JP2004531640A - 水性めっき液の脱気方法 - Google Patents
水性めっき液の脱気方法 Download PDFInfo
- Publication number
- JP2004531640A JP2004531640A JP2002562449A JP2002562449A JP2004531640A JP 2004531640 A JP2004531640 A JP 2004531640A JP 2002562449 A JP2002562449 A JP 2002562449A JP 2002562449 A JP2002562449 A JP 2002562449A JP 2004531640 A JP2004531640 A JP 2004531640A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- solution
- oxygen
- composition
- membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 38
- 238000007872 degassing Methods 0.000 title description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 239000012528 membrane Substances 0.000 claims abstract description 33
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000001301 oxygen Substances 0.000 claims abstract description 32
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000000835 fiber Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 239000007789 gas Substances 0.000 claims abstract description 13
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 10
- 239000011148 porous material Substances 0.000 claims abstract description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 39
- 239000000654 additive Substances 0.000 description 23
- 230000000996 additive effect Effects 0.000 description 17
- 239000006259 organic additive Substances 0.000 description 16
- 238000004382 potting Methods 0.000 description 16
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- 239000012510 hollow fiber Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- -1 accelerators Chemical compound 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920001600 hydrophobic polymer Polymers 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000003134 recirculating effect Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229920006356 Teflon™ FEP Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000000108 ultra-filtration Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0031—Degasification of liquids by filtration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0068—General arrangements, e.g. flowsheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D63/00—Apparatus in general for separation processes using semi-permeable membranes
- B01D63/02—Hollow fibre modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/30—Polyalkenyl halides
- B01D71/32—Polyalkenyl halides containing fluorine atoms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Degasification And Air Bubble Elimination (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26729501P | 2001-02-07 | 2001-02-07 | |
| PCT/US2002/002924 WO2002062446A1 (en) | 2001-02-07 | 2002-01-31 | Process for degassing an aqueous plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004531640A true JP2004531640A (ja) | 2004-10-14 |
| JP2004531640A5 JP2004531640A5 (enExample) | 2005-12-22 |
Family
ID=23018184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002562449A Pending JP2004531640A (ja) | 2001-02-07 | 2002-01-31 | 水性めっき液の脱気方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7014679B2 (enExample) |
| EP (1) | EP1357989A4 (enExample) |
| JP (1) | JP2004531640A (enExample) |
| KR (1) | KR100824910B1 (enExample) |
| CN (1) | CN1499992A (enExample) |
| TW (1) | TW593783B (enExample) |
| WO (1) | WO2002062446A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1357989A4 (en) | 2001-02-07 | 2005-05-18 | Mykrolis Corp | PROCESS FOR DEGASSING AN AQUEOUS GALVANOPLASTIC DEPOSITION BATH |
| JP4173306B2 (ja) * | 2001-11-30 | 2008-10-29 | 東京エレクトロン株式会社 | 信頼性評価試験装置、信頼性評価試験システム及び信頼性評価試験方法 |
| US7189146B2 (en) * | 2003-03-27 | 2007-03-13 | Asm Nutool, Inc. | Method for reduction of defects in wet processed layers |
| US6939392B2 (en) | 2003-04-04 | 2005-09-06 | United Technologies Corporation | System and method for thermal management |
| TW200505554A (en) * | 2003-04-22 | 2005-02-16 | Mykrolis Corp | Pleated construction for effecting gas transfer membrane |
| US7393388B2 (en) | 2005-05-13 | 2008-07-01 | United Technologies Corporation | Spiral wound fuel stabilization unit for fuel de-oxygenation |
| US7435283B2 (en) * | 2005-05-18 | 2008-10-14 | United Technologies Corporation | Modular fuel stabilization system |
| US7377112B2 (en) | 2005-06-22 | 2008-05-27 | United Technologies Corporation | Fuel deoxygenation for improved combustion performance |
| US7632338B2 (en) * | 2006-10-05 | 2009-12-15 | United Technologies Corporation | Electrochemical oxygen pump for fuel stabilization unit |
| US9455139B2 (en) | 2009-06-17 | 2016-09-27 | Novellus Systems, Inc. | Methods and apparatus for wetting pretreatment for through resist metal plating |
| US20100320081A1 (en) | 2009-06-17 | 2010-12-23 | Mayer Steven T | Apparatus for wetting pretreatment for enhanced damascene metal filling |
| US9677188B2 (en) | 2009-06-17 | 2017-06-13 | Novellus Systems, Inc. | Electrofill vacuum plating cell |
| US9138784B1 (en) | 2009-12-18 | 2015-09-22 | Novellus Systems, Inc. | Deionized water conditioning system and methods |
| TW201218277A (en) * | 2010-09-09 | 2012-05-01 | Novellus Systems Inc | By-product mitigation in through-silicon-via plating |
| US9816193B2 (en) | 2011-01-07 | 2017-11-14 | Novellus Systems, Inc. | Configuration and method of operation of an electrodeposition system for improved process stability and performance |
| KR102113883B1 (ko) * | 2012-03-13 | 2020-05-22 | 노벨러스 시스템즈, 인코포레이티드 | 관통 레지스트 금속 도금을 위한 웨팅 전처리의 방법들 및 장치 |
| US9816196B2 (en) | 2012-04-27 | 2017-11-14 | Novellus Systems, Inc. | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte |
| US9613833B2 (en) | 2013-02-20 | 2017-04-04 | Novellus Systems, Inc. | Methods and apparatus for wetting pretreatment for through resist metal plating |
| TWI517935B (zh) * | 2013-04-16 | 2016-01-21 | 國立台灣科技大學 | 氣體添加硏磨液的供應系統及其方法 |
| US9435049B2 (en) | 2013-11-20 | 2016-09-06 | Lam Research Corporation | Alkaline pretreatment for electroplating |
| US9481942B2 (en) | 2015-02-03 | 2016-11-01 | Lam Research Corporation | Geometry and process optimization for ultra-high RPM plating |
| US9617648B2 (en) | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
| CN106145231A (zh) * | 2015-03-24 | 2016-11-23 | 通用电气公司 | 用于除氧的装置和方法 |
| CN107427743A (zh) * | 2015-03-31 | 2017-12-01 | 株式会社杰希优 | 处理液的脱气判定方法 |
| US10527011B2 (en) * | 2017-06-06 | 2020-01-07 | Hamilton Sundstrand Corporation | Sonication-assisted fuel deoxygenation |
| TWI887558B (zh) * | 2017-07-10 | 2025-06-21 | 美商應用材料股份有限公司 | 具有減少的夾帶空氣的電鍍系統 |
| CN108754605B (zh) * | 2018-06-22 | 2019-11-12 | 东北大学 | 水溶液电解质中电沉积定向生长金属单晶体的装置和方法 |
| JP7588959B2 (ja) * | 2020-02-27 | 2024-11-25 | 日東電工株式会社 | エマルションの製造方法および製造装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3822093C2 (de) * | 1987-06-30 | 1997-11-06 | Fuji Photo Film Co Ltd | Verfahren zur Entgasung und Entschäumung einer lichtempfindlichen Überzugslösung und Vorrichtung zur Durchführung dieses Verfahrens |
| US4869732A (en) * | 1988-12-23 | 1989-09-26 | Texaco Inc. | Deoxygenation of aqueous polymer solutions used in enhanced oil recovery processes |
| CA2141612C (en) | 1992-08-07 | 1999-03-09 | Yasutoshi Senoo | Improvement to membrane type deaerator |
| US5266639A (en) * | 1992-08-28 | 1993-11-30 | E. I. Du Pont De Nemours And Company | Low-melting tetrafluorethylene copolymer and its uses |
| US5383483A (en) * | 1992-10-14 | 1995-01-24 | Shibano; Yoshihide | Ultrasonic cleaning and deburring apparatus |
| US5762684A (en) * | 1995-11-30 | 1998-06-09 | Dainippon Screen Mfg. Co., Ltd. | Treating liquid supplying method and apparatus |
| JPH09162118A (ja) * | 1995-12-11 | 1997-06-20 | Dainippon Screen Mfg Co Ltd | 基板用処理液の脱気装置 |
| JP2969075B2 (ja) * | 1996-02-26 | 1999-11-02 | ジャパンゴアテックス株式会社 | 脱気装置 |
| US5695545A (en) * | 1996-05-10 | 1997-12-09 | Hoechst Celanese Corporation | Degassing liquids: apparatus and method |
| US6001189A (en) * | 1996-09-30 | 1999-12-14 | Micron Technology, Inc. | Method for reducing gaseous species of contamination in wet processes |
| US6171367B1 (en) | 1997-06-05 | 2001-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for delivering and recycling a bubble-free liquid chemical |
| TW522455B (en) * | 1998-11-09 | 2003-03-01 | Ebara Corp | Plating method and apparatus therefor |
| JP2000176261A (ja) * | 1998-12-11 | 2000-06-27 | Fuji Photo Film Co Ltd | 水系塗工液の脱気方法 |
| ES2267508T3 (es) * | 1999-01-29 | 2007-03-16 | Entegris, Inc. | Membranas de fibra hueca envueltas y metodo de fabricacion. |
| JP2001073182A (ja) * | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
| US6391209B1 (en) * | 1999-08-04 | 2002-05-21 | Mykrolis Corporation | Regeneration of plating baths |
| US6217634B1 (en) | 1999-08-27 | 2001-04-17 | Electric Power Research Institute, Inc. | Apparatus and method for monitoring and purifying dielectric fluids |
| JP4384762B2 (ja) * | 1999-12-07 | 2009-12-16 | 日本パイオニクス株式会社 | 液体原料の供給システム及び供給方法 |
| EP1357989A4 (en) | 2001-02-07 | 2005-05-18 | Mykrolis Corp | PROCESS FOR DEGASSING AN AQUEOUS GALVANOPLASTIC DEPOSITION BATH |
| US20040026255A1 (en) * | 2002-08-06 | 2004-02-12 | Applied Materials, Inc | Insoluble anode loop in copper electrodeposition cell for interconnect formation |
-
2002
- 2002-01-31 EP EP02707656A patent/EP1357989A4/en not_active Withdrawn
- 2002-01-31 KR KR1020037010414A patent/KR100824910B1/ko not_active Expired - Fee Related
- 2002-01-31 CN CNA028075315A patent/CN1499992A/zh active Pending
- 2002-01-31 WO PCT/US2002/002924 patent/WO2002062446A1/en not_active Ceased
- 2002-01-31 JP JP2002562449A patent/JP2004531640A/ja active Pending
- 2002-01-31 US US10/467,245 patent/US7014679B2/en not_active Expired - Fee Related
- 2002-02-06 TW TW091102093A patent/TW593783B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1357989A4 (en) | 2005-05-18 |
| KR100824910B1 (ko) | 2008-04-23 |
| CN1499992A (zh) | 2004-05-26 |
| WO2002062446A1 (en) | 2002-08-15 |
| TW593783B (en) | 2004-06-21 |
| KR20040020882A (ko) | 2004-03-09 |
| US20040060436A1 (en) | 2004-04-01 |
| EP1357989A1 (en) | 2003-11-05 |
| US7014679B2 (en) | 2006-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004531640A (ja) | 水性めっき液の脱気方法 | |
| KR100697875B1 (ko) | 도금방법 및 장치 | |
| US6821407B1 (en) | Anode and anode chamber for copper electroplating | |
| EP1485193B1 (en) | Hollow fiber membrane contact apparatus and process | |
| US6890416B1 (en) | Copper electroplating method and apparatus | |
| KR100756160B1 (ko) | 도금 장치, 도금 방법, 및 반도체 장치의 제조 방법 | |
| JP4611341B2 (ja) | めっき方法及び装置 | |
| KR100476174B1 (ko) | 전해동박의 전해장치 및 그 전해장치로 얻어진 전해동박 | |
| JPWO2000028115A1 (ja) | めっき方法及び装置 | |
| TWI491767B (zh) | 高速銅電鍍槽 | |
| JP2006193822A (ja) | めっき装置、めっき方法、半導体装置、及び半導体装置の製造方法 | |
| KR20190117707A (ko) | 막 증류용 다공질 막 및 막 증류용 모듈의 운전 방법 | |
| JP2004531640A5 (enExample) | ||
| KR100816232B1 (ko) | 중공섬유막 접촉기 | |
| US20020029974A1 (en) | Method and apparatus of purifying an electrolyte | |
| JP2017115170A (ja) | めっき装置及びめっき方法 | |
| KR20110044834A (ko) | 개선된 다마신 금속 충전에 있어서 웨팅 전처리를 위한 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050120 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050120 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20060228 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070528 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070605 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20070829 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20070905 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071204 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080122 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20080415 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20080422 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080718 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080826 |