HK1041106B - 引線框和用於引線框的銅合金 - Google Patents

引線框和用於引線框的銅合金

Info

Publication number
HK1041106B
HK1041106B HK02102708.7A HK02102708A HK1041106B HK 1041106 B HK1041106 B HK 1041106B HK 02102708 A HK02102708 A HK 02102708A HK 1041106 B HK1041106 B HK 1041106B
Authority
HK
Hong Kong
Prior art keywords
lead frame
copper alloy
lead
frame
alloy
Prior art date
Application number
HK02102708.7A
Other languages
English (en)
Other versions
HK1041106A1 (en
Inventor
Tomioka Yasuo
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of HK1041106A1 publication Critical patent/HK1041106A1/xx
Publication of HK1041106B publication Critical patent/HK1041106B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
HK02102708.7A 2000-02-29 2002-04-10 引線框和用於引線框的銅合金 HK1041106B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000053968A JP3318309B2 (ja) 2000-02-29 2000-02-29 リードフレームおよびリードフレーム用銅合金

Publications (2)

Publication Number Publication Date
HK1041106A1 HK1041106A1 (en) 2002-06-28
HK1041106B true HK1041106B (zh) 2005-12-09

Family

ID=18575285

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102708.7A HK1041106B (zh) 2000-02-29 2002-04-10 引線框和用於引線框的銅合金

Country Status (5)

Country Link
JP (1) JP3318309B2 (zh)
KR (1) KR100380214B1 (zh)
CN (1) CN1199262C (zh)
HK (1) HK1041106B (zh)
TW (1) TW541677B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4524471B2 (ja) * 2004-08-30 2010-08-18 Ｄｏｗａメタルテック株式会社 銅合金箔およびその製造法
KR101448313B1 (ko) * 2006-06-23 2014-10-07 엔지케이 인슐레이터 엘티디 구리계 압연 합금의 제조 방법
EP2339039B8 (en) 2006-07-21 2016-12-07 Kabushiki Kaisha Kobe Seiko Sho Copper alloy sheet for electric and electronic part
ATE518968T1 (de) 2006-10-02 2011-08-15 Kobe Steel Ltd Kupferlegierungsplatte für elektrische und elektronische bauteile
JP2010222618A (ja) * 2009-03-23 2010-10-07 Nippon Mining & Metals Co Ltd Ｃｕ−Ｎｉ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
JP5339995B2 (ja) * 2009-04-01 2013-11-13 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｚｎ−Ｓｎ系合金板及びＣｕ−Ｚｎ−Ｓｎ系合金Ｓｎめっき条
KR101260911B1 (ko) 2010-02-08 2013-05-06 주식회사 풍산 고강도, 고전도성을 갖는 동합금 및 그 제조방법
JP5427971B1 (ja) * 2013-03-25 2014-02-26 Ｊｘ日鉱日石金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6842270B2 (ja) * 2016-10-05 2021-03-17 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
CN1199262C (zh) 2005-04-27
HK1041106A1 (en) 2002-06-28
JP3318309B2 (ja) 2002-08-26
KR20010085422A (ko) 2001-09-07
CN1317828A (zh) 2001-10-17
TW541677B (en) 2003-07-11
JP2001244400A (ja) 2001-09-07
KR100380214B1 (ko) 2003-04-18

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150228