TW541677B - Lead frame and copper alloy to be used for lead frame - Google Patents

Lead frame and copper alloy to be used for lead frame Download PDF

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Publication number
TW541677B
TW541677B TW090104583A TW90104583A TW541677B TW 541677 B TW541677 B TW 541677B TW 090104583 A TW090104583 A TW 090104583A TW 90104583 A TW90104583 A TW 90104583A TW 541677 B TW541677 B TW 541677B
Authority
TW
Taiwan
Prior art keywords
copper alloy
lead frame
peak intensity
unavoidable impurities
patent application
Prior art date
Application number
TW090104583A
Other languages
English (en)
Chinese (zh)
Inventor
Yasuo Tomioka
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Application granted granted Critical
Publication of TW541677B publication Critical patent/TW541677B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
TW090104583A 2000-02-29 2001-02-27 Lead frame and copper alloy to be used for lead frame TW541677B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000053968A JP3318309B2 (ja) 2000-02-29 2000-02-29 リードフレームおよびリードフレーム用銅合金

Publications (1)

Publication Number Publication Date
TW541677B true TW541677B (en) 2003-07-11

Family

ID=18575285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090104583A TW541677B (en) 2000-02-29 2001-02-27 Lead frame and copper alloy to be used for lead frame

Country Status (5)

Country Link
JP (1) JP3318309B2 (ja)
KR (1) KR100380214B1 (ja)
CN (1) CN1199262C (ja)
HK (1) HK1041106B (ja)
TW (1) TW541677B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4524471B2 (ja) * 2004-08-30 2010-08-18 Ｄｏｗａメタルテック株式会社 銅合金箔およびその製造法
JP5263525B2 (ja) * 2006-06-23 2013-08-14 日本碍子株式会社 銅基圧延合金の製造方法
EP2339038B8 (en) 2006-07-21 2017-01-11 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet for electric and electronic part
EP2388347B1 (en) 2006-10-02 2014-04-16 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Method for producing a copper alloy sheet for electric and electronic parts
JP2010222618A (ja) * 2009-03-23 2010-10-07 Nippon Mining & Metals Co Ltd Ｃｕ−Ｎｉ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
JP5339995B2 (ja) * 2009-04-01 2013-11-13 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｚｎ−Ｓｎ系合金板及びＣｕ−Ｚｎ−Ｓｎ系合金Ｓｎめっき条
KR101260911B1 (ko) 2010-02-08 2013-05-06 주식회사 풍산 고강도, 고전도성을 갖는 동합금 및 그 제조방법
JP5427971B1 (ja) * 2013-03-25 2014-02-26 Ｊｘ日鉱日石金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6842270B2 (ja) * 2016-10-05 2021-03-17 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
KR100380214B1 (ko) 2003-04-18
KR20010085422A (ko) 2001-09-07
JP3318309B2 (ja) 2002-08-26
JP2001244400A (ja) 2001-09-07
CN1199262C (zh) 2005-04-27
HK1041106B (zh) 2005-12-09
CN1317828A (zh) 2001-10-17
HK1041106A1 (en) 2002-06-28

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees