TW564188B - Apparatus and method for cleaning substrate - Google Patents

Apparatus and method for cleaning substrate Download PDF

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Publication number
TW564188B
TW564188B TW091102081A TW91102081A TW564188B TW 564188 B TW564188 B TW 564188B TW 091102081 A TW091102081 A TW 091102081A TW 91102081 A TW91102081 A TW 91102081A TW 564188 B TW564188 B TW 564188B
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TW
Taiwan
Prior art keywords
substrate
cleaning
vacuum chuck
brush
exposed
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Application number
TW091102081A
Other languages
Chinese (zh)
Inventor
Futoshi Shimai
Hirotsugu Kumazawa
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Tokyo Ohka Kogyo Co Ltd
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Publication of TW564188B publication Critical patent/TW564188B/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B08B1/32—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

The object is to provide a cleaning apparatus for uniformly cleaning the surface of a large-sized substrate. There is a support member 15 arranged at the position faced to a disk brush 14 while a glass substrate W is interposed. The support member 15 is constituted of a cylinder 16 arranged below the bottom plate 4, a rod 17 penetrating the upper bottom plate 4a and the lower bottom plate 4b and extending upward and three PVA-made roll brushes 19 fit to the rod 17 via a bracket 18.

Description

564188 A7 B7 五、發明説明（，） 【發明領域】 本發明係關於洗淨連結於液晶顯示裝置的玻璃基板等 的表面的裝置及其方法。 【.發明背景】 【習知技藝之說明】 在連結於液晶顯示裝置的玻璃基板形成有TFT陣列 (Array)等。此TFT陣列係在玻璃基板形成光阻（Resist) 膜，以和曝光、蝕刻等的半導體積體電路的形成製程同一 的方法形成。 上述光阻膜係藉由使用旋塗機（Spin coater)等在玻璃 基板表面塗佈光阻液後烘乾而形成，但是，在塗佈光阻液 前必須由玻璃基板表面除去垃圾、異物。 用以除去垃圾的基板洗淨方法有對純水施加超音波噴 出於基板表面，或以高壓朝基板表面噴射離子水的非接觸 式，與將旋轉的圓盤刷子（Disc brush)按壓於基板表面以除 去髒污的非接觸洗淨方法與接觸（刷洗（Scrub))洗淨方法， 惟以非接觸洗淨方法很難除去強固地附著於基板表面的髒 污或夾在圖案（P a 11 e r η)間的異物。 【發明槪要】 因此’需要利用圓盤刷子的刷洗洗淨（接觸洗淨）。此刷 洗洗淨也有在以導銷（Guide pin)等保持基板的周緣部之狀 態下洗淨的機械保持方式，與在藉由真空吸盤（Chuck)保持 本i張尺度適财關家標準（CNS ) M規格（21GX297公董） ' -4- -- (請先閲讀背面之注意事項再填寫本頁)564188 A7 B7 V. Description of the Invention (,) [Field of the Invention] The present invention relates to a device and method for cleaning the surface of a glass substrate or the like connected to a liquid crystal display device. [Background of the invention] [Explanation of the know-how] A TFT array or the like is formed on a glass substrate connected to a liquid crystal display device. This TFT array is formed with a resist film on a glass substrate, and is formed by the same method as a semiconductor integrated circuit formation process such as exposure and etching. The photoresist film is formed by coating a photoresist liquid on the surface of a glass substrate with a spin coater or the like and drying the photoresist liquid. However, it is necessary to remove garbage and foreign matter from the surface of the glass substrate before applying the photoresist liquid. The method for cleaning the substrate to remove garbage includes a non-contact method in which pure water is sprayed on the substrate surface with ultrasonic waves, or ion water is sprayed on the substrate surface with a high pressure, and a rotating disc brush is pressed on the substrate surface. The non-contact cleaning method and the contact (scrub) cleaning method are used to remove dirt, but the non-contact cleaning method is difficult to remove the dirt or the pattern (P a 11 er) that is strongly adhered to the substrate surface. η). [Summary of the invention] Therefore, it is necessary to wash with a disc brush (contact washing). This brush cleaning also includes a mechanical holding method of cleaning while holding the peripheral edge of the substrate with a guide pin or the like, and maintaining this standard with a vacuum sucker (Chuck). ) M specification (21GX297 public director) '-4--(Please read the precautions on the back before filling this page)

、1T 經濟部智慧財產局員工消費合作社印製 564188 A7 _ ___ B7 _ 五、發明説明（2 ) 基板的背面中央的狀態下洗淨的吸附保持方式，前者的機 構複雜並且基板容易由導銷等脫落，基板容易損傷。 (請先閱讀背面之注意事項再填寫本頁) 另一方面，對於使用真空吸盤的吸附保持方式，如最 近若基板尺寸變大的話，由真空吸盤露出的部分也大。而 且，若露出的部分變大的話，該部分因自身重量使朝下方 的撓曲量變大，其結果變成圓盤刷子不接觸，引起洗淨不 均或洗淨不良。 本發明係應改善使用上述真空吸盤的基板洗淨裝置與 洗淨方法所進行的創作。 即與本發明有關的基板洗淨裝置係具備洗淨罩（Cup)、 配置於此洗淨罩內的真空吸盤、刷洗洗淨被此真空吸盤吸 附保持的基板表面之刷子，其中，更於刷子刷洗洗淨由前 述基板的真空吸盤露出的部分時，配設由下方支持該露出 部分的支持構件之構成。 此處，刷洗洗淨基板表面的刷子爲圓盤刷子或滾筒刷 子（Roll brush)的任一個都可以。 經濟部智慧財產局員工消費合作社印製 前述支持構件若爲具備可升降動作的滾筒刷子的話， 在與洗淨基板表面的同時，若對基板背面供給洗淨液的 話，也能進行背面的洗淨。 而且，與本發明有關的基板洗淨方法係以配置於洗淨 罩內的真空吸盤吸附保持基板，在此狀態下使真空吸盤旋 轉，在水平面內使基板旋轉，接觸在水平旋轉的基板表面 旋轉的刷子，以刷洗洗淨基板表面的方法，其中在以前述 刷子刷洗洗淨由該基板的真空吸盤露出的基板表面時，令 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） — 一 -5- 564188 A7 B7 五、發明説明（3 ) 由該真空吸盤露出部分不撓曲而由下方以支持構件支持且 進行刷洗洗淨。 【圖式之簡單說明】 .圖1係與本發明有關的洗淨裝置的全體側面圖。 圖2係由上方看洗淨中的基板的圖。 圖3係圓盤刷子的縱剖面圖。 圖4係支持構件的俯視圖。 圖5係與其他實施例有關的洗淨裝置的全體側面圖。 圖6係由上方看藉由圖5的裝置的洗淨中的基板的 圖。 圖7係與顯示其他實施例之圖6 —樣的圖。 【符號說明】 1:洗淨罩 2:旋轉器軸 3 :真空吸盤 4:底板 4a: 上底板 .4b:下底板 5:背面洗淨噴嘴 6:排氣口 7:導板 8:臂 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） I___：______丨 (請先閲讀背面之注意事項再填寫本頁)Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, 1T 564188 A7 _ ___ B7 _ V. Description of the invention (2) The adsorption and holding method for cleaning in the state of the back of the substrate, the former mechanism is complex and the substrate is easily guided by pins, etc. The substrate is easily damaged due to falling off. (Please read the precautions on the back before filling in this page.) On the other hand, for the adsorption and holding method using a vacuum chuck, if the substrate size becomes larger recently, the exposed part of the vacuum chuck will also be large. Furthermore, if the exposed portion becomes larger, the downward deflection amount of the portion due to its own weight becomes larger, and as a result, the disc brush does not contact, resulting in uneven cleaning or poor cleaning. The present invention is to improve the creation of a substrate cleaning device and a cleaning method using the vacuum chuck. That is, the substrate cleaning device according to the present invention is provided with a cleaning cover (Cup), a vacuum chuck disposed in the cleaning cover, and a brush for cleaning and cleaning the surface of the substrate adsorbed and held by the vacuum chuck. When the part exposed by the vacuum chuck of the said board | substrate is brush-washed and cleaned, the support member which supports this exposed part below is arrange | positioned. Here, the brush for cleaning the surface of the substrate may be any of a disc brush and a roll brush. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, if the supporting member is a roller brush provided with a lifting and lowering operation, the substrate can be cleaned at the same time as the substrate surface and the substrate liquid can be cleaned by supplying a cleaning solution . In addition, the substrate cleaning method according to the present invention uses a vacuum chuck disposed in a cleaning cover to suck and hold a substrate. In this state, the vacuum chuck is rotated, the substrate is rotated in a horizontal plane, and the substrate is rotated in contact with the horizontally rotating substrate surface. Method for cleaning the surface of a substrate by brushing, wherein when cleaning the surface of the substrate exposed by the vacuum chuck of the substrate with the aforementioned brush, the paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) — -5- 564188 A7 B7 V. Description of the invention (3) The exposed part of the vacuum chuck is not deflected, but is supported by the supporting member below, and washed and washed. [Brief Description of the Drawings] FIG. 1 is an overall side view of a cleaning device related to the present invention. FIG. 2 is a view of the substrate being cleaned when viewed from above. Fig. 3 is a longitudinal sectional view of a disc brush. Fig. 4 is a plan view of a supporting member. Fig. 5 is an overall side view of a cleaning device according to another embodiment. Fig. 6 is a view of the substrate during cleaning by the apparatus of Fig. 5 as viewed from above. Fig. 7 is a view similar to Fig. 6 showing another embodiment. [Symbol description] 1: Washing cover 2: Rotator shaft 3: Vacuum chuck 4: Bottom plate 4a: Upper plate. 4b: Lower plate 5: Rear cleaning nozzle 6: Exhaust port 7: Guide plate 8: Arm paper The dimensions are applicable to China National Standard (CNS) A4 specifications (210X297 mm) I___: ______ 丨 (Please read the precautions on the back before filling this page)

、1T 經濟部智慧財產局員工消費合作社印製 -6- 564188 A7 B7 五、發明説明（4 ) 9 :刷洗單元 10:筒體 (請先閲讀背面之注意事項再填寫本頁) 11:旋轉軸 1 2 :洗淨液噴出管 13:夾具 1 4 :圓盤刷子 15:支持構件 16:汽缸 17:桿 18:托架 19、24:滾筒刷子 20:軸 W:玻璃基板 【較佳實施例之詳細說明】 經濟部智慧財產局員工消費合作社印製 以下根據添附圖示說明本發明的實施形態。圖1係刷 洗洗淨基板表面的刷子適用圓盤刷子的洗淨裝置的全體側 面圖，圖2係由上方看洗淨中的基板的圖，圖3係圓盤刷 子的縱剖面圖，圖4係支持構件的俯視圖。 基板洗淨裝置係旋轉器（Spinne「）軸2由下方插入洗淨 罩1內，在此旋轉器軸2的上端配設有真空吸盤3。在此 真空吸盤3的頂面形成有連接於真空幫浦（pump)的開口。 前述旋轉器軸2所貫通的底板4係中央部高周邊部 低，且形成以由上底板4a與下底板4b所構成的內部爲空 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -7- 564188 A7 B7 五、發明説明（5 ) (請先閲讀背面之注意事項再填寫本頁) 洞的雙重構造，在上底板4a配設有對基板W的背面噴出 洗淨液的背面洗淨噴嘴5，在下底板4b形成有連接於減壓 裝置的排氣口 6，在洗淨罩1內的上部內側配設將由玻璃基 板W飛散來的洗淨液導入下方的導板（Guide piate)7。 .而且，在洗淨罩1的上方配設有臂8，在此臂8的前 端安裝有刷洗單元9。前述臂8如圖2所示可在水平面內 擺動，其結果刷洗單元9大致沿著被真空吸盤3吸附保持 的玻璃基板W的對角線移動。此外，臂8不限於擺動，直 線動作也可以。 前述刷洗單元9的具體構造如圖3所示，在筒體1 0的 內側配置有管狀的旋轉軸1 1，洗淨液噴出管1 2面對此旋 轉軸1 1內，在旋轉軸1 1的下端中介夾具（Holder)1 3安裝 有圓盤刷子1 4。 經濟部智慧財產局員工消費合作社印製 另一方面，夾著玻璃基板W，在與圓盤刷子1 4相對的 位置配設有支持構件1 5。此支持構件1 5係由配設於底板4 下方的汽缸16、貫通上底板4a與下底板4b延伸於上方的 桿（R〇d)17、中介托架（Bracket)18安裝於此桿17的三個 PVA製的滾筒刷子1 9所構成。 其軸20被組裝於與玻璃基板W的旋轉方向直交的方 向，俾前述滾筒刷子1 9可追蹤玻璃基板W的旋轉而旋 轉。 此外，雖然附加於支持構件1 5前端的構件不限於滾筒 刷子1 9，惟藉由選擇滾筒刷子1 9不僅支持由玻璃基板W 的真空吸盤露出的部分，藉由供給洗淨液可洗淨背面。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8- 564188 A7 B7 五、發明説明（6) (請先閲讀背面之注意事項再填寫本頁) 在以上中對於洗淨玻璃基板W的表面，首先將玻璃基 板W傳入洗淨罩1內，以真空吸盤3吸附保持玻璃基板W 的底面中央。然後，使臂8旋轉（下降），使汽缸桿1 7上 升，令圓盤刷子1 4接觸玻璃基板W的表面， 滾筒刷子 1 9接觸由玻璃基板W的真空吸盤3露出的部分的底面，由 下支持玻璃基板W同時藉由旋轉器軸2使玻璃基板W水平 旋轉。 與玻璃基板W的水平旋轉同時或稍微早地由洗淨液噴 出管1 2對玻璃基板W的表面供給洗淨液，而且，由背面 洗淨噴嘴5對玻璃基板W的背面供給洗淨液。 然後，繼續低速旋轉旋轉器軸2，在水平面內緩慢地使 玻璃基板W旋轉，並且使臂8擺動或直線動作以刷洗洗淨 玻璃基板W的表面。 然後，使臂8後退由玻璃基板W上拆下圓盤刷子1 4， 降下支持構件1 5的桿1 7，由玻璃基板W的背面隔開滾筒 刷子1 9。 經濟部智慧財產局員工消費合作社印製 然後，再度使旋轉器軸2旋轉進行乾燥處理後，由洗 淨罩1將玻璃基板W傳出到下一製程。 圖5以及圖6係與顯示其他實施例的圖1以及圖2 — 樣的圖，對於此實施例，取代前述實施例的圓盤刷子1 4， 將滾筒刷子24安裝於臂8。 因前述滾筒刷子24的長度太長的話，由基板露出的部 分變多，故與前述圓盤刷子1 4的一邊的長度同程度或如圖 1 7所示，以基板W的短邊的1/2左右。而且，滾筒刷子 本紙張尺度適财®國家料（CNS ) A4規格（210X297公釐) 一~ -9 - 564188 A7 ______B7 五、發明説明（7 ) 24的移動也不限於擺動，如圖7所示以直線動作也可以。 【發明的功效】 如以上說明如果依照本發明，關於洗淨玻璃基板等 因藉由滾筒刷子等由下方支持且以圓盤刷子刷洗洗淨由於 自身重量使撓曲變大的部分，故無發生洗淨不均或洗淨不 良，可對處基板的尺寸變大。 (請先閱讀背面之注A思事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-6T 564188 A7 B7 V. Description of the invention (4) 9: Brushing unit 10: Cylinder (please read the precautions on the back before filling this page) 11: Rotary axis 1 2: Cleaning liquid spouting tube 13: Fixture 1 4: Disk brush 15: Support member 16: Cylinder 17: Rod 18: Bracket 19, 24: Roller brush 20: Shaft W: Glass substrate Detailed description] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, the following describes embodiments of the present invention based on the attached drawings. Fig. 1 is a side view of the entire cleaning device of the disk brush used for cleaning the surface of the substrate brush. Fig. 2 is a view of the substrate being cleaned from above. Fig. 3 is a longitudinal sectional view of the disc brush. Top view of the support member. The substrate cleaning device is a spinner ("Spinne") shaft 2 inserted into the cleaning cover 1 from below, and a vacuum chuck 3 is arranged at the upper end of the spinner shaft 2. The top surface of the vacuum chuck 3 is connected to a vacuum. The opening of the pump. The bottom plate 4 penetrated by the rotator shaft 2 has a high central portion and a low peripheral portion, and the interior formed by the upper bottom plate 4a and the lower bottom plate 4b is empty. (CNS) A4 specification (210X297mm) -7- 564188 A7 B7 V. Description of the invention (5) (Please read the precautions on the back before filling this page) The double structure of the hole is provided on the upper base plate 4a. The back surface cleaning nozzle 5 that sprays the cleaning solution on the back surface of W is provided with an exhaust port 6 connected to a pressure reducing device on the lower bottom plate 4b. The upper and inner sides of the cleaning cover 1 are provided with cleaning from the glass substrate W Guide piate 7 for liquid introduction. Moreover, an arm 8 is arranged above the washing cover 1, and a brushing unit 9 is installed at the front end of the arm 8. The aforementioned arm 8 can be mounted on the The horizontal plane oscillates, and as a result, the brushing unit 9 is sucked by the vacuum chuck 3 substantially along The held glass substrate W moves diagonally. In addition, the arm 8 is not limited to swing, and a linear motion is also possible. The specific structure of the brushing unit 9 is shown in FIG. 3, and a tubular rotating shaft is arranged inside the cylinder 10. 1 1. The cleaning liquid ejection tube 1 2 faces the rotating shaft 1 1, and a disc brush 1 4 is installed at the lower end of the rotating shaft 1 1. A stamp is printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. On the other hand, a support member 15 is disposed at a position opposite to the disc brush 14 between the glass substrate W. The support member 15 is formed by a cylinder 16 disposed below the bottom plate 4 and penetrating the upper bottom plate 4a. A rod (Rod) 17 and an intermediate bracket (Bracket) 18 extending above the lower base plate 4b are composed of three PVA roller brushes 19 mounted on the rod 17. The shaft 20 is assembled with a glass substrate In the direction orthogonal to the rotation direction of W, the aforementioned roller brush 19 can rotate while tracking the rotation of the glass substrate W. In addition, although the member attached to the front end of the support member 15 is not limited to the roller brush 19, the roller brush 1 is selected by 9 Not only supports vacuum chucks made of glass substrate W The exposed part can be cleaned by supplying the cleaning solution. The paper size applies the Chinese National Standard (CNS) A4 (210X297 mm) -8- 564188 A7 B7 V. Description of the invention (6) (Please read the back first For the matters needing attention, fill in this page again.) In the above, for cleaning the surface of the glass substrate W, the glass substrate W is first introduced into the cleaning cover 1 and the bottom center of the glass substrate W is held by the vacuum chuck 3. Then, the arm 8 Rotate (down) to raise the cylinder rod 17 so that the disc brush 14 contacts the surface of the glass substrate W, and the roller brush 19 contacts the bottom surface of the portion exposed by the vacuum chuck 3 of the glass substrate W and supports the glass substrate from below W simultaneously rotates the glass substrate W by the spinner shaft 2. At the same time or slightly earlier as the horizontal rotation of the glass substrate W, the cleaning liquid is supplied from the cleaning liquid discharge pipe 12 to the surface of the glass substrate W, and the rear surface cleaning nozzle 5 is used to supply the cleaning liquid to the rear surface of the glass substrate W. Then, the spinner shaft 2 is continuously rotated at a low speed, the glass substrate W is slowly rotated in a horizontal plane, and the arm 8 is swung or moved in a straight line to scrub and clean the surface of the glass substrate W. Then, the arm 8 is moved backward, the disk brush 14 is removed from the glass substrate W, the lever 17 of the supporting member 15 is lowered, and the roller brush 19 is separated by the back surface of the glass substrate W. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. After rotating the spinner shaft 2 again for drying, the cleaning cover 1 transfers the glass substrate W to the next process. 5 and 6 are diagrams similar to FIG. 1 and FIG. 2 showing other embodiments. In this embodiment, instead of the disc brush 14 of the foregoing embodiment, a roller brush 24 is mounted on the arm 8. If the length of the roller brush 24 is too long, the exposed portion of the substrate increases. Therefore, the length of one side of the disk brush 14 is the same as the length of one side of the disk brush 14 or as shown in FIG. 2 or so. In addition, the roller brush paper size is suitable for China® (CNS) A4 specification (210X297 mm) 1 ~ -9-564188 A7 ______B7 V. Description of the invention (7) 24 The movement of 24 is not limited to swing, as shown in Figure 7 It is also possible to move in a straight line. [Effects of the Invention] As described above, according to the present invention, the cleaning of glass substrates and the like is supported by a roller brush or the like from below and the disk brush is used to wash and clean the portion that has a large deflection due to its own weight. Uneven cleaning or poor cleaning results in a large substrate size. (Please read Note A on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

-10--10-

Claims (1)

經濟部智慧財產局員工消費合作社印製 56樹竭8)2081號專利申請案 Ϊ8 中文申請專利範圍修正本民國91年4月修正g88 >、中¥^利範圍 JL 年 Λ * ,cv\ v〇\ 1 一，一—^一一- \ 1 · 一種基板洗淨裝置，包含： 洗淨罩； 配置於此洗淨罩內的真空吸盤；以及 刷洗洗淨被此真空吸盤吸附保持的基板表面之刷子， 其特徵爲： 此基板洗淨裝置於該刷子刷洗洗淨由該基板的真空吸 盤露出的部分時，配設由下方支持該露出部分的支持構 件。 2 ·如申請專利範圍第1項所述之基板洗淨裝置，其中 該支持構件爲具備可升降動作的滾筒刷子。 3 . —種基板洗淨方法，係以配置於洗淨罩內的真空吸 盤吸附保持基板，在此狀態下使真空吸盤旋轉，在水平面 內使基板旋轉，接觸在水平旋轉的基板表面旋轉的刷子， 以刷洗洗淨基板表面的方法，其特徵爲： 在以該刷子刷洗洗淨由真空吸盤露出的基板表面時， 令由該基板的真空吸盤露出的部分不撓曲而由下方以支持 構件支持且進行刷洗洗淨。 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇><297公* ) (請先閲讀背面之注意事項再填寫本頁)Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, the Consumer Cooperative Cooperative, printed 56) 8) 2081 Patent Application Ϊ8 Chinese Patent Application Amendment Amendment g88 > in April of the Republic of China, ^ ¥ profit range JL year Λ *, cv \ v 〇 \ 1 一 — ^ 一一-\ 1 · A substrate cleaning device comprising: a cleaning cover; a vacuum chuck disposed in the cleaning hood; and scrubbing and cleaning the surface of the substrate adsorbed and held by the vacuum chuck The brush is characterized in that: the substrate cleaning device is provided with a supporting member for supporting the exposed portion from below when the brush cleans and cleans a portion exposed by the vacuum chuck of the substrate. 2. The substrate cleaning device according to item 1 of the scope of patent application, wherein the supporting member is a roller brush provided with a lifting action. 3. A substrate cleaning method is to suck and hold the substrate with a vacuum chuck arranged in the cleaning cover, and in this state, rotate the vacuum chuck, rotate the substrate in a horizontal plane, and contact the brush rotating on the surface of the substrate that rotates horizontally. A method for cleaning and cleaning the surface of a substrate by brushing is characterized in that: when the surface of the substrate exposed by the vacuum chuck is cleaned and washed with the brush, the part exposed by the vacuum chuck of the substrate is not deflected and is supported by the supporting member below and Wash and wash. This paper size applies Chinese National Standard (CNS) A4 specification (21〇 > < 297g *) (Please read the precautions on the back before filling this page)
TW091102081A 2001-02-06 2002-02-06 Apparatus and method for cleaning substrate TW564188B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105798034A (en) * 2016-04-27 2016-07-27 芜湖真空科技有限公司 Glass cleaning equipment
TWI788454B (en) * 2017-11-14 2023-01-01 日商荏原製作所股份有限公司 Substrate processing apparatus and substrate processing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007225810A (en) * 2006-02-22 2007-09-06 Hoya Corp Spin washing method and spin washing device
KR100876375B1 (en) 2007-12-05 2008-12-29 세메스 주식회사 Wafer cleaning apparatus and correcting method of the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100213992B1 (en) * 1995-05-12 1999-08-02 히가시 데쓰로 Cleaning apparatus
DE69835988T2 (en) * 1997-08-18 2007-06-21 Tokyo Electron Ltd. Double side cleaning machine for a substrate
JPH11260783A (en) * 1998-03-11 1999-09-24 Oki Electric Ind Co Ltd Substrate cleaning equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105798034A (en) * 2016-04-27 2016-07-27 芜湖真空科技有限公司 Glass cleaning equipment
TWI788454B (en) * 2017-11-14 2023-01-01 日商荏原製作所股份有限公司 Substrate processing apparatus and substrate processing method

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KR100775627B1 (en) 2007-11-13
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