CN1284113C - 带有纤维材料制成的天线底座和芯片底座的无接触智能卡 - Google Patents

带有纤维材料制成的天线底座和芯片底座的无接触智能卡 Download PDF

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CN1284113C
CN1284113C CNB028020715A CN02802071A CN1284113C CN 1284113 C CN1284113 C CN 1284113C CN B028020715 A CNB028020715 A CN B028020715A CN 02802071 A CN02802071 A CN 02802071A CN 1284113 C CN1284113 C CN 1284113C
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乔治斯·卡彦纳基斯
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item

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Abstract

本发明涉及一种无接触智能卡，其包括：一个位于纤维材料制成的天线底座(10)的天线(12)，该天线包括丝幕印刷在该天线底座上的匝以及二个触点(14，16)，该天线底座的每一面上的一个卡体(32，34)，以及一个带有触点(28，30)的和该天线连接的芯片(26)。该卡特征还在于一个用纤维材料制成的芯片底座(20)，后者(20)具有二个丝幕印刷在其上的并且与芯片(26)的触点(28，30)连接的导电条(22，24)，在该天线底座(10)上把芯片底座(20)定位成使这些导电条(22，24)和该天线的触点(14，16)接触并且与之连接而且使该芯片(26)位于一个腔(18)中，该腔是出于该目的在天线底座(10)中形成的。

Description

带有纤维材料制成的天线底座 和芯片底座的无接触智能卡
技术领域
本发明涉及智能卡领域，并且更具体地涉及一种具有纸制的适配器的无接触智能卡。
背景技术
智能卡业正在全面发展。这些以银行卡和电话卡的形式变成普及的工具随着新技术的发展以及随着无接触技术已经目击到显著的第二次增长。确实已经发明新的应用，例如，在运输部门中，已把无接触智能卡开发为一种用于公共运输系统以及高速公路系统的支付手段。电子钱包代表无接触作为支付手段的另一种应用。许多公司已经利用无接触智能卡开发用于它们的员工的识别工具。
无接触卡和相关读出器之间的信息交换是通过无接触卡容纳的天线和位于该读出器中的第二天线之间的远程电磁耦合实现的。为了形成、存储和处理信息，卡备有一个和该天线连接的无接触芯片或者电子模块。该天线和该芯片或无接触模块典型地位于一个由塑料材料(聚氯乙烯(PVC))、聚酯(PET)、聚碳酸酯(PC)…)制成的绝缘底座上。通过在该底座上的化学铜或铝蚀刻或者通过缠绕例如铜的金属导线得到该天线。
卡通常是整体的。天线底座插入到二层形成上、下卡体的塑料材料(PVC、PET、PC，丙烯腈-丁二烯-苯乙烯(ABC)，…)之间，然后加压下通过热层压法接合。通过实现欧姆接触的导电胶或等同物把该无接触芯片或模块连接到该天线。
但是，这种类型的卡具有几个主要缺点。最重要的缺点是，在该层压处理期间进行的塑料热结合操作导致一种应力吸收恢复上机械性能中等的单块卡。当该卡受到过大的弯曲和/或扭曲应力时，所有施加的应力传递到无接触芯片或电子模块上并且主要施加在造成连接的接合点上。这些接合节的机械强度受到可能造成芯片-天线或无接触模块-天线连接断开的大应变。作为这些机械应力的后果还可能切断天线。
传统无接触智能卡的另一个缺点是它的成本价格。采用通过化学蚀刻或者通过绕线金属线得到的天线是造成高成本价格的主要原因，这种高成本价格和这种类型的工具的广泛应用是非常矛盾的。另外，使用无接触电子模块也增加成本价格。
为了克服这些缺点，在法国9915019号专利中说明的另一种制造过程包括使用例如纸的纤维底座，其上利用导电墨水丝幕印刷的天线。接着该天线底座受到热处理以固化墨水。随后的步骤包括连接芯片和天线以及通过热压模制从两面上把各个卡体焊接到该天线底座上，该后一个步骤为层压步骤。
该方法遇到的缺点归因于芯片(其上把触点胶合到天线触点上从而建立连接)的刚性会导致裂缝，这些裂缝是在层压步骤期间于构成天线的导电墨水上形成的。后果是，芯片和天线之间的连接有时是断开的，在所有情况下是脆弱的，并且有可能在任何时候断裂，尤其当遇到外部应力时。
发明内容
从而本发明的第一个目的是通过提供一种耐得住与它的使用关联的机械应力并且由于使用便宜材料而成本价格低的无接触智能卡减轻这些缺点。
本发明的第二个目的是提供一种天线和芯片之间的连接在卡的层压工艺步骤期间不会脆化的无接触智能卡。
从而本发明涉及一种无接触智能卡，其特征为，一个位于纤维材料制成的天线底座上的天线，该天线包括至少一匝的导电墨水和二个丝幕印刷在该天线底座上的触点，用至少一层的塑料材料做成的每个卡体，以及一个带有和该天线连接的触点的芯片。该卡还包括一个用纤维材料制成的芯片底座，后者特征在于，二条丝幕印刷在该芯片底座上的并且其上和该芯片的触点相连接的可聚合化导电墨水，该芯片底座定位在该天线底座的上面从而这些可聚合化导电墨水条和天线的触点接触并连接它们，并且该芯片定位在一个为此目的形成的天线底座中的腔内从而该芯片的刚性部件不和天线的触点或天线本身接触。本发明的另一个用途是一种智能卡制造过程，其包括步骤：
-在用纤维材料制成的天线底座上制造一个包括利用可聚合化导电墨水印制的丝幕印刷匝组以及二个天线触点的天线并且使该天线底座受到热处理以烘烤并聚合化该导电墨水，
-通过切割该天线底座在该天线底座中形成一个腔，
-通过在一个纤维材料的底座上丝幕印刷二条可聚合化导电墨水制造纤维材料的芯片底座，
-根据该芯片底座上的各个触点连接一块芯片，从而该芯片的触点和这些可聚合化导电墨水条接触，
-在该天线底座上把该芯片底座定位成使这些可聚合化导电墨水条和该天线的触点组接触并且使该芯片位于该腔内，以及
-在该天线底座的每一面上层压卡体，其包括通过热压模制在该底座的每一面上焊接至少一层的塑料材料。
附图说明
在连带着各附图下从下面的说明本发明的用途、目的和特征会变得更加清楚，附图是：
图1是依据本发明的智能卡的天线底座的正视图。
图2a和2b是依据本发明的智能卡的芯片底座的正视图。
图3是沿图2中所示的芯片底座的轴A-A的剖面图。
图4是承载该芯片底座的天线底座的纵剖面图。
图5示出依据本发明的该智能卡的纵剖面图。
具体实施方式
如图1中所示，依据本发明的智能卡包括一个天线底座10。该底座10由纤维材料制成。该材料最好是纸。在该底座上丝幕印刷出天线12。该天线包括四个同心匝。天线12的各个端头形成一个天线触点14或16。这些匝以及这些天线触点是用可聚合化导电墨水做成的。依据一优选实施例，该墨水是掺着导电元素例如银、铜或碳的环氧墨水。通过切割在天线底座中形成一个腔18。该腔用来容纳芯片。
在图2a和2b中示出芯片底座20的前视图。该底座20是由纤维材料做成的。依据一优选实施例，该纤维材料是纸。在该底座20上丝幕印刷出二条可聚合化的导电墨水22和24。依据一优选实施例，该墨水是掺着导电元素例如银、铜或碳的环氧墨水。可聚合化墨水表面22和24可以为其它形状，这不背离本发明的范围。例如，如图2b中所示，表面22和24可以是二个长边和底座20的二个相对外沿毗连的梯形。这种梯形形状的大表面面积降低了把该芯片底座放在该天线底座上从而建立连接的操作的精度要求，并且从而提高该操作的生产程度而且获得产量提高和降低机器成本。带有若干触点的芯片定位在该底座20上。
图3表示图2中所示的芯片底座20沿轴A-A的纵剖面图。可以看出芯片26和底座20连接从而触点28和30和可聚合化的导电墨水条22和24接触。可以利用数种方法使芯片26和底座20连接。
依据第一实施例，一旦把芯片26定位成使触点28和30对着导电墨水条22和24时，对该芯片施压从而作为该压力的后果芯片的触点使芯片底座20以及可聚合化导电墨水条22、24变形。在撤掉该压力后，芯片底座20和可聚合化导电墨水条22、24保持它们的变形形状，从而能在芯片触点和导电墨水条之间得到大的接触面。
依据第二实施例，对可聚合化导电墨水条22和24涂以导电胶。接着，把芯片26定位在芯片底座20上从而使所述芯片的触点28和30埋在所述导电胶中并且对着可聚合化导电墨水条22和24。
这样得到的芯片底座20按照使芯片26容纳在腔18的方式定位在天线底座10上，如图4中所示。可聚合化导电墨水条22、24和天线触点14、16接触。从而芯片26和天线12连接。当完成该卡的加工时，该不用导电胶做成的连接是明确的。可聚合化导电墨水条22和24的长长度能在不影响芯片和天线之间的连接的要求下纵向地把芯片底座20放在天线底座10上。一旦完成卡的加工，横向移动是不可能的。尽管如此，为了完善技术并且改进接触和防止芯片底座20移动，可以在可聚合化导电墨水条22、24和天线的触点14、16之间施加一层导电胶。
图5中示出该智能卡在它的最终配置下的剖面图。在承载芯片底座20的天线底座10的每一面上压上一层塑料材料，从而形成卡体32和34。最好通过热压模制完成该层压。卡体所使用的塑料材料是聚氯乙烯(PVC)、聚酯(PET，PETG)、聚碳酸酯(PC)或丙烯腈-丁二烯-苯乙烯(ABC)。依据一优选实施例，这些卡体是用PVC制成的。依据该实施例，每个卡体由单层构成。但是，每个卡体可以由相同或不同的数层塑料材料构成。
由于天线底座和芯片底座都是用相同的非常韧性的纤维材料制成的这一事实，这样得到的智能卡提供出色的机械阻力。因此，和具有金属模块的无接触卡不同，它不向天线底座传递可能导致天线断开的机械应力。该卡中存在的唯一应力点是芯片本身，这归因于芯片的刚性结构。然而，由于芯片的表面积很小，这些应力也是小的。另外，由于芯片安放在专用芯片底座上并且置于在天线底座内形成的腔内，芯片不和天线底座直接接触，从而芯片不和天线的匝或触点接触，这减小了层压操作期间会在天线触点上或在天线本身上出现的机械应力以及尤其是剪应力。从而这种智能卡提供高可靠性，尽管它采用着能以非常低的成本价格生产卡的便宜材料。

Claims (8)

1.一种无接触智能卡，其特征为，一个位于用纤维材料制成的天线底座(10)上的天线(12)，所述天线包括至少一个导电墨水匝和两个丝幕印刷在所述天线底座上的天线触点(14，16)，在所述天线底座每一侧的卡体(32，34)，所述卡体由至少一层的塑料材料构成，以及一个带有和该天线连接的触点(28，30)的芯片(26)，
所述卡特征在于还包括一个由纤维材料制成的芯片底座(20)，所述芯片底座(20)上包括两条丝幕印刷在其上的并且该芯片(26)的所述触点(28，30)与之连接的可聚合化导电墨水条(22，24)，所述芯片底座(20)定位在所述天线底座(10)上，所述可聚合化导电墨水条(22，24)和所述天线触点(14，16)接触并且与后者连接，使所述芯片(26)定位于所述天线底座(10)中为此目的而形成的一个腔(18)中，从而芯片的刚性部分不和所述天线触点(14，16)或所述天线(12)接触。
2.依据权利要求1的智能卡，其中通过把所述芯片触点埋在所述导电墨水条中以及所述芯片底座中达到该芯片和可聚合化导电墨水条的连接。
3.依据权利要求1的智能卡，其中通过一层位于芯片的各触点和所述可聚合化导电墨水条之间的导电胶得到该芯片和可聚合化导电墨水条的连接。
4.依据上述任一权利要求的智能卡，其中所述纤维材料是纸。
5.依据权利要求4的智能卡，其中通过一层导电胶使所述可聚合化导电墨水条和天线的各触点连接。
6.依据权利要求4的智能卡，其中形成卡体的塑料材料为聚氯乙烯(PVC)、聚酯(PET、PETG)、聚碳酸酯(PC)或丙烯腈-丁二烯-苯乙烯(ABC)。
7.依据权利要求4的智能卡，其中所述可聚合化的导电墨水是掺着包括银、铜或碳的颗粒的导电成分的环氧墨水。
8.一种依据权利要求1至7中任一权利要求的智能卡的制造方法，包括步骤：
-在用纤维材料制成的天线底座(10)上制造一个包括利用可聚合化导电墨水印制的丝幕印刷匝组以及二个天线触点(14，16)的天线(12)并且使该天线底座受到热处理以烘烤和聚合化该导电墨水，
-通过切割该天线底座在该天线底座(10)中形成一个腔(18)，
-通过在一个纤维材料的底座上丝幕印刷二条可聚合化导电墨水(22，24)制造纤维材料的芯片底座(20)，
-根据所述芯片底座上的各个触点(28，30)连接一块芯片(26)，从而所述触点(28 30)和这些可聚合化导电墨水条(22，24)接触，
-在该天线底座(10)上把芯片底座(20)定位成使所述可聚合化导电墨水条和天线(12)的所述触点(14，16)接触并且使所述芯片(26)位于该腔(18)中，从而该芯片的刚性部件都不和所述天线触点(14，16)或所述天线(12)接触，以及
-在所速天线底座(10)的每一面上层压卡体(32，34)，包括通过热压模制把塑料材料层焊接到所述底座的每一面上，以便完全连接所述芯片(26)和天线(12)。
CNB028020715A 2001-06-14 2002-06-12 带有纤维材料制成的天线底座和芯片底座的无接触智能卡 Expired - Fee Related CN1284113C (zh)

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