TW564188B - Apparatus and method for cleaning substrate - Google Patents
Apparatus and method for cleaning substrate Download PDFInfo
- Publication number
- TW564188B TW564188B TW091102081A TW91102081A TW564188B TW 564188 B TW564188 B TW 564188B TW 091102081 A TW091102081 A TW 091102081A TW 91102081 A TW91102081 A TW 91102081A TW 564188 B TW564188 B TW 564188B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- cleaning
- vacuum chuck
- brush
- exposed
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 76
- 238000004140 cleaning Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims description 18
- 230000001680 brushing effect Effects 0.000 claims description 6
- 238000005201 scrubbing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 29
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000005406 washing Methods 0.000 description 3
- 230000002079 cooperative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241001306247 Ophrys sphegodes Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
- Liquid Crystal (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001029397A JP2002233829A (ja) | 2001-02-06 | 2001-02-06 | 基板洗浄装置および洗浄方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW564188B true TW564188B (en) | 2003-12-01 |
Family
ID=18893751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091102081A TW564188B (en) | 2001-02-06 | 2002-02-06 | Apparatus and method for cleaning substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2002233829A (ko) |
| KR (1) | KR100775627B1 (ko) |
| TW (1) | TW564188B (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798034A (zh) * | 2016-04-27 | 2016-07-27 | 芜湖真空科技有限公司 | 玻璃清洗设备 |
| TWI788454B (zh) * | 2017-11-14 | 2023-01-01 | 日商荏原製作所股份有限公司 | 基板處理裝置及基板處理方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007225810A (ja) * | 2006-02-22 | 2007-09-06 | Hoya Corp | スピン洗浄方法及びスピン洗浄装置 |
| KR100876375B1 (ko) | 2007-12-05 | 2008-12-29 | 세메스 주식회사 | 기판 세정 장치 및 그 보정 방법 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5685039A (en) * | 1995-05-12 | 1997-11-11 | Tokyo Electron Limited | Cleaning apparatus |
| EP0898301B1 (en) * | 1997-08-18 | 2006-09-27 | Tokyo Electron Limited | Apparatus for cleaning both sides of a substrate |
| JPH11260783A (ja) * | 1998-03-11 | 1999-09-24 | Oki Electric Ind Co Ltd | 基板洗浄装置 |
-
2001
- 2001-02-06 JP JP2001029397A patent/JP2002233829A/ja not_active Withdrawn
-
2002
- 2002-02-06 KR KR1020020006680A patent/KR100775627B1/ko active IP Right Grant
- 2002-02-06 TW TW091102081A patent/TW564188B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105798034A (zh) * | 2016-04-27 | 2016-07-27 | 芜湖真空科技有限公司 | 玻璃清洗设备 |
| TWI788454B (zh) * | 2017-11-14 | 2023-01-01 | 日商荏原製作所股份有限公司 | 基板處理裝置及基板處理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100775627B1 (ko) | 2007-11-13 |
| JP2002233829A (ja) | 2002-08-20 |
| KR20020065395A (ko) | 2002-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |