KR100775627B1 - 기판 세정장치 및 세정방법 - Google Patents
기판 세정장치 및 세정방법 Download PDFInfo
- Publication number
- KR100775627B1 KR100775627B1 KR1020020006680A KR20020006680A KR100775627B1 KR 100775627 B1 KR100775627 B1 KR 100775627B1 KR 1020020006680 A KR1020020006680 A KR 1020020006680A KR 20020006680 A KR20020006680 A KR 20020006680A KR 100775627 B1 KR100775627 B1 KR 100775627B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- cleaning
- brush
- vacuum chuck
- glass substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 75
- 238000004140 cleaning Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 15
- 238000005201 scrubbing Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 29
- 239000007788 liquid Substances 0.000 description 10
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 5
- 239000000428 dust Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims (3)
- 세정 컵과, 이 세정 컵 내에 배치되는 진공 척과, 이 진공 척으로 흡착 보유된 기판 표면을 스크러브 세정하는 브러시를 구비한 기판 세정장치에 있어서, 이 기판 세정장치는 진공 척으로부터 돌출하는 상기 기판의 부분을 상기 브러시가 스크러브 세정할 때에, 그 돌출하는 부분을 아래쪽에서 지지하는 지지부재를 설치한 것을 특징으로 하는 기판 세정장치.
- 제 1 항에 있어서, 상기 지지부재는 승강이 가능한 롤 브러시를 구비하고 있는 것을 특징으로 하는 기판 세정장치.
- 세정 컵 내에 배치한 진공 척으로 기판을 흡착 보유하고, 이 상태에서 진공 척을 회전시켜서 기판을 수평면 내에서 회전시키고, 수평으로 회전하는 기판의 표면에 회전하는 브러시를 접촉하여 기판 표면을 스크러브 세정하는 방법에 있어서, 상기 브러시로 진공 척으로부터 돌출하는 기판 표면을 스크러브 세정할 때에, 진공 척으로부터 돌출하는 그 기판의 부분이 휘어지지 않도록 아래쪽에서 지지부재로 지지하면서 스크러브 세정하는 것을 특징으로 하는 기판 세정방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001029397A JP2002233829A (ja) | 2001-02-06 | 2001-02-06 | 基板洗浄装置および洗浄方法 |
JPJP-P-2001-00029397 | 2001-02-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020065395A KR20020065395A (ko) | 2002-08-13 |
KR100775627B1 true KR100775627B1 (ko) | 2007-11-13 |
Family
ID=18893751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020020006680A KR100775627B1 (ko) | 2001-02-06 | 2002-02-06 | 기판 세정장치 및 세정방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2002233829A (ko) |
KR (1) | KR100775627B1 (ko) |
TW (1) | TW564188B (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007225810A (ja) * | 2006-02-22 | 2007-09-06 | Hoya Corp | スピン洗浄方法及びスピン洗浄装置 |
KR100876375B1 (ko) | 2007-12-05 | 2008-12-29 | 세메스 주식회사 | 기판 세정 장치 및 그 보정 방법 |
CN105798034A (zh) * | 2016-04-27 | 2016-07-27 | 芜湖真空科技有限公司 | 玻璃清洗设备 |
JP7148349B2 (ja) * | 2017-11-14 | 2022-10-05 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990023678A (ko) * | 1997-08-18 | 1999-03-25 | 히가시 데쓰로 | 기판의 양면세정장치 |
KR100213992B1 (ko) * | 1995-05-12 | 1999-08-02 | 히가시 데쓰로 | 세정장치 |
JPH11260783A (ja) * | 1998-03-11 | 1999-09-24 | Oki Electric Ind Co Ltd | 基板洗浄装置 |
-
2001
- 2001-02-06 JP JP2001029397A patent/JP2002233829A/ja not_active Withdrawn
-
2002
- 2002-02-06 KR KR1020020006680A patent/KR100775627B1/ko active IP Right Grant
- 2002-02-06 TW TW091102081A patent/TW564188B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100213992B1 (ko) * | 1995-05-12 | 1999-08-02 | 히가시 데쓰로 | 세정장치 |
KR19990023678A (ko) * | 1997-08-18 | 1999-03-25 | 히가시 데쓰로 | 기판의 양면세정장치 |
JPH11260783A (ja) * | 1998-03-11 | 1999-09-24 | Oki Electric Ind Co Ltd | 基板洗浄装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20020065395A (ko) | 2002-08-13 |
JP2002233829A (ja) | 2002-08-20 |
TW564188B (en) | 2003-12-01 |
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