TWI237890B - Integrated semiconductor structure - Google Patents

Integrated semiconductor structure Download PDF

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Publication number
TWI237890B
TWI237890B TW092114098A TW92114098A TWI237890B TW I237890 B TWI237890 B TW I237890B TW 092114098 A TW092114098 A TW 092114098A TW 92114098 A TW92114098 A TW 92114098A TW I237890 B TWI237890 B TW I237890B
Authority
TW
Taiwan
Prior art keywords
interconnection
semiconductor structure
metal
scope
integrated semiconductor
Prior art date
Application number
TW092114098A
Other languages
English (en)
Chinese (zh)
Other versions
TW200402863A (en
Inventor
Robert Bauer
Werner Ertle
Till Frohnmueller
Bernd Goller
Reinhard Greiderer
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of TW200402863A publication Critical patent/TW200402863A/zh
Application granted granted Critical
Publication of TWI237890B publication Critical patent/TWI237890B/zh

Links

Classifications

    • H10W72/90—
    • H10W72/9232—
    • H10W72/934—
    • H10W72/952—
    • H10W72/983—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
TW092114098A 2002-07-01 2003-05-23 Integrated semiconductor structure TWI237890B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10229493A DE10229493B4 (de) 2002-07-01 2002-07-01 Integrierte Halbleiterstruktur

Publications (2)

Publication Number Publication Date
TW200402863A TW200402863A (en) 2004-02-16
TWI237890B true TWI237890B (en) 2005-08-11

Family

ID=29796063

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092114098A TWI237890B (en) 2002-07-01 2003-05-23 Integrated semiconductor structure

Country Status (7)

Country Link
US (1) US7190077B2 (show.php)
EP (1) EP1518272B1 (show.php)
JP (1) JP4065876B2 (show.php)
CN (1) CN100440497C (show.php)
DE (2) DE10229493B4 (show.php)
TW (1) TWI237890B (show.php)
WO (1) WO2004004002A1 (show.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108329A (ja) * 2004-10-04 2006-04-20 Fujitsu Ltd 半導体装置
CN100413066C (zh) * 2005-11-30 2008-08-20 中芯国际集成电路制造(上海)有限公司 低k介电材料的接合焊盘和用于制造半导体器件的方法
JP5353313B2 (ja) * 2009-03-06 2013-11-27 富士通セミコンダクター株式会社 半導体装置
KR101823677B1 (ko) 2011-04-21 2018-01-30 엘지이노텍 주식회사 엘이디 조명장치
US20130154099A1 (en) * 2011-12-16 2013-06-20 Semiconductor Components Industries, Llc Pad over interconnect pad structure design
CN102571135B (zh) * 2012-02-15 2014-05-14 京信通信系统（中国）有限公司 射频半集成应用装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
EP0637840A1 (en) * 1993-08-05 1995-02-08 AT&T Corp. Integrated circuit with active devices under bond pads
KR100267105B1 (ko) * 1997-12-09 2000-11-01 윤종용 다층패드를구비한반도체소자및그제조방법
US5986343A (en) * 1998-05-04 1999-11-16 Lucent Technologies Inc. Bond pad design for integrated circuits
US6232662B1 (en) * 1998-07-14 2001-05-15 Texas Instruments Incorporated System and method for bonding over active integrated circuits
US6087732A (en) * 1998-09-28 2000-07-11 Lucent Technologies, Inc. Bond pad for a flip-chip package
JP2000183104A (ja) * 1998-12-15 2000-06-30 Texas Instr Inc <Ti> 集積回路上でボンディングするためのシステム及び方法
TW430935B (en) * 1999-03-19 2001-04-21 Ind Tech Res Inst Frame type bonding pad structure having a low parasitic capacitance
JP3727220B2 (ja) 2000-04-03 2005-12-14 Ｎｅｃエレクトロニクス株式会社 半導体装置
US7201784B2 (en) * 2003-06-30 2007-04-10 Intel Corporation Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics

Also Published As

Publication number Publication date
WO2004004002A1 (de) 2004-01-08
US7190077B2 (en) 2007-03-13
CN1666336A (zh) 2005-09-07
DE10229493A1 (de) 2004-01-29
DE50311482D1 (show.php) 2009-06-10
EP1518272A1 (de) 2005-03-30
CN100440497C (zh) 2008-12-03
DE10229493B4 (de) 2007-03-29
TW200402863A (en) 2004-02-16
JP2006502561A (ja) 2006-01-19
JP4065876B2 (ja) 2008-03-26
US20050242374A1 (en) 2005-11-03
EP1518272B1 (de) 2009-04-29

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MM4A Annulment or lapse of patent due to non-payment of fees