層塗在該晶片接點 與該導電油墨帶之間的導電膠而達成。 4、 如申請專利範圍前述中之任一項所述之智慧卡, 其中該纖維材料爲紙。 5、 如申請專利範圍第4項所述之智慧卡,其中該導 1 (請先閲讀背面之注意事項再塡寫本頁) 訂: 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297公釐) A8B8C8D8 fl248i8S| n 六、申請專利範圍 電油墨帶係藉由一層導電膠連接該天線接點。 6、 如申請專利範圍第4項所述之智慧卡,其中形成 該卡片本體的該塑膠材料係選自PVC,PET,PETG,PC 以及ABS所組成的群組中。 7、 如申請專利範圍第4項所述之智慧卡,其中該導 電油墨帶的材料係一環氧樹脂並摻雜有例如銀,銅或碳之 粒子之導電材料。 8、 一種製造智慧卡之方法,該方法包括下列步驟: 在纖維材料製作的天線支座(1 0 )上,使用可聚合 的導電油墨印製天線(1 2 )及製作兩個天線接點(1 4 ’ 1 6 ) ’並且對於該天線支座進行熱處理以烘乾導電油 靈, 從該天線支座(1 〇)剪開以形成一空穴(丨8); 製作一晶片支座,該晶片支座係以纖維材料(2 〇) 製成,並且在該晶片支座上印製兩條導電油墨帶(2 2, 2 4); 連接一晶片(2 6 )及在該晶片支座接點(2 8,3 0 )’使得該晶片接點(2 8,3 0 )接觸該導電油墨帶 (2 2,2 4 ); 將該晶片支座(2 0 )放置在該天線支座(i 〇 }上 ,使得該導電油墨帶與該天線(1 2 )之接點(丨4,丄 6 )相接觸,並且使得該晶片(2 6 )被置於該空穴(丄 8 )中,因而該晶片的堅硬部份並沒有接觸該天線(丄4 ,1 6 )接點或者該天線(1 2 );以及 2 (請先間讀背面之注意事項再填寫本頁) 訂: 適用中國國家標準(CNS)A4規格(210 X 297公釐) B8 C8 D8 、申請專利範圍 使卡片本體(3 2,3 4 )疊合在該天線支座(1 〇 )的兩側,包括藉由熱壓模組技術在該天線支座的兩側熔 接一層塑膠材料,完美地使該晶片(2 6 )與該天線(1 2)相連接。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)
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Publication number | Publication date |
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US6786419B2 (en) | 2004-09-07 |
KR101074439B1 (ko) | 2011-10-18 |
IL154106A (en) | 2007-03-08 |
FR2826154B1 (fr) | 2004-07-23 |
ES2256496T3 (es) | 2006-07-16 |
DK1399880T3 (da) | 2006-05-22 |
JP4339111B2 (ja) | 2009-10-07 |
WO2002103628A1 (fr) | 2002-12-27 |
EP1399880A1 (fr) | 2004-03-24 |
US20020190132A1 (en) | 2002-12-19 |
BR0205607A (pt) | 2003-06-10 |
IL154106A0 (en) | 2003-07-31 |
CA2418764A1 (fr) | 2002-12-27 |
DE60208796T2 (de) | 2006-11-02 |
KR20030025287A (ko) | 2003-03-28 |
HK1061294A1 (en) | 2004-09-10 |
ATE316272T1 (de) | 2006-02-15 |
CA2418764C (fr) | 2011-09-27 |
JP2004521429A (ja) | 2004-07-15 |
MXPA03001308A (es) | 2003-10-06 |
EP1399880B1 (fr) | 2006-01-18 |
CN1463413A (zh) | 2003-12-24 |
FR2826154A1 (fr) | 2002-12-20 |
DE60208796D1 (de) | 2006-04-06 |
CN1284113C (zh) | 2006-11-08 |
BRPI0205607B1 (pt) | 2015-09-08 |
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