CN1211759C - 制造带有纸天线支座的无接触智能卡的方法 - Google Patents

制造带有纸天线支座的无接触智能卡的方法 Download PDF

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CN1211759C
CN1211759C CNB008031932A CN00803193A CN1211759C CN 1211759 C CN1211759 C CN 1211759C CN B008031932 A CNB008031932 A CN B008031932A CN 00803193 A CN00803193 A CN 00803193A CN 1211759 C CN1211759 C CN 1211759C
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乔治斯·卡耐基斯
克里斯托弗·马蒂厄
塞贝斯廷·德里奈
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Abstract

本发明涉及无接触智能卡的制造方法,更具体地说,涉及其天线是在由像纸这样的纤维材料制成的支座上的无接触智能卡的制造方法。所述方法包括通过丝网印刷将天线产生在支座上的步骤;利用导电粘合剂将芯片的触点粘在天线支座上的步骤,以及通过热压法将卡体元件层压在天线支座上的步骤。在层压步骤之前在天线支座各个角上做出切口使卡体元件能结合在一起。这样所得到的卡可在视觉上观察到它曾经受到的有害的机械应力(极端的折弯)。

Description

制造带有纸天线支座的无接触智能卡的方法
技术领域
本发明涉及智能卡的制造方法,更具体地说,涉及无接触智能卡的制造方法,它的天线是在由纸这样的纤维材料制成的支座上的。
背景技术
无接触智能卡是在各部门中使用日益增长的一种系统。在运输部门,卡被开发成为一种支付手段。电子钱包的情况也是这样。许多公司也为它们的人员使用无接触智能卡开发了识别装置。
在无接触卡和读出器之间的信息交换是通过在嵌入无接触卡中的天线和读出器中的第二天线之间的远程电磁耦合而实现的。为了要建立、存储和处理信息,卡上装着芯片或电子模件并与天线相连接。天线和芯片通常都位于由塑料制成的介电支座上。这些部件的标准的工业化制造方法可以分解成三个步骤:
-在塑料电介质支座〔聚氯乙烯(PVC)、聚酯(PET)、聚碳酸酯(PC)...〕上利用铜或铝的蚀刻技术制造天线;
-利用导电墨水或导电树脂或导电聚合物将芯片的接触片和天线的接触片连接,这通常被称这“倒装式芯片”模片接合技术;
-在压力下将卡体的上部和下部塑料层〔PVC、PET、PC、丙烯腈-丁二烯-苯乙烯(ABS)...〕热层压到天线支座上以便建立一张单体卡。
但是,这一过程产生几个主要缺点。这个过程导致具有不同的热膨胀系数的塑料材料胶合或热结合在一起成为一种复合的叠层。因此,出现了系统的不可接受和不可连续的卡的变形(扭转、弯曲),同时在受到标准化或等价的测试时缺乏机械的耐受性。
此外,PVC表现出差的热机械性质。在层压过程中,材料的流动是明显的因而天线的形状系数不能保持。这导致天线的不正常工作,因为电气参数(电感和电阻)发生了变化。在受到强烈的剪切应力的区域天线断裂的经历是常见的。这种情况特别出现在转角处和电气跨接点。
叠层的ISO卡的总体厚度是780和840μm。考虑到上面所说的材料的流动,要在卡的总体上向顾客保证有限且受控的分布也是非常困难的。
在层压操作期间所用的塑料热结合过程建立了一种在标准化的折弯和扭曲测试中所吸收的应力的复原方面具有差的机械性能的单体卡,所有施加的应力都传递到芯片而且主要是加到构成连接的结合点上。结合点的机械强度会受到很大的应变,因此芯片模片对天线的结合操作的(“倒装式芯片”模片接合技术)最轻微的不完善也会导致芯片和天线电气连接的断裂。
在层压后,在印制的卡体上铜的蚀刻所造成的痕迹是可见的。这虽然并不妨碍卡的正确工作,但这一缺陷常被用户所强调,因为他们对美学准则是非常在乎的。
此外,用这样的过程来制造卡的成本对于要使卡的使用能有实质性的增长而言是太高了。
最后,目前所用的方法不能产生具有这样可能性的卡,即要能观察到由用户强加在它们身上的机械方面的恶劣对待,特别是为了欺诈的目的。实际上对某些具有用卡来欺诈经验的人来说可以较容易地通过重复地将卡折弯而使它毁坏,而在以后又不能那么容易证明任何出于恶意的意图。例如,天线可以被切断而不会使卡留下记号。在公司内设立的商业政策通常都保证免费更换有毛病的卡。系统地替换这些卡是这些公司主要的附加成本的源头。
发明内容
本发明的目标是通过提供一种所发明的制造方法来减轻这些缺点,它使用一种纤维材料制成的支座,天线就用导电墨水以丝网印刷在支座上,从而明显地降低混杂型或无接触智能卡的生产成本。
因此本发明涉及一种制造无接触智能卡的方法,包括通过在一个支座上进行丝网印刷来制造一个天线、在所述支座上粘结一个芯片,以及在所述天线的支座上层压卡体,其特征在于所述方法包括下列步骤:一个天线制造步骤,包括在纸制成的支座上丝网印刷导电聚合物墨水的圈,并对所述支座进行热处理以烘干所述墨水,一个粘结步骤,使用导电粘合剂把所述芯片粘合到所述天线的粘结片上,一个通过热压成型过程把卡体层压在天线支座上的步骤,其中包括将所述支座的每一侧面结合到形成所述卡体的至少两片具有不同刚度的塑料片上,以及其中在天线的制造步骤中,纸的天线支架的各角是切成缺口的以便使所述两个卡体被结合在一起,这样得到的上述卡提供了一个优先的脱开区,该脱开区用于在事后揭示任何故意损坏卡的行为。
附图说明
本发明的目的、对象和特性从下面的说明并在结合附图将会变得更清楚,在这些图中:
图1A到1C表示在支座上丝网印刷天线时所用的各步骤。
图2表示在层压步骤之前带有丝网印刷的天线的支座。
图3表示在制造方法结束时的智能卡。
图4是图3所示的智能卡沿曲线A-A的截面图。
具体实施方式
按照本发明的智能卡制造方法最初包括将天线放在支座上。这个支座是由一片纤维材料例如纸制成的。按照制造方法的优选实施例,天线以几个步骤丝网印刷在这一材料上。第一步如图1A所示,包括丝网印刷天线的两圈10和12和两个粘结片14和16。第二步由图1B表示,包括丝网印刷一个绝缘条以便使圈10和12互相重叠而没有电的接触。第三步由图1C表示,包括丝网印刷一个电桥20以连接圈10和粘结片14。
一旦天线丝网印刷到支座上以后,支座就被切割成卡的尺寸。按照优选实施例,支座的每一个角都做成一个缺口22,如图2所示。这一缺口使得在层压过程中能让卡体之间直接结合。
层压由热压成型实现。按照优选实施例,每一卡体使用两层塑料材料。这种塑料材料通常是聚氯乙烯(PVC)、聚酯(PET、PETG)、聚碳酸酯(PC)、或丙烯腈-丁二烯-苯乙烯(ABS)。按照优选实施例,使用了PVC。这两层有不同的刚度。外层用坚硬的PVC制成而内层(与天线支座相接触的层)则用具有较低维卡氏(Vicat)软化温度(这是PVC从空硬状态转移到橡胶状态的温度)的软PVC制成。这两层也可以有不同的厚度。例如每一卡体包括一个外部的坚硬PVC层、其厚度约为310微米(μm),以及一个内部软PVC层,其厚度约为80μm。天线支座由厚度约为125μm的纸制成。按照另一个制造实例,这是个优选实施例,卡体的每一个都包括三层。一个表层由透明的PVC片或清漆层构成,这一层在卡体的外部层被印刷在外表层上以便保护该印刷内容。这个表层约40μm厚。这样,卡体的外部层的厚度是275μm,而内部层厚度约为40μm。
层压步骤包括把形成卡体的各个PVC层和天线支座叠在一起。这个夹层然后放到一个层压用的叠压机中。这个夹层在大于100℃最好大于150℃的温度下进行热处理。与此同时,这个夹层受压以便使各层熔融在一起。在热和压力的共同作用下,外部PVC层软化而由较低的维卡氏(Vicat)软化温度的PVC制成的内部层则液化。液化的PVC将丝网印刷的天线墨水陷入到卡体的材质之内,从而使它提高了耐受在智能卡的使用期间所遭到的机械应力的能力。此外,天线将更好地粘在卡体上。这种粘合通过使用放在卡体和天线之间压敏双面带而更加提高。
在天线支座的角上所作的缺口22可以让两个内部PVC层相互接触。通过将两个卡体结合在一块而使各个角封闭,所有的机械应力都导向卡的内部。在纸的情况下,纸浆表现出低的内部粘着力。当它受到剪切力时,纸的内芯趋于脱开。如果这些应力太强,卡就裂开而成为两部分(含有连接到模件的天线的那一部分仍能工作)。在这种情况下,通过对纸的类型和它内部粘着力的作用,我们可以得益于这个物理性质以建立一种具有内在和可变应力标志的卡。根据客户的需要,这种脱开可以或快些或慢些,也可以更明显或不那么明显,使得由于卡内部的纸的脱开而使卡的有限的弯曲能够看得见。
一旦这一步骤结束,就可以得到如图3所示的卡。卡体24是在各角经过天线支座的缺口22而热结合在一起的。芯片26嵌在卡中因而是不可见的。
图4是图3所示的智能卡沿轴线A-A的截面图。卡包括由纤维材料制成的天线支座28,它插在两个卡体之中。每一卡体包括一个表层30,它包括透明的PVC薄膜层或清漆层,坚硬的外部PVC层32和内部的软PVC层34。圈36和粘接片是陷入卡体PVC材质的内部层34中的。芯片40用一层导电胶42连接到天线38的粘接片。这个导电胶是导电墨水、以树脂或聚合物为基质的。按照一特定的实施例,粘接是按照通常称作“倒装芯片”模件接合技术的过程实施的。
按照本发明这过程为使用它的公司提供一种具有两个主要品质的卡:保持电气部件以便为该卡提供提高了的牢固性,以及在卡不正常工作时,像纸这样的纤维材料的脱开性质可以确保该卡没有遭到为欺诈目的而猛烈的折弯。

Claims (7)

1.一种制造无接触智能卡的方法,包括通过在一个支座上进行丝网印刷来制造一个天线、在所述支座上粘结一个芯片,以及在所述天线的支座上层压卡体,
其特征在于所述方法包括下列步骤:
一个天线制造步骤,包括在纸制成的支座上丝网印刷导电聚合物墨水的圈,并对所述支座进行热处理以烘干所述墨水,
一个粘结步骤,使用导电粘合剂把所述芯片粘合到所述天线的粘接片上,
一个通过热压成型过程把卡体层压在天线支座上的步骤,其中包括将所述支座的每一侧面结合到形成所述卡体的至少两片具有不同刚度的塑料片上,以及
其中在天线的制造步骤中,纸的天线支架的各角是切成缺口的以便使所述两个卡体被结合在一起,这样得到的上述卡提供了一个优先的脱开区,该脱开区用于在事后揭示任何故意损坏卡的行为。
2.按照权利要求1的智能卡的制造方法,其特征在于形成卡体外部层的片比形成卡体内部层的片硬,所说的内部层有低的维卡氏软化温度。
3.按照前述权利要求2的智能卡的制造方法,其中形成卡体的两片的每一片都有不同厚度。
4.按照权利要求3的智能卡的制造方法,其中形成外部层的片比形成内部层的片厚。
5.按照前述权利要求4的智能卡的制造方法,其中在把卡体层热层压到天线支座上的步骤中,在每一卡体上加上第三塑料层或清漆层,它作为表层。
6.按照前述权利要求之一的智能卡的制造方法,其中形成卡体的塑料材料是聚氯乙烯PVC、聚酯PET、PETG、聚碳酸酯PC或丙烯腈-丁二烯-苯乙烯ABS。
7.按照前述权利要求6的智能卡的制造方法,其中用于将芯片粘到天线粘接片上去的导电胶水是使用树脂或聚合物为基本材料的导电墨水。
CNB008031932A 1999-11-29 2000-11-28 制造带有纸天线支座的无接触智能卡的方法 Expired - Fee Related CN1211759C (zh)

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ATE388453T1 (de) 2008-03-15
ID29989A (id) 2001-10-25
EP1183643B1 (fr) 2008-03-05
KR100817961B1 (ko) 2008-03-31
HK1044398A1 (en) 2002-10-18
ZA200105716B (en) 2002-02-21
MXPA01007466A (es) 2003-03-12
FR2801708A1 (fr) 2001-06-01
DE60038230D1 (de) 2008-04-17
AU2179301A (en) 2001-06-12
JP2003515848A (ja) 2003-05-07
US20010006194A1 (en) 2001-07-05
BR0007790A (pt) 2002-02-05
NO20013405L (no) 2001-09-12
CA2360351A1 (fr) 2001-06-07
FR2801708B1 (fr) 2003-12-26
CA2360351C (fr) 2010-01-05
NO20013405D0 (no) 2001-07-09
RU2251744C2 (ru) 2005-05-10
HK1044398B (zh) 2006-02-17
TR200102182T1 (tr) 2002-03-21
IL144301A (en) 2005-12-18
US6536674B2 (en) 2003-03-25
EP1183643A1 (fr) 2002-03-06
TW513672B (en) 2002-12-11
WO2001041060A1 (fr) 2001-06-07
PT1183643E (pt) 2008-06-17
CN1338085A (zh) 2002-02-27
IL144301A0 (en) 2002-05-23
KR20010110419A (ko) 2001-12-13
JP4731779B2 (ja) 2011-07-27
AU776169B2 (en) 2004-09-02
DE60038230T2 (de) 2008-11-13

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