JP2001046918A - Processing solution discharge nozzle, liquid treating device and liquid treating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing soln. discharge nozzle by which the processing soln. is not dripped on a substrate when moved, and the product yield is improved and the liq. treating device and method using the nozzle. SOLUTION: The processing soln. discharge nozzle 60 for discharging a processing soln. on a body to be treated has a liq. supply pipe 61 for sending the processing soln. almost horizontally and a discharge part 62 communicating with the supply pipe 61 and discharging the processing soln. The discharge part 62 has a draining part 63 arranged above the supply pipe 61 and a tip 64 directed downward from the draining part 63 and discharging the processing soln. on the body to be treated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing liquid discharge nozzle for performing liquid processing on a substrate such as a glass substrate for a liquid crystal display (LCD) or a semiconductor wafer, a liquid processing apparatus and a liquid processing method.

[0002]

2. Description of the Related Art In the manufacture of a liquid crystal display (LCD), for example, a photoresist liquid is applied to a rectangular LCD substrate made of glass to form a resist film, and the resist film is exposed according to a circuit pattern. A circuit pattern is formed by a so-called photolithography technique of developing the substrate.

The formation of such a circuit pattern is performed by a resist coating and developing system in which a plurality of processing units are integrated. In such a system, first, the surface of the substrate is subjected to surface modification / cleaning treatment by ultraviolet irradiation as necessary, and then the cleaning unit performs brush cleaning and ultrasonic water cleaning. Thereafter, the substrate is subjected to a hydrophobic treatment (HMDS treatment) in an adhesion treatment unit in order to enhance the fixability of the resist,
Subsequently, a resist coating is performed in a resist coating unit, and after pre-baking, a predetermined pattern is exposed by an exposure device, further developed by a developing unit, and post-baked to form a predetermined circuit pattern.

Among these, for example, a developing unit is
A developing nozzle for discharging a developing solution to the substrate, a discharging nozzle for discharging a rinsing liquid after the developing process, a spin chuck for holding the substrate, and a moving mechanism for moving the developing nozzle and the discharging nozzle from the standby position onto the substrate, respectively, A cup is provided around the spin chuck to collect the processing liquid shaken off.
Then, when the developing processing is performed by the developing processing unit, first, the substrate is placed on the spin chuck, and the developing nozzle is moved from the standby position to the substrate, so that the developing solution is loaded on the substrate. After the completion of the liquid filling, the developing nozzle moves to the standby position. After maintaining a predetermined development time in this state, the spin chuck is rotated, the developer is shaken off, and then the rinse liquid discharge nozzle for discharging the rinse liquid moves from the standby position onto the substrate, and the rinse liquid is rotated while rotating the spin chuck. After the discharge, the supply of the rinse liquid is stopped, and the rinse liquid is shaken off and dried. After shaking off and drying, the rinse liquid discharge nozzle moves to the standby position.

[0005]

However, when the rinse liquid nozzle moves to the standby position after the shake-off drying is completed, the rinse liquid may drip from the nozzle onto the substrate. If the rinsing liquid drips, there is a possibility that a trace of water droplets will be formed on the substrate, or the rinsing liquid which has dropped will adhere to the substrate transfer device, and the rinsing liquid may adhere to other substrates. As described above, if a water droplet mark is directly formed on a substrate or a rinsing liquid adhered to a substrate transfer device adheres to another substrate, the yield of products is reduced.

The present invention has been made in view of such circumstances, and a processing liquid discharge nozzle capable of improving the yield of products without the processing liquid dripping onto a substrate during movement, a liquid processing apparatus and a liquid processing apparatus using the same. The aim is to provide a method.

[0007]

According to a first aspect of the present invention, there is provided a processing liquid discharge nozzle for discharging a processing liquid to an object to be processed. A liquid supply pipe for feeding, and a discharge unit that is in communication with the liquid supply pipe and discharges the processing liquid; the discharge unit includes a liquid drain unit disposed above the liquid supply pipe; and the liquid drain unit. Turned down from
A processing liquid discharge nozzle having a tip for discharging a processing liquid to an object to be processed is provided.

According to a second aspect of the present invention, there is provided a processing liquid discharge nozzle for discharging a processing liquid to an object to be processed, comprising: a liquid feed pipe for feeding a processing liquid; And a discharge section disposed above the liquid supply pipe, and a tip that is directed downward from the liquid discharge section and discharges a processing liquid to an object to be processed. The processing liquid ejection nozzle is provided, wherein the tip portion is formed such that the thickness thereof is reduced toward the tip.

According to a third aspect of the present invention, there is provided a processing liquid discharge nozzle for discharging a processing liquid to an object to be processed, comprising: a liquid feed pipe for feeding a processing liquid; And a discharge part for discharging the liquid. At least a part of the discharge part has a roughness of an inner surface thereof smaller than a roughness of an inner surface of the liquid supply pipe. Claim 3).

According to a fourth aspect of the present invention, there is provided a processing liquid discharge nozzle for discharging a processing liquid to an object to be processed, comprising: a liquid feed pipe for feeding the processing liquid; And a discharge portion for discharging the liquid, and at least a part of the discharge portion has a resin film formed on an inner surface thereof.

According to a fifth aspect of the present invention, there is provided a processing liquid discharge nozzle for discharging a processing liquid to an object to be processed, comprising: a liquid feed pipe for feeding a processing liquid; And a vibrating section for vibrating the processing liquid is provided in the discharging section, wherein a processing liquid discharge nozzle is provided (claim 5).

According to a sixth aspect of the present invention, a holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle which is moved upward from the standby position to above the substrate. A processing liquid discharge nozzle moving mechanism for moving the processing liquid discharge nozzle, wherein the processing liquid discharge nozzle is connected to a liquid supply pipe that sends the processing liquid in a substantially horizontal direction, and the liquid supply pipe,
A discharge unit configured to discharge the processing liquid, wherein the discharge unit is disposed above the liquid supply pipe, and is directed downward from the liquid discharge unit to discharge the processing liquid to the object to be processed. A liquid processing apparatus comprising:

According to a seventh aspect of the present invention, a holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid to the surface of the substrate, and a processing liquid discharge nozzle moved from a standby position to a position above the substrate. A liquid processing apparatus comprising: a processing liquid discharge nozzle moving mechanism for moving the processing liquid; wherein the processing liquid discharge nozzle is connected to a liquid feed pipe for feeding a processing liquid, and a discharge unit that discharges the processing liquid. The discharge unit includes a liquid drain portion disposed above the liquid feed pipe, and a tip portion that is directed downward from the liquid drain portion and discharges a processing liquid to the object to be processed. A liquid processing apparatus is provided, wherein the tip portion is formed so that its thickness becomes smaller toward the tip portion.

According to an eighth aspect of the present invention, a holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle which moves the processing liquid discharge nozzle upward from the standby position to above the substrate A liquid processing apparatus comprising: a processing liquid discharge nozzle moving mechanism for moving the processing liquid; wherein the processing liquid discharge nozzle is connected to a liquid feed pipe for feeding a processing liquid, and a discharge unit that discharges the processing liquid. Wherein a resin film is formed on the inner surface of the liquid discharge section.

According to a ninth aspect of the present invention, a holding portion for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle which moves the processing liquid discharge nozzle upward from the standby position to above the substrate A liquid processing apparatus comprising: a processing liquid discharge nozzle moving mechanism for moving the processing liquid; wherein the processing liquid discharge nozzle is connected to a liquid feed pipe for feeding a processing liquid, and a discharge unit that discharges the processing liquid. Wherein the discharge section has a vibrating section for vibrating the processing liquid.

According to a tenth aspect of the present invention, a holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle which moves the processing liquid discharge nozzle upward from the standby position to above the substrate A liquid processing apparatus including a processing liquid discharge nozzle moving mechanism for moving, wherein the processing liquid discharge nozzle moving mechanism vibrates a processing liquid discharge nozzle and shakes off a processing liquid near a discharge port of the processing liquid discharge nozzle. A liquid processing apparatus is provided, comprising: nozzle vibrating means; and control means for controlling the nozzle vibrating means.
2).

According to an eleventh aspect of the present invention, a holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto a surface of the substrate, and a processing liquid discharge nozzle for moving the processing liquid from a discharge nozzle standby position to a position on the substrate. A processing apparatus comprising a processing liquid discharge nozzle moving mechanism for moving the processing liquid upward, wherein the processing liquid discharged from the processing liquid discharge nozzle reaches the substrate surface obliquely upward with respect to the substrate surface. The processing liquid is disposed between the processing liquid discharge nozzle and the substrate and substantially vertically below the discharge port of the processing liquid discharge nozzle, and the processing liquid dropped almost vertically downward from the discharge port to the substrate. The liquid processing apparatus is provided with a processing liquid recovery means for recovering the processing liquid before the temperature reaches the threshold (claim 13).

According to a twelfth aspect of the present invention, a step of supplying a processing liquid from a processing liquid discharge nozzle to a surface of a substrate placed substantially horizontally, a step of stopping the supply of the processing liquid, Vibrating the processing liquid discharge nozzle so as to shake off the processing liquid in the vicinity of the discharge port of the liquid discharge nozzle; and rotating the substrate almost horizontally about the center of the substrate as an axis to shake off unnecessary processing liquid on the substrate surface And a liquid treatment method comprising the steps of:

According to the first and sixth aspects of the present invention, the liquid drain is disposed above the liquid feed pipe of the processing liquid discharge nozzle, and the tip for discharging the processing liquid is drained. After the supply of the processing liquid is stopped, the processing liquid in the tip portion falls by its own weight from the highest point of the liquid draining section, and thereafter the processing liquid does not exist in this portion. . Therefore, even if the discharge nozzle is subsequently moved to the standby position, the processing liquid does not drop from the discharge nozzle during the movement. Since the liquid feed pipe sends the processing liquid in the horizontal direction, the processing liquid in the liquid feed pipe is located at the highest point of the liquid drainage section even if gravity is applied to the processing liquid as compared with the case where the liquid feed pipe is vertical. Is less likely to be discharged than when the liquid feed pipe is vertical, and only the processing liquid in the tip end is discharged from the highest point of the liquid draining section after the processing liquid supply is stopped. After the supply of the liquid is stopped, the amount of the processing liquid discharged from the discharge nozzle may be smaller, and the stability of the discharge amount can be improved as compared with the case where the liquid supply pipe is vertical.

According to the second and seventh aspects of the present invention, the outer shape of the distal end of the processing liquid discharge nozzle is shaped like an inverted truncated cone so that the thickness of the distal end of the processing liquid discharge nozzle becomes smaller toward the distal end. Since it is formed in a shape, the area where the water droplet hanging on the tip portion contacts the tip portion can be further reduced, and the water droplet hardly hangs on the tip portion and the water droplet hardly remains on the tip portion.

According to the third aspect of the present invention, since the roughness of at least a part of the inner surface of the discharge unit is smaller than the roughness of the inner surface of the liquid sending pipe, the processing liquid is less likely to adhere to the discharge unit. In addition, the liquid discharge in the discharge section becomes good.

According to the fourth and eighth aspects of the present invention, since the resin film is formed on at least a part of the inner surface of the discharge part of the processing liquid discharge nozzle, the discharge part has high water repellency. As a result, the liquid shortage at the discharge portion becomes good.

According to the fifth and ninth aspects of the present invention, since the vibrating section for vibrating the processing liquid is provided at the discharge section of the processing liquid discharge nozzle, the vibrating section is vibrated. Thereby, the liquid drainage property in the discharge unit is improved.

According to the tenth and twelfth aspects of the present invention, the processing liquid is vibrated to the processing liquid discharge nozzle to shake off the processing liquid in the vicinity of the discharge port. The liquid can be almost completely removed. Further, as in the tenth aspect of the present invention, since the nozzle oscillating means is provided in the processing liquid discharge nozzle moving mechanism, even if a plurality of processing liquid discharge nozzles are attached to the processing liquid discharge nozzle moving mechanism, the nozzle vibration means is provided. There is no need to provide a plurality of means, and the apparatus can be simplified.

According to the eleventh aspect of the present invention, the processing liquid is discharged obliquely from the processing liquid discharge nozzle to the substrate surface, and the discharge nozzle is provided between the substrate and the discharge nozzle below the discharge port. A processing liquid collecting means is provided to collect the processing liquid that has dropped vertically from the substrate. When supplying the processing liquid, the processing liquid is supplied to the substrate obliquely from above the substrate surface and discharged after the processing liquid supply is stopped. The processing liquid dripping from the nozzle can be collected before reaching the substrate surface, and the product yield can be increased.

In the processing liquid discharge nozzle according to the first and second aspects, it is preferable that the liquid drain portion is formed to be curved upward. Thus, since the liquid draining portion is formed to be curved upward, the discharge nozzle can be formed by bending the pipe, so that the discharge nozzle can be easily formed without the need for drilling or the like. In addition, the inner surface of the pipe can be treated before the pipe is bent, so that the discharge nozzle can be easily formed.

In the processing liquid discharge nozzle according to the first to third and fifth aspects, it is preferable that a resin film is formed on at least a part of the inner surface of the discharge part. . Thereby, the water repellency of the discharge unit is increased, and the liquid discharge at the discharge unit can be further improved.

In the liquid processing apparatus according to the sixth to eleventh aspects, the liquid processing apparatus is a development processing apparatus,
The processing liquid discharge nozzle may be a nozzle that discharges a rinsing liquid that removes the developing liquid from the substrate or a nozzle that discharges the developing liquid to the substrate. When the rinse liquid is discharged, the rinse liquid is discharged after the development is completed, and then the substrate is dried while rotating the substrate, and then the discharge nozzle is moved from the substrate to the discharge nozzle standby position. The rinsing liquid is dripped onto the substrate surface, and a drop of water droplets on the substrate surface or the rinsing liquid dripping on the substrate surface is attached to the substrate transfer device, and the possibility that the rinsing liquid is attached to another substrate is reduced. Further, when the developer is discharged, even if the discharge nozzle is moved from the substrate to the discharge nozzle standby position in a state where the liquid is deposited on the substrate surface, the developer drops from the discharge nozzle onto the liquid-filled substrate surface. The risk is small, and therefore, it is possible to reduce the possibility that the developing solution which cannot be held by the surface tension due to an increase in the amount of liquid to be poured is wrapped around the substrate back surface and contaminates the substrate back surface,
The yield can be kept high.

In the liquid processing apparatus according to the sixth to eleventh aspects, the liquid processing apparatus is a resist coating apparatus, and the processing liquid discharge nozzle discharges a resist onto a substrate or discharges a resist solvent onto a substrate. It may be a nozzle (claim 15). In the case of discharging the resist, the resist is discharged to almost the center of the substrate surface, and then the discharge nozzle is moved.When the resist drips on the substrate surface at this time, the resist liquid is circularly formed substantially at the center of the substrate surface. The thorn-shaped portion that protrudes from the circular core portion even if the resist is spread over the surface of the substrate by rotating the substrate in the horizontal direction and then spreading out from the circular core portion without spreading out, and then spreading out the resist over the substrate surface. Therefore, the resist may not be uniform, or the substrate may need to be rotated for an unnecessarily long time to achieve a uniform thickness. However, in the present invention, the possibility that the resist drips onto the substrate surface when the discharge nozzle moves is reduced, so that the film thickness uniformity of the resist can be improved. On the other hand, when the resist solvent is discharged, the resist solvent is first discharged onto the substrate surface, the substrate is rotated to spread the solvent on the substrate surface, and then the resist is discharged onto the substrate surface to spread the resist on the substrate surface. If the solvent drips onto the substrate surface when moving the resist solvent discharge nozzle, the solvent will increase only in that part of the substrate, and the resist film thickness at that part of the substrate may change after spreading the resist. According to the present invention, the possibility of the solvent dripping when the resist solvent discharge nozzle moves is reduced, so that the uniformity of the resist film thickness can be improved.

[0030] In the liquid processing apparatus according to the sixth to eleventh aspects, the liquid processing apparatus is a substrate cleaning apparatus,
The processing liquid discharge nozzle may be a nozzle that discharges a cleaning liquid to the substrate. In this case, even after the substrate is washed, the substrate is rotated and dried, and then the cleaning liquid discharge nozzle is moved from above the substrate to the discharge nozzle standby position, the cleaning liquid drips onto the dried substrate surface, and the substrate surface is dried. The possibility that the cleaning liquid drops on the substrate or the cleaning liquid dripping on the substrate surface adheres to the substrate transfer device and the cleaning liquid adheres to another substrate is reduced, and the yield can be kept high.

In the liquid processing method according to the twelfth aspect, the step of oscillating the processing liquid discharge nozzle preferably overlaps the step of stopping the supply of the processing liquid in time. . This makes it possible to improve the liquid discharging property of the discharge nozzle.

In the liquid processing method according to the twelfth aspect, the step of oscillating the processing liquid discharge nozzle is preferably performed in a state where the processing liquid discharge nozzle is positioned on the substrate. Since the discharge nozzle is vibrated while the discharge nozzle is positioned on the substrate, the discharge amount is controlled in consideration of the amount of liquid to be drained, so that the drained processing liquid can be used, and wasteful processing liquid can be eliminated. Can be.

[0033]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing an LCD substrate resist coating / developing processing system to which the present invention is applied.

This coating / developing processing system includes a cassette station 1 on which a cassette C accommodating a plurality of substrates G is mounted, and a plurality of processing units for performing a series of processes including resist coating and developing on the substrates G. A processing unit 2 is provided, and an interface unit 3 for transferring a substrate G between the processing unit 2 and an exposure apparatus (not shown). A cassette station 1 and an interface unit 3 are provided at both ends of the processing unit 2, respectively. Are located.

The cassette station 1 has a transport mechanism 10 for transporting the LCD substrate between the cassette C and the processing section 2. And cassette station 1
, A cassette C is loaded and unloaded. The transport mechanism 10 includes a transport arm 11 that can move on a transport path 10 a provided along the direction in which the cassettes are arranged. The transport arm 11 allows the substrate G to be moved between the cassette C and the processing unit 2.
Is carried out.

The processing section 2 is divided into a front section 2a, a middle section 2b, and a rear section 2c.
2, 13 and 14, and each processing unit is disposed on both sides of these transport paths. Then, relay portions 15 and 16 are provided between them.

The front section 2a includes a main transfer device 17 movable along the transfer path 12. On one side of the transfer path 12, two cleaning units (SCR) 21a and 21b are arranged. On the other side of the transport path 12, an ultraviolet irradiation / cooling unit 25 in which an ultraviolet irradiation device (UV) and a cooling device (COL) are vertically stacked, and two heat treatment devices (HP) are vertically stacked. A heat treatment unit 26 and a cooling unit 27 in which two cooling devices (COL) are vertically stacked are arranged.

The middle section 2b includes a main transfer device 18 movable along the transfer path 13. On one side of the transfer path 13, a resist coating unit (CT) 22 and a peripheral portion of the substrate G are provided. A peripheral resist removal unit (ER) 23 for removing the resist of the portion is provided integrally,
On the other side of the transport path 13, a heat treatment unit 28 in which two heating devices (HP) are vertically stacked, and a heat treatment in which a heat treatment device (HP) and a cooling treatment device (COL) are vertically stacked. / Cooling unit 29, and an adhesion processing / cooling unit 30 in which an adhesion processing device (AD) and a cooling device (COL) are vertically stacked.
Is arranged.

Further, the rear stage 2c is provided with a main transport device 19 movable along the transport path 14,
On one side, three development processing units (DEV) 24
a, 24b, and 24c are arranged, and on the other side of the transport path 14, a heat treatment unit 31 in which two heat treatment devices (HP) are vertically stacked, and a heat treatment device (H
P) and a cooling device (COL) are vertically stacked, and two heat treatment / cooling units 32 and 33 are arranged.

The main transporting devices 17, 18, and 19 respectively include an X-axis driving mechanism, a Y-axis driving mechanism in two directions in a horizontal plane,
And a vertical Z-axis drive mechanism.
A rotation drive mechanism that rotates about an axis is provided, and has arms 17a, 18a, and 19a that support the substrate G, respectively.

The processing unit 2 includes a cleaning processing unit 21a and a resist processing unit 2 on one side of the conveyance path.
2. Only a spinner unit such as the development processing unit 24a is arranged, and only a heat processing unit such as a heating processing unit or a cooling processing unit is arranged on the other side.

A chemical solution supply unit 34 is provided at a portion of the relay units 15 and 16 on the side where the spinner system unit is provided, and a space 35 for maintenance is provided.

The interface section 3 includes an extension 36 for temporarily holding the substrate when transferring the substrate to and from the processing section 2, and two buffer stages 37 provided on both sides thereof for disposing a buffer cassette. And a substrate G between these and an exposure apparatus (not shown)
And a transport mechanism 38 for carrying in and out the wafer. The transport mechanism 38 includes the extension 36 and the buffer stage 3
The transfer arm 39 is provided on the transfer path 38a provided along the arrangement direction of the transfer unit 7 and the transfer arm 39 transfers the substrate G between the processing unit 2 and the exposure apparatus.

By consolidating and integrating the processing units in this way, space can be saved and processing efficiency can be improved.

In the coating / developing processing system configured as described above, the substrate G in the cassette C is transported to the processing unit 2, and the processing unit 2 firstly starts the ultraviolet irradiation / cooling unit 25 of the front stage 2 a. After the surface modification / cleaning treatment is performed by an ultraviolet irradiation device (UV) and then cooled by the cooling device (COL) of the unit, the cleaning unit (SCR)
Scrubber cleaning is performed at 21a and 21b, and the front part 2a is cleaned.
After being dried by heating in one of the heat treatment devices (HP) arranged in the cooling unit 27, the cooling device (CO
L).

Thereafter, the substrate G is transported to the middle section 2b,
In order to improve the fixability of the resist, a hydrophobic treatment (H) is performed by an adhesion treatment device (AD) in the upper stage of the unit 30.
MDS processing), and after cooling by the lower cooling device (COL), the resist is applied by the resist coating unit (CT) 22 and the extra resist on the periphery of the substrate G is removed by the peripheral resist removal unit (ER) 23. . Thereafter, the substrate G is pre-baked in one of the heat treatment apparatuses (HP) arranged in the middle section 2b, and cooled by the lower cooling apparatus (COL) of the unit 29 or 30.

Thereafter, the substrate G is transferred from the relay section 16 to the exposure apparatus via the interface section 3 by the main transfer apparatus 19, where a predetermined pattern is exposed. And
The substrate G is carried in again via the interface unit 3,
If necessary, any one of the heat treatment devices (H
After performing post exposure bake processing in P),
Development processing is performed in any of the development processing units (DEV) 24a, 24b, and 24c, and a predetermined circuit pattern is formed. The developed substrate G is subjected to a post-baking process in any one of the heat treatment devices (HP) in the subsequent section 2c, and then cooled by a cooling device (COL).
The cassette is stored in a predetermined cassette on the cassette station 1 by the transfer mechanism 10.

Next, a developing unit (DEV) to which the present invention is applied will be described. FIG. 2 is a sectional view of the developing unit (DEV), and FIG. 3 is a plan view of the developing unit (DEV).

As shown in FIG. 2, the developing unit (D
In the EVs 24a, 24b, and 24c, the spin chuck 41 for mechanically holding the substrate G is provided with a rotation driving mechanism 42.
The spin chuck 41 is provided with a cover 4 surrounding the rotation drive mechanism 42.
3, two under cups 44 and 45 are provided around the outer periphery of the cover 43 so as to be separated from each other.

Above the space between the two under cups 44 and 45, an inner cup 46 for mainly flowing the developing solution downward is provided so as to be able to move up and down.
An outer cup 47 for mainly flowing the rinsing liquid downward is provided integrally with the inner cup 46 on the outer side of the lower part 5 so as to be vertically movable. In FIG. 2, the left side shows the position where the inner cup 46 and the outer cup 47 are raised when the developer is discharged, and the right side shows the position where they are lowered when the rinsing liquid is discharged. I have.

Further, a sink 48 for surrounding the whole of the development processing unit is provided, and the sink 48 has an exhaust port 4 for exhausting the inside of the unit at the time of rotational drying.
9, a drain tube 50a for a developer and a drain tube 50b for a rinse solution are provided.

As shown in FIG. 3, on one side of the outer cup 47, there is provided a nozzle arm 51 for a developing solution.
0 is stored. The nozzle arm 51 is configured to move across the substrate G along a guide rail 53 by a drive mechanism 52 such as a belt drive, so that when the developer is applied, the nozzle arm 51 While discharging the developing solution from the nozzle, the stationary substrate G
Is to be scanned.

On the other side of the outer cup 47, a nozzle arm 54 for rinsing liquid such as pure water is provided.
0 is provided. This nozzle arm 54 has a pivot 55
Are provided so as to be rotatable by a driving mechanism 56 around the center. Thus, when discharging the rinsing liquid, the nozzle arm 54 scans the substrate G while discharging the rinsing liquid from the rinsing liquid discharging nozzle 60.

A lid (not shown) is provided on the outer cup 47 so as to be able to move up and down, and the lid is closed when rinsing. A notch is formed in the outer cup 47 so that the lid can be closed while the rinsing liquid discharge nozzle 60 is kept in the cup.

As shown in FIG. 4, a rotary drive mechanism 42 for rotating the spin chuck 41, a drive mechanism 52 for driving the nozzle arm 51 for the developer, and a drive for rotating the nozzle arm 54 for the rinse liquid. Each of the mechanisms 56 is controlled by the control device 70.

As shown in the sectional view of FIG. 5, the rinsing liquid discharge nozzle 60 has a tubular shape, is disposed horizontally, and has a liquid supply pipe 61 for supplying the rinse liquid. And a discharge unit 62 for discharging the liquid. Discharge unit 62
Is a liquid drain portion 63 disposed above the liquid sending pipe 61,
A tip 64 is directed downward from the liquid draining section and discharges a rinsing liquid onto the substrate G. The liquid draining section 63 is formed to be curved upward. The liquid supply pipe 61 is connected to an air operation valve (not shown), and can control supply and stop of the rinsing liquid. The rinsing liquid discharge nozzle 60 is made of metal and can be formed with a small amount of processing by bending.

Next, the developing operation in the developing units (DEV) 24a, 24b, 24c configured as described above will be described. First, as shown in FIG.
The exposed substrate G is carried into one of the development processing units (DEV) 24a, 24b, and 24c by the main carrier device 19, and the carried substrate G is suction-held by the spin chuck 41 as shown in FIG. Is done. Next, the developing solution is discharged from a developing solution discharge nozzle (not shown) attached to the nozzle arm 51 while the developing solution nozzle arm 51 moves on the substrate G which is stationary along the guide rail 53 by the driving mechanism 52. Is applied to the entire surface of the substrate G. Thereafter, the nozzle arm 51 moves to the standby position, in which state the nozzle arm 51 is stopped for a predetermined time, and the developing process proceeds by natural convection. Thereafter, the substrate G is rotated by the spin chuck 41 to shake off the developing solution.

Next, the nozzle arm 54 for the rinsing liquid is pivoted about the pivot 55 by the drive mechanism 56, moves onto the substrate G, lowers the lid (not shown), seals it, and rotates the substrate G. Meanwhile, the rinsing liquid is discharged from the rinsing liquid discharge nozzle 60, and the substrate is cleaned.

After a lapse of a predetermined time, the supply of the rinsing liquid is stopped, the rotation of the substrate G is accelerated, and the rinsing liquid and the remaining developing liquid are shaken off and dried. Thereafter, the rotation is stopped and the lid is raised, and then the rinsing liquid discharge nozzle 60 is moved to the standby position, and a series of development processing ends.

At this time, in the rinsing liquid supply nozzle 60 having the structure shown in FIG. 5, after the supply of the rinsing liquid is stopped, the rinsing liquid drops freely from the highest point of the liquid draining section 63 due to gravity. Has no rinsing liquid. Therefore, even if the rinsing liquid discharge nozzle 60 is subsequently moved to the standby position, the rinsing liquid is less likely to drip from the rinse liquid discharge nozzle 60 onto the substrate surface during the movement, causing water droplet marks on the substrate surface or dripping on the substrate surface. The possibility that the dropped rinsing liquid adheres to the substrate transfer device and the rinsing liquid adheres to another substrate is reduced, and the yield of the product is improved.

When the liquid feed pipe is vertical, gravity is applied to the processing liquid in the liquid feed pipe even after the supply of the processing liquid is stopped, so that the processing liquid in the liquid feed pipe passes over the highest point of the liquid drain section. Although it is discharged, the discharge amount of the processing liquid is not stable, but in the present invention,
Since the liquid feed pipe 61 is arranged in a substantially horizontal direction, even if gravity is applied to the rinse liquid, the rinse liquid in the liquid feed pipe 61 is discharged even over the highest point of the liquid draining section 63. The possibility is small compared to the case where the liquid feed pipe is vertical, and only the rinsing liquid in the tip end portion 64 is discharged from the highest point of the liquid draining section after the rinsing liquid supply is stopped. The amount of the rinsing liquid discharged from the rinsing nozzle can be reduced, and the stability of the discharge amount can be improved as compared with the case where the liquid supply pipe is vertical.

In the rinse liquid discharge nozzle 60 having the structure shown in FIG. 5, it is preferable that the roughness of the inner surface of the liquid draining section 63 is smaller than the roughness of the inner surface of the liquid feed pipe 61. This makes it more difficult for the rinsing liquid to adhere to the liquid draining unit 63, improves the liquid drainage at the liquid draining unit 63, and may cause the rinsing liquid to drop from the rinsing liquid discharging nozzle 60 when the rinsing liquid discharging nozzle 60 moves. It can be further reduced. In order to make the roughness of the inner surface of the liquid drain 63 smaller than the roughness of the inner surface of the liquid feed pipe 61, the inner surface of the liquid drain 63 may be polished.

As shown in FIG. 6, instead of polishing the inner surface of the draining portion 63 of the rinsing liquid discharge nozzle 60 to reduce the surface roughness, a resin film 65 is formed on at least the inner surface of the draining portion 63. May be. Since the surface of the resin coating 65 is usually very smooth, the roughness of the inner surface of the liquid draining section 63 will be smaller than that of the inner surface of the liquid sending pipe 61, and
The water repellency of the draining part 63 is further improved,
Of the liquid is good.

These inner surface treatments can be performed before bending, and the rinsing liquid discharge nozzle 60 can be easily formed.

The tip 64 of the rinsing liquid discharge nozzle 60
As shown in FIG. 7, it is preferable that the thickness be reduced toward the tip. In this case, the outer shape is formed in the shape of an inverted truncated cone, and the area of the droplet 66 hanging on the distal end portion 64 in contact with the distal end portion 64 can be made extremely small, so that the droplet hangs on the distal end portion 64. This makes it difficult for the droplet to remain on the end portion 64.

As shown in FIG. 8, a vibrating section 67 for vibrating the rinse liquid discharged to the rinse liquid discharge nozzle 60 is provided.
May be provided. The vibration unit 67 can control the vibration time by a control unit (not shown). The vibration section 67 is provided adjacent to at least a part of the rinse liquid discharge nozzle 60 or integrally with the rinse liquid discharge nozzle 60, and can apply vibration to the rinse liquid present in the liquid drain section 63. When the vibrating section 67 is provided, a rinsing liquid is supplied,
When the supply of the rinsing liquid is stopped, and after the supply of the rinsing liquid is stopped, the vibrating section 67 is vibrated, so that the liquid drainage section 63 is more likely to run out of liquid. The possibility of dripping from the surface can be reduced. When vibrating the vibrating section 67,
When the rinsing liquid discharge nozzle 60 is positioned above the substrate G, the discharge amount is controlled in consideration of the liquid amount to be drained, so that the rinse liquid that has been drained can be used, and the waste rinse liquid can be used. Can be omitted. The rinsing liquid discharge nozzle 60 may be vibrated at the position off the substrate G to vibrate the vibrating section 67 so that the rinse liquid that has been drained may not be reused.

While the above description has been given of the example in which the present invention is applied to the rinsing liquid discharge nozzle 60, the present invention can also be applied to the developing liquid discharge nozzle 80. An example will be described with reference to FIGS. FIG. 9 is a perspective view of the developer discharge nozzle 80, and FIG. 10 is a sectional view of the developer discharge nozzle 80. The developer discharge nozzle 80 includes a liquid feed pipe 81 that feeds the developer in a substantially horizontal direction, and a discharge part 82 that communicates with the liquid feed pipe 81 and discharges the developer. The liquid supply pipe 81 is connected to an air operation valve (not shown).
It is possible to control the supply and stop of the developer. The discharge part 82 is provided with the liquid drain part 8 disposed above the liquid feed pipe 81.
3, a nozzle block 84 communicating with the liquid draining portion, and a tip portion 85 provided below the nozzle block 84 to discharge the developer. The length of the nozzle block 84 in the longitudinal direction is longer than the short side of the substrate G. A plurality of small-diameter holes 86 are provided in the front end portion 85 in a line in the longitudinal direction of the nozzle block 84, and the range in which the holes 86 are arranged is substantially the same as the short side length of the substrate. Therefore, by moving the developing solution discharge nozzle 80 while discharging the developing solution from one short side of the substrate G to the other short side while maintaining the state parallel to the short side, the developing solution is discharged onto the surface of the substrate G. It is being served.

In the developing solution discharge nozzle 80 having such a structure, the developing solution falls freely from the highest point of the liquid draining section 83 by gravity, similarly to the rinsing liquid discharging nozzle described above. No liquid is present. Therefore, the developer discharging nozzle 80
Even if is moved from the substrate G to the standby position of the developing solution discharge nozzle, the possibility that the developing solution drips from the developing solution discharge nozzle to the surface of the substrate G filled with liquid is small, and therefore, the amount of liquid to be stored is increased. It is possible to reduce the possibility that the developing solution that cannot be held by the surface tension wraps around the back surface of the substrate and contaminate the back surface of the substrate, thereby maintaining a high yield.

After the developing solution is discharged, even after the air operation valve (not shown) is closed in order to stop the supply of the developing solution, the developing solution from the liquid draining portion 83 to the front end portion 85 remains on the substrate G.
Since the developer is supplied to the upper side, the amount of the developer may be measured in advance. In the step of filling the developing solution on the surface of the substrate G, the necessary amount of developing solution can be supplied to the surface of the substrate G by closing the air operation valve in consideration of the amount of the developing solution supplied after closing the air operation valve.

Next, a case where the processing liquid discharge nozzle of the present invention is applied to the resist liquid discharge nozzle of the resist coating unit (CT) 22 will be described. FIG. 11 is a plan view showing a schematic configuration of the resist coating unit (CT). This resist coating unit (CT) 22
A horizontally rotatable spin chuck 9 for holding a substrate G by suction
1. A rotating cup 92 having a bottomed open cylindrical shape, which surrounds the upper end of the spin chuck 91 and surrounds the substrate G sucked and held by the spin chuck 91 and has an open upper end. It has a lid (not shown) to be covered, and a drain cup 93 fixedly arranged so as to surround the outer periphery of the rotating cup 92. This allows
At the time of discharging the resist solution, the substrate G
Are rotated by a spin chuck 91, and when the resist solution is diffused, the substrate G is rotated by the spin chuck 91, and at the same time, the rotary cup 92 with the lid closed is rotated. The drain cup 93
An outer cover 94 is provided on the outer periphery of the.

Further, a resist coating unit (CT)
Reference numeral 22 has a nozzle arm 95 for discharging a resist solution and a solvent on a rectangular LCD substrate G made of glass. The nozzle arm 95 is moved to the center of the substrate G when discharging the resist liquid or the solvent. At the tip of the nozzle arm 95, a resist liquid discharge nozzle 100 and a solvent discharge nozzle 110 for discharging a solvent of the resist are provided, and are connected to a resist supply section (not shown) via a resist supply pipe (not shown). It is connected.
The substrate G on which the resist has been applied by the resist coating unit (CT) 22 is transported to an edge remover (ER) 23 by a pair of transport arms 96.

The resist liquid discharge nozzle 100 is basically configured in the same manner as the above-described rinse liquid discharge nozzle 60, and has a tubular shape and is horizontally disposed as shown in FIG. It has a liquid pipe 101 and a discharge section 102 which is connected to the liquid supply pipe 101 and discharges a resist liquid. The discharging unit 102 includes a liquid draining unit 103 disposed above the liquid feeding pipe 101 and a front end 104 that is directed downward from the liquid draining unit and discharges the resist liquid onto the substrate G. The liquid draining section 103 is formed to be curved upward. The liquid feed pipe 101 is connected to an air operation valve (not shown), and can control the supply and stop of the resist liquid. The resist liquid discharge nozzle 100 is also made of metal and can be formed with a small amount of processing by bending.

Next, the coating operation in the resist coating unit (CT) 22 configured as described above will be described. First, the substrate G is vacuum-adsorbed to the spin chuck 91 and the substrate G is rotated by the spin chuck 91. In this state, the nozzle arm 95 is rotated to the center of the substrate G, and the solvent discharge nozzle 110 is
Is reached, the solvent such as thinner is discharged onto the surface of the rotating substrate G, and the solvent is evenly spread from the center of the substrate G to the entire surrounding area by centrifugal force. Subsequently, the resist liquid discharge nozzle 100 reaches the center of the spin chuck 91 (the center of the substrate G), and the resist liquid is discharged to the center of the substrate G. Thereafter, the lid is lowered to seal the inside of the cup. In this state, the substrate G is rotated together with the cup and the lid, and the resist solution is evenly spread from the center of the substrate G to the entire surrounding area by the centrifugal force. Thereafter, the rotation is stopped, the lid is raised, and the substrate G is carried out. The ejection of the solvent is not essential.

At this time, the resist solution is discharged from the resist solution discharge nozzle 100 having the structure shown in FIG. 12 to approximately the center of the surface of the substrate G, and then the resist solution discharge nozzle 100 is moved to the standby position. In 100, after the supply of the rinsing liquid is stopped, the rinsing liquid drops freely from the highest point of the liquid draining section 103 due to gravity, and thereafter there is no rinsing liquid in this portion. Therefore, even if the resist liquid discharge nozzle 100 is subsequently moved to the standby position, there is little possibility that the resist liquid drops from the resist liquid discharge nozzle 100 onto the substrate surface during the movement. If the resist liquid drips onto the surface of the substrate G during the movement of the resist discharge nozzle 100, the resist liquid does not spread in a circular shape substantially at the center of the surface of the substrate G, but spreads outward from the circular core portion in a barbed manner, Thereafter, even if the substrate G is rotated in the horizontal direction to spread the resist over the surface of the substrate G, the resist may not be uniform since the thorn-shaped portion protruding from the circular core portion spreads first. In addition, it is necessary to rotate the substrate for an unnecessarily long time to obtain a uniform thickness. However, since the possibility that the resist liquid drips onto the surface of the substrate G when the resist liquid discharge nozzle 100 moves is reduced, the uniformity of the resist film thickness can be improved and the product yield can be improved.

Although the example in which the present invention is applied to the resist liquid discharging nozzle 100 has been described, the present invention can also be applied to the solvent discharging nozzle 110. In this case, the solvent discharge nozzle 110 can be configured almost similarly to the resist liquid discharge nozzle 100.

When moving the solvent discharge nozzle 110,
When the solvent drips on the substrate surface, the solvent increases only in the sloping part, and after the resist is spread, the resist film thickness in that part of the substrate G may be different from other parts. It is configured in substantially the same manner as the resist liquid discharge nozzle 100, and by reducing the possibility of the solvent dripping when the solvent discharge nozzle moves, the uniformity of the resist film thickness can be improved and the product yield is improved. .

Next, the case where the processing liquid discharge nozzle of the present invention is applied to the resist liquid discharge nozzle of the cleaning units (SCR) 21a, 21b will be described. FIG. 13 is a schematic perspective view of the cleaning unit (SCR) 21a (21b).
The cleaning unit (SCR) 21a (21b) includes a rotatable chuck 121 for holding the substrate G, a cup 122 provided around the chuck 121, a brush 123 for cleaning the substrate G, and a plurality of cleaning liquids for discharging the cleaning liquid to the substrate. An ejection nozzle 130 is provided. The cleaning liquid discharge nozzle 130 is
It has the same structure as the rinsing liquid nozzle 60 described above, and a plurality (four in the figure) of cleaning liquid discharge nozzles 130 are arranged in parallel. These cleaning liquid discharge nozzles 130 are communicated with a single liquid supply pipe 131 that is disposed horizontally. The liquid feed pipe 131 is connected to an air operation valve (not shown), and can control supply and stop of the cleaning liquid.

Next, the cleaning operation of the cleaning units (SCR) 21a and 21b configured as described above will be described. First, the substrate G is placed on the chuck 121,
Next, the brush 123 and the cleaning liquid discharge nozzle 130
Moved up. Then, while rotating the cleaning brush 123 and discharging the cleaning liquid from the cleaning liquid discharge nozzle 130, the brush 123 and the cleaning liquid discharge nozzle 130 perform the brush cleaning from the short side on one side of the substrate G to the short side on the other side. . Thereafter, the brush 123 is moved to the standby position, the cleaning liquid discharge nozzle 130 is moved to the center of the substrate G, and the substrate G is cleaned with the cleaning liquid while rotating the substrate G at a low speed (50 rpm). After the discharge of the cleaning liquid is stopped, the substrate G is rotated at a high speed (1000 rpm) to shake off and dry the substrate. After the drying is completed, the rotation of the substrate G is stopped, the cleaning liquid discharge nozzle 130 is moved to the standby position, and then the substrate G is carried out.

In this case, the cleaning liquid discharge nozzle 130 has the same structure as that of the above-mentioned rinse liquid discharge nozzle 60 and has a liquid drainage portion. Even if 130 is moved from the substrate G to the standby position, the cleaning liquid is less likely to drip onto the dry substrate surface, and the cleaning liquid is dropped onto the substrate surface, or the cleaning liquid dripping on the substrate surface is transferred to the substrate transfer device. The possibility that the cleaning liquid adheres to the other substrate and adheres to another substrate is small.

Next, another example of the structure of the processing liquid discharge nozzle of the present invention will be described. FIG. 14 shows a developing unit (D
FIG. 14 is a cross-sectional view showing another example of the rinsing liquid discharge nozzle provided on the (EV) 24a, 24b, 24c. As shown in FIG. 14, the rinse liquid discharge nozzle 140 has a tubular shape,
A liquid supply pipe 141 that is horizontally disposed to supply a rinse liquid, and a discharge unit 14 that is connected to the liquid supply pipe 141 and discharges the rinse liquid.
And 2. The discharge part 142 has an inner cylinder 143 and an outer cylinder 144 which are vertically and coaxially arranged. An inlet for introducing a rinsing liquid from the outer cylinder 144 to the inner cylinder 143 is provided at the upper end of the inner cylinder 143. 147 are provided.
The upper portions of the outer cylinder 144 and the inner cylinder 143 are connected to the liquid feeding pipe 1.
A liquid draining portion 145 is disposed above the lower surface 41, and a lower end portion of the inner cylinder 143 forms a front end portion 146 for discharging a rinsing liquid onto the substrate G.

The rinsing liquid discharge nozzle 14 having such a structure
Even at 0, after the supply of the rinsing liquid is stopped, the rinsing liquid falls freely by gravity from the highest point of the liquid draining section 145, and no rinsing liquid is present in this portion thereafter. Therefore, even if the rinsing liquid discharge nozzle 140 is subsequently moved to the standby position, the rinsing liquid is less likely to drip onto the substrate surface from the rinsing liquid discharge nozzle 140 during the movement, causing water droplets to adhere to the substrate surface or dripping on the substrate surface. The possibility that the dropped rinsing liquid adheres to the substrate transfer device and the rinsing liquid adheres to another substrate is reduced, and the yield of the product is improved.

Rinse liquid discharge nozzle 140 having the structure shown in FIG.
In this case, by making the roughness of the inner surface of the inner cylinder 143 including the liquid drain portion 145 smaller than the roughness of the inner surface of the liquid feed pipe 141, the rinse liquid 145 is supplied to the liquid drain portion 145 similarly to the case of the rinse liquid discharge nozzle 60. Is more difficult to adhere, the liquid drainage at the liquid drainer 145 is improved, and the rinse liquid discharge nozzle 14
The risk that the rinsing liquid drops from the rinsing liquid discharge nozzle 140 during the movement of 0 can be further reduced.

As shown in FIG. 15, instead of polishing the inner surface of the inner cylinder 143 including the liquid drain portion 145 of the rinsing liquid discharge nozzle 140 to reduce the surface roughness,
8 may be formed. This makes it possible for the liquid to be drained at the liquid drain 145 as well as the rinse liquid discharge nozzle 60 described above.

Also, the tip 146 of the rinsing liquid discharge nozzle 140 is formed so that its thickness becomes smaller toward the tip, similarly to the tip 64 of the rinse liquid discharge nozzle 60 shown in FIG. Is preferred.

Further, as shown in FIG. 16, a vibrating section 149 for vibrating the rinse liquid discharged similarly to the rinse liquid discharge nozzle 60 may be provided.

Next, a description will be given of a liquid processing apparatus in which a vibrating section is not provided in the processing liquid discharge nozzle, but a nozzle vibrating section for providing vibration to the discharge nozzle is provided in the processing liquid discharge nozzle moving mechanism.

As shown in FIG. 17, the processing apparatus includes a processing liquid discharge nozzle 150 and a processing liquid discharge nozzle moving mechanism 1.
And the processing liquid discharge nozzle moving mechanism 1
60 allows the processing liquid discharge nozzle 150 to move between a discharge position on the substrate G held by a chuck (not shown) in the cup 170 and a standby position.

As shown in FIG. 18, the processing liquid discharge nozzle 150 includes a liquid feed pipe 151 for feeding the processing liquid in the horizontal direction and a discharge part 152 for discharging the processing liquid downward. The liquid supply pipe 151 is connected to an air operation valve (not shown), and can supply and stop the processing liquid. Also, the processing liquid discharge nozzle moving mechanism 160
A nozzle arm 161 to which the processing liquid discharge nozzle 150 is attached, and the processing liquid discharge nozzle 150
And a motor 162 for rotating the nozzle arm 161 so as to move between a discharge position on the substrate G held by a chuck (not shown) in 70 and a standby position.
Further, a vibration part 163 is attached to the nozzle arm 161, and the vibration time of the vibration part 163 is controlled by the control part 16.
4 enables control. And this vibrating part 1
By vibrating 63, the processing liquid discharge nozzle 150 is vibrated.

The processing liquid discharge nozzle 150 is a rinsing liquid discharge nozzle of the development processing unit as described above.
It can be applied to a resist liquid discharge nozzle of a resist coating unit, a resist solvent discharge nozzle, and the like.When performing each processing operation using this nozzle, the processing liquid is discharged,
The vibration of the processing liquid discharge nozzle 150 is started by the vibrating unit 163 a predetermined time before the end of the discharge time, and the vibration of the vibrating unit 163 is stopped after a predetermined time has elapsed from the end of the processing liquid discharge. After a lapse of a predetermined time, the discharge nozzle moves to the standby position.

Therefore, the processing liquid in the processing liquid discharge nozzle 150 is vibrated before and after the end of the processing liquid discharge, and the processing liquid in the processing liquid discharge nozzle 150 and the processing liquid
The processing liquid attached to the tip can be shaken off from the discharge nozzle 150, and the possibility that the processing liquid drops from the processing liquid discharge nozzle 150 when the processing liquid discharge nozzle 150 moves after the stop of the processing liquid discharge is reduced.

Needless to say, the step of vibrating the processing liquid discharge nozzle 150 may be performed only after the supply of the processing liquid is stopped. In this case, since the nozzle 150 is not vibrated while the processing liquid is being discharged, the processing liquid can be discharged at an appropriate position with respect to the substrate.

Further, the shape of the nozzle in the case where the vibrating portion is provided in the nozzle arm is not limited to the above-described nozzle 150. When the nozzle arm is applied to the developing solution discharge nozzle of the developing processing unit, as shown in FIG. A liquid feed pipe 181 for feeding the processing liquid in the horizontal direction, and a discharge unit 18 for discharging the processing liquid downward.
2, and the discharge unit 182 includes a vertical portion 183 continuous with the liquid feed pipe 181 and a nozzle block 184 continuous with the vertical portion 183. At the lower end of the nozzle block 184, a number of processing liquid discharge holes 185 are formed. When used for a cleaning nozzle of a cleaning apparatus, FIG.
As shown in the figure, a plurality of the nozzles 150 (four in the figure)
May be arranged in parallel, and the processing liquid discharge nozzle 190 may have a structure in which these nozzles 150 are connected to one liquid supply pipe 191 arranged horizontally.

The motor 16 of the nozzle arm 161
2 is repeatedly rotated in the forward and reverse directions, so that the discharge nozzle 150
May be vibrated. In this case, there is no need to provide the vibrating section 163, and the device can be simplified and downsized.
Further, since the number of parts can be reduced, the reliability of the apparatus is improved.

Next, another example of a developing unit provided with another processing liquid discharge nozzle will be described. FIG.
FIG. 22 is a perspective view of such a developing unit, and FIG.
Is a sectional view thereof. The development processing unit includes a developer ejection nozzle (not shown) for ejecting a developer, a spin chuck 201 as a holding member for holding the substrate G, a cup 202 provided around the spin chuck, and a rinse A rinse liquid discharge nozzle 210 for discharging a liquid is provided. The rinsing liquid discharge nozzle 210 is a nozzle arm 2
04.

The rinsing liquid discharge nozzle 210 has a discharge port 211 at a tip portion thereof.
The rinsing liquid is formed so that the rinsing liquid can be discharged obliquely to the surface of the substrate G. Further, below the discharge port 211 of the rinse liquid discharge nozzle 210, between the substrate G and the rinse liquid discharge nozzle 210, a processing liquid recovery means for recovering the rinse liquid dripped vertically from the rinse liquid discharge nozzle 210. For example, a drain receiver 205 is provided. The drain receiver 205 is attached to the nozzle arm 204, and the positional relationship between the rinse liquid discharge nozzle 210 and the drain receiver 205 does not change even if the nozzle arm 204 moves. A pipe (not shown) is connected to the drain receiver 205 so that the rinsing liquid in the drain receiver 205 can be discharged.

In the developing unit configured as described above, the process is performed up to the filling of the developing solution by the same process as described above, and after the filling, the developing solution discharge nozzle is moved to the standby position. After elapse of a predetermined time after the development liquid is filled, as shown in FIG. 23, the nozzle arm 204 is rotated and lowered, and the rinse liquid discharge nozzle 210 is arranged at the discharge position. Then, the cup 202 is raised, and a lid (not shown) provided above the cup is lowered to close the upper opening of the cup 202. Since the cup 202 has a cutout for the rinse nozzle arm 204,
The nozzle arm 204 does not hinder the lid. In this state, the rinsing liquid is discharged from the rinsing liquid discharging nozzle 210 while rotating the substrate G, as shown in FIG. After a lapse of a predetermined time, the supply of the rinsing liquid is stopped, the rotation speed of the substrate G is increased, and the rinsing liquid is shaken off and dried. After the rotation of the substrate G is stopped, the lid is raised, the rinse liquid discharge nozzle 210 is moved to the standby position, and the substrate G is carried out.

As described above, when supplying the rinsing liquid, the rinsing liquid is supplied to the substrate G from obliquely above the substrate surface. After the rinsing liquid supply is stopped, the discharge port 2 of the rinsing liquid supply nozzle 210 is
The rinsing liquid dripping from 11 falls under its own weight and is collected in the drain receiver 205 before reaching the surface of the substrate G. Therefore, there is little possibility that the rinsing liquid remaining in the nozzle reaches the surface of the substrate G, and it is possible to maintain a high product yield.

[0098] Similar to the nozzle described above, such a nozzle is not limited to the rinsing liquid for the developing unit, and may be used for the developing nozzle of the developing apparatus. It can be used for a nozzle, a solvent discharge nozzle thereof, and a cleaning liquid discharge nozzle of a substrate cleaning apparatus.

The present invention is not limited to the above-described embodiment, but can be variously modified within the scope of the technical concept, and a plurality of the above-described embodiments may be combined. Also, for example, the present invention has been described by taking a processing system for a liquid crystal display device substrate represented by a TFT array glass substrate as an example, but it is naturally applicable to a system for processing other substrates such as a color filter and a conductor wafer. Can be.

[0100]

According to the present invention, the liquid drain is disposed above the liquid feed pipe of the processing liquid discharge nozzle, and the tip for discharging the processing liquid is directed downward from the liquid drain. After the supply of the processing liquid is stopped, the processing liquid in the front end portion falls by its own weight from the highest point of the liquid draining section, and thereafter, the processing liquid does not exist in this portion. Therefore, even if the discharge nozzle is subsequently moved to the standby position, the processing liquid does not drop from the discharge nozzle during the movement. Since the liquid feed pipe sends the processing liquid in the horizontal direction, the processing liquid in the liquid feed pipe is located at the highest point of the liquid drainage section even if gravity is applied to the processing liquid as compared with the case where the liquid feed pipe is vertical. Is less likely to be discharged than when the liquid supply pipe is vertical, and only the processing liquid in the tip end is discharged from the highest point of the liquid draining section after the processing liquid supply is stopped. After the supply of the liquid is stopped, the amount of the processing liquid discharged from the discharge nozzle may be smaller, and the stability of the discharge amount can be improved as compared with the case where the liquid supply pipe is vertical.

Further, according to the present invention, the outer shape of the tip is formed in an inverted truncated cone shape so that the thickness area of the tip of the processing liquid discharge nozzle becomes smaller toward the tip. The area in which the water droplet hanging on the portion comes into contact with the tip can be further reduced, the water droplet hardly hangs on the tip, and the water droplet hardly remains on the tip.

Further, according to the present invention, since the roughness of at least a part of the inner surface of the discharge section is smaller than the roughness of the inner surface of the liquid supply pipe, the processing liquid is less likely to adhere to the discharge section, and Good drainage.

Further, according to the present invention, since the resin film is formed on at least a part of the inner surface of the discharge part of the processing liquid discharge nozzle, the water repellency of the discharge part is increased, and the liquid discharge at the discharge part is performed. Is good.

Further, according to the present invention, the vibrating section for vibrating the processing liquid is provided at the discharge section of the processing liquid discharge nozzle. Is improved.

Further, according to the present invention, since the processing liquid is vibrated to the processing liquid discharge nozzle to shake off the processing liquid near the discharge port, the processing liquid near the discharge port of the processing liquid discharge nozzle is almost completely removed. Can be. Further, since the nozzle vibrating means is provided in the processing liquid discharge nozzle moving mechanism, it is not necessary to provide a plurality of nozzle vibrating means even if a plurality of processing liquid discharge nozzles are attached to the processing liquid discharge nozzle moving mechanism.
The device can be simplified.

Furthermore, according to the present invention, the processing liquid is discharged obliquely from the processing liquid discharge nozzle toward the substrate surface, and the discharge liquid is vertically interposed between the substrate and the discharge nozzle below the discharge port. A processing liquid collecting means is provided to collect the processing liquid that has dropped onto the substrate.When supplying the processing liquid, the processing liquid is supplied to the substrate from an oblique upper side with respect to the substrate surface. The falling processing liquid can be collected before reaching the substrate surface, and the product yield can be increased.

[Brief description of the drawings]

FIG. 1 is a plan view showing an LCD substrate resist coating / developing processing system to which the present invention is applied.

FIG. 2 is a sectional view showing a developing unit mounted on the system of FIG. 1;

FIG. 3 is a plan view showing the developing unit shown in FIG. 2;

FIG. 4 is a block diagram showing a control system in the development processing unit shown in FIGS. 2 and 3;

FIG. 5 is a cross-sectional view showing a rinsing liquid supply nozzle according to an embodiment of the processing liquid supply nozzle of the present invention mounted on the development processing unit shown in FIGS. 2 and 3;

FIG. 6 is a sectional view showing a modification based on the rinse liquid supply nozzle shown in FIG. 5;

FIG. 7 is a partial cross-sectional view showing a preferred example of the shape of the tip of the rinsing liquid supply nozzle.

FIG. 8 is a sectional view showing another modified example based on the rinsing liquid supply nozzle shown in FIG. 5;

FIG. 9 is a perspective view showing a developing solution discharge nozzle according to another embodiment of the processing liquid supply nozzle of the present invention.

FIG. 10 is a sectional view of the developing solution discharge nozzle shown in FIG. 9;

FIG. 11 is a sectional view showing a resist coating unit mounted on the system of FIG. 1;

FIG. 12 is a cross-sectional view showing a resist liquid discharge nozzle according to another embodiment of the processing liquid supply nozzle of the present invention.

FIG. 13 is a schematic perspective view showing a cleaning unit mounted on the system of FIG. 1;

FIG. 14 is a sectional view showing another example of the structure of the processing liquid ejection nozzle of the present invention.

FIG. 15 is a cross-sectional view illustrating a modification based on the processing liquid discharge nozzle of FIG.

FIG. 16 is a sectional view showing another modified example based on the processing liquid ejection nozzle of FIG. 14;

FIG. 17 is a perspective view showing a liquid processing apparatus in a case where a nozzle vibrating unit that vibrates a discharge nozzle is provided in a processing liquid discharge nozzle moving mechanism.

FIG. 18 is a side view showing a processing liquid ejection nozzle used in the apparatus of FIG. 17;

FIG. 19 illustrates a developing solution discharge nozzle in a case where a liquid processing apparatus in which a nozzle arm is provided with a vibrating portion in a case where a nozzle vibrating portion that applies vibration to a discharge nozzle is provided in a processing liquid discharge nozzle moving mechanism is applied to a developing unit. FIG.

FIG. 20 is a perspective view showing a cleaning liquid discharge nozzle in a case where a liquid processing apparatus having a nozzle arm provided with a vibration part is applied to a cleaning unit in a case where a nozzle vibrating part for applying vibration to a discharge nozzle is provided in a processing liquid discharge nozzle moving mechanism; FIG.

FIG. 21 is a perspective view showing a developing unit provided with another processing liquid discharge nozzle.

FIG. 22 is a sectional view showing the development processing unit of FIG. 21;

FIG. 23 is a cross-sectional view showing a state where a rinsing process is being performed in the developing unit of FIG. 21;

[Explanation of symbols]

 24a, 24b, 24c; development processing unit (DEV) 41; spin chuck 42; rotation drive mechanism 46; inner cup 47; outer cup 51; Arm 60; Rinse liquid discharge nozzle 61; Liquid supply pipe 62; Discharge part 63; Drain part 64; Tip part 65; Resin coating 67;

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02F 1/1333 500 H01L 21/304 643C 4F033 H01L 21/027 G03F 7/30 501 4F041 21/304 643 F04B 21 / 02 J 5F043 21/306 H01L 21/30 569C 5F046 // G03F 7/30 501 21/306 R F term (reference) 2H088 FA17 FA18 FA21 FA30 HA01 HA12 HA28 MA20 2H090 HC18 JB02 JC19 LA04 LA15 2H096 AA25 GA17 GA17 GA31 LA30 3H071 AA01 CC11 CC44 DD35 4D075 AA04 AA33 AA39 BB13X BB46X BB65X CA47 DA06 DB31 DC22 EA45 EB60 4F033 AA14 BA03 CA04 DA01 EA05 NA01 4F041 AA06 AB01 BA05 BA12 BA17 BA53 5F04EE04 LA13 EE4

Claims (19)

[Claims] 1. A processing liquid discharge nozzle for discharging a processing liquid to an object to be processed, comprising: a liquid sending pipe for sending the processing liquid in a substantially horizontal direction; and a discharge unit communicating with the liquid sending pipe and discharging the processing liquid. The discharge unit has a liquid drain portion disposed above the liquid sending pipe, and a tip portion directed downward from the liquid drain portion and discharging the processing liquid to the object to be processed. A processing liquid discharge nozzle. 2. A processing liquid discharge nozzle that discharges a processing liquid to an object to be processed, comprising: a liquid sending pipe that sends a processing liquid; and a discharge unit that is connected to the liquid sending pipe and that discharges the processing liquid. The discharge unit includes a liquid drain disposed above the liquid feed pipe, and a distal end directed downward from the liquid drain and discharging the processing liquid to the object to be processed. Is a processing liquid discharge nozzle characterized in that its thickness is formed so as to decrease as it goes to the tip. 3. A processing liquid discharge nozzle for discharging a processing liquid to a processing object, comprising: a liquid feed pipe for feeding a processing liquid; and a discharge part communicating with the liquid feed pipe and discharging the processing liquid. A processing liquid discharge nozzle, wherein at least a part of the discharge unit has a roughness of an inner surface smaller than a roughness of an inner surface of the liquid sending pipe. 4. A processing liquid discharge nozzle that discharges a processing liquid to an object to be processed, comprising: a liquid sending pipe for sending a processing liquid; and a discharge unit that is connected to the liquid sending pipe and discharges the processing liquid. A processing liquid discharge nozzle, wherein at least a part of the discharge unit has a resin film formed on an inner surface thereof. 5. A processing liquid discharge nozzle that discharges a processing liquid to an object to be processed, comprising: a liquid feed pipe for feeding a processing liquid; and a discharge part that is connected to the liquid feed pipe and discharges the processing liquid. And a vibrating section for vibrating the processing liquid in the discharging section. 6. The processing liquid discharge nozzle according to claim 1, wherein the liquid drain portion is formed to be curved upward. 7. At least a part of the inner surface of the discharge unit,
The resin film is formed, Claim 1,
The processing liquid discharge nozzle according to any one of claims 2, 3, and 5. 8. A holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle moving mechanism for moving the processing liquid discharge nozzle from a standby position to above the substrate. A liquid processing apparatus comprising: a processing liquid discharge nozzle, a liquid sending pipe for sending a processing liquid in a substantially horizontal direction, and a discharge unit that is connected to the liquid sending pipe and discharges the processing liquid, The liquid, comprising: a liquid drain portion disposed above the liquid feeding pipe; and a tip portion directed downward from the liquid drain portion and discharging a processing liquid to a processing target. Processing equipment. 9. A holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto a surface of the substrate, and a processing liquid discharge nozzle moving mechanism for moving the processing liquid discharge nozzle from a standby position to above the substrate. A liquid processing apparatus comprising: a processing liquid discharge nozzle, the processing liquid discharge nozzle has a liquid sending pipe that sends a processing liquid, and a discharge unit that is connected to the liquid sending pipe and discharges a processing liquid, A liquid drain portion disposed above the liquid sending pipe, and a tip portion directed downward from the liquid drain portion and discharging the processing liquid to the object to be processed. Wherein the tip is formed in an inverted conical shape such that the area of the tip decreases toward the tip. 10. A holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle moving mechanism for moving the processing liquid discharge nozzle from a standby position to above the substrate. Wherein the processing liquid discharge nozzle has a liquid sending pipe for sending a processing liquid, and a discharge unit that is connected to the liquid sending pipe and discharges the processing liquid. A liquid processing apparatus characterized in that at least a part thereof has a resin film formed on an inner surface thereof. 11. A holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle moving mechanism for moving the processing liquid discharge nozzle from a standby position to above the substrate. A liquid processing apparatus comprising: a processing liquid discharge nozzle, the processing liquid discharge nozzle has a liquid sending pipe that sends a processing liquid, and a discharge unit that is connected to the liquid sending pipe and discharges a processing liquid, And a vibrating section for vibrating the processing liquid. 12. A holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle moving mechanism for moving the processing liquid discharge nozzle from a standby position to above the substrate. A liquid processing apparatus comprising: a processing liquid discharge nozzle moving mechanism that applies vibration to a processing liquid discharge nozzle and shakes off a processing liquid near a discharge port of the processing liquid discharge nozzle; and the nozzle vibration means. And a control means for controlling the pressure. 13. A holding section for holding a substrate, a processing liquid discharge nozzle for discharging a processing liquid onto the surface of the substrate, and a processing liquid discharge nozzle movement for moving the processing liquid discharge nozzle from a discharge nozzle standby position to above the substrate. A liquid processing apparatus including a mechanism, wherein the processing liquid discharge nozzle is configured such that the processing liquid discharged from the processing liquid discharge nozzle reaches the substrate surface from an obliquely upward direction with respect to the substrate surface, A processing liquid recovery is located between the processing liquid discharge nozzle and the substrate and substantially below the discharge port of the processing liquid discharge nozzle, and recovers the processing liquid dropped almost vertically downward from the discharge port before reaching the substrate. A liquid processing apparatus comprising a means. 14. The liquid processing apparatus is a developing apparatus, and the processing liquid discharge nozzle is a nozzle that discharges a rinsing liquid that removes the developing liquid from the substrate or a nozzle that discharges the developing liquid to the substrate. The liquid processing apparatus according to any one of claims 8 to 13. 15. The liquid processing apparatus is a resist coating apparatus, and the processing liquid discharge nozzle is a nozzle that discharges a resist onto a substrate or a nozzle that discharges a resist solvent onto a substrate. Item 14. The liquid processing apparatus according to any one of items 13. 16. The liquid processing apparatus is a substrate cleaning apparatus, and the processing liquid discharge nozzle is a nozzle that discharges a cleaning liquid to a substrate.
The liquid treatment apparatus according to any one of the above. 17. A step of supplying a processing liquid from a processing liquid discharge nozzle to a surface of a substrate placed substantially horizontally, a step of stopping the supply of the processing liquid, and a processing in the vicinity of a discharge port of the processing liquid discharge nozzle. Vibrating the processing liquid discharge nozzle so as to shake off the liquid; and rotating the substrate substantially horizontally about a substantially center of the substrate as an axis to shake off unnecessary processing liquid on the substrate surface. Liquid treatment method. 18. The liquid processing method according to claim 17, wherein the step of vibrating the processing liquid discharge nozzle overlaps the step of stopping the supply of the processing liquid in time. 19. The liquid according to claim 17, wherein the step of oscillating the processing liquid discharge nozzle is performed in a state where the processing liquid discharge nozzle is positioned on a substrate. Processing method.