TWD228601S - 用於基板處理腔室的抗旋轉處理套件的擋板 - Google Patents

用於基板處理腔室的抗旋轉處理套件的擋板 Download PDF

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Publication number
TWD228601S
TWD228601S TW112302955D01F TW112302955D01F TWD228601S TW D228601 S TWD228601 S TW D228601S TW 112302955D01 F TW112302955D01 F TW 112302955D01F TW 112302955D01 F TW112302955D01 F TW 112302955D01F TW D228601 S TWD228601 S TW D228601S
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TW
Taiwan
Prior art keywords
design
baffle
substrate processing
processing chamber
rotation process
Prior art date
Application number
TW112302955D01F
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English (en)
Chinese (zh)
Inventor
羅漢維傑 雷恩
雪楊 常
提蒙西喬瑟夫 富蘭克林
丹尼爾桑 比恩
Original Assignee
美商應用材料股份有限公司
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Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD228601S publication Critical patent/TWD228601S/zh

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TW112302955D01F 2022-04-04 2022-10-03 用於基板處理腔室的抗旋轉處理套件的擋板 TWD228601S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202229833394 2022-04-04
US29/833,394 2022-04-04

Publications (1)

Publication Number Publication Date
TWD228601S true TWD228601S (zh) 2023-11-11

Family

ID=86055241

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112302955D01F TWD228601S (zh) 2022-04-04 2022-10-03 用於基板處理腔室的抗旋轉處理套件的擋板
TW112302955F TWD228600S (zh) 2022-04-04 2022-10-03 用於基板處理腔室的抗旋轉處理套件的擋板

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112302955F TWD228600S (zh) 2022-04-04 2022-10-03 用於基板處理腔室的抗旋轉處理套件的擋板

Country Status (2)

Country Link
JP (2) JP1742743S (ja)
TW (2) TWD228601S (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber

Also Published As

Publication number Publication date
JP1742743S (ja) 2023-04-24
TWD228600S (zh) 2023-11-11
JP1742710S (ja) 2023-04-24

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