CN1199262C - 引线框和用于引线框的铜合金 - Google Patents
引线框和用于引线框的铜合金 Download PDFInfo
- Publication number
- CN1199262C CN1199262C CNB011119454A CN01111945A CN1199262C CN 1199262 C CN1199262 C CN 1199262C CN B011119454 A CNB011119454 A CN B011119454A CN 01111945 A CN01111945 A CN 01111945A CN 1199262 C CN1199262 C CN 1199262C
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- CN
- China
- Prior art keywords
- copper alloy
- lead frame
- upper epidermis
- encapsulation
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Abstract
Description
样号 | 化学成份(%) | 最终冷轧条件 | {100}/{111}峰的比率 | ||||||||||||||
Cr | Zr | Zn | Ti | Fe | Sn | Ni | Si | Mg | P | In | Mn | Cu-杂质 | 加工辊直径(mm) | 滚动速度(m/分) | 辊油粘度(cm2/s) | ||
实施例1 | - | - | 0.24 | - | 2.41 | - | - | - | - | 0.03 | - | - | 平衡 | 120 | 250 | 0.12 | 0.025 |
对比例1 | - | - | 0.25 | - | 2.55 | - | - | - | - | 0.03 | - | - | 平衡 | 45 | 300 | 0.15 | 0.041 |
实施例2 | - | - | - | - | - | - | 2.86 | 0.66 | 0.11 | - | - | - | 平衡 | 120 | 250 | 0.12 | 0.023 |
对比例2 | - | - | - | - | - | - | 2.95 | 0.63 | 0.12 | - | - | - | 平衡 | 160 | 100 | 0.20 | 0.049 |
实施例3 | - | - | 0.28 | - | - | 1.22 | 3.05 | 0.65 | - | - | - | - | 平衡 | 160 | 300 | 0.18 | 0.017 |
对比例3 | - | - | 0.30 | - | - | 1.23 | 3.12 | 0.62 | - | - | - | - | 平衡 | 45 | 400 | 0.08 | 0.048 |
实施例4 | 0.23 | - | 0.19 | - | - | 0.25 | - | - | - | - | - | - | 平衡 | 140 | 250 | 0.14 | 0.023 |
对比例4 | 0.24 | 0.16 | - | - | 0.23 | - | - | - | - | - | - | 平衡 | 120 | 300 | 0.04 | 0.044 |
拉伸强度(MPa) | 电导率(%IACS) | 氧化膜的剥落温度(k) | |
例1 | 530 | 63 | 633 |
对比例1 | 510 | 66 | 613 |
例2 | 710 | 50 | 613 |
对比例2 | 730 | 48 | 593 |
例3 | 640 | 37 | 613 |
对比例3 | 650 | 35 | 573 |
例4 | 570 | 76 | 633 |
对比例4 | 580 | 73 | 593 |
化学组成(%) | 最终冷轧的条件 | {100}/{111}峰的比率 | ||||||||||||||||
Cr | Zr | Zn | Ti | Fe | Sn | Ni | Si | Mg | P | In | Mn | Cu-杂质 | 加工辊的直径(mm) | 滚动速度(m/分) | 辊油的粘度(cm2/S) | |||
实施例 | 5 | 0.25 | 0.11 | 0.18 | - | - | - | - | - | - | - | - | - | 平衡 | 150 | 350 | 0.09 | 0.015 |
6 | 0.29 | 0.09 | 0.27 | - | - | 0.33 | - | - | - | - | - | - | 平衡 | 120 | 300 | 0.10 | 0.017 | |
7 | 0.24 | 0.12 | 0.22 | - | - | - | 0.13 | - | - | - | - | - | 平衡 | 100 | 300 | 0.07 | 0.022 | |
8 | 0.23 | 0.15 | 0.31 | - | - | - | - | 0.24 | - | - | - | - | 平衡 | 160 | 300 | 0.09 | 0.020 | |
9 | 0.33 | 0.18 | 0.24 | - | - | - | - | - | 0.10 | - | - | - | 平衡 | 130 | 550 | 0.12 | 0.010 | |
10 | 0.19 | 0.09 | 0.28 | - | - | - | - | - | - | 0.03 | - | - | 平衡 | 140 | 450 | 0.12 | 0.018 | |
11 | 0.22 | 0.12 | 0.36 | - | - | - | - | - | - | - | 0.04 | - | 平衡 | 120 | 250 | 0.16 | 0.017 | |
12 | 0.23 | 0.16 | 0.41 | - | - | - | - | - | - | - | - | 0.15 | 平衡 | 140 | 250 | 0.06 | 0.024 | |
13 | 0.24 | 0.15 | 0.24 | 0.28 | 0.44 | - | - | - | - | - | - | - | 平衡 | 160 | 400 | 0.12 | 0.017 | |
14 | 0.22 | 0.13 | 0.43 | 0.39 | 0.77 | - | - | 0.24 | - | - | - | - | 平衡 | 140 | 250 | 0.11 | 0.026 | |
15 | 0.27 | 0.07 | 0.33 | 0.32 | 0.55 | - | - | - | 0.04 | - | - | - | 平衡 | 150 | 450 | 0.12 | 0.014 | |
16 | 0.18 | 0.11 | 0.51 | 0.42 | 0.80 | - | - | - | - | 0.07 | - | - | 平衡 | 120 | 500 | 0.10 | 0.017 | |
17 | 0.22 | 0.13 | 0.23 | 0.28 | 0.54 | - | - | - | - | - | - | 0.14 | 平衡 | 130 | 400 | 0.11 | 0.011 | |
对比例 | 5 | 0.21 | 0.11 | 0.28 | - | - | - | - | - | - | - | - | - | 平衡 | 40 | 250 | 0.12 | 0.042 |
6 | 0.19 | 0.07 | 0.15 | - | - | - | - | - | 0.09 | - | - | - | 平衡 | 120 | 150 | 0.07 | 0.046 | |
7 | 0.25 | 0.15 | 0.33 | 0.31 | 0.49 | - | - | - | - | - | - | - | 平衡 | 135 | 250 | 0.04 | 0.048 |
样号 | 拉伸强度(MPa) | 电导率(%LACS) | 氧化膜的剥落温度(k) | |
实施例 | 5 | 580 | 80 | 673 |
6 | 620 | 76 | 673 | |
7 | 610 | 77 | 673 | |
8 | 590 | 79 | 693 | |
9 | 580 | 81 | 673 | |
10 | 580 | 77 | 693 | |
11 | 590 | 80 | 693 | |
12 | 590 | 79 | 693 | |
13 | 680 | 71 | 673 | |
14 | 700 | 68 | 693 | |
15 | 720 | 69 | 673 | |
16 | 680 | 65 | 693 | |
17 | 690 | 66 | 673 | |
对比例 | 5 | 580 | 81 | 633 |
6 | 590 | 77 | 653 | |
7 | 690 | 68 | 653 |
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53968/2000 | 2000-02-29 | ||
JP2000053968A JP3318309B2 (ja) | 2000-02-29 | 2000-02-29 | リードフレームおよびリードフレーム用銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1317828A CN1317828A (zh) | 2001-10-17 |
CN1199262C true CN1199262C (zh) | 2005-04-27 |
Family
ID=18575285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011119454A Expired - Fee Related CN1199262C (zh) | 2000-02-29 | 2001-02-28 | 引线框和用于引线框的铜合金 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3318309B2 (zh) |
KR (1) | KR100380214B1 (zh) |
CN (1) | CN1199262C (zh) |
HK (1) | HK1041106B (zh) |
TW (1) | TW541677B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4524471B2 (ja) * | 2004-08-30 | 2010-08-18 | Dowaメタルテック株式会社 | 銅合金箔およびその製造法 |
KR101448313B1 (ko) * | 2006-06-23 | 2014-10-07 | 엔지케이 인슐레이터 엘티디 | 구리계 압연 합금의 제조 방법 |
EP2045344B1 (en) | 2006-07-21 | 2012-05-23 | Kabushiki Kaisha Kobe Seiko Sho | Process for producing copper alloy sheets for electrical/electronic part |
ATE518968T1 (de) | 2006-10-02 | 2011-08-15 | Kobe Steel Ltd | Kupferlegierungsplatte für elektrische und elektronische bauteile |
JP2010222618A (ja) * | 2009-03-23 | 2010-10-07 | Nippon Mining & Metals Co Ltd | Cu−Ni−Si系銅合金圧延板及びそれを用いた電気部品 |
JP5339995B2 (ja) * | 2009-04-01 | 2013-11-13 | Jx日鉱日石金属株式会社 | Cu−Zn−Sn系合金板及びCu−Zn−Sn系合金Snめっき条 |
KR101260911B1 (ko) | 2010-02-08 | 2013-05-06 | 주식회사 풍산 | 고강도, 고전도성을 갖는 동합금 및 그 제조방법 |
JP5427971B1 (ja) * | 2013-03-25 | 2014-02-26 | Jx日鉱日石金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
JP6842270B2 (ja) * | 2016-10-05 | 2021-03-17 | ローム株式会社 | 半導体装置 |
-
2000
- 2000-02-29 JP JP2000053968A patent/JP3318309B2/ja not_active Expired - Fee Related
-
2001
- 2001-02-20 KR KR10-2001-0008417A patent/KR100380214B1/ko not_active IP Right Cessation
- 2001-02-27 TW TW090104583A patent/TW541677B/zh not_active IP Right Cessation
- 2001-02-28 CN CNB011119454A patent/CN1199262C/zh not_active Expired - Fee Related
-
2002
- 2002-04-10 HK HK02102708.7A patent/HK1041106B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3318309B2 (ja) | 2002-08-26 |
KR20010085422A (ko) | 2001-09-07 |
CN1317828A (zh) | 2001-10-17 |
HK1041106A1 (en) | 2002-06-28 |
JP2001244400A (ja) | 2001-09-07 |
KR100380214B1 (ko) | 2003-04-18 |
TW541677B (en) | 2003-07-11 |
HK1041106B (zh) | 2005-12-09 |
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Date | Code | Title | Description |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NIKKO METAL MFG. CO., LTD. Free format text: FORMER OWNER: NIPPON MINING AND METALS CO., LTD. Effective date: 20050610 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20050610 Address after: Kanagawa Patentee after: Nikko Metal Manufacturing Co.,Ltd. Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co.,Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: NIKKO MATERIALS CO. LTD Free format text: FORMER NAME OR ADDRESS: NIKKO METAL MFG. CO., LTD. Owner name: NIPPON MINING AND METALS CO., LTD. Free format text: FORMER NAME OR ADDRESS: NIKKO MATERIALS CO. LTD |
|
CP03 | Change of name, title or address |
Address after: Tokyo, Japan Patentee after: Nippon Mining & Metals Co.,Ltd. Address before: Tokyo, Japan Patentee before: NIKKO MATERIALS Co.,Ltd. Address after: Tokyo, Japan Patentee after: NIKKO MATERIALS Co.,Ltd. Address before: Kanagawa Patentee before: Nikko Metal Manufacturing Co.,Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORP. Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: JX Nippon Mining & Metals Corp. Address before: Tokyo, Japan Patentee before: Nippon Mining & Metals Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050427 Termination date: 20150228 |
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EXPY | Termination of patent right or utility model |