TWI231730B - Method of applying corrosion inhibitor to circuit board mounted with parts - Google Patents

Method of applying corrosion inhibitor to circuit board mounted with parts Download PDF

Info

Publication number
TWI231730B
TWI231730B TW089116861A TW89116861A TWI231730B TW I231730 B TWI231730 B TW I231730B TW 089116861 A TW089116861 A TW 089116861A TW 89116861 A TW89116861 A TW 89116861A TW I231730 B TWI231730 B TW I231730B
Authority
TW
Taiwan
Prior art keywords
parts
aforementioned
circuit board
corrosion inhibitor
mesh
Prior art date
Application number
TW089116861A
Other languages
English (en)
Inventor
Takehiko Murakami
Original Assignee
Minami Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minami Co Ltd filed Critical Minami Co Ltd
Application granted granted Critical
Publication of TWI231730B publication Critical patent/TWI231730B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Printing Plates And Materials Therefor (AREA)

Description

1231730 五、發明說明（1) -- [發明所屬之技術領域] 、本發明是關於零件構裝完畢基板之防腐蝕材料之塗敷方 法。 [習知之技術] 、2於零件構裝完畢之印刷基板，在最後會對必要之零件 進行f腐蝕材料之塗敷。但是，習知這種塗敷方法是&過 =工片一片地加以進行。而且，被構裝零件間之間隔非 二小所以僅僅對必要零件進行塗敷之工作就會非常辛 [發明所欲解決之問題；I 本發明為基於上述原 材料之塗敷，能一次在 塗敷，同時，可解消因 塗敷場合所帶來之煩惱 力，此種對零件構裝完 [解決問題之手段] 因此，本發明要點是 構裝完畢部份之凹狀部 敷防腐蝕材料之零件位 似網眼狀之防腐飯材料 過網版印刷，以塗敷防 板，所進行之防腐蝕材 另外，作為使防腐I虫 之手段’可通過使用類 因，想提供通過印刷來進行防腐蝕 多片零件構裝完畢印刷基板上進行 為要利用手工僅僅對必要零件進行 ，並能大幅提昇整體構裝製程之能 畢基板之防腐蝕材料之塗敷方法。 在背面設置一個能包入基板之零件 ，同時，在該凹狀部基板之應該塗 Ϊ❹UP 〇 ’使用設置有類 塗敷用之穿透孔之網罩（mask)，通 腐蝕材料為特徵之零件構裝完畢基 料之塗敷方法。 材料塗敷用穿透孔達到類似網眼狀 似蝕刻法（etching)等適合之穿孔 1231730
钱材料7。 另外，在用橡膠推椁β技&府^ u、 起呈膠狀之防腐蝕材料7 網孔產生之反抗引 隨後，穿透網孔並在ΓΛ面相擴/^^ 之厚度覆蓋在零件5，上τ相互銜接’形成整體很平均 此狀態如圖7所示，防腐铋姑袓7 士 a〆 件5,上被正確塗敷。防腐#材科？在各印刷基板4之各零 [發明之效果] 腐::;次完畢基板上進行防 零件進行塗敷場為要並二^ 裴製程之能力。 、 並此大幅提昇整體構 五、發明說明（4) [元件編號之說明] 1 a lb 網罩 表面 背面 凹狀部 3a 3b 防腐蝕材料塗敷用穿透孔 穿透孔 網 基板 5 ’ · ·零件
1231730 五、發明說明（4) 6 ....橡膠推桿 • •防腐蝕材料 1111 89116861.ptd 第7頁 1231730 圖式簡單說明 圖1是本發明使用之網罩表面圖。 圖2是本發明使用之網罩表面側部分放大視圖。 圖3是本發明使用之網罩之背面圖。 圖4是本發明使用之網罩背面側部分放大視圖。 圖5是塗敷狀態前之印刷基板之俯視圖。 圖6是塗敷製程之說明圖。 圖7是塗敷製程之說明圖。
89116861.ptd 第8頁

Claims (1)

  1. /61231730 案滅 891168fi1 六、申請專利範圍 為將零件構裝蝕材料之塗敷方法，其 為包括： 疋零#塗敷防腐崎料之方法，其特徵 述材Γ網版印刷對全部基板上之前 前述各基式於f述網罩之背面以能包住 應前述各基板上之前述特定；件：狀:h·在對 域内，設置複數個穿透孔。 前述各凹狀部的區 2·如申請專利範圍第1項之零件 材料之塗敷方法，其中，前述穿裝/凡畢基板之防腐蝕 tl· m 11. ^ ^穿透孔係藉由穿孔手P 令 數罝地穿透設置細孔，以形成網眼狀。芽孔手奴，多 3,如申請專利範圍第丨項之零件 材料之塗敷方法，其中，前述穿 畢基板之防腐麵 之網於該穿透孔，以形成網眼：透孔係藉由貼覆所需大小 修正 替換本 1111 C:\ 總檔\89\89116861 \89116861(替換）-2.ptc 第9頁
TW089116861A 1999-08-27 2000-08-19 Method of applying corrosion inhibitor to circuit board mounted with parts TWI231730B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24100799A JP2001068831A (ja) 1999-08-27 1999-08-27 部品実装済基板への腐食防止材の塗布方法

Publications (1)

Publication Number Publication Date
TWI231730B true TWI231730B (en) 2005-04-21

Family

ID=17067952

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089116861A TWI231730B (en) 1999-08-27 2000-08-19 Method of applying corrosion inhibitor to circuit board mounted with parts

Country Status (5)

Country Link
US (1) US6548106B1 (zh)
JP (1) JP2001068831A (zh)
DE (1) DE10037170C2 (zh)
GB (1) GB2353639B (zh)
TW (1) TWI231730B (zh)

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JP2006078280A (ja) * 2004-09-08 2006-03-23 Denso Corp 容量式湿度センサ
KR100801623B1 (ko) * 2006-06-23 2008-02-11 삼성전자주식회사 표시장치의 제조방법과 이에 사용되는 표시장치의 제조장치및 이에 의하여 제조된 표시장치
CN100572058C (zh) * 2007-06-08 2009-12-23 富葵精密组件(深圳)有限公司 文字印刷网版及采用该文字印刷网版制作电路板的方法
WO2010068256A2 (en) * 2008-12-10 2010-06-17 Cts Corporation Counter sunk screen
RU2446896C2 (ru) * 2010-06-09 2012-04-10 Александр Иванович Крашенинников Способ нанесения ингибитора коррозии стали
JP2013143563A (ja) * 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
US8534533B2 (en) * 2012-01-19 2013-09-17 Raytheon Company Solder paste transfer process
US8770462B2 (en) 2012-03-14 2014-07-08 Raytheon Company Solder paste transfer process
WO2013142858A1 (en) 2012-03-23 2013-09-26 Hzo, Inc. Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
JP7433998B2 (ja) * 2020-03-13 2024-02-20 本田技研工業株式会社 ゴムシールの製造方法

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JPS5258606A (en) * 1975-11-07 1977-05-14 Hitachi Ltd Printing metal mask
DD146873A1 (de) * 1979-11-20 1981-03-04 Guenter Schieferdecker Kontaktschicht fuer elektrische kontaktflaechen auf leiterplatten
US4678531A (en) * 1986-03-24 1987-07-07 General Motors Corporation Method and apparatus for screen printing solder paste onto a substrate with device premounted thereon
GB2188686B (en) * 1986-04-01 1989-11-15 Dowty Seals Ltd A method of manufacturing a seal
US4739919A (en) * 1987-06-15 1988-04-26 Northern Telecom Limited Masking of circuit boards for wave soldering
JP2512496B2 (ja) * 1987-09-14 1996-07-03 憲吾 伊藤 マスキング材の付着方法
US5232651A (en) * 1989-12-11 1993-08-03 Japan Rec Co., Ltd. Method of sealing electric parts mounted on electric wiring board with resin composition
DE4015292A1 (de) * 1990-05-12 1991-11-14 Bosch Gmbh Robert Drucksieb fuer den siebdruck von elektrischen elementen und strukturen auf einer traegerplatte mit unebenheiten
US5368883A (en) * 1993-05-21 1994-11-29 Delco Electronics Corp. Method and stencil design for printing non-planar hybrid circuits
JPH0780682A (ja) * 1993-09-10 1995-03-28 Fujitsu Ltd はんだペースト
JPH07323675A (ja) * 1994-05-31 1995-12-12 Sony Corp クリームはんだ印刷マスク
EP0843886A1 (en) * 1996-06-11 1998-05-27 Koninklijke Philips Electronics N.V. The provision of color elements on substrates by means of a screen-printing or stencil-printing method
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JP2001068833A (ja) * 1999-08-27 2001-03-16 Minami Kk 部品実装済基板への接着剤の塗布方法

Also Published As

Publication number Publication date
JP2001068831A (ja) 2001-03-16
DE10037170A1 (de) 2001-03-22
DE10037170C2 (de) 2003-09-25
GB0016626D0 (en) 2000-08-23
GB2353639A (en) 2001-02-28
US6548106B1 (en) 2003-04-15
GB2353639B (en) 2003-09-03

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