TW593783B - Process for degassing an aqueous plating solution - Google Patents

Process for degassing an aqueous plating solution Download PDF

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Publication number
TW593783B
TW593783B TW091102093A TW91102093A TW593783B TW 593783 B TW593783 B TW 593783B TW 091102093 A TW091102093 A TW 091102093A TW 91102093 A TW91102093 A TW 91102093A TW 593783 B TW593783 B TW 593783B
Authority
TW
Taiwan
Prior art keywords
solution
composition
gas
patent application
item
Prior art date
Application number
TW091102093A
Other languages
English (en)
Chinese (zh)
Inventor
Bipin Parekh
Saksatha Ly
Quinwel Wu
Original Assignee
Mykrolis Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mykrolis Corp filed Critical Mykrolis Corp
Application granted granted Critical
Publication of TW593783B publication Critical patent/TW593783B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0031—Degasification of liquids by filtration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0068—General arrangements, e.g. flowsheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D63/00—Apparatus in general for separation processes using semi-permeable membranes
    • B01D63/02—Hollow fibre modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/06—Organic material
    • B01D71/30—Polyalkenyl halides
    • B01D71/32—Polyalkenyl halides containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Degasification And Air Bubble Elimination (AREA)
TW091102093A 2001-02-07 2002-02-06 Process for degassing an aqueous plating solution TW593783B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26729501P 2001-02-07 2001-02-07
PCT/US2002/002924 WO2002062446A1 (en) 2001-02-07 2002-01-31 Process for degassing an aqueous plating solution

Publications (1)

Publication Number Publication Date
TW593783B true TW593783B (en) 2004-06-21

Family

ID=23018184

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091102093A TW593783B (en) 2001-02-07 2002-02-06 Process for degassing an aqueous plating solution

Country Status (7)

Country Link
US (1) US7014679B2 (enExample)
EP (1) EP1357989A4 (enExample)
JP (1) JP2004531640A (enExample)
KR (1) KR100824910B1 (enExample)
CN (1) CN1499992A (enExample)
TW (1) TW593783B (enExample)
WO (1) WO2002062446A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI890705B (zh) * 2020-02-27 2025-07-21 日商日東電工股份有限公司 乳膠之製造方法及製造裝置

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EP1357989A4 (en) 2001-02-07 2005-05-18 Mykrolis Corp PROCESS FOR DEGASSING AN AQUEOUS GALVANOPLASTIC DEPOSITION BATH
JP4173306B2 (ja) * 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
US7189146B2 (en) * 2003-03-27 2007-03-13 Asm Nutool, Inc. Method for reduction of defects in wet processed layers
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TW200505554A (en) * 2003-04-22 2005-02-16 Mykrolis Corp Pleated construction for effecting gas transfer membrane
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US7632338B2 (en) * 2006-10-05 2009-12-15 United Technologies Corporation Electrochemical oxygen pump for fuel stabilization unit
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US20100320081A1 (en) 2009-06-17 2010-12-23 Mayer Steven T Apparatus for wetting pretreatment for enhanced damascene metal filling
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9138784B1 (en) 2009-12-18 2015-09-22 Novellus Systems, Inc. Deionized water conditioning system and methods
TW201218277A (en) * 2010-09-09 2012-05-01 Novellus Systems Inc By-product mitigation in through-silicon-via plating
US9816193B2 (en) 2011-01-07 2017-11-14 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
KR102113883B1 (ko) * 2012-03-13 2020-05-22 노벨러스 시스템즈, 인코포레이티드 관통 레지스트 금속 도금을 위한 웨팅 전처리의 방법들 및 장치
US9816196B2 (en) 2012-04-27 2017-11-14 Novellus Systems, Inc. Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
TWI517935B (zh) * 2013-04-16 2016-01-21 國立台灣科技大學 氣體添加硏磨液的供應系統及其方法
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
US9481942B2 (en) 2015-02-03 2016-11-01 Lam Research Corporation Geometry and process optimization for ultra-high RPM plating
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
CN106145231A (zh) * 2015-03-24 2016-11-23 通用电气公司 用于除氧的装置和方法
CN107427743A (zh) * 2015-03-31 2017-12-01 株式会社杰希优 处理液的脱气判定方法
US10527011B2 (en) * 2017-06-06 2020-01-07 Hamilton Sundstrand Corporation Sonication-assisted fuel deoxygenation
TWI887558B (zh) * 2017-07-10 2025-06-21 美商應用材料股份有限公司 具有減少的夾帶空氣的電鍍系統
CN108754605B (zh) * 2018-06-22 2019-11-12 东北大学 水溶液电解质中电沉积定向生长金属单晶体的装置和方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI890705B (zh) * 2020-02-27 2025-07-21 日商日東電工股份有限公司 乳膠之製造方法及製造裝置

Also Published As

Publication number Publication date
EP1357989A4 (en) 2005-05-18
KR100824910B1 (ko) 2008-04-23
CN1499992A (zh) 2004-05-26
JP2004531640A (ja) 2004-10-14
WO2002062446A1 (en) 2002-08-15
KR20040020882A (ko) 2004-03-09
US20040060436A1 (en) 2004-04-01
EP1357989A1 (en) 2003-11-05
US7014679B2 (en) 2006-03-21

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MM4A Annulment or lapse of patent due to non-payment of fees