CN101052978A - 具有无接触式rfid芯片的标识文件 - Google Patents

具有无接触式rfid芯片的标识文件 Download PDF

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CN101052978A
CN101052978A CNA200580037871XA CN200580037871A CN101052978A CN 101052978 A CN101052978 A CN 101052978A CN A200580037871X A CNA200580037871X A CN A200580037871XA CN 200580037871 A CN200580037871 A CN 200580037871A CN 101052978 A CN101052978 A CN 101052978A
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rfid chip
identification document
chip
page
extra play
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沃克·蒂姆
金·源
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Koninklijke Philips NV
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Koninklijke Philips Electronics NV
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

本文提供了一个类似于护照的标识文件，在该文件的某一页面上至少集成有一个无接触式RFID芯片(10)和连接到芯片(10)上的天线(12)，在无接触式RFID芯片的周围区域内有一个额外层(22)，该层用来自动地保护芯片(10)，该设计使得RFID芯片能经受住年久磨损。

Description

具有无接触式RFID芯片的标识文件
技术领域
本发明涉及一种标识文件，这种标识文件中包含有一个如权利要求1的前序部分所定义的无接触式RFID芯片，其中特别的，标识文件是护照。
背景技术
新一代护照将包括存储在RFID芯片上的生物统计数据，其中RFID芯片集成在文件中。可以通过扫描护照并读取芯片上的信息来执行护照控制(例如，在边境处)。因为读取芯片上的信息只需要几秒钟，所以很快就能标识护照持有者的身份。在这方面，所要研究的是如何让这种嵌有芯片和天线的护照可以经受住盖章、折叠等负荷长达10多年之久。
已有技术已知芯片卡(例如，多媒体卡或者智能卡)的稳固性设计。这种卡具有由合成材料和结合半导体芯片制成的卡主体。
US5,544,014描述了一种在卡主体内的微型芯片，其中微型芯片的边缘逐渐变薄。通过减少厚度可以获得增强的耐用性，也能够经受较强的负荷。
WO03/058713描述了一种在芯片载体中固定微型芯片的机制。芯片载体的外侧固定边缘由附加层保护。在一个优选实施例中，此保护的内边缘呈弯曲状或锯齿状而非直线型。这就使得在芯片载体的受保护区域和内侧区域之间的转变区减少断裂的灵敏度。
另外，已有技术公开了一种方法，其中在至少一层开孔时，智能卡不同层之间的连接的稳定性增强。例如，这种方法可从JP200231615和JP200221609获知。
US2003/0,132,302描述了一个芯片后部带有较小的金属板(从芯片顶部看)的无接触式RFID存储卡，金属板以机械方式增强了芯片的外围部分并防止其受到毁坏。
一般来说嵌入在基层主体上的芯片卡的微型芯片其自身比要嵌入的材料的刚性要高。普通芯片卡由合成材料制成(如ISO7816，ISO14443)，这一机械载体具有合成材料卡的整个尺寸，并包括用于无接触式操作的天线和微型芯片两者。合成材料卡的机械刚性很高，所以，微芯片很难被弯折，并因而不容易被折断。
比较而言，新一代护照或标识卡既不具备如同ISO7816和ISO14443的合成材料卡形式，也不具备机械刚性。如果不采取其它的方法，而对弯曲强度有严格要求，那么即使是非常薄的基层的微型芯片，将不会经受长时间的应力。用于制造微型芯片的半导体材料例如硅是非常脆的，因此，更容易折断并不能承受符合弯曲负荷。
发明内容
本发明的目标之一就是提供一种结构，其中RFID芯片能经受住年久的磨损。根据本发明，此目标是通过权利要求1的特征部分所述的标识文件来实现的。在此标识文件的一页页面上至少设置有一个无接触式RFID芯片和由焊线连接到RFID芯片上的天线。由于在页面上的RFID芯片区内设置了以机械方式增强RFID芯片的附加层，从而，有利地，可以获得受到免于断裂的保护的基本的芯片材料。
根本发明的一优选实施例，附加的增强层由例如不锈钢之类的不锈材料制成。从而允许长时间使用而不会改变该层的机械条件。可以以非常薄的尺寸形成不锈钢板(V2A)。适用于制造附加层的防腐材料是V2A，V4A，Gfk或碳化纤维。由于机械增强层由高热容量的材料制成，所以可以获得当操作RFID芯片时产生的热被传导的优点。由此，RFID芯片的使用寿命更长。
根据本发明的另一优选实施例，附加的增强层具有弯曲状或锯齿状的外边缘。从而可以确保具有均匀的厚度，该层的刚性逐渐从中部向外边缘降低，而芯片的中部得到了支撑。在机械应力的情况下，即，当力作用于附加层的外边缘时，文件的页面弯曲，而曲率在中部变小并能够向着边缘方向逐渐增加。因此，较小的应力施加在芯片上，即不会趋于断裂也不会被挤压到嵌入材料中(必然会产生断裂)。
一种上述结构的简单实现方式在于使得附加的增强层开孔。用于连接两层的粘合剂可以通过这些小孔，从而保证了附加的增强层的较强的粘合以及在芯片的基本主体上外部连接覆盖片的较强的粘合。
附图说明
图1示出了在一个由合成材料制成的已知卡上RFID芯片和天线的结构。
 图2示出了在没有弯曲力作用下时机械增强RFID芯片的RFID芯片以及层的结构。
图3示出了在有弯曲力作用下时机械增强RFID芯片的RFID芯片以及层的结构。
图4示出了自机械增强层的一种几何形状。
图5示出了机械增强层的另一种几何形状。
图6示出了含有大量小孔的机械增强层。
具体实施方式
图1示出了已有技术的RFID系统的结构。RFID芯片10和内侧线圈12(作为天线)通过焊线14和16实现互相连接。该系统设置在由合成材料制成的芯片卡主体18上。因为合成材料本身具有相对较高的刚性，所以可以保护RFID芯片免于断裂。但是，与首先提到的情况相比，当RFID芯片嵌入在标识文件中时，载体材料的刚性实际上非常低。这样就产生了本发明所考虑的问题。
图2示出了在没有弯曲力作用下RFID芯片的机械保护的设计。再次，通过焊线14和16互相连接的RFID芯片10和天线设置在模块主体20上，模块主体由合成材料制成并且比用于普通智能卡的材料柔软。机械增强层22设置在面向RFID芯片的标识文件的页面一侧。具体地，图2所示的结构由设置在顶部和底部的附加保护层围绕。没有机械增强层22，则将实际上选择较高的模块主体20的刚性，不利之处在于后续的层可能脱落。在这种分层的情况下，将会在嵌入的RFID芯片的表面上产生剪切力，这种力将会损坏到天线和RFID芯片10自身的连接14和16。
图3示出了在有弯曲力P24的作用下相同的结构。标识文件的页面全部用数字100来表示。通过保持机械装置26考虑将页面固定在RFID芯片10中部区域。由于机械增强层22的刚性从RFID芯片10的中部到层22的边缘处逐渐减弱，曲率半径从内侧到外侧逐渐增加，所以使得RFID芯片10的面积内的各个区域相对偏离度为最小，因而芯片被损坏的可能性就降到了最低。
图4示出了机械增强层22的一种可能的几何图形，该层22具有适当行为。机械增强层外边缘30弯曲，圆角具有最大的曲率半径，从而防止机械增强层22被挤入到模块主体20的嵌入材料中。图4示出了基本形状为矩形的增强层。然而，可选的，增强层也可以是圆形，如图5所示。
图6示出了包含有多个小孔32的机械增强层22。通过下列方法可以获得该机械增强层22：采用合适的粘合剂设置械增强层22，使其更牢固地与外围层粘合，即，与模块主体20和包封材料粘合。粘合剂通过小孔32并与周围材料连接，从而防止层脱落。这种设置使得带有上述后果的层脱落发生的风险最小。

Claims (6)

1.一种标识文件，特别是护照，其中至少一个无接触式RFID芯片(10)和连接到芯片上的天线(12)集成在标识文件的页面上；其中，以机械方式增强RFID芯片的附加层(22)位于页面上的RFID芯片(10)的区域上。
2.如权利要求1所述的标识文件，其中，以机械方式增强RFID芯片(10)的附加层(22)设置在标识文件页面的正面。
3.如前述任一权利要求所述的标识文件，其中，以机械方式增强RFID芯片(10)的附加层(22)由例如不锈钢板的防腐材料制成。
4.如前述任一权利要求所述的标识文件，其中，以机械方式增强RFID芯片(10)的附加层(22)的刚性从中部向边缘逐渐降低。
5.如前述任一权利要求所述的标识文件，其中，以机械方式增强RFID芯片(10)的附加层(22)具有弯曲状或锯齿状的外边缘。
6.如前述任一权利要求所述的标识文件，其中，多个小孔(32)已经从以机械方式增强RFID芯片(10)的附加层(22)穿孔。
CNA200580037871XA 2004-09-02 2005-08-30 具有无接触式rfid芯片的标识文件 Pending CN101052978A (zh)

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EP04104216 2004-09-02
EP04104216.9 2004-09-02

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US (1) US9152902B2 (zh)
EP (1) EP1789915B8 (zh)
JP (1) JP2008511893A (zh)
CN (1) CN101052978A (zh)
AT (1) ATE469403T1 (zh)
DE (1) DE602005021515D1 (zh)
WO (1) WO2006025017A1 (zh)

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FR2916558B1 (fr) * 2007-05-21 2010-03-12 Fasver Vignette adhesive souple de securite dotee d'au moins un microcircuit sans contact pour document officiel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109906167A (zh) * 2017-07-13 2019-06-18 康达提斯-瓦普弗勒有限公司 用于识别滑动触点的磨损的设备和方法和滑接导线系统
US11652386B2 (en) 2017-07-13 2023-05-16 Conductix-Wampfler Gmbh Device and method for the detection of wear on a sliding contact and brushgear system

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EP1789915B8 (en) 2010-07-14
US9152902B2 (en) 2015-10-06
ATE469403T1 (de) 2010-06-15
EP1789915A1 (en) 2007-05-30
US20080218308A1 (en) 2008-09-11
EP1789915B1 (en) 2010-05-26
WO2006025017A1 (en) 2006-03-09
JP2008511893A (ja) 2008-04-17
DE602005021515D1 (de) 2010-07-08

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