JP2008511893A - 非接触ｒｆｉｄチップを有する身分証明書 - Google Patents

非接触ｒｆｉｄチップを有する身分証明書 Download PDF

Info

Publication number
JP2008511893A
JP2008511893A JP2007529116A JP2007529116A JP2008511893A JP 2008511893 A JP2008511893 A JP 2008511893A JP 2007529116 A JP2007529116 A JP 2007529116A JP 2007529116 A JP2007529116 A JP 2007529116A JP 2008511893 A JP2008511893 A JP 2008511893A
Authority
JP
Japan
Prior art keywords
rfid chip
identification card
chip
layer
page
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007529116A
Other languages
English (en)
Japanese (ja)
Inventor
フォルカー、ティム
キム、ギュエン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2008511893A publication Critical patent/JP2008511893A/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Adornments (AREA)
JP2007529116A 2004-09-02 2005-08-30 非接触ｒｆｉｄチップを有する身分証明書 Withdrawn JP2008511893A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04104216 2004-09-02
PCT/IB2005/052830 WO2006025017A1 (en) 2004-09-02 2005-08-30 Identification document with a contactless rfid chip

Publications (1)

Publication Number Publication Date
JP2008511893A true JP2008511893A (ja) 2008-04-17

Family

ID=35457523

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007529116A Withdrawn JP2008511893A (ja) 2004-09-02 2005-08-30 非接触ｒｆｉｄチップを有する身分証明書

Country Status (7)

Country Link
US (1) US9152902B2 (zh)
EP (1) EP1789915B8 (zh)
JP (1) JP2008511893A (zh)
CN (1) CN101052978A (zh)
AT (1) ATE469403T1 (zh)
DE (1) DE602005021515D1 (zh)
WO (1) WO2006025017A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012078983A (ja) * 2010-09-30 2012-04-19 Toppan Printing Co Ltd 高強度ｉｃカード
JP2014032510A (ja) * 2012-08-02 2014-02-20 Dainippon Printing Co Ltd 非接触及び接触共用ｉｃカード、非接触及び接触共用ｉｃカードの製造方法
US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
US11056350B2 (en) 2014-04-22 2021-07-06 Applied Materials, Inc. Retaining ring having inner surfaces with facets

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9152902B2 (en) * 2004-09-02 2015-10-06 Nxp, B.V. Identification document with a contactless RFID chip
JP4382783B2 (ja) * 2006-08-09 2009-12-16 富士通株式会社 Ｒｆｉｄタグ
JP5006916B2 (ja) * 2009-08-26 2012-08-22 富士通株式会社 Ｒｆｉｄタグ
US20140138443A1 (en) * 2012-11-21 2014-05-22 Black Card Llc Transaction card
DE102017115744A1 (de) * 2017-07-13 2019-01-17 Conductix-Wampfler Gmbh Vorrichtung und Verfahren zur Erkennung des Verschleißes eines Schleifkontaktes und Schleifleitungssystem

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4578279A (en) * 1981-05-26 1986-03-25 International Business Machines Corporation Inspection of multilayer ceramic circuit modules by electrical inspection of unfired green sheets
JPS60208289A (ja) * 1984-03-31 1985-10-19 Dainippon Printing Co Ltd 光記録材料
US4671255A (en) * 1985-10-16 1987-06-09 Mcghan Medical Corporation Tissue expander with self-contained injection reservoir and reinforcing insert
GB9011457D0 (en) * 1990-05-22 1990-07-11 Amblehurst Ltd Tamper indicating security tape
DE69314466T2 (de) * 1992-08-12 1998-05-07 Oki Electric Ind Co Ltd Chip-Karte
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
US6268237B1 (en) * 1995-04-03 2001-07-31 Aptek Industries, Inc. Stress-free silicon wafer and a die or chip made therefrom and method
US5898370A (en) * 1997-12-16 1999-04-27 At&T Corp Security monitoring system and method
US6114962A (en) * 1998-10-15 2000-09-05 Intermec Ip Corp. RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto
US7306158B2 (en) * 2001-07-10 2007-12-11 American Express Travel Related Services Company, Inc. Clear contactless card
CA2405143A1 (en) * 2000-04-07 2001-10-18 The Chief Controller, Research And Development Transmit/receiver module for active phased array antenna
JP4575559B2 (ja) 2000-07-13 2010-11-04 エフアイエス株式会社 ケトン感応素子
DE10054873C2 (de) * 2000-11-06 2002-10-17 Mada Marx Datentechnik Gmbh Kontaktlose Chipkarte und Verfahren zur Herstellung einer solchen Chipkarte
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
JP4736191B2 (ja) * 2001-01-22 2011-07-27 大日本印刷株式会社 Ｉｃカードとその製造方法
DE10109327A1 (de) * 2001-02-27 2002-09-12 Infineon Technologies Ag Halbleiterchip und Herstellungsverfahren für ein Gehäuse
US20030211246A1 (en) * 2001-05-11 2003-11-13 Kydd Paul H. Additive electronic circuits on thermally unstable substrates
FR2826154B1 (fr) * 2001-06-14 2004-07-23 A S K Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux
JP2003108958A (ja) * 2001-09-28 2003-04-11 Konica Corp Ｉｃカード及びｉｃカードの製造方法
CA2652104C (en) * 2001-12-24 2012-02-14 Digimarc Id Systems, Llc Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same
DE10200382B4 (de) 2002-01-08 2006-05-04 Infineon Technologies Ag Chipmodul für Chipkarten
US20050072849A1 (en) * 2003-09-03 2005-04-07 Jones Robert L. Identification document with optical memory and related method of manufacture
US9152902B2 (en) * 2004-09-02 2015-10-06 Nxp, B.V. Identification document with a contactless RFID chip
FR2916558B1 (fr) * 2007-05-21 2010-03-12 Fasver Vignette adhesive souple de securite dotee d'au moins un microcircuit sans contact pour document officiel

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012078983A (ja) * 2010-09-30 2012-04-19 Toppan Printing Co Ltd 高強度ｉｃカード
JP2014032510A (ja) * 2012-08-02 2014-02-20 Dainippon Printing Co Ltd 非接触及び接触共用ｉｃカード、非接触及び接触共用ｉｃカードの製造方法
US11056350B2 (en) 2014-04-22 2021-07-06 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US11682561B2 (en) 2014-04-22 2023-06-20 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
US11453099B2 (en) 2015-05-29 2022-09-27 Applied Materials, Inc. Retaining ring having inner surfaces with features

Also Published As

Publication number Publication date
WO2006025017A1 (en) 2006-03-09
EP1789915A1 (en) 2007-05-30
ATE469403T1 (de) 2010-06-15
DE602005021515D1 (de) 2010-07-08
US9152902B2 (en) 2015-10-06
EP1789915B8 (en) 2010-07-14
EP1789915B1 (en) 2010-05-26
CN101052978A (zh) 2007-10-10
US20080218308A1 (en) 2008-09-11

Similar Documents

Publication Publication Date Title
JP2008511893A (ja) 非接触ｒｆｉｄチップを有する身分証明書
TWI338260B (en) Rfid tag
US5682295A (en) Plastic integrated circuit card with reinforcement structure separated from integrated circuit module by card
JP3781196B2 (ja) チップカード
JP4750450B2 (ja) Ｒｆｉｄタグ
KR100927881B1 (ko) 향상된 전자적 모듈 강도를 구비한 비접촉식 또는 복합접촉-비접촉 스마트 카드
WO2006005985A1 (en) Contactless identification device
US7364088B2 (en) Radio frequency identification tag
US8640961B2 (en) Transponder inlay with antenna breaking layer for a document for personal identification, and a method for producing a transponder inlay
KR100723904B1 (ko) Ｒｆｉｄ 태그 및 ｒｆｉｄ 태그 제조 방법
JP2006236081A (ja) 非接触ｉｃタグと非接触ｉｃタグの装着方法
JP4845179B2 (ja) Ｉｃチップの補強板および用紙
JP2012043341A (ja) Ｉｃモジュールおよびそれを用いたｉｃカード
JP2005519357A (ja) トランスポンダーラベル
JP2007249399A (ja) 捺印システム
JP2003187201A (ja) Ｒｆ−ｉｄメディア
JP2008234246A (ja) 非接触式ｉｃカード
US20230409865A1 (en) Inlay for electronic document, method for producing an electronic document comprising such an inlay, and electronic document obtained
JP5556550B2 (ja) 高強度ｉｃカード
JP4440677B2 (ja) 非接触情報媒体
JP2007230641A (ja) 非接触ｉｃタグ付き容器
JP2009277255A (ja) Ｒｆｉｄタグ
JP5040101B2 (ja) Ｒｆ−ｉｄタグ用ｉｃチップ実装スレッド付き偽造防止媒体およびその製造方法
JP2007300121A (ja) チップモジュール、チップカード、および、それらの製造方法
JP2004062568A (ja) コンビネーションｉｃカード

Legal Events

Date Code Title Description
A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A711

Effective date: 20080529

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080829

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20091105