CN1499992A - 含水镀液的脱气方法 - Google Patents

含水镀液的脱气方法 Download PDF

Info

Publication number
CN1499992A
CN1499992A CNA028075315A CN02807531A CN1499992A CN 1499992 A CN1499992 A CN 1499992A CN A028075315 A CNA028075315 A CN A028075315A CN 02807531 A CN02807531 A CN 02807531A CN 1499992 A CN1499992 A CN 1499992A
Authority
CN
China
Prior art keywords
solution
shell
degasser
composition
fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA028075315A
Other languages
English (en)
Chinese (zh)
Inventor
ƽ
拜平·帕雷赫
萨克塞斯·利
吴群伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMD Millipore Corp
Original Assignee
Millipore Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Millipore Corp filed Critical Millipore Corp
Publication of CN1499992A publication Critical patent/CN1499992A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • B01D19/0031Degasification of liquids by filtration
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D19/00Degasification of liquids
    • B01D19/0068General arrangements, e.g. flowsheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D63/00Apparatus in general for separation processes using semi-permeable membranes
    • B01D63/02Hollow fibre modules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D71/00Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
    • B01D71/06Organic material
    • B01D71/30Polyalkenyl halides
    • B01D71/32Polyalkenyl halides containing fluorine atoms
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Degasification And Air Bubble Elimination (AREA)
CNA028075315A 2001-02-07 2002-01-31 含水镀液的脱气方法 Pending CN1499992A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26729501P 2001-02-07 2001-02-07
US60/267,295 2001-02-07

Publications (1)

Publication Number Publication Date
CN1499992A true CN1499992A (zh) 2004-05-26

Family

ID=23018184

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA028075315A Pending CN1499992A (zh) 2001-02-07 2002-01-31 含水镀液的脱气方法

Country Status (7)

Country Link
US (1) US7014679B2 (enExample)
EP (1) EP1357989A4 (enExample)
JP (1) JP2004531640A (enExample)
KR (1) KR100824910B1 (enExample)
CN (1) CN1499992A (enExample)
TW (1) TW593783B (enExample)
WO (1) WO2002062446A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102400196A (zh) * 2010-09-09 2012-04-04 诺发系统有限公司 在穿硅通孔镀敷中减少副产品
CN106145231A (zh) * 2015-03-24 2016-11-23 通用电气公司 用于除氧的装置和方法
US9816196B2 (en) 2012-04-27 2017-11-14 Novellus Systems, Inc. Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
US9816193B2 (en) 2011-01-07 2017-11-14 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
CN107427743A (zh) * 2015-03-31 2017-12-01 株式会社杰希优 处理液的脱气判定方法
CN108754605A (zh) * 2018-06-22 2018-11-06 东北大学 水溶液电解质中电沉积定向生长金属单晶体的装置和方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1357989A4 (en) 2001-02-07 2005-05-18 Mykrolis Corp PROCESS FOR DEGASSING AN AQUEOUS GALVANOPLASTIC DEPOSITION BATH
JP4173306B2 (ja) * 2001-11-30 2008-10-29 東京エレクトロン株式会社 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法
US7189146B2 (en) * 2003-03-27 2007-03-13 Asm Nutool, Inc. Method for reduction of defects in wet processed layers
US6939392B2 (en) 2003-04-04 2005-09-06 United Technologies Corporation System and method for thermal management
TW200505554A (en) * 2003-04-22 2005-02-16 Mykrolis Corp Pleated construction for effecting gas transfer membrane
US7393388B2 (en) 2005-05-13 2008-07-01 United Technologies Corporation Spiral wound fuel stabilization unit for fuel de-oxygenation
US7435283B2 (en) * 2005-05-18 2008-10-14 United Technologies Corporation Modular fuel stabilization system
US7377112B2 (en) 2005-06-22 2008-05-27 United Technologies Corporation Fuel deoxygenation for improved combustion performance
US7632338B2 (en) * 2006-10-05 2009-12-15 United Technologies Corporation Electrochemical oxygen pump for fuel stabilization unit
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US20100320081A1 (en) 2009-06-17 2010-12-23 Mayer Steven T Apparatus for wetting pretreatment for enhanced damascene metal filling
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9138784B1 (en) 2009-12-18 2015-09-22 Novellus Systems, Inc. Deionized water conditioning system and methods
KR102113883B1 (ko) * 2012-03-13 2020-05-22 노벨러스 시스템즈, 인코포레이티드 관통 레지스트 금속 도금을 위한 웨팅 전처리의 방법들 및 장치
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
TWI517935B (zh) * 2013-04-16 2016-01-21 國立台灣科技大學 氣體添加硏磨液的供應系統及其方法
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
US9481942B2 (en) 2015-02-03 2016-11-01 Lam Research Corporation Geometry and process optimization for ultra-high RPM plating
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
US10527011B2 (en) * 2017-06-06 2020-01-07 Hamilton Sundstrand Corporation Sonication-assisted fuel deoxygenation
TWI887558B (zh) * 2017-07-10 2025-06-21 美商應用材料股份有限公司 具有減少的夾帶空氣的電鍍系統
JP7588959B2 (ja) * 2020-02-27 2024-11-25 日東電工株式会社 エマルションの製造方法および製造装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3822093C2 (de) * 1987-06-30 1997-11-06 Fuji Photo Film Co Ltd Verfahren zur Entgasung und Entschäumung einer lichtempfindlichen Überzugslösung und Vorrichtung zur Durchführung dieses Verfahrens
US4869732A (en) * 1988-12-23 1989-09-26 Texaco Inc. Deoxygenation of aqueous polymer solutions used in enhanced oil recovery processes
CA2141612C (en) 1992-08-07 1999-03-09 Yasutoshi Senoo Improvement to membrane type deaerator
US5266639A (en) * 1992-08-28 1993-11-30 E. I. Du Pont De Nemours And Company Low-melting tetrafluorethylene copolymer and its uses
US5383483A (en) * 1992-10-14 1995-01-24 Shibano; Yoshihide Ultrasonic cleaning and deburring apparatus
US5762684A (en) * 1995-11-30 1998-06-09 Dainippon Screen Mfg. Co., Ltd. Treating liquid supplying method and apparatus
JPH09162118A (ja) * 1995-12-11 1997-06-20 Dainippon Screen Mfg Co Ltd 基板用処理液の脱気装置
JP2969075B2 (ja) * 1996-02-26 1999-11-02 ジャパンゴアテックス株式会社 脱気装置
US5695545A (en) * 1996-05-10 1997-12-09 Hoechst Celanese Corporation Degassing liquids: apparatus and method
US6001189A (en) * 1996-09-30 1999-12-14 Micron Technology, Inc. Method for reducing gaseous species of contamination in wet processes
US6171367B1 (en) 1997-06-05 2001-01-09 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for delivering and recycling a bubble-free liquid chemical
TW522455B (en) * 1998-11-09 2003-03-01 Ebara Corp Plating method and apparatus therefor
JP2000176261A (ja) * 1998-12-11 2000-06-27 Fuji Photo Film Co Ltd 水系塗工液の脱気方法
ES2267508T3 (es) * 1999-01-29 2007-03-16 Entegris, Inc. Membranas de fibra hueca envueltas y metodo de fabricacion.
JP2001073182A (ja) * 1999-07-15 2001-03-21 Boc Group Inc:The 改良された酸性銅電気メッキ用溶液
US6391209B1 (en) * 1999-08-04 2002-05-21 Mykrolis Corporation Regeneration of plating baths
US6217634B1 (en) 1999-08-27 2001-04-17 Electric Power Research Institute, Inc. Apparatus and method for monitoring and purifying dielectric fluids
JP4384762B2 (ja) * 1999-12-07 2009-12-16 日本パイオニクス株式会社 液体原料の供給システム及び供給方法
EP1357989A4 (en) 2001-02-07 2005-05-18 Mykrolis Corp PROCESS FOR DEGASSING AN AQUEOUS GALVANOPLASTIC DEPOSITION BATH
US20040026255A1 (en) * 2002-08-06 2004-02-12 Applied Materials, Inc Insoluble anode loop in copper electrodeposition cell for interconnect formation

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102400196A (zh) * 2010-09-09 2012-04-04 诺发系统有限公司 在穿硅通孔镀敷中减少副产品
US9816193B2 (en) 2011-01-07 2017-11-14 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
US10745817B2 (en) 2011-01-07 2020-08-18 Novellus Systems, Inc. Configuration and method of operation of an electrodeposition system for improved process stability and performance
US9816196B2 (en) 2012-04-27 2017-11-14 Novellus Systems, Inc. Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
CN106145231A (zh) * 2015-03-24 2016-11-23 通用电气公司 用于除氧的装置和方法
CN107427743A (zh) * 2015-03-31 2017-12-01 株式会社杰希优 处理液的脱气判定方法
CN108754605A (zh) * 2018-06-22 2018-11-06 东北大学 水溶液电解质中电沉积定向生长金属单晶体的装置和方法

Also Published As

Publication number Publication date
EP1357989A4 (en) 2005-05-18
KR100824910B1 (ko) 2008-04-23
JP2004531640A (ja) 2004-10-14
WO2002062446A1 (en) 2002-08-15
TW593783B (en) 2004-06-21
KR20040020882A (ko) 2004-03-09
US20040060436A1 (en) 2004-04-01
EP1357989A1 (en) 2003-11-05
US7014679B2 (en) 2006-03-21

Similar Documents

Publication Publication Date Title
CN1499992A (zh) 含水镀液的脱气方法
KR100697875B1 (ko) 도금방법 및 장치
US6821407B1 (en) Anode and anode chamber for copper electroplating
CN102804343B (zh) 用于增强型镶嵌金属填充的润湿预处理的设备
EP1485193B1 (en) Hollow fiber membrane contact apparatus and process
TWI491767B (zh) 高速銅電鍍槽
JP4611341B2 (ja) めっき方法及び装置
KR20190117707A (ko) 막 증류용 다공질 막 및 막 증류용 모듈의 운전 방법
KR100306839B1 (ko) 화학반응을이용한처리방법및처리장치
US20040222100A1 (en) Process and system for providing electrochemical processing solution with reduced oxygen and gas content
JPWO2000028115A1 (ja) めっき方法及び装置
KR20010034399A (ko) 도금장치
JP2004531640A5 (enExample)
CN1256465C (zh) 用于高锰酸盐蚀刻液电化学再生的阴极
JP3568455B2 (ja) 基板メッキ装置
US6841074B2 (en) Method and apparatus of purifying an electrolyte
CN217948322U (zh) 电镀系统
JP5320665B2 (ja) 超純水製造装置および方法
KR101265416B1 (ko) 개선된 다마신 금속 충전에 있어서 웨팅 전처리를 위한 장치
US20040007473A1 (en) Electrolyte/organic additive separation in electroplating processes
JP4112966B2 (ja) 純水製造装置及び純水の製造方法
JP2000199083A (ja) 酸化錫膜のエッチング装置および方法
CN119096010A (zh) 减压镀覆处理用的镀覆装置以及减压镀覆处理方法
JP2003201600A (ja) メッキ処理装置、および半導体デバイスの製造方法
CN1880517A (zh) 电化学处理槽

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
AD01 Patent right deemed abandoned
C20 Patent right or utility model deemed to be abandoned or is abandoned