TWI223850B - Substrate cleaning apparatus and substrate cleaning method - Google Patents
Substrate cleaning apparatus and substrate cleaning method Download PDFInfo
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- TWI223850B TWI223850B TW090104090A TW90104090A TWI223850B TW I223850 B TWI223850 B TW I223850B TW 090104090 A TW090104090 A TW 090104090A TW 90104090 A TW90104090 A TW 90104090A TW I223850 B TWI223850 B TW I223850B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
Description
1223850 A7 B7 五、發明說明（1 ) 本發明係有關一種使用毛刷洗淨被處理基板之基板洗 淨裝置及基板洗淨方法。 在液晶顯示器（LCD)或半導體元件之製程中，係以被處 理基板（LCD基板、半導體晶圓等）之表面處於潔淨狀態為 前提而進行各精密加工。為此，於進行各加工處理前或是 於各加工處理間空檔時進行基板表面之洗淨，諸如在微影 程序中，先於塗佈光阻前以被稱為擦洗器（scrubber)之刷淨 裝置進行擦洗或刷洗基板表面。 頁 4 通常’在這種刷淨裝置中，係一面將毛刷接觸於基板表 面磨擦’ 一面以一定方向或路徑移動（掃描）進行洗務。因 毛刷之故，使基板表面擦去之異物（塵埃、破片、污染物等） 之一部份殘留在基板上。因此，在裝置内做為固持基板用 之固持機構係使用可做旋轉之旋轉夾盤，於擦淨後驅動旋 轉夾盤旋轉，使基板一面旋轉，由洗淨液喷嘴將洗淨液喷 向基板表面（沖吹洗淨），洗去基板上之異物。之後，於沖 u人洗淨後’在旋轉夾盤以高速旋轉基板，藉離心力將殘留 於基板上之洗淨液甩乾’再使基板表面乾燥。 迄今’ LCD基板用之刷淨裝置中，係將用以載置基板 並將之固持之旋轉夾頭之夾盤形成比基板大一圈之矩形形 狀，憑藉諸如直立裝設或突出裝設於此矩形夾盤四角落之 各一對保持銷由兩側（兩邊）夾住基板角，而將基板固持於 夾盤上方者。現幾乎已不採用真空吸附式之圓形夾盤了。 其理由在於：在可載置LCD基板全面並將之固持之真空吸 附式圓形夾盤，係具有基板對角線距離以上之直徑，使梦 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 發明說明（2) 造成本明顯地增加者。此匕外’纟僅載i LCD基板一部份諸 如只載置中心部並加以固持之真空吸附式之圓形夾盤:則 無法將清洗毛刷按壓在由基板夾盤超出之部份上，因此會 產生無法貫施擦洗不便之問題。 但’即使使用前述之機械式夾盤，也因在基板角部附近 :基板表面突出之保持銷之故，而有妨礙毛刷之移動或掃 “之虞’造成對基板肖落部無法充分進行刷淨，以及進行 擦洗時無法使毛刷由待機位置迅速且安全地進人基板上^ 問題存在。 【發明之概要】 本發明係有I監於前述之習知技術之問題點而所構建成 者:其目的在於提供一種基板洗淨裝置及基板洗淨方法， 二係使用u毛刷與被處理基板相互摩擦洗淨基板表面之刷 >尹處理以低成本且安全並確實地執行者。 又，本發明之目的係提供-種基板洗淨裝置及基板洗淨 方法’其係使進行刷洗處理及喷吹洗淨液以洗淨基板表面 之賀洗處理2階段洗淨步驟之複合型洗淨處理，使其洗淨 處理效率及處理品質提昇者。 種基板洗淨裝置及基板洗 毛刷可迅速且安全地接近 進而，本發明之目的係提供一 淨方法，其係使於刷淨處理時， 基板，以使洗淨處理效率提高者 為達成前述目的，本發明之基板洗淨裝置係構建成：包 3有：―固持機構，係用以載置被處理基板之職部位， 且以吸著力固持該基板者；一支撐機構，係用 !22385〇 五、 發明說明（ 撐前述基㈣Μ述固持機構相之部分者； 機構，其係具有一毛刷，其係用 / 烁取/无淨則逃固持機槿 所固持且由前述支撐機構所支撐之 孖钺構 曰 又访炙别述基板表面者；及一 幵降裝置’係用以使前述支禮機谨 昇降移動者。 支拉機構相對於—持機構作 又，本發明之基板洗淨方法係具有：第，係㈣ 处理基板配置於第1位置者；第2步驟，係擦拭洗淨支樓 於前述第i位置之被處理基板表面者；第3步驟，係使前 述基板之至少一部份由前述第“立置朝第2位置改變位置 者；及，第4步驟，在前述第2位置對前述基板表面吹附 洗淨液並加以洗淨者。 在本發明之基板洗淨裝置中，也可將固持機構之基板載 置面製成比被處理基板小之大小。因固持裝置係以吸附力 保持基板之故，所以不需要由基板表面上突出般之固持構 件。基板超出固持機構外側之部份（超出部）係按壓毛刷 時，可藉支撐機構由下朝上支撐，因此可施以與基板載置 於固持機構之部分（非超出部）同等安定程度之刷淨。在刷 淨開始前或俟結束後，昇降機構使支撐機構相對於固持機 構作下降，可使基板超出部解除藉支撐構件之支撐。 在本發明之基板洗淨裝置中也可構造成具有一毛刷移 运機構’其係用以使前述毛刷相對於不需承受前述支撐機 構之支撐且因重力而使該超出部朝下彎斜之前述基板，通 過前述超出部上方，並由預定待機位置進入前述基板上方 者0 -------------------訂 --------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -6 - 1223850 A7 B7 五、發明說明（4 慧 員 費 印 “在!3此構造中’因為基板超出固持機構外側之部分(超 =)叉重力_曲而朝邊緣降低，所以使毛刷自該超出部之 1緣進入基板上方，可使毛刷水平移動並使其迅速且安全 的進入基板上方。然後，於4刖—八％ 料m 進入後，昇降機構係 :支撐機構相對於固持機構做相對上昇(以使固持機構之基板载置面與支撐機構之支撐面約為同一高度者為佳），使 支撐構件由下支撑基板之超出部，可使毛刷立即動作。 在本發明之基板洗淨裝置中也可構建成具有-第2洗淨機構，其係用以對前述固持機構所固持之基板表面噴吹 洗淨液，以進行洗淨者，進而也可包含有—旋轉驅動機構， 其係與前述固持機構做機械式連接，且可於依前述第2洗 淨機構所進行之洗淨處理的當中，使前述基板與前述固持 機構一同旋轉者。 在如此構造中，也可在第2洗淨機構動作時，藉昇降裝 置解除支撐構件對基板超出部之支撐，以重力將超出部朝 下管者。藉此，使供予基板表面洗淨之洗淨液易由基板上 滴洛下來，提幵洗淨效果。 【發明之實施形態】 以下’參照附圖說明本發明之實施形態。 第1圖係用以顯示本發明之基板洗淨方法或裝置可適 用之構成例之塗佈顯影處理系統。此塗佈顯影處理系統2 设置於潔淨室内，將諸如LCD基板為被處理基板，於lcd 製程中之顯影微刻程序中進行洗淨、塗佈光阻液、預烘烤、 顯影及後烘烤之各種處理。曝光處理係由設置於鄰接此系 訂 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱 1223850 A7 B7 五、發明說明（5 ) 統之外部曝光裝置（未圖示）進行之。 (請先閱讀背面之注意事項再填寫本頁) 此塗佈顯影處理系統之構成大略分為卡匣（C/S) 10、處 理站（P/S)12及界面部（I/F)14。 設置於系統一端之卡匣（C/S)10係包含有：卡匣台16， 其係可載置一定數諸如4個為止之可收納數基板G之卡匣 C，及對此台12上之卡匣C進行取送基板G之搬送機構 20。該搬送機構20係具有可保持基板G之裝置諸如搬送 臂，可以X、Y、Z、0 4軸動作，可進行後述之處理站（P/S)12 側之搬送裝置3 8與基板G之交付者。 處理站（P/S)12，自前述卡匣（C/S)10側開始，以基板中 繼部23、藥液供給25及空間27為中介（隔著）依序設置有 橫向一列之洗淨處理部22、塗佈處理部24、顯影處理部 26 〇 洗淨處理部22係包含有以下裝置：2個刷淨單元 (SCR)28、上下2段之紫外線照射/冷卻單元（UV/COL)30、 加熱單元（HP)32及冷卻裝置（COL)34。 經濟部智慧財產局員工消費合作社印製 塗佈處理部24係包含有以下裝置：光阻液塗佈單元 (CT)40、真空乾燥單元（VD)42、邊界移動單元（ER)44、上 下2段式附著/冷卻單元（AD/COL)46、上下2段式加熱/冷 卻單元（HP/COL)48及加熱單元（HP)50。 顯影處理部26係包含有3個顯影單元（DEV)52、2個上 下2段式加熱/冷卻單元（HP/COL)54及加熱單元（HP)56。 在各處理部22、24、26中央部沿長向裝設搬送路36、 52、58，主搬送裝置38、54、60係沿著各搬送路移動而接 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 12238501223850 A7 B7 V. Description of the invention (1) The present invention relates to a substrate cleaning device and a substrate cleaning method for cleaning a substrate to be processed using a brush. In the manufacturing process of liquid crystal displays (LCDs) or semiconductor devices, precision processing is performed on the premise that the surface of the substrate to be processed (LCD substrate, semiconductor wafer, etc.) is clean. For this reason, the surface of the substrate is cleaned before each processing or when the processing space is empty. For example, in the lithography process, before the photoresist is applied, it is called a scrubber. The cleaning device scrubs or scrubs the surface of the substrate. Page 4 Generally, in this type of cleaning device, the brush is moved to a certain direction or path (scanning) for cleaning while the brush is brought into contact with the surface of the substrate and rubbed. Due to the brush, part of the foreign matter (dust, fragments, contaminants, etc.) wiped off the substrate surface remains on the substrate. Therefore, as the holding mechanism for holding the substrate in the device, a rotating chuck that can be rotated is used. After cleaning, the rotating chuck is driven to rotate to rotate the substrate, and the cleaning liquid is sprayed onto the substrate by the cleaning liquid nozzle. Surface (wash and rinse) to remove foreign matter from the substrate. Then, after washing, the substrate is rotated on the chuck at a high speed, and the cleaning solution remaining on the substrate is dried by centrifugal force, and then the surface of the substrate is dried. To date, in the cleaning device for LCD substrates, the chuck of the rotary chuck for holding the substrate and holding it is formed into a rectangular shape larger than the substrate, and is installed here by means of upright or protruding installation. Each pair of retaining pins at the four corners of the rectangular chuck clamps the corner of the substrate from both sides (two sides), and holds the substrate above the chuck. Nowadays, the circular chuck of vacuum suction type is almost no longer used. The reason is that the vacuum suction circular chuck that can hold and hold the LCD substrate in its entirety has a diameter above the diagonal distance of the substrate, so that the paper size of the dream paper applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) Description of the invention (2) Causes a significant increase in cost. This dagger only contains a part of the LCD substrate, such as a vacuum suction-type circular chuck that only holds the center part and is held: it is not possible to press the cleaning brush on the part beyond the substrate chuck. Therefore, inconvenience of inconvenient scrubbing may occur. However, 'even if the aforementioned mechanical chuck is used, it is near the corners of the substrate: the retaining pins protruding from the surface of the substrate may prevent the brush from moving or sweeping, and may not sufficiently perform the substrate drop-out portion. There is a problem that the brushes cannot be quickly and safely entered into the substrate from the standby position when scrubbing. [Summary of the Invention] The present invention is constructed by monitoring the problems of the conventional technology described above. The purpose is to provide a substrate cleaning device and a substrate cleaning method. The second line is a brush that rubs and cleans the substrate surface with a U brush and the substrate to be processed. Yin processing is performed at low cost, safely and reliably. In addition, the object of the present invention is to provide a substrate cleaning device and a substrate cleaning method, which are two-stage cleaning steps of a two-stage cleaning step in which a brushing process and a cleaning liquid are sprayed to clean the substrate surface. Cleaner, which can improve the cleaning process efficiency and quality. A substrate cleaning device and a substrate cleaning brush can be quickly and safely approached. Furthermore, the object of the present invention is to provide a clean method, which is In the cleaning process, the substrate is used to improve the efficiency of the cleaning process. In order to achieve the aforementioned purpose, the substrate cleaning device of the present invention is constructed as follows: Package 3 includes:-a holding mechanism for mounting the substrate to be processed And holding the substrate with a suction force; a support mechanism is used! 22385505. Description of the invention (supports the aforementioned part of the holding mechanism phase; mechanism, which has a brush, which is used for / Shuo take / No clean, escape the fixed structure held by the hibiscus and supported by the aforementioned support mechanism, and then visit the surface of other substrates; and a lowering device 'is used to make the aforementioned gift machine lift The supporting and pulling mechanism is relative to the holding mechanism, and the substrate cleaning method of the present invention includes: first, the processing substrate is disposed at the first position; and the second step is cleaning and cleaning the supporting structure at the aforementioned first the surface of the substrate to be processed at the i position; the third step is to change the position of at least a part of the substrate from the "vertical position" to the second position; and the fourth step is to align the substrate at the second position Blow cleaning solution on the surface and In the substrate cleaning device of the present invention, the substrate mounting surface of the holding mechanism can be made smaller than the substrate to be processed. Since the holding device holds the substrate with an adsorption force, it is not necessary A holding member protruding from the surface of the substrate. The portion of the substrate beyond the outside of the holding mechanism (excess) is pressed from the bottom to the top by the support mechanism, so it can be placed on the holding mechanism with the substrate. Some (non-excess) brushes are equally stable. Before and after the cleaning is started, the lifting mechanism lowers the supporting mechanism relative to the holding mechanism, so that the substrate excess can be released from the support by the supporting member. In the present invention The substrate cleaning device may also be configured with a brush transporting mechanism, which is used to make the aforementioned brush relative to the aforementioned device that does not need to bear the support of the supporting mechanism and the excess portion is bent downward due to gravity. The substrate passes through the above-mentioned overhang portion and enters the above-mentioned substrate from a predetermined standby position. 0 ------------------- Order --------- (Please Read the notes on the back before filling Page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs-6-1223850 A7 B7 V. Description of the invention (4 Wisdom fee printed "in! 3 in this structure 'because the substrate exceeds the outside of the holding mechanism (extra =) fork gravity It lowers toward the edge, so that the brush enters the substrate from one edge of the overhang portion, which can move the brush horizontally and make it quickly and safely enter the substrate. Then, after 4 刖 —8% of the material enters, the lifting mechanism is: the supporting mechanism is relatively raised relative to the holding mechanism (so that the substrate mounting surface of the holding mechanism and the supporting surface of the supporting mechanism are about the same height) By making the supporting member from the overhang portion of the lower supporting substrate, the brush can be moved immediately. The substrate cleaning device of the present invention may be constructed to have a second cleaning mechanism, which is configured to spray a cleaning solution on the surface of the substrate held by the holding mechanism to perform cleaning, and may further include Yes-Rotary drive mechanism, which is mechanically connected to the holding mechanism, and can rotate the substrate together with the holding mechanism during the cleaning process performed by the second cleaning mechanism. In this structure, when the second cleaning mechanism is operated, the support member can be used to release the support of the substrate overhang portion by the lifting device, and the overhang portion can be directed downward by gravity. Thereby, the cleaning liquid for cleaning the surface of the substrate is easily dripped from the substrate, thereby improving the cleaning effect. [Embodiments of the invention] Hereinafter, embodiments of the invention will be described with reference to the drawings. Fig. 1 is a coating development processing system showing a configuration example applicable to the substrate cleaning method or apparatus of the present invention. This coating and development processing system 2 is set in a clean room. The LCD substrate is a substrate to be processed, and it is washed, coated with photoresist, pre-baked, developed, and post-baked in a development micro-etching process in the LCD process. Of various processing. Exposure processing is performed by an external exposure device (not shown) that is set adjacent to this series of 4 paper sizes that apply Chinese National Standard (CNS) A4 specifications (210 X 297 Public Love 1223850 A7 B7). 5. Description of the invention (5) (Please read the precautions on the back before filling this page) The composition of this coating and development processing system is roughly divided into cassette (C / S) 10, processing station (P / S) 12 and interface (I / F) ) 14. The cassette (C / S) 10 set at one end of the system includes: a cassette table 16 which can hold a certain number of cassettes C, such as four, which can accommodate a number of substrates G, and The cassette C on the table 12 carries a transfer mechanism 20 for transferring the substrate G. The transfer mechanism 20 is provided with a device capable of holding the substrate G, such as a transfer arm, which can move in X, Y, Z, and 0 axes, and can perform processing described later Station (P / S) 12 side conveying device 38 and the delivery of substrate G. Processing station (P / S) 12 starts from the aforementioned cassette (C / S) 10 side, with substrate relay section 23, medicine The liquid supply 25 and the space 27 are intermediary (separated), and a cleaning processing section 22, a coating processing section 24, and a developing processing section 26 in a horizontal row are sequentially provided. The management unit 22 includes the following devices: two brushing units (SCR) 28, two UV irradiation / cooling units (UV / COL) 30 above and below, heating units (HP) 32, and cooling units (COL) 34. Economy The Department of Intellectual Property Bureau's Consumer Cooperative Cooperative Printing and Coating Processing Department 24 contains the following devices: photoresist coating unit (CT) 40, vacuum drying unit (VD) 42, boundary moving unit (ER) 44, upper and lower 2 sections AD / COL unit 46, 2-stage heating / cooling unit (HP / COL) 48, and heating unit (HP) 50. The developing unit 26 includes three developing units (DEV) 52, Two vertical and two-stage heating / cooling units (HP / COL) 54 and heating units (HP) 56. In the central part of each processing section 22, 24, 26, transport paths 36, 52, and 58 are installed in the longitudinal direction, and the main transport The devices 38, 54, and 60 are moved along each conveying path, and the paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 1223850
經濟部智慧財產局員工消費合作社印製 五、發明說明（6) 近於各處理部内之各單元，進行基板G之搬入/搬出或是搬 送者。又，在此系統中，在各處理部22、24、26中，於搬Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (6) Those who are in / out of each processing unit and who carry in or out of the substrate G. Moreover, in this system, in each of the processing sections 22, 24, and 26,
送路36、52、58 —邊配置自旋系之單元（SCR、CT、dEV 等），另一邊配置有熱處理系之單元（Hp、c〇L等）。 設置於系統另一端部之界面部（I/F)14係鄰接於處理站 12之處裝設延伸（基板交付部）57及緩衝站56，並於與曝光 裝置鄰接之處裝設搬送機構59。 第2圖系用以顯示於此塗佈顯影處理系統之處理順 序。首先，在卡匣站（C/S)1〇中，搬送機構2〇係由台12 上規疋的卡匣C中取出1片基板G，將之交付於處理站（p/s) I2中洗淨處理部22之搬送裝置38(步驟S1)。 於洗淨處理部22，基板G係首先依序地搬入紫外線照 射/冷卻單元（UV/COL)30，在最初之紫外線照射單元（uv) 中依紫外線照射實施乾式洗淨，接著在下一個冷卻單元 (COL)冷卻至預定溫度（步驟s2)。在此紫外線洗淨主要係 為除去基板表面之有機物。 接著，基板G在刷淨單元（SCR)28中之一個裝置接受刷 拭洗淨處理，從基板表面除去粒子狀之污垢（步驟S3)。經 刷拭洗淨處理後，基板G係依加熱單元（Hp)32加熱接受脫 水處理（步驟S4)，接著在冷卻單元（COL)34冷卻至規定之 基板溫度（步驟S5)。如此在洗淨處理部22結束前處理，基 板G係藉主搬送裝置38以基板交付部23為中介搬送至塗 佈處理部24。 在塗佈處理部24中，基板G係首先依序地搬入附著/ -----------•裝--------tr_ 卜------- (請先閱讀背面之注意事項再填寫本頁)Sending paths 36, 52, 58-one side is equipped with spin system units (SCR, CT, dEV, etc.), and the other side is equipped with heat treatment system units (Hp, coL, etc.). The interface section (I / F) 14 provided at the other end of the system is provided with an extension (substrate delivery section) 57 and a buffer station 56 adjacent to the processing station 12, and a transfer mechanism 59 is provided adjacent to the exposure device. . Figure 2 shows the processing sequence of the coating and development processing system. First, in the cassette station (C / S) 10, the transfer mechanism 20 removes one substrate G from the cassette C on the table 12 and delivers it to the processing station (p / s) I2. The conveying device 38 of the washing processing unit 22 (step S1). In the cleaning processing section 22, the substrate G is firstly sequentially carried into an ultraviolet irradiation / cooling unit (UV / COL) 30, and the first ultraviolet irradiation unit (uv) is subjected to dry cleaning by ultraviolet irradiation, and then the next cooling unit (COL) is cooled to a predetermined temperature (step s2). The ultraviolet cleaning here is mainly to remove organic matter on the surface of the substrate. Next, the substrate G is subjected to a brush cleaning process in one of the cleaning units (SCR) 28 to remove particulate dirt from the substrate surface (step S3). After the brush cleaning process, the substrate G is heated and dewatered by the heating unit (Hp) 32 (step S4), and then cooled to the predetermined substrate temperature in the cooling unit (COL) 34 (step S5). In this way, before the end of the cleaning processing section 22, the substrate G is transferred to the coating processing section 24 by the main transfer device 38 with the substrate transfer section 23 as an intermediary. In the coating processing unit 24, the substrate G is firstly sequentially moved in and attached / ----------- • installation -------- tr_ Bu ------- (Please (Read the notes on the back before filling out this page)
1223850 A7 B7 五、發明說明（7) (請先閱讀背面之注意事項再填寫本頁) 冷卻單元（AD/COL)46，在最初之附著單元（AD)接受疏水化 處理（HMDS)(步驟S6)，在下個冷卻單元（COL)冷卻至規定 之基板溫度（步驟S7)。 之後，基板G在光阻塗佈單元（CT)40塗佈光阻液，接 著在減壓乾燥單元（VD)42藉減壓接受乾燥處理，然後在邊 界移動單元（ER)44除去基板周邊部份多餘（不要）之光阻液 (步驟S8)。 接著，基板G再依序搬入加熱/冷卻單元（HP/COL)48， 在最初之加熱單元（HP)進行塗佈後之烘烤（預烘烤）（步驟 S9)，接著在冷卻單元（COL)冷卻至規定之基板溫度（步驟 S10)。又，也可在這塗佈後之烘烤程序中使用加熱單元 (HP)50。 經濟部智慧財產局員工消費合作社印製 基板G係於前述塗佈處理後，藉塗佈處理部24之主搬 送裝置54與顯影處理部26之主搬送裝置60搬送至界面部 (I/F)14，從界面部（I/F)14之處交付至曝光裝置（步驟S11)。 在曝光裝置中於基板G上之光阻進行曝光規定之電路圖 案。然後，結束圖案曝光之基板G再由曝光裝置交還至界 面部（I/F) 14。界面部（I/F) 14之搬送機構59係將從曝光裝 置領取之基板G以延伸裝置57為中介交付至處理站 (P/S)12中之顯影處理部26(步驟S11)。 在顯影處理部26，基板G係在顯影單元（DEV)52中之 一個接受顯影處理（步驟S12)，接著依序搬入加熱/冷卻單 元（HP/COL)55中的一個裝置内，在最初的加熱單元（HP) 進行後烘烤（步驟S13)，接著在冷卻單元（COL)冷卻至預定 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -10- 1223850 A7 元 五、發明說明（8 ) 之基板溫度（步驟Sl4)。也可在後烘烤程序中使用加熱單 (HP)53 〇 在顯影處理部26結束一連串的處理後之基板G係藉處 理站（P/S)24内之搬送裝置6〇、54、％送還至卡昆站 (c/s)io，在那裡依搬送機構2〇收納至其中一個卡匣c(步 驟 S1)。 在此塗佈顯影處理系統中，本發明也適用於刷淨單元 (SCR)28。以下，用第3圖至第7圖說明本發明適用於刷 淨單元（SCR)28之實施形態。 如第3圖所示，本實施形態之刷淨單元（SCR)28係具有 底座之外设或外箱6 0，於此箱6 0之中央部裝設有旋轉型 之刷淨裝置62。 刷淨裝置62之構成，基本上係包含有做為處理容器機 能之杯64、裝設於此杯64内側處之基板支撐機構66，及 設置於杯64内且可自由出入之洗淨機構丨丨〇所構建而成 者。 基板支撐機構66之構成係包含有旋轉夾盤68，其係以 真空吸附基板G並保持其可旋轉並昇降，及在此旋轉夾盤 68之周圍為由下支撐基板〇且可昇降之基板支撐部7〇。 方疋轉夾盤6 8係具有，直徑比基板G之較短一邊短且幾 為水平面之圓形夾盤底盤72。基板G係僅對應於此夾盤底 盤72形狀及面積之基板中心付近之規定部份載置於夾盤 底盤72上，此外也就是外側部分（超出部份）Gd則呈現出 從夾盤底盤72超出於半徑方向外側之情況。 本紙張尺度過用甲國國家標準（CNS)A4規格（21〇 χ 297公釐） ·裝-------- 訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -11 - 1223850 A7 B7 五、發明說明（9 ) 部 智 慧 局 員 工 消 費 合 作 社 印 在夾盤底盤72内部中心部份於垂直方向固定有延伸旋 轉支撐軸74之上端部，此旋轉支撐軸74之下端部係由裝 設於驅動部76内之旋轉驅動部諸如電力馬達（未圖示）结合 而動作。藉該電力馬達之旋轉驅動以旋轉支撐轴Μ為中 介，成為一體之夾盤底般7? &瓜72及吸付固定於此夾盤底盤72 上之基板G以預定速度旋轉。 於驅動部76内部，為使夹盤底盤72昇降移動，也裝設 有諸如由汽缸所構成之第1昇降驅動部（未圖示）。於基板 G之搬入/搬出時，第！昇降驅動部於垂直上方僅藉規定之 衝，將旋轉㈣軸74舉起，如第3圖所示，夾盤底盤Μ 上昇至規定之同度位置Hb，而形成與主搬送裝置叫第1 圖）之間進行基板G之交付。於穩定時或洗淨時（第5圖）， 第1昇降驅動部係將旋轉支撐軸74下降至原點位置，夹盤 底盤72係被設定於基準之高度位置。 如第4圖所示，於夾盤底盤72上面有同心圓狀之溝72a ，放射狀之溝72b交差（接續）形成之，這些溝則相通於規 定之位置’諸如於夾盤中心、部以貫通爽盤底盤72及旋轉支 撐軸74 而形成之空氣通路為中介通向負壓源諸如真 空幫浦。將基板G載置在失盤底盤72上面時，則從負壓 源之真空給予至各溝72a、72b，由各溝所給予 之真^吸引力作用於基板G之裏面’使基板g成固定保持 之狀態。 基板支揮部70係具有與基板幾乎同形狀、同尺寸剛硬 體之水平支撐板78。與此水平支撐板78對應於夹盤底盤 頁 訂 雅 4 本紙張尺度姻中_家標準（CNS)A4規格（21() χ挪公爱 -12 - 1223850 A71223850 A7 B7 V. Description of the invention (7) (Please read the precautions on the back before filling out this page) Cooling unit (AD / COL) 46. The initial attachment unit (AD) is subjected to hydrophobic treatment (HMDS) (step S6) ), Cooling to the predetermined substrate temperature in the next cooling unit (COL) (step S7). After that, the substrate G is coated with a photoresist liquid on a photoresist coating unit (CT) 40, and then subjected to a drying treatment under reduced pressure in a reduced pressure drying unit (VD) 42, and then the peripheral portion of the substrate is removed in a boundary moving unit (ER) 44 Excess (unwanted) photoresist (step S8). Next, the substrate G is sequentially carried into the heating / cooling unit (HP / COL) 48, and the first heating unit (HP) performs baking (pre-baking) after coating (step S9), and then the cooling unit (COL) ) Cool to a predetermined substrate temperature (step S10). It is also possible to use a heating unit (HP) 50 in the baking process after coating. The printed circuit board G of the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is transferred to the interface section by the main transfer device 54 of the coating processing section 24 and the main transfer device 60 of the development processing section 26 after the aforementioned coating process (I / F) 14. Deliver to the exposure device from the interface portion (I / F) 14 (step S11). A predetermined circuit pattern for exposing a photoresist on a substrate G in an exposure device. Then, the substrate G which has been subjected to the pattern exposure is returned to the boundary face (I / F) 14 by the exposure device. The transfer mechanism 59 of the interface unit (I / F) 14 is used to deliver the substrate G received from the exposure device to the developing processing unit 26 in the processing station (P / S) 12 through the extension device 57 (step S11). In the development processing section 26, the substrate G is subjected to a development process in one of the development units (DEV) 52 (step S12), and then sequentially loaded into a device in a heating / cooling unit (HP / COL) 55. The heating unit (HP) performs post-baking (step S13), and then the cooling unit (COL) is cooled to a predetermined size. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -10- 1223850 A7 RMB 5 The substrate temperature of the invention description (8) (step S14). It is also possible to use a heating sheet (HP) 53 in the post-baking process. The substrate G after a series of processing is completed in the development processing section 26 is returned by a conveying device 60, 54, and% in a processing station (P / S) 24. Go to Ka Kun Station (c / s) io, where one of the cassettes c is stored according to the transfer mechanism 20 (step S1). In this coating development processing system, the present invention is also applicable to a brushing unit (SCR) 28. Hereinafter, an embodiment in which the present invention is applied to the cleaning unit (SCR) 28 will be described with reference to Figs. 3 to 7. As shown in Fig. 3, the cleaning unit (SCR) 28 of this embodiment has a base 60 or an outer box 60, and a rotary type cleaning device 62 is installed at the center of this box 60. The structure of the cleaning device 62 basically includes a cup 64 as a processing container function, a substrate supporting mechanism 66 installed inside the cup 64, and a cleaning mechanism provided in the cup 64 and freely in and out 丨丨 〇 built from. The structure of the substrate supporting mechanism 66 includes a rotating chuck 68 that vacuum-sucks the substrate G and keeps it rotatable and liftable, and around the rotary chuck 68 is a substrate that is supported by the lower substrate and can be raised and lowered. Department 70. The square chuck 68 has a circular chuck chassis 72 having a diameter shorter than that of the shorter side of the substrate G and a substantially horizontal surface. The base plate G is only placed on the chuck base 72 in accordance with the prescribed portion of the center of the base plate corresponding to the shape and area of the chuck base 72. In addition, the outer portion (excess) Gd appears from the chuck base 72. If it is outside the radius. This paper has passed the National Standard A (CNS) A4 specification (21〇χ 297 mm) · Packing -------- Order --------- (Please read the precautions on the back first (Fill in this page again.) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -11-1223850 A7 B7 V. Description of the invention (9) The Consumer Cooperatives of the Ministry of Economic Affairs printed on the inner center of the chuck chassis 72 is extended in a vertical direction. The upper end portion of the rotary support shaft 74 is operated by a combination of a rotary drive portion such as an electric motor (not shown) installed in the drive portion 76. By the rotation drive of the electric motor, the rotation support shaft M is used as an intermediary to form an integrated chuck bottom 7 and the melons 72 and the substrate G fixed on the chuck bottom 72 are rotated at a predetermined speed. Inside the driving section 76, a first lifting driving section (not shown), such as a cylinder, is also installed to move the chuck chassis 72 up and down. When board G is moved in / out, the first! The lifting drive unit vertically lifts the rotary shaft 74 only by a predetermined punch. As shown in FIG. 3, the chuck chassis M is raised to a predetermined position Hb, and the main conveying device is called FIG. 1. ) Delivery of substrate G is performed. At the time of stabilization or cleaning (Fig. 5), the first lifting drive unit lowers the rotary support shaft 74 to the origin position, and the chuck chassis 72 is set at a reference height position. As shown in Fig. 4, concentric grooves 72a are formed on the chuck chassis 72, and radial grooves 72b are intersected (continued), and these grooves communicate with each other at a predetermined position, such as in the center of the chuck, and The air passage formed through the disc tray 72 and the rotating support shaft 74 is an intermediate passage to a negative pressure source such as a vacuum pump. When the substrate G is placed on the lost chassis 72, the vacuum from the negative pressure source is applied to each groove 72a, 72b, and the true attraction force given by each groove acts on the inside of the substrate G to make the substrate g fixed. Keep it up. The substrate supporting portion 70 is a horizontal supporting plate 78 having a rigid body having substantially the same shape and the same size as the substrate. This horizontal support plate 78 corresponds to the chuck chassis. Page Order Elegant 4 paper size in the middle _ home standard (CNS) A4 specifications (21 () χ Norwegian public -12-1223850 A7
1223850 A7 五、發明說明（11 ) 昇降移動之上方處壁部84,和此上方處壁部84以直徑方 向空出空隙對向之下方處壁部86，與此下方處壁部％ 一 體構成’且具備有形成箱60底部之底板部88。 在杯64之外部或内部（驅動部76内）中，裝設有支撐杯 64之上方處壁部84,且可在所設定之昇降範圍内昇降驅動 於隨意的高度之眾所皆知杯支撐/昇降機構（未圖示）。如第 3圖所示，於交付基板G時，為使主搬送裝置％之搬送臂 (未圖示）通過杯内側，上方處壁部84會降下至最低之設定 位置。但，在處理過程中，如第5圖所示，上方處壁部84 會上昇至適合接受從旋轉夾M 68滴下之滴液或氣流之高 度。 在此實施形態，杯64之上方處壁部84係具有朝向直徑 方向斜上延伸之尖端部84a。此上方處壁部84之尖端部8乜 係在洗淨處理中之杯高度位置接近基板G之側面處，發揮 接受由基板G飛散至四方周圍處之滴液並使其滴落至下方 之機能。 於杯下方處壁部86之内側處係沿著圓周方向形成廢液 回收室90。此廢液回收室9〇之底部係於圓周方向有高低 落差，在最低之位置設有廢液口 92。此廢液口 92係以排 液管94為中介通向廢液儲藏槽（未圖示）。 前述廢液回收室90之上面空間不僅是廢液流路也兼做 排氣流路，在杯底板部88比廢液回收室9〇位於更内側之 位置設置有排氣口 96。此排氣口 96係以排氣管98為中介 連結通往外部排氣系統諸如排氣通風管。於夾盤底盤72 i 智 慧 財 產 局 員 工 消 費1223850 A7 V. Description of the invention (11) The upper wall portion 84 and the upper wall portion 84 have a gap in the diameter direction and the lower wall portion 86 is opposite to the upper wall portion 84. Further, a bottom plate portion 88 forming a bottom of the box 60 is provided. A cup support 64 is installed outside or inside the cup 64 (inside the driving portion 76), and the cup support can be lifted and driven at any height within a set range of elevation. / Lifting mechanism (not shown). As shown in Fig. 3, when the substrate G is delivered, the upper wall portion 84 is lowered to the lowest setting position so that the conveying arm (not shown) of the main conveying device passes through the inside of the cup. However, during the processing, as shown in Fig. 5, the upper wall portion 84 rises to a height suitable for receiving the dripping liquid or the airflow dripped from the rotary clamp M68. In this embodiment, the wall portion 84 above the cup 64 has a tip portion 84a extending obliquely upward in the diameter direction. The tip portion 8 of the upper wall portion 84 is close to the side surface of the substrate G at the height of the cup during the cleaning process, and exerts the function of receiving the dripping liquid scattered from the substrate G to the surroundings of the square and dropping it downward. . A waste liquid recovery chamber 90 is formed on the inner side of the wall portion 86 below the cup along the circumferential direction. The bottom of the waste liquid recovery chamber 90 has a height difference in the circumferential direction, and a waste liquid port 92 is provided at the lowest position. The waste liquid outlet 92 is connected to a waste liquid storage tank (not shown) through a liquid discharge pipe 94 as an intermediary. The space above the waste liquid recovery chamber 90 serves not only as a waste liquid flow path but also as an exhaust flow path. An exhaust port 96 is provided in the cup bottom portion 88 at a position further inside than the waste liquid recovery chamber 90. The exhaust port 96 is connected to an external exhaust system such as an exhaust vent pipe through an exhaust pipe 98 as an intermediary. On the chuck chassis 72 i Intellectual Property Bureau staff consumption
S 本紙張尺度適用中關冢標準（CNS)A4規格⑵G x 297公复 1223850 A7 B7 五、發明說明（l2 ) 下方係設置有構成廢液及排氣流路之傘狀隔膜板1〇〇。此 隔膜板100係形成有為能使各垂直支撐構件昇降可能之 孔 100a。 於箱60之底面係於1處或複數之地方設有排氣或排水 口 102。各排氣或排水口 102係以排氣或廢液管104為中 介連結通往排氣或廢液系統（未圖示）。 _在此刷淨裝置62之洗淨機構11〇係具有諸如第5圖所 不般之刷洗機構112及噴洗機構114。在第5圖為方便說 明同時顯示兩機構112、114 ’但通常先由刷洗機構112進 行擦拭洗淨’之後再由噴洗機構114進行沖吹洗淨，在一 訂 機構動作時’另一機構會在杯64外側處設於箱6〇角落之 規定位置（圖示無顯示）待機著。 在本實施形態之刷洗機構112係—種洗淨機構，係一邊 旋轉具有圓筒狀毛刷面之滾動刷子116與基板表面相互摩 擦，一邊掃描基板G上方。 4 $_子端部份係由從擦拭毛刷本體 延伸至垂直下方-對可昇降之支擇臂12〇支樓著，同 經濟部智慧財產局員工消費合作社印製 f支㈣m内部之傳導方法(滑輪及傳動帶等)為 中"接績毛刷本體118内藏之旋糙 、 ^ pi -疋轉驅動部諸如電動馬達 (未圖不）而動作。毛刷本體118係依 示）沿移往至規定退运機構（未圖 方向。又，毛刷本體118自身，或 : 之昇降機構（未圖示）進行昇降移動動作。 ’、可依規疋 在此刷洗機構m中’於滾輪毛刷ιΐ6之幾乎正上方位 本紙張尺度適用中關家標準（CNS)A4規格（21Q x 297 ~ -15- 1223850 A7 五、發明說明（l3 ) 置，於垂直臂12〇之中間部架設有幾乎水平之支撐於配列 有多數朝下之洗淨喷嘴或吐出口於滾輪毛刷116軸方向而 成之喷霧管124之狀態或構造。此洗淨喷霧管124係以延 伸至垂直方向之洗淨液供給管126為中介連通於毛刷本體 118内之洗淨液供給部或中繼部（未圖示）。 喷洗機構U4係包含有從正上方朝向基板〇表面高壓 吐出洗淨液jw之1個或複數個之洗淨喷嘴128，以洗淨 喷嘴128及洗淨供給管29等機構為中介以物理性且機能性 支撐之喷射毛刷本體130,及使喷射毛刷本體13〇沿導執 132送往一定方向之洗淨喷嘴移送機構（未圖示）。 接著，說明在此實施形態之刷淨單元（SCR)28之作用。 洗淨處理部22之主搬送裝置38將基板G 一搬送至 單元（SCR)28之作用時，配合此時機驅動部76内之第i 降驅動部將會如第3圖所示把旋轉夾盤68之夾盤底盤 上昇至所設定之高度位置Hb。在此高度位置Hb，依主… 达裝置38之搬送臂載置基板G於夾盤底盤72上面（基板 載置面）。又，杯64之上方處壁部84則如第3圖所示般下 降至最下處高度之位置，則主搬送裝置38之搬送臂可自 進入杯64之内部。 基板G載置在夾盤底盤72上時，旋轉夾盤68之真一 吸引機構會隨之動作，保持及固定基板G。在此，從基板 G超出夾盤底盤72的部份（超出部份）Gd係因重力而下 (傾斜）。主搬送裝置38之搬送臂退避至杯64外時，該第 昇降驅動部將夾盤底盤72下降至基準之高度位置Ha。基 頁 訂 此 昇 72 搬 4 由 空 彎 本紙張尺度適用中關家標準（CNS)A4規格(_21G X 297公釐一 16- 五、發明說明（l4 ) 板G也與夾盤底盤72合為一體一同下降。此時，因基板 =部之水平«板78係下降线爾切）用之第2 -度位置H2之故，基板G在夾盤底盤”上面保 ， 超出部份Gd係呈現因重力而下彎之狀態。 如前述般基板G之搬入完畢後，在刷洗機構ιΐ2中， 將滾輪毛刷116從杯64外本位移動至杯“内衫之洗淨 在此洗淨動作開始前之毛刷移動程序，毛刷本體 規疋之方向沿著溝122進…4中時，在規定之途 距：置下毛：本體118本體’或是支擇臂12°僅下降規定之 下降至滚輪毛刷116下面僅比央盤底盤72之高度位 南之規定高度位置Hr。接著將滾輪毛刷ιΐ6保持在 面度位置Hr不動，依毛刷本體ns沿著冑122進入， 如第6圖所示般滚輪毛刷116在基板G之超出部份⑹最 -位置處進人較長方向端部（單侧）上，在此位置（洗淨起 =1止：在此時’基板支撐部70之水平支…才 之I 'I广度位置’基板G之超出部Gd係因重力下彎 之故’滾輪毛刷1丨6係，不合接縮 W 觸基板G之邊緣處從橫 σ >可㈣速且安全進入基板上面或存取基板 如前述般之動作，滾輪㈣ιΐ6 —待結束以基板g 垂直支撐:驅動部％内之第2昇降驅動部以 用之第= 將水平讀板78上昇至基板支撐 78之上曰：又位置扪。如第7圖所示般，藉此水平支撐板 幵，水平支撐板78上之支撐鎖8〇從基板内侧接觸 1223850 A7S This paper size is applicable to Zhongguanzuo Standard (CNS) A4 specification ⑵ G x 297 public reply 1223850 A7 B7 5. Description of the invention (l2) An umbrella-shaped diaphragm plate 100 is formed below the waste liquid and exhaust flow path. The diaphragm plate 100 is formed with a hole 100a which is capable of raising and lowering each vertical supporting member. The bottom surface of the box 60 is provided at one or a plurality of places with exhaust or drainage ports 102. Each exhaust or drain port 102 is connected to an exhaust or waste system (not shown) through an exhaust or waste pipe 104 as an intermediary. The cleaning mechanism 110 of the brushing device 62 is provided with a brushing mechanism 112 and a spraying mechanism 114, such as those shown in FIG. In FIG. 5, two mechanisms 112 and 114 are displayed at the same time for the convenience of description. However, the brushing mechanism 112 is usually used for cleaning and cleaning, and then the spray cleaning mechanism 114 is used for flushing. When one order mechanism operates, the other mechanism It will be placed at a predetermined position (not shown in the figure) at the corner of the box 60 outside the cup 64 and waits. The brushing mechanism 112 in the present embodiment is a cleaning mechanism that scans the substrate G while rotating the rolling brush 116 having a cylindrical brush surface and the surface of the substrate while rubbing against each other. 4 $ _ The sub-end part is extended from the wiper brush body to the vertical bottom-for the optional arm that can be raised and lowered 120 branches, and printed with the internal conductive method of f branch ㈣m with the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. (Pulleys, transmission belts, etc.) are operated by a spiral & rough, pi-turn drive such as an electric motor (not shown) built in the medium " successive brush body 118. The brush body 118 is moved to the specified return mechanism (not shown in the figure). The brush body 118 itself, or the lifting mechanism (not shown), moves up and down. ', According to regulations In this brushing mechanism m, the position of the roller brush ΐ6 is almost directly above. The paper size is applicable to the Zhongguanjia Standard (CNS) A4 specification (21Q x 297 ~ -15-1223850 A7. V. Description of the invention (l3)) The middle part of the vertical arm 120 is provided with a state or structure that is almost horizontally supported by a spray tube 124 arranged with a plurality of downward-facing cleaning nozzles or discharge ports in the direction of the roller brush 116 axis. This cleaning spray The tube 124 is a cleaning liquid supply pipe or a relay (not shown) which is connected to the cleaning liquid supply pipe 126 extending to the vertical direction through the brush body 118. The spraying mechanism U4 includes a direct from above. One or a plurality of cleaning nozzles 128 of the cleaning solution jw are discharged toward the surface of the substrate 0 at high pressure, and the spraying brush body 130 is physically and functionally supported by the cleaning nozzle 128 and the cleaning supply pipe 29 as an intermediary. And send the spray brush body 13〇 along the guide 132 A cleaning nozzle transfer mechanism (not shown) in a fixed direction. Next, the function of the brush unit (SCR) 28 in this embodiment will be described. The main transfer device 38 of the cleaning processing unit 22 transfers the substrate G to the unit ( When the SCR) 28 functions, the i-th lowering driving part in the timing driving part 76 will raise the chuck chassis of the rotating chuck 68 to the set height position Hb as shown in Fig. 3. At this height position Hb, according to the main ... The transfer arm of the reaching device 38 mounts the substrate G on the chuck chassis 72 (the substrate mounting surface). Moreover, the wall portion 84 above the cup 64 is lowered to the bottom as shown in FIG. 3 Position, the transfer arm of the main transfer device 38 can enter the inside of the cup 64. When the substrate G is placed on the chuck chassis 72, the true suction mechanism of the rotating chuck 68 will follow to hold and fix the substrate G. Here, the portion (excess) Gd of the base plate G beyond the chuck chassis 72 is lowered (inclined) due to gravity. When the transfer arm of the main transfer device 38 retracts out of the cup 64, the first lifting drive unit Lower the chuck chassis 72 to the reference height position Ha. The base sheet will be raised 72 4 From the blank-curved paper size, the Zhongguanjia Standard (CNS) A4 specification (_21G X 297 mm-1 16- V. Description of the invention (l4) The plate G is also integrated with the chuck chassis 72. At this time, Because the base plate = the horizontal level of the board (the board 78 is the descending line), the second-degree position H2 is used, and the base plate G is secured on the chuck chassis. The excess Gd is bent down due to gravity. After the substrate G has been carried in as described above, in the brushing mechanism ιΐ2, the roller brush 116 is moved from the cup 64 outside the cup to the cup "cleaning of the inner shirt. The brush moving process before this cleaning action starts, the brush When the direction of the main body enters along the groove 122 ... 4 times, at the specified distance: set down the hair: the main body 118 or the optional arm 12 ° only lowered below the prescribed limit to the bottom of the roller brush 116 only than the center The height of the disk chassis 72 is south at a predetermined height position Hr. Next, keep the roller brush ΐ6 at the plane position Hr, and enter along 胄 122 according to the brush body ns. As shown in Figure 6, the roller brush 116 enters at the most-position of the excess portion of the substrate G. On the longer end (single side), at this position (from cleaning to 1 stop: at this time, the horizontal support of the substrate support portion 70 ... is the only I'I breadth position 'the excess portion Gd of the substrate G is due to The reason why gravity bends down 'Roller brush 1 丨 6 series, it does not fit the contraction W touches the edge of the substrate G from the horizontal σ > can quickly and safely enter the substrate or access the substrate as described above, the roller ㈣ιΐ 6 — To be completed, the substrate g is vertically supported: the second lifting drive unit within the driving unit% is used to raise the horizontal reading plate 78 above the substrate support 78: again, position 扪. As shown in Figure 7, borrow This horizontal support plate 幵, the support lock 8 on the horizontal support plate 78 contacts 1223850 A7 from the inside of the substrate
請 先_ 閱 讀 背· 訂 面 之 注 意 事Please read the notes of the back and order first
書裝 1223850 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（I6 ) 方向）。 在如前述之擦拭洗淨中’從基板G之洗淨液會飛散至 四周圍。特別從滾輪毛刷116觀察由基板〇之後方端往外 飛散或滴落下多量之洗淨液’ 一部份混合在這飛散或滴落 下之洗淨液中之異物係也隨之往外飛散或滴落。飛散或滴 落下之洗淨液及/或異物係碰觸到杯64之上方處壁部84之 内壁後，有的係直接落下，將之收集至杯底部之排除廢液 回收室90，再由廢液口排出杯64外。 當毛刷擦拭洗淨處理結束後，於毛刷洗淨機構丨丨2中， 將從毛刷擦拭本體11 8至滾輪毛刷11 6 一整套由基板〇上 退避至杯64外之本位。於滾輪毛刷丨16退壁後，在基板支 撐部70，驅動部76内之第2昇降驅動部係將水平支撐板 78由至目刖為止之基板支樓用之第1高度位置η〗下降至 退避（非支撐）用之第2高度位置H2。其結果係基板G之超 出部份G d呈現浮起狀態，並因重力而下彎。 然後，再由喷洗機構114進行喷吹洗淨。在這喷吹洗淨 中，如第9圖所示，洗淨液喷嘴128係一邊將超音波振動 之兩壓洗淨液JW朝向基板G喷射，於基板G上方諸如在 基板半徑範圍内以水平方向往返移動，依先前之擦拭洗淨 擦拭去除基板表面之異物或以高壓洗淨液JW沖洗即使依 擦拭洗淨也無法除去之異物。 此犄，旋轉夾盤66也開始動作，與夾盤底盤72 一同使 基板G以規定之低速諸如以5〇〜1〇〇rpm旋轉。在此低速旋 轉’並非係基板G之超出部份Gd(特別係基板端部）以水平 本紙張尺度_㈣目家標準（CNS)A4規格（i10 x 297公爱） -----------•裝------ —1 訂--- ----- (請先閱讀背面之注意事項再填寫本頁) -19- 1223850Booklet 1223850 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Direction of Invention (I6). In the wiping and cleaning as described above, the cleaning liquid from the substrate G is scattered around. In particular, observe from the roller brush 116 that a large amount of cleaning liquid is scattered or dripped from the rear end of the substrate 0, and a part of the foreign matter mixed in the scattered or dropped cleaning liquid is also scattered or dripped out. . The scattered or dropped washing liquid and / or foreign matter touch the inner wall of the wall portion 84 above the cup 64, and some of them fall directly and are collected in the waste liquid recovery chamber 90 at the bottom of the cup, and then The waste liquid outlet is discharged out of the cup 64. After the brush cleaning and washing process is completed, in the brush cleaning mechanism 丨 2, a whole set from the brush wiping body 118 to the roller brush 11 6 is retracted from the substrate 0 to a position outside the cup 64. After the roller brush 16 is retracted from the wall, the second lifting driving portion in the substrate supporting portion 70 and the driving portion 76 lowers the horizontal supporting plate 78 from the first height position η for the substrate supporting structure to the end of the project. To the second height position H2 for retreat (non-support). As a result, the excess portion G d of the base plate G is in a floating state, and bends down due to gravity. Then, it is spray-washed by the spray-washing mechanism 114 again. In this spray cleaning, as shown in FIG. 9, the cleaning liquid nozzle 128 sprays the two-pressure ultrasonic cleaning liquid JW toward the substrate G, and is horizontally above the substrate G, such as within a radius of the substrate. Move back and forth in the direction, remove foreign matter on the surface of the substrate according to the previous wiping, or use a high-pressure cleaning solution JW to rinse the foreign matter that cannot be removed even by wiping. At this time, the rotary chuck 66 also starts to operate, and together with the chuck chassis 72, the substrate G is rotated at a predetermined low speed, such as 50 to 100 rpm. Rotating at low speed here is not the excess part Gd of the substrate G (especially the end of the substrate) at the level of the paper. _ ㈣ 目 家 standard (CNS) A4 size (i10 x 297 public love) ---- • Installation ------ —1 Order --- ------ (Please read the precautions on the back before filling this page) -19- 1223850
五、發明說明（17 ) 經濟部智慧財產局員工消費合作社印製 洋上之離心力於基板G作用，基板G之超出部份Gd係維 夺X重力朝下.卷之安勢。如這般藉著將以重力朝下彎之（越 是頂端彎的越低）基板G超出部份Gd上面之洗淨jw流落 至基板〇外，可有效的從基板G洗去異物。即使在喷2洗 平中，往基板G外飛散及滴落之洗淨液及/或是異物係，碰 觸到杯64之上方處壁部84内壁後，有些係直接滴落，集 中於杯底部之排液回收室90,再由廢液口 9〇排出至杯= 外0 結束依前述般之喷射洗淨機構114之喷吹洗淨時，接著 在將洗淨機構110退避至杯64外之狀態進行旋轉乾燥。在 此旋轉乾燥係比旋轉夾盤66與夾盤底盤72 一同噴吹洗淨 基板G時更高速之旋轉速度諸如以5〇〇〜25〇〇ΓρΜ之規定時 間進行旋轉。依此高速旋轉，附著於基板G之表面乃至裏 面之洗淨液藉離心力甩乾周圍之洗淨力，在短時間基板g 即呈現乾燥之狀態。 又在本實施形態，第6圖〜第8圖所顯示擦拭洗淨後， 在依喷洗機構114之喷吹洗淨程序中，如第1〇圖所示，也 可於基板支撐部70之高度位置H1係維持原狀（如第8圖 所示之狀態）將基板G保持水平，一邊將洗淨液噴射噴嘴 128朝向基板G平行地往返移動，一邊高壓噴射出洗淨液 JW進行噴吹洗淨。如此，持續水平保持基板〇，藉由喷洗 機構114進行噴吹洗淨，可將洗淨液平均的噴吹至基板g 全面，可提昇洗淨能力。 藉噴洗機構114之喷吹洗淨後，如第11圖所示，將洗 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） --------------------------- (請先閱讀背面之注意事項再填寫本頁) -20 1223850 A7 B7 1 局 員 工 消 費 社 印 製 五、發明說明（1S ) 淨機構110退避至杯64外，將基板支撐部7〇從高度位置 H1下降至H2，旋轉夾盤66與夾盤底盤72 _同喷吹洗淨 基板G以高旋轉速度諸如以5〇〇〜25〇〇rpmi規定時間進行 旋轉。依此高速旋轉，基板G之超出部份㈤係因離心力 浮I而附著表面乃至裡面之洗淨液會被甩乾周圍之洗淨 力，在短時間基板G即呈現乾燥之狀態。 又，也可藉噴洗機構114之噴吹洗淨後，將基板支撐部 70從高度位置H1下降至H2，於㈣述之高速旋轉⑽口 500〜250〇rpm)進行旋轉乾燥前，以低速諸如5以 lOOrpm，在基板G頂端下彎之狀態下，將洗淨液甩乾某 度。 ’、 結束旋轉乾燥時，如第3圖所示，旋轉支撐軸以上 將基板G從旋轉夾盤68提高至規定之高度，杯之上方 壁部84則下降至最低之設定位置。在此，主搬送裝置 之搬送臂進入，從旋轉支撐軸74接取基板G，彳1單几 (SCR)28外搬出。搬出之基板（^之表面係實施以如前述: 之安定確實且有效的擦拭洗淨及噴吹洗淨，因異物幾乎沒 有附著於基板G上，則呈現清淨高之表面。因此，即使^ 下一個程序之光阻塗佈處理及顯影處理中可㈣ 子極少之處理結果，如此可得到高良品率之。 於前述實施形態之刷洗機構112，也可將滾輪毛刷丄 在基板G上面往返移動，反覆進行掃描擦洗程序。此時 滾輪毛刷116也可一次通過洗淨起點a ^ ^ ” ^之基板頂端部 另一端之基板頂端部出至基板0外。然後如第12圖所 程 昇處 38 元 116 及 不 ------------------备---------*^1 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公釐 1223850 A7 五 、發明說明（19 ) 般，滾輪毛刷116行至基板G外後，由基板支撐部7〇將 水平支撐板78下降至第2高度位置112，基板係以重力將 超出部份Gd下彎，在這裡可與前述同樣地將以水平移動 將滾輪毛刷116再一次進入基板G上。接著如第13圖所 示，也可於基板支撐部70將水平支撐板78上昇至第工高 度位置Η1基板係用以將超出部份Gd水平支撐著，然後再 度開始滾輪毛刷116之洗淨動作。又，再第2圖及第3圖 中，將滾輪毛刷116再次動作時係，由第2洗淨噴霧管134 朝向滾輪毛刷11 6之行進方法之最近基板表面吹附洗淨液 CW。如這般裝設第2洗淨喷霧管134，於滾輪毛刷ιΐ6之 行進方向兩侧，也就是依於洗淨機構112之移送方向兩側 f具備有喷霧管124及134,可時常地針對滾輪毛刷116 行進方向處之基板G吹附洗淨液cw，可有效進行洗淨程 序。 又，本實施形態也適用於顯影單元（DEV)52。也就是此 顯影單元（DEV)52係，如第14圖所示，於有底圓筒狀之杯 -中具有與第5-9圖之旋轉夾盤機構及基板支撐部70 同樣構成之旋轉夾盤68，驅動部76及基板支撐部7〇。在 此，就與第5-9圖相同之構成附與同樣之標號。 於基板G上方係配置有可藉未圖示之驅動機構移往基 板G之水平方向，且用以朝基板供給顯影液之顯影液喷嘴 5此顯衫液噴嘴13 5之長向長度雖未圖示，但係幾乎相 等於基板G之短邊長度而形成之。於此顯影液喷嘴135係 形成有多數可沿著前述長向吐出顯影液之吐出孔136。於 (請先閱讀背面之注音？事項再填寫本頁) · 經濟部智慧財產局員工消費合作社印製 -22- 1223850 A7 B7 五、發明說明（2〇 ) 經濟部智慧財產局員工消費合作社印製 杯CP底部雖然圖示無顯示，裝設有將顯影液排除至 之排出口。又，此顯影液噴嘴135係供給顯影液時以外; 機在杯CP外側之待機位置。 、 在如上述般構成之顯影單元（順)52,如第14圖所示， 基板G係在依夾盤底盤72及配置與夾盤底盤72同一高度 之水平支撐板水平料狀態下，—面㈣影㈣嘴 向基板G之上面平行移動，一面將顯影液均一的供給至美 板G上面之全面。然後放置一定時間後，在此基板係如土 15圖所不者，藉基板支撐部7〇從高度幻下降至Η?，〜 超出/份下彎。然後待機在# cp之外處之潤滑喷嘴二 係藉圖示無顯示之移動機構移動至基板G上面之中心 置。此潤滑喷嘴Π8係，用以將供給至基板G上面之顯 液沖洗而吐出潤滑液，依此一面朝向基板G上面之中心 出潤滑液，將基板G以低速諸如5〇rpm〜1〇〇rpm旋轉， 此離心力沖洗去除顯影液。又，於潤滑液之供給時，由… 基板G超出部Gd下彎，即使低速旋轉也可有效將潤滑液 排出於基板G外處。 月述貫施形態之基板支撐部70之構成係具備一體成型 之水平支撐板78。但，也可係分離式之基板支撐構造 如’將水平支撐板72於長向分割成左右2個（78L、78R) 驅動部76内之第2昇降驅動部係也可以個別（獨立）地將 撐板78L、78R昇降驅動者。在此構成中例如，如第1 6 所示，進行擦拭洗淨處理時藉有選擇的將業已通過處之 輪毛刷11 6之分割支撐板（例如72 R)下降至第2高度位 第 使 位 影 吐 藉 於 例 支 圖 滾 (請先閱讀背面之注意事項再填寫本頁) 訂· _ Φ 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 χ 297公釐） -23- 1223850 五、發明說明（21 ) H2，以重力將剛洗淨好之基板超出部份Gd朝下彎，則可 使洗淨液及異物容易流下沖洗。 ' 在前述實施形態中係使水平支撐板78在2個高度位置 HI，H2之間昇降移動所構建而成，但也可以3 =二上之 高度位置，在規定之範圍内昇降移動或配合位置於任意之 高度位置所構成之。又，也可藉固定水平支撐板乃之高度 位置，改變旋轉夾盤66處也就是夾盤底盤72之高度位置， 構建成將兩者（72、78)間之相對的高低差設定為可^更改。 刷洗並非僅限定滾輪毛刷，也可係其他形式之毛刷例如具 有於基板表面之垂直回轉軸之圓盤毛刷等。 本發明之基板洗淨方法或裝置係，非僅限定於塗怖顯影 處理，也適用進行毛刷擦拭方式之洗淨之任意裝置。在本 發明被處理基板非限LCD基板，也適用半導體晶圓、cD 基板、玻璃基板、光罩、印刷基板等。 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 如上述之說明，依照本發明之基板洗淨裝置或基板洗淨 方法的話，可以以低成本且安全確實進行刷淨處理之同 時，也可將毛刷朝基板上以迅速且安全地接近。又，在進 行擦洗處理及喷洗處理之2階段洗淨步驟，可提昇洗淨處 理效率及處理品質。V. Description of the invention (17) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs The centrifugal force on the ocean acts on the substrate G, and the excess Gd of the substrate G maintains the gravity of X downwards. In this way, by cleaning the jw on the excess portion Gd of the substrate G bent downward (the lower the curve at the top), the jw flows out onto the substrate 0, and the foreign matter can be effectively washed away from the substrate G. Even during spraying and washing, the cleaning liquid and / or foreign matter scattered and dripping out of the substrate G touched the inner wall of the wall portion 84 above the cup 64, and some of them dropped directly and concentrated on the cup. The drain recovery chamber 90 at the bottom is discharged from the waste liquid port 90 to the cup = outside 0. When the spray cleaning of the spray cleaning mechanism 114 as described above ends, the cleaning mechanism 110 is then retracted to the outside of the cup 64 In this state, spin drying is performed. Here, the spin drying is performed at a higher rotation speed than when the substrate G is spray-washed and cleaned together with the spin chuck 66 and the chuck chassis 72, for example, at a predetermined time of 500 to 2500 rpM. According to this high-speed rotation, the cleaning liquid attached to the surface of the substrate G and even the inside is dried by the centrifugal force to dry the surrounding cleaning force, and the substrate g is in a dry state in a short time. In this embodiment, as shown in FIG. 6 to FIG. 8, after wiping and cleaning, in the spray cleaning process of the spray cleaning mechanism 114, as shown in FIG. 10, it may be applied to the substrate support portion 70. The height position H1 is to keep the substrate G horizontally (as shown in FIG. 8), and while the cleaning liquid spray nozzle 128 is moved back and forth in parallel to the substrate G, the cleaning liquid JW is sprayed and sprayed at high pressure. net. In this way, the substrate 0 is continuously held horizontally, and the spray cleaning is performed by the spray cleaning mechanism 114, so that the cleaning liquid can be sprayed evenly to the entire surface of the substrate g, and the cleaning ability can be improved. After spray cleaning by the spraying mechanism 114, as shown in Figure 11, the paper size of the paper is applied to the Chinese National Standard (CNS) A4 (210 x 297 mm) ---------- ----------------- (Please read the precautions on the back before filling this page) -20 1223850 A7 B7 1 Printed by the Bureau Consumer Bureau V. Invention Description (1S) Net The mechanism 110 retracts out of the cup 64, lowers the substrate supporting portion 70 from the height position H1 to H2, and rotates the chuck 66 and the chuck chassis 72 to spray and clean the substrate G at a high rotation speed such as 500 to 25. The rotation is performed at a predetermined time. According to this high-speed rotation, the excess part of the substrate G is due to the centrifugal force floating I, and the cleaning liquid attached to the surface or the inside will be dried by the surrounding cleaning force, and the substrate G will appear dry in a short time. Alternatively, the substrate support portion 70 may be lowered from the height position H1 to H2 after being spray-washed by the spray-cleaning mechanism 114, and then rotated and dried at a low speed before the high-speed rotation nozzle (500 to 250 rpm) described above. For example, at a speed of 100 rpm, the cleaning solution is dried to a certain degree while the top end of the substrate G is bent down. When the spin-drying is finished, as shown in Fig. 3, the substrate G is raised above the rotary chuck 68 to a predetermined height, and the upper wall portion 84 of the cup is lowered to the lowest setting position. Here, the transfer arm of the main transfer device enters, picks up the substrate G from the rotary support shaft 74, and carries it out outside the SCR 28. The surface of the removed substrate (^ is implemented as described above: stable and effective wipe cleaning and spray cleaning, because foreign matter hardly adheres to the substrate G, it shows a clean surface. Therefore, even if ^ down The photoresist coating process and the development process of one program can have very few processing results, so that a high yield can be obtained. In the brushing mechanism 112 of the foregoing embodiment, the roller brush can also be moved back and forth on the substrate G Scanning and scrubbing procedures are repeated. At this time, the roller brush 116 can also pass through the substrate top end portion of the starting point a ^ ^ ^ at the other end to the substrate 0 outside. Then lift up as shown in Figure 12 38 yuan 116 and not ----------- prepare --------- * ^ 1 (Please read the precautions on the back before filling this page) The paper size applies the Chinese National Standard (CNS) A4 specification (21 × 297 mm 1223850 A7 V. Description of the invention (19) Generally, after the roller brush 116 travels outside the substrate G, the substrate support portion 70 will horizontally support the plate. 78 descends to the second height position 112, and the base plate is bent down by gravity beyond the Gd. Here, In the same manner as described above, the roller brush 116 can be horizontally moved into the substrate G again. Then, as shown in FIG. 13, the horizontal support plate 78 can also be raised to the first working height position at the substrate support portion 70. It is used to horizontally support the excess Gd, and then start the cleaning operation of the roller brush 116 again. In FIGS. 2 and 3, when the roller brush 116 is operated again, it is cleaned by the second step. The spraying tube 134 is directed toward the roller brush 116, and the cleaning solution CW is blown on the surface of the nearest substrate. A second cleaning spraying tube 134 is installed on both sides of the roller brush 6 in the direction of travel, that is, Spraying pipes 124 and 134 are provided on both sides f of the cleaning mechanism 112 in the conveying direction, and the cleaning liquid cw can be blown on the substrate G at the direction of the roller brush 116 in advance, which can effectively perform the cleaning process. This embodiment is also applicable to the developing unit (DEV) 52. That is, the developing unit (DEV) 52 is shown in FIG. Rotating chuck mechanism, rotating chuck 68, driving section 76, Board support part 70. Here, the same components as in Figs. 5-9 are given the same reference numerals. Above the substrate G, a horizontal direction of the substrate G can be moved by a driving mechanism (not shown), and The developer liquid nozzle 5 for supplying the developer to the substrate, and the developer liquid nozzle 13 5 are formed in a lengthwise direction that is almost equal to the length of the short side of the substrate G, although not shown. Here, the developer liquid nozzle 135 is formed. There are a large number of discharge holes 136 along which the developer can be discharged in the aforementioned long direction. (Please read the phonetic on the back? Matters before filling out this page) · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs-22- 1223850 A7 B7 V. Description of the Invention (20) Although the bottom of the printed cup CP, which is printed by the Employee Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, is not shown in the figure, it is equipped with a discharge port to which the developer is discharged. In addition, the developer nozzle 135 is other than when the developer is supplied; the machine is in a standby position outside the cup CP. In the developing unit (shun) 52 configured as described above, as shown in FIG. 14, the substrate G is in a state of being horizontally arranged according to the chuck chassis 72 and a horizontal support plate arranged at the same height as the chuck chassis 72. Phantom's mouth moves parallel to the upper surface of the substrate G, and uniformly supplies the developer to the entire surface of the upper surface of the beautiful plate G. After leaving it for a certain period of time, the substrate is like the one shown in Figure 15, and the substrate supporting portion 70 is lowered from the height of the substrate to Η, which is over / percent down. Then, the lubrication nozzle 2 waiting outside of # cp is moved to the center of the upper surface of the substrate G by the moving mechanism without the illustration. This lubricating nozzle Π8 is used to rinse the liquid supplied onto the substrate G and spit out the lubricant, and then the lubricant is discharged toward the center of the substrate G at this side. Rotate, this centrifugal force rinses away the developer. When the lubricating liquid is supplied, the substrate G overhang portion Gd is bent down, and the lubricating liquid can be effectively discharged outside the substrate G even if it is rotated at a low speed. The structure of the substrate support portion 70 described in the above-mentioned embodiment includes a horizontal support plate 78 integrally formed. However, it is also possible to use a separate substrate support structure such as' the horizontal support plate 72 is divided into two left and right (78L, 78R) drive units 76 in the longitudinal direction, and the second lifting drive units may also be individually (independently) The spreaders 78L, 78R lift the driver. In this configuration, for example, as shown in FIG. 16, the divided support plate (for example, 72 R) which has passed the wheel brush 11 6 is selectively lowered to the second height when performing the cleaning process. Weiyingtuo borrowed the chart support (please read the precautions on the back before filling in this page) Order _ Φ This paper size applies to China National Standard (CNS) A4 (21〇χ 297 mm) -23- 1223850 V. Description of the invention (21) H2, the excess part Gd of the newly cleaned substrate is bent downward by gravity, so that the cleaning liquid and foreign matter can be easily washed down. '' In the foregoing embodiment, the horizontal support plate 78 is constructed to move up and down between two height positions HI and H2, but it can also be moved up or down within a specified range at 3 = two height positions Constructed at any height. In addition, by fixing the height position of the horizontal support plate and changing the height position of the rotating chuck 66, that is, the chuck chassis 72, the relative height difference between the two (72, 78) can be set to be ^ change. The brushing is not limited to roller brushes, and may be other types of brushes, such as disk brushes having a vertical axis of rotation on the surface of the substrate. The substrate cleaning method or device of the present invention is not limited to the coating and developing process, and is also applicable to any device for cleaning by a brush wiping method. The substrate to be processed in the present invention is not limited to an LCD substrate, and is also applicable to semiconductor wafers, cD substrates, glass substrates, photomasks, printed substrates, and the like. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs as described above. According to the substrate cleaning device or the substrate cleaning method of the present invention, the cleaning process can be carried out at a low cost and safely. The substrate is accessed quickly and safely. In addition, the two-stage cleaning step of scrubbing treatment and spray cleaning treatment can improve the cleaning treatment efficiency and treatment quality.
^23850^ 23850
五、發明說明（22 【圖式之簡單說明】 弟1圖係用以顯示適用本發明之基板洗淨方法或 之塗佈顯影處理系統構成之平面圖。 —、 弟2圖係用以顯示於一實施形態之塗佈顯影處理系统 中處理順序之流程圖。 '' 弟3圖係用以顯示實施形態之刷淨單元内構成（基板 之搬出入時）之簡單剖面圖。 第4圖係用以顯示於實施形態之刷淨單元之夾盤底盤 及基板支撐部之上面構成之平面圖。 现 第5圖係用以顯示實施形態之刷淨單元内構成（洗淨 時）之簡單剖面圖。 第6圖係用以顯示於實施形態中使滾輪毛刷進入被處 理基板上面時之作用之簡單侧視圖。 第7圖係用以顯示於實施形態中，於滾輪毛刷朝向基 板上面進入後，使基板支撐部上昇至基板支撐用之高度位 置作用之簡單侧視圖。 苐8圖係用以顯示於實施形態中，進行毛刷擦洗時重 要位置關係及動作之簡單侧視圖。 第9圖係用以顯示於實施形態中，喷洗時重要位置關 係及動作之簡單側視圖。 第1 〇圖係用以顯示喷洗時另一實施形態之簡單側視 圖。 第11圖係用以顯示同樣之喷洗時另一實施形態之簡 單侧視圖。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） --- (請先閱讀背面之注意事項再填寫本頁) · 經濟部智慧財產局員工消費合作社印製 -25- l22385〇 A7 B7 五、 發明說明（23 ) 第12圖係用以顯示於杂 At K %形悲之一變化例中，進行刷 /寸重要4置關係及動作之簡單側視圖。 々第13圖係用以顯示於實施形態之_變化例中，進行刷 淨時重要位置關係及動作之簡單側視圖。 第14圖係用以顯示將本發明適用於顯影單元（DEV) 時，顯影液供給時之作用之簡單側視圖。 第15圖係用以顯示於第14圖之顯影單元（DEV)中， 潤滑液供給時之作用之簡單侧視圖。 第16圖係用以顯示於依實施形態之一變化例之分割 式基板支撐構造之簡單側視圖。 【圖中標號說明】 經濟部智慧財產局員工消費合作社印製 28 :刷淨單元（SCR) 60 ··箱 62 :刷淨裝置 64 :杯（處理容器） 66 :旋轉夾盤機構 70 :基板支撐部 72 :夾盤底盤 74 :旋轉驅動軸 76 :驅動部 78 :水平支撐板 8 0 ·支撐鎖 82 :垂直支撐構件 112 114 116 118 122 刷洗裝置 噴洗裝置 滾輪毛刷 毛刷擦拭本體 溝 124，134 :洗淨噴霧管 12 8 :洗淨液喷嘴 13 0 :喷射毛刷本體 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) -26V. Explanation of the invention (22 [Simplified description of the drawings] The first figure is a plan view showing the constitution of the substrate cleaning method or the coating and developing processing system applicable to the present invention. —, The second figure is used to display the first The flowchart of the processing sequence in the coating and development processing system of the embodiment. '' Figure 3 is a simple cross-sectional view showing the internal structure of the brushing unit of the embodiment (when the substrate is moved in and out). Figure 4 is used for The plan view showing the upper structure of the chuck chassis and the substrate supporting part of the cleaning unit of the embodiment. Now, FIG. 5 is a simple cross-sectional view showing the internal structure (when cleaning) of the cleaning unit of the embodiment. Section 6 Figure 7 is a simple side view showing the function of the roller brush when it enters the substrate to be processed in the embodiment. Figure 7 is used to show the substrate after the roller brush enters the substrate surface in the embodiment, and then the substrate A simple side view of the role of the supporting part rising to a height position for supporting the substrate. 苐 8 is a simple side view showing the important positional relationship and action during brush scrubbing in the embodiment. Figure 9 is a simple side view showing important positional relationships and actions during spray washing in the embodiment. Figure 10 is a simple side view showing another embodiment during spray washing. Figure 11 is for To show a simple side view of another embodiment of the same spray cleaning. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) --- (Please read the precautions on the back before filling this page ) · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -25-l 22385〇A7 B7 V. Description of the Invention (23) The 12th figure is used to display in one of the variants of the miscellaneous At K%. A simple side view of important relationships and actions. 々 Figure 13 is a simple side view showing important position relationships and actions during cleaning in the _ variation of the embodiment. Figure 14 is a simple side view When the present invention is applied to a developing unit (DEV), a simple side view of the function when the developer is supplied. Figure 15 is a simple side of the developing unit (DEV) shown in Figure 14 when the lubricant is supplied. View Figure 16 is for display A simple side view of a divided substrate supporting structure according to a variation of the embodiment. [Description of the symbols in the figure] Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 28: Brush cleaning unit (SCR) 60 ·· Box 62: Brush Net device 64: Cup (processing container) 66: Rotary chuck mechanism 70: Substrate support section 72: Chuck chassis 74: Rotary drive shaft 76: Drive section 78: Horizontal support plate 80 0 Support lock 82: Vertical support member 112 114 116 118 122 Brushing device Spraying device Roller hair brushes Brush body grooves 124, 134: Washing spray tube 12 8: Washing liquid nozzle 13 0: Spraying brush body This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm) ------------------- Order --------- (Please read the notes on the back before filling this page)- 26
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000045586 | 2000-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI223850B true TWI223850B (en) | 2004-11-11 |
Family
ID=34566970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090104090A TWI223850B (en) | 2000-02-23 | 2001-02-22 | Substrate cleaning apparatus and substrate cleaning method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100738443B1 (en) |
| TW (1) | TWI223850B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI416646B (en) * | 2007-11-20 | 2013-11-21 | Semes Co Ltd | Device and method for cleansing a substrate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100864943B1 (en) * | 2007-08-09 | 2008-10-23 | 세메스 주식회사 | Apparatus for cleaning substrate |
| CN111632168B (en) * | 2020-06-10 | 2021-01-05 | 青岛市黄岛区中心医院 | Rotary circulating type sterilizing machine for medical operating forceps |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697137A (en) * | 1992-09-14 | 1994-04-08 | Dainippon Screen Mfg Co Ltd | Substrate cleaning equipment |
| JP3779483B2 (en) * | 1998-03-23 | 2006-05-31 | 東京エレクトロン株式会社 | Substrate cleaning apparatus and cleaning method |
-
2001
- 2001-02-21 KR KR1020010008572A patent/KR100738443B1/en not_active IP Right Cessation
- 2001-02-22 TW TW090104090A patent/TWI223850B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI416646B (en) * | 2007-11-20 | 2013-11-21 | Semes Co Ltd | Device and method for cleansing a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010085431A (en) | 2001-09-07 |
| KR100738443B1 (en) | 2007-07-12 |
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