TW587398B - Method for making a display panel - Google Patents
Method for making a display panel Download PDFInfo
- Publication number
- TW587398B TW587398B TW091112314A TW91112314A TW587398B TW 587398 B TW587398 B TW 587398B TW 091112314 A TW091112314 A TW 091112314A TW 91112314 A TW91112314 A TW 91112314A TW 587398 B TW587398 B TW 587398B
- Authority
- TW
- Taiwan
- Prior art keywords
- pressure
- display
- manufacturing
- adhesive
- display panel
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 135
- 239000000853 adhesive Substances 0.000 claims description 96
- 230000001070 adhesive effect Effects 0.000 claims description 93
- 238000004519 manufacturing process Methods 0.000 claims description 63
- 230000008859 change Effects 0.000 claims description 61
- 238000004806 packaging method and process Methods 0.000 claims description 60
- 238000003825 pressing Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 230000005284 excitation Effects 0.000 claims description 4
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 71
- 239000005394 sealing glass Substances 0.000 abstract description 24
- 238000007789 sealing Methods 0.000 abstract description 12
- 238000005401 electroluminescence Methods 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 4
- 239000010410 layer Substances 0.000 description 32
- 239000010408 film Substances 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 108091006146 Channels Proteins 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003230 hygroscopic agent Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2217/00—Gas-filled discharge tubes
- H01J2217/38—Cold-cathode tubes
- H01J2217/49—Display panels, e.g. not making use of alternating current
- H01J2217/492—Details
- H01J2217/49264—Vessels
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001198925A JP4894987B2 (ja) | 2001-06-29 | 2001-06-29 | 表示用パネルの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW587398B true TW587398B (en) | 2004-05-11 |
Family
ID=19036282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091112314A TW587398B (en) | 2001-06-29 | 2002-06-07 | Method for making a display panel |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7135086B2 (2) |
| JP (1) | JP4894987B2 (2) |
| KR (1) | KR100510003B1 (2) |
| CN (1) | CN1184520C (2) |
| TW (1) | TW587398B (2) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7449081B2 (en) * | 2000-06-21 | 2008-11-11 | E. I. Du Pont De Nemours And Company | Process for improving the emission of electron field emitters |
| TWI352553B (en) * | 2002-12-26 | 2011-11-11 | Semiconductor Energy Lab | Light emitting device and a method for manufacturi |
| CN100466883C (zh) * | 2003-01-14 | 2009-03-04 | 松下电器产业株式会社 | 电路基板及其制造方法 |
| JP4582443B2 (ja) * | 2004-05-25 | 2010-11-17 | 日本精機株式会社 | 有機ｅｌパネルの封止方法 |
| US20060030036A1 (en) * | 2004-05-28 | 2006-02-09 | Victor Joseph | Chips for multiplex analyses |
| JP2006100763A (ja) * | 2004-09-06 | 2006-04-13 | Fuji Photo Film Co Ltd | 固体撮像装置の製造方法及び接合装置 |
| KR100688830B1 (ko) * | 2005-09-20 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기 발광 표시소자의 제조 방법 및 그 제조 장치 |
| KR100673765B1 (ko) * | 2006-01-20 | 2007-01-24 | 삼성에스디아이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
| JP5061475B2 (ja) * | 2006-03-02 | 2012-10-31 | 株式会社デンソー | 表示装置 |
| WO2008091626A1 (en) | 2007-01-22 | 2008-07-31 | Wafergen, Inc. | Apparatus for high throughput chemical reactions |
| WO2009054168A1 (ja) * | 2007-10-22 | 2009-04-30 | Sharp Kabushiki Kaisha | 表示装置及びその製造方法 |
| DE102009038799B4 (de) * | 2009-08-25 | 2011-07-28 | Grenzebach Maschinenbau GmbH, 86663 | Verfahren und Vorrichtung zum blasenfreien Verkleben großflächiger Glasplatten |
| TW201114317A (en) * | 2009-10-07 | 2011-04-16 | Au Optronics Corp | Organic electro-luminescent device and packaging process thereof |
| JP2013109836A (ja) * | 2011-11-17 | 2013-06-06 | Mitsubishi Heavy Ind Ltd | 有機ｅｌパネルの製造方法及び有機ｅｌパネルの封止装置 |
| US8896521B2 (en) | 2012-04-24 | 2014-11-25 | Qualcomm Mems Technologies, Inc. | Metal-insulator-metal capacitors on glass substrates |
| CN102929044B (zh) * | 2012-11-23 | 2015-08-26 | 深圳市华星光电技术有限公司 | 垂直配向型液晶面板 |
| JP6017396B2 (ja) * | 2012-12-18 | 2016-11-02 | 東京エレクトロン株式会社 | 薄膜形成方法および薄膜形成装置 |
| US9772487B1 (en) * | 2013-12-19 | 2017-09-26 | Amazon Technologies, Inc. | Lamination method and apparatus |
| CN104020614B (zh) * | 2014-05-29 | 2017-03-08 | 合肥鑫晟光电科技有限公司 | 液晶填充装置及应用其的液晶面板制造设备 |
| JP6620160B2 (ja) | 2015-02-20 | 2019-12-11 | タカラ バイオ ユーエスエー， インコーポレイテッド | 単一細胞の迅速かつ正確な分注、視覚化及び解析のための方法 |
| CN104767252A (zh) | 2015-04-28 | 2015-07-08 | 高创(苏州)电子有限公司 | 平板电脑 |
| CA3020629A1 (en) | 2016-07-21 | 2018-01-25 | Takara Bio Usa, Inc. | Multi-z imaging and dispensing with multi-well devices |
| CN110325883B (zh) | 2017-02-14 | 2024-01-09 | 3M创新有限公司 | 包含通过立铣制成的微观结构组的安全制品 |
| JP6805081B2 (ja) * | 2017-05-26 | 2020-12-23 | 新光電気工業株式会社 | 発光装置用蓋体 |
| JP6965717B2 (ja) * | 2017-12-13 | 2021-11-10 | トヨタ自動車株式会社 | 電池パックの製造方法 |
| CN112420792B (zh) * | 2020-11-17 | 2024-01-26 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其绑定方法、显示装置 |
| CN114975726B (zh) * | 2022-04-07 | 2025-12-23 | 广州华星光电半导体显示技术有限公司 | 压合工装及其组装方法 |
| CN119850398B (zh) * | 2025-03-19 | 2025-07-08 | 上海申菲激光光学系统有限公司 | 一种高精度超薄玻璃基片制备方法 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4640583A (en) * | 1983-07-22 | 1987-02-03 | Kabushiki Kaisha Seiko Epson | Display panel having an inner and an outer seal and process for the production thereof |
| US5246789A (en) * | 1989-08-28 | 1993-09-21 | Kabushiki Kaisha Toshiba | AC powder type EL panel and method of manufacturing the same |
| JPH03156888A (ja) | 1989-08-28 | 1991-07-04 | Toshiba Corp | 分散型ｅｌパネル及びその製造方法 |
| US5239228A (en) * | 1990-07-02 | 1993-08-24 | Sharp Kabushiki Kaisha | Thin-film electroluminescence device for displaying multiple colors with groove for capturing adhesive |
| JPH04199129A (ja) * | 1990-11-29 | 1992-07-20 | Toshiba Corp | 液晶表示器の製造方法 |
| US5499127A (en) * | 1992-05-25 | 1996-03-12 | Sharp Kabushiki Kaisha | Liquid crystal display device having a larger gap between the substrates in the display area than in the sealant area |
| JP3225700B2 (ja) | 1992-08-04 | 2001-11-05 | 松下電器産業株式会社 | 液晶パネルの製造方法および製造装置 |
| JP3412873B2 (ja) | 1993-08-24 | 2003-06-03 | キヤノン株式会社 | 液晶表示装置の製造方法 |
| JP2795207B2 (ja) | 1994-03-31 | 1998-09-10 | 株式会社デンソー | エレクトロルミネッセンス表示器及びその製造方法 |
| TW378276B (en) * | 1995-01-13 | 2000-01-01 | Seiko Epson Corp | Liquid crystal display device and its fabrication method |
| US5632297A (en) * | 1995-09-26 | 1997-05-27 | Amcast Industrial Corporation | Piston-type thermally or pressure activated relief device |
| US5697825A (en) * | 1995-09-29 | 1997-12-16 | Micron Display Technology, Inc. | Method for evacuating and sealing field emission displays |
| JP3842362B2 (ja) * | 1996-02-28 | 2006-11-08 | 株式会社東芝 | 熱圧着方法および熱圧着装置 |
| TW439007B (en) * | 1996-09-11 | 2001-06-07 | Canon Kk | Process and apparatus for producing electrode plate and process for producing liquid crystal device including the plate |
| JP3645067B2 (ja) * | 1997-06-10 | 2005-05-11 | セイコーエプソン株式会社 | 液晶表示装置の製造方法 |
| US5959712A (en) * | 1997-07-11 | 1999-09-28 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a liquid crystal display element having a decreased fluctuation of aperture ratio |
| EP0899987A1 (en) * | 1997-08-29 | 1999-03-03 | TDK Corporation | Organic electroluminescent device |
| KR100268129B1 (ko) * | 1997-10-06 | 2000-10-16 | 윤종용 | 액정 표시 장치 제조 방법 및 그 장치 |
| JPH11121170A (ja) * | 1997-10-15 | 1999-04-30 | Tdk Corp | 有機ｅｌ素子およびその製造方法 |
| JP4059968B2 (ja) * | 1997-12-18 | 2008-03-12 | Ｔｄｋ株式会社 | 有機ｅｌ素子の製造方法 |
| JPH11264991A (ja) * | 1998-01-13 | 1999-09-28 | Matsushita Electric Ind Co Ltd | 液晶表示素子の製造方法 |
| JPH11224773A (ja) | 1998-02-09 | 1999-08-17 | Denso Corp | Ｅｌパネルの製造方法およびｅｌパネルへの絶縁流体注入装置 |
| JP2000003783A (ja) | 1998-06-12 | 2000-01-07 | Tdk Corp | 有機ｅｌ表示装置 |
| JP3139462B2 (ja) * | 1998-07-17 | 2001-02-26 | 日本電気株式会社 | 有機薄膜ｅｌデバイスの製造方法 |
| JP3196733B2 (ja) * | 1998-07-24 | 2001-08-06 | 日本電気株式会社 | 液晶表示素子セルのセルギャップ形成方法および装置 |
| JP2000066163A (ja) * | 1998-08-24 | 2000-03-03 | Matsushita Electric Ind Co Ltd | 液晶表示素子の製造方法および基板貼り合わせ装置 |
| JP2000173766A (ja) | 1998-09-30 | 2000-06-23 | Sanyo Electric Co Ltd | 表示装置 |
| JP2000164354A (ja) * | 1998-11-25 | 2000-06-16 | Toyota Motor Corp | Ｅｌ素子の密封方法及びｅｌ素子密封装置 |
| TWI235863B (en) * | 1998-11-30 | 2005-07-11 | Toshiba Corp | Manufacturing method of liquid crystal lattice |
| JP2000193988A (ja) * | 1998-12-25 | 2000-07-14 | Fujitsu Ltd | 液晶表示パネルの製造方法と製造装置 |
| JP2001035654A (ja) | 1999-07-15 | 2001-02-09 | Sony Corp | 表示パネル及びその製造方法 |
| US6833668B1 (en) | 1999-09-29 | 2004-12-21 | Sanyo Electric Co., Ltd. | Electroluminescence display device having a desiccant |
| US6624570B1 (en) * | 1999-09-29 | 2003-09-23 | Sanyo Electric Co., Ltd. | Electroluminescent display device and method for its fabrication |
| JP2001102167A (ja) | 1999-09-29 | 2001-04-13 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置 |
| JP2001155855A (ja) | 1999-11-24 | 2001-06-08 | Toyota Motor Corp | 有機ｅｌ素子の封止方法 |
| TW452952B (en) * | 2000-03-30 | 2001-09-01 | Delta Optoelectronics Inc | Packaging method of electro-luminescent device |
| JP4112779B2 (ja) * | 2000-05-31 | 2008-07-02 | 三星エスディアイ株式会社 | 有機ｅｌ素子の製造方法 |
| JP2003015552A (ja) * | 2001-06-29 | 2003-01-17 | Sanyo Electric Co Ltd | 表示用パネルの製造方法 |
| KR100480819B1 (ko) * | 2002-03-20 | 2005-04-06 | 엘지.필립스 엘시디 주식회사 | 합착기 챔버의 크리닝 방법 |
-
2001
- 2001-06-29 JP JP2001198925A patent/JP4894987B2/ja not_active Expired - Lifetime
-
2002
- 2002-06-07 TW TW091112314A patent/TW587398B/zh not_active IP Right Cessation
- 2002-06-27 US US10/183,785 patent/US7135086B2/en not_active Expired - Lifetime
- 2002-06-28 CN CNB021251614A patent/CN1184520C/zh not_active Expired - Lifetime
- 2002-06-28 KR KR10-2002-0036802A patent/KR100510003B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20030006003A1 (en) | 2003-01-09 |
| CN1184520C (zh) | 2005-01-12 |
| KR100510003B1 (ko) | 2005-08-26 |
| JP2003015538A (ja) | 2003-01-17 |
| US7135086B2 (en) | 2006-11-14 |
| CN1395133A (zh) | 2003-02-05 |
| JP4894987B2 (ja) | 2012-03-14 |
| KR20030003076A (ko) | 2003-01-09 |
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