TW540272B - Improved adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes - Google Patents

Improved adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes Download PDF

Info

Publication number
TW540272B
TW540272B TW091119352A TW91119352A TW540272B TW 540272 B TW540272 B TW 540272B TW 091119352 A TW091119352 A TW 091119352A TW 91119352 A TW91119352 A TW 91119352A TW 540272 B TW540272 B TW 540272B
Authority
TW
Taiwan
Prior art keywords
adhesive
curable
adhesive composition
composition
patent application
Prior art date
Application number
TW091119352A
Other languages
English (en)
Chinese (zh)
Inventor
Michael John Watson
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of TW540272B publication Critical patent/TW540272B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/231—Configurations of stacked chips the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/291—Configurations of stacked chips characterised by containers, encapsulations, or other housings for the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2835—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including moisture or waterproof component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
TW091119352A 2001-09-17 2002-08-27 Improved adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes TW540272B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/954,262 US7074481B2 (en) 2001-09-17 2001-09-17 Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes

Publications (1)

Publication Number Publication Date
TW540272B true TW540272B (en) 2003-07-01

Family

ID=25495178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091119352A TW540272B (en) 2001-09-17 2002-08-27 Improved adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes

Country Status (6)

Country Link
US (1) US7074481B2 (enExample)
JP (1) JP2005503468A (enExample)
KR (1) KR100880091B1 (enExample)
DE (1) DE10297224B4 (enExample)
TW (1) TW540272B (enExample)
WO (1) WO2003025081A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235425B2 (en) 2004-02-24 2007-06-26 Kabushiki Kaisha Toshiba Semiconductor device and fabrication method for the same

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6959489B2 (en) * 2000-09-29 2005-11-01 Tessera, Inc. Methods of making microelectronic packages
TW546795B (en) * 2002-06-04 2003-08-11 Siliconware Precision Industries Co Ltd Multichip module and manufacturing method thereof
US20050098890A1 (en) * 2003-10-08 2005-05-12 Stephan Blaszczak Method for producing an adhesive bond and adhesive bond between a chip and a planar surface
US20050269692A1 (en) * 2004-05-24 2005-12-08 Chippac, Inc Stacked semiconductor package having adhesive/spacer structure and insulation
US20050258527A1 (en) 2004-05-24 2005-11-24 Chippac, Inc. Adhesive/spacer island structure for multiple die package
US8552551B2 (en) * 2004-05-24 2013-10-08 Chippac, Inc. Adhesive/spacer island structure for stacking over wire bonded die
DE102005015036B4 (de) 2004-07-19 2008-08-28 Qimonda Ag Verfahren zur Montage eines Chips auf einer Unterlage
US20060022273A1 (en) * 2004-07-30 2006-02-02 David Halk System and method for assembly of semiconductor dies to flexible circuits
US20060273441A1 (en) * 2005-06-04 2006-12-07 Yueh-Chiu Chung Assembly structure and method for chip scale package
CN101238181B (zh) * 2005-08-04 2011-10-05 陶氏康宁公司 增强的有机硅树脂膜及其制备方法
WO2008045104A2 (en) * 2005-12-21 2008-04-17 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
US20070152314A1 (en) * 2005-12-30 2007-07-05 Intel Corporation Low stress stacked die packages
WO2008051242A2 (en) 2006-01-19 2008-05-02 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone compositon
CN101379153B (zh) * 2006-02-02 2011-12-28 陶氏康宁公司 有机硅树脂膜，其制备方法和纳米材料填充的有机硅组合物
US8084097B2 (en) 2006-02-20 2011-12-27 Dow Corning Corporation Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition
CN101522838B (zh) * 2006-10-05 2012-07-04 陶氏康宁公司 有机硅树脂膜及其制备方法
TWI314775B (en) * 2006-11-09 2009-09-11 Orient Semiconductor Elect Ltd A film and chip packaging process using the same
KR100946606B1 (ko) 2007-01-12 2010-03-09 세키스이가가쿠 고교가부시키가이샤 전자 부품용 접착제
CN101595166A (zh) * 2007-02-06 2009-12-02 陶氏康宁公司 有机硅树脂、有机硅组合物、涂覆基材和增强有机硅树脂膜
EP2117835A1 (en) * 2007-02-22 2009-11-18 Dow Corning Corporation Reinforced silicone resin films
EP2117836B1 (en) * 2007-02-22 2012-11-07 Dow Corning Corporation Reinforced silicone resin films
EP2118203B1 (en) * 2007-02-22 2012-05-23 Dow Corning Corporation Reinforced silicone resin film and method of preparing same
WO2008137262A2 (en) * 2007-05-01 2008-11-13 Dow Corning Corporation Reinforced silicone resin film
EP2142588A1 (en) * 2007-05-01 2010-01-13 Dow Corning Corporation Nanomaterial-filled silicone composition and reinforced silicone resin film
US20090050266A1 (en) * 2007-08-21 2009-02-26 Kang Yang Crosslinked polymeric materials as filler and spacers in adhesives
CN101848960A (zh) * 2007-10-12 2010-09-29 陶氏康宁公司 强化的硅酮树脂膜和纳米纤维填充的硅酮组合物
KR102090456B1 (ko) 2012-11-30 2020-03-18 엘지디스플레이 주식회사 비 전도성 타입 접착수단과 이를 구비한 표시장치
DE102015101711B4 (de) * 2014-02-11 2020-10-01 GM Global Technology Operations LLC (n. d. Ges. d. Staates Delaware) Verfahren zum Bilden einer Klebeverbindung sowie Verfahren zum Reparieren von Automobilkomponenten

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE8005194L (sv) * 1979-07-17 1981-01-18 Lion Corp Termoplastkomposition och sett att forma foremal derav
US4766176A (en) 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5148266A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
JPH04152642A (ja) * 1990-10-17 1992-05-26 Fujitsu Ltd 接着用ペースト
CA2121843A1 (en) * 1991-10-22 1993-04-29 Dap Products Inc. Moisture curable silicone-urethane copolymer sealants
JP2707026B2 (ja) * 1992-07-16 1998-01-28 信越化学工業株式会社 流動性及び充填剤分離性の改良されたシリコーンゴム組成物
JPH06244225A (ja) * 1993-02-16 1994-09-02 Hitachi Ltd 半導体装置とその製法
US5391604A (en) * 1993-07-30 1995-02-21 Diemat, Inc. Adhesive paste containing polymeric resin
US5477611A (en) 1993-09-20 1995-12-26 Tessera, Inc. Method of forming interface between die and chip carrier
JP3519779B2 (ja) 1994-04-27 2004-04-19 東レ・ダウコーニング・シリコーン株式会社 接着剤および半導体装置
JP3637126B2 (ja) * 1996-01-25 2005-04-13 ナミックス株式会社 液晶表示セル用シール剤およびそれを用いた液晶表示セル
JPH10130616A (ja) * 1996-10-31 1998-05-19 Sumitomo Bakelite Co Ltd 半導体用接着剤
JPH10335568A (ja) * 1997-05-29 1998-12-18 Toppan Printing Co Ltd リードフレーム
DE19745053A1 (de) 1997-10-11 1999-05-06 Mannesmann Sachs Ag Kupplungsscheibe für Kraftfahrzeug-Kupplungen
ATE219125T1 (de) * 1997-12-18 2002-06-15 Tremco Inc Polysiloxan mit dispergiertem copolymeren und dieses enthaltende dichtungsmassen
JPH11193829A (ja) 1997-12-26 1999-07-21 Hks Co Ltd 多板式クラッチ
JPH11228930A (ja) * 1998-02-13 1999-08-24 Hitachi Chem Co Ltd 接着剤組成物および接着シート
US5977226A (en) * 1998-05-04 1999-11-02 Dow Corning Corporation Vacuum dispensable silicone compositions
US6410415B1 (en) * 1999-03-23 2002-06-25 Polymer Flip Chip Corporation Flip chip mounting technique
KR100414698B1 (ko) 1999-04-01 2004-01-13 미쯔이카가쿠 가부시기가이샤 액정밀봉제 조성물
JP2001019928A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2001019936A (ja) * 1999-07-08 2001-01-23 Dow Corning Toray Silicone Co Ltd 接着剤、および半導体装置
JP2001139894A (ja) * 1999-11-15 2001-05-22 Dow Corning Toray Silicone Co Ltd シリコーン系接着性シート、および半導体装置
JP2001164231A (ja) * 1999-12-07 2001-06-19 Shigeru Koshibe 半導体用高純度接着剤
US6352775B1 (en) * 2000-08-01 2002-03-05 Takeda Chemical Industries, Ltd. Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7235425B2 (en) 2004-02-24 2007-06-26 Kabushiki Kaisha Toshiba Semiconductor device and fabrication method for the same

Also Published As

Publication number Publication date
DE10297224B4 (de) 2008-06-19
US7074481B2 (en) 2006-07-11
JP2005503468A (ja) 2005-02-03
DE10297224T5 (de) 2004-11-04
US20030054162A1 (en) 2003-03-20
KR100880091B1 (ko) 2009-01-23
KR20040044937A (ko) 2004-05-31
WO2003025081A1 (en) 2003-03-27

Similar Documents

Publication Publication Date Title
TW540272B (en) Improved adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
KR100880090B1 (ko) 반도체용 다이 부착 접착제, 반도체 장치의 제조 방법 및이 방법으로 제조된 반도체 장치
TWI229695B (en) Adhesives
KR20120106993A (ko) 폴리이미드 수지 조성물, 그것을 포함하는 접착제, 적층체 및 디바이스
JPH1112546A (ja) シリコーン系接着性シート、その製造方法、および半導体装置
TW310481B (enExample)
WO2004001844A2 (en) Thermal interface materials and methods for their preparation and use
TW200308030A (en) Semiconductor package and method of preparing same
KR101280277B1 (ko) 절연성 액상 다이 결합제 및 반도체 디바이스
EP1067162B1 (en) Adhesive and semiconductor devices
JPWO2015008330A1 (ja) 感光性樹脂組成物、フィルム状接着剤、接着シート、接着剤パターン、接着剤層付半導体ウェハ及び半導体装置
JPH06322350A (ja) 導電性接着剤及びその製造方法並びに半導体チップの接着方法
CN102105537A (zh) 树脂组合物
TW201038699A (en) Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device
EP1067163B1 (en) Adhesive and semiconductor devices
JP2005508767A (ja) インターフェース材料、ならびにその製造方法および使用方法
JP4994743B2 (ja) フィルム状接着剤及びそれを使用する半導体パッケージの製造方法
CN103250235A (zh) 带粘接剂层的半导体晶片、半导体装置的制造方法及半导体装置
TW200401805A (en) Thermally conductive coating compositions, methods of production and uses thereof
JP5183076B2 (ja) 半導体装置の製造方法
JP5086514B2 (ja) 熱伝導性硬化性液状ポリマー組成物および半導体装置
JP2000080335A (ja) シリコーン系接着性シート、その製造方法、および半導体装置
TWI246129B (en) Underfill and mold compounds including siloxane-based aromatic diamines
JPH1142730A (ja) 電子装置用熱伝導性インタフェース
JP2000273143A (ja) 半導体装置

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees