TWI236965B - Film adhering method and device - Google Patents
Film adhering method and device Download PDFInfo
- Publication number
- TWI236965B TWI236965B TW092114756A TW92114756A TWI236965B TW I236965 B TWI236965 B TW I236965B TW 092114756 A TW092114756 A TW 092114756A TW 92114756 A TW92114756 A TW 92114756A TW I236965 B TWI236965 B TW I236965B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- substrate
- pressing roller
- roller
- adhered
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1875—Tensioning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B2037/1063—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using an electrostatic force
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/1223—Hot-melt adhesive film-shaped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
- B32B2310/025—Electrostatic charges
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003030264A JP3774701B2 (ja) | 2003-02-07 | 2003-02-07 | フィルム貼付方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200415003A TW200415003A (en) | 2004-08-16 |
TWI236965B true TWI236965B (en) | 2005-08-01 |
Family
ID=32957200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092114756A TWI236965B (en) | 2003-02-07 | 2003-05-30 | Film adhering method and device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3774701B2 (ko) |
KR (1) | KR100550649B1 (ko) |
CN (1) | CN1307033C (ko) |
TW (1) | TWI236965B (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4780559B2 (ja) * | 2005-12-14 | 2011-09-28 | 株式会社日立プラントテクノロジー | フィルム貼付方法およびその装置 |
JP2007245438A (ja) * | 2006-03-15 | 2007-09-27 | Hitachi Plant Technologies Ltd | フィルム貼付方法とその装置 |
KR100749152B1 (ko) * | 2006-05-09 | 2007-08-14 | (주)화백엔지니어링 | 필름 리와인드 장치 |
KR100743398B1 (ko) * | 2006-06-13 | 2007-08-02 | (주)두일알에스 | 패널의 라미네이팅 장치 및 방법 |
JP5015824B2 (ja) * | 2008-02-29 | 2012-08-29 | 日東電工株式会社 | 粘着フィルム位置検出器および粘着フィルム貼付装置 |
KR20130127950A (ko) * | 2012-05-15 | 2013-11-25 | 시바우라 메카트로닉스 가부시끼가이샤 | 테이프 부재의 공급 장치, 점착 테이프의 접착 장치 및 테이프 부재의 공급 방법 |
US9067374B2 (en) * | 2012-11-30 | 2015-06-30 | The Boeing Company | Method and apparatus for applying film material to elongate members |
CN104210693A (zh) * | 2014-08-26 | 2014-12-17 | 浙江万江木业有限公司 | 一种专用于胶合板的贴膜装置 |
JP5885813B1 (ja) * | 2014-12-03 | 2016-03-16 | 日東電工株式会社 | 光学的表示装置の製造方法及び製造装置 |
CN107949180B (zh) * | 2017-12-18 | 2020-03-24 | 厦门市铂联科技股份有限公司 | 一种fpc覆盖膜方法及装置 |
JP7020189B2 (ja) * | 2018-03-02 | 2022-02-16 | トヨタ自動車株式会社 | フィルム搬送装置、フィルム搬送方法、及びフィルム貼付け装置 |
CN108556333B (zh) * | 2018-06-15 | 2024-03-26 | 嘉兴市品鼎电器有限公司 | 一种led灯导光板的覆膜装置 |
CN110884110B (zh) * | 2019-11-27 | 2024-08-02 | 肇庆宏旺金属实业有限公司 | 贴膜机 |
CN111438927A (zh) * | 2020-04-21 | 2020-07-24 | 徐州优元防静电设备有限公司 | 一种除静电式贴膜机 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58115864U (ja) * | 1982-01-27 | 1983-08-08 | 三菱電機株式会社 | 車両用充電発電機 |
DE9200625U1 (de) * | 1992-01-21 | 1993-05-19 | Robert Bosch Gmbh, 7000 Stuttgart | Anschlußdeckel für Elektrokraftstoffpumpe |
US5207562A (en) * | 1992-04-30 | 1993-05-04 | The Marley Company | Submersible pump with handle providing electrical connection and oil port |
JP3046550B2 (ja) * | 1996-08-29 | 2000-05-29 | 東海興業株式会社 | ケース一体コネクタ、及びその成形方法 |
JP3463641B2 (ja) * | 2000-01-21 | 2003-11-05 | 株式会社デンソー | 圧力検出装置の製造方法 |
-
2003
- 2003-02-07 JP JP2003030264A patent/JP3774701B2/ja not_active Expired - Fee Related
- 2003-05-30 TW TW092114756A patent/TWI236965B/zh not_active IP Right Cessation
- 2003-07-10 CN CNB031466583A patent/CN1307033C/zh not_active Expired - Fee Related
- 2003-07-30 KR KR1020030052640A patent/KR100550649B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2004237636A (ja) | 2004-08-26 |
KR100550649B1 (ko) | 2006-02-08 |
CN1307033C (zh) | 2007-03-28 |
JP3774701B2 (ja) | 2006-05-17 |
CN1519095A (zh) | 2004-08-11 |
TW200415003A (en) | 2004-08-16 |
KR20040073934A (ko) | 2004-08-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |